CN115058760B - Electroplating equipment and film plating machine - Google Patents
Electroplating equipment and film plating machine Download PDFInfo
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- CN115058760B CN115058760B CN202210788253.4A CN202210788253A CN115058760B CN 115058760 B CN115058760 B CN 115058760B CN 202210788253 A CN202210788253 A CN 202210788253A CN 115058760 B CN115058760 B CN 115058760B
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- 238000007747 plating Methods 0.000 title claims abstract description 135
- 238000009713 electroplating Methods 0.000 title claims abstract description 90
- 230000000712 assembly Effects 0.000 claims abstract description 26
- 238000000429 assembly Methods 0.000 claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 6
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005253 cladding Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000008719 thickening Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000011149 active material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses electroplating equipment and a film plating machine, wherein the electroplating equipment comprises an electroplating bath and a plurality of anode assemblies, the electroplating bath is used for electroplating a conductive base film entering the electroplating bath, one side of the conductive base film entering the electroplating bath is a groove entering side, one side of the conductive base film leaving the electroplating bath is a groove exiting side, the direction from the groove entering side to the groove exiting side is a first direction, the plurality of anode assemblies are arranged in the electroplating bath at intervals along the first direction, the anode assemblies are electrically connected with a power supply, and the current introduced by at least part of the anode assemblies is gradually increased along the first direction. Through setting up along the electric current of at least partial anode assembly lets in the first direction and increase gradually, namely, along with the cladding material thickness of electrically conductive base film electroplating increases gradually, the current-carrying capacity of electrically conductive base film increases gradually, increases the electric current of at least partial anode assembly lets in correspondingly to can improve the speed to electrically conductive base film electroplating, and then improve production efficiency.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to electroplating equipment and a film plating machine.
Background
The current collector is an important component of the lithium battery, and current generated by the active materials of the battery is gathered and output to the outside. In preparing a new composite current collector, a metal plating layer is plated on a conductive base film using a plating apparatus to prepare the current collector.
The electroplating equipment comprises an electroplating bath and an anode plate arranged in the electroplating bath, wherein the conductive base film is arranged in the electroplating bath during electroplating, the anode plate is used as an anode, and the conductive base film is used as a cathode, so that metal ions undergo a reduction reaction on the conductive base film to realize electroplating of a metal coating on the conductive base film. However, in the related art, the plating efficiency of the plating apparatus is low, resulting in low production efficiency.
Disclosure of Invention
The embodiment of the invention discloses electroplating equipment and a film plating machine.
To achieve the above object, in a first aspect, an embodiment of the present invention discloses an electroplating apparatus, including:
the electroplating tank is used for electroplating the conductive base film entering the electroplating tank, and the film entering direction of the conductive base film is a first direction; and
The plurality of anode assemblies are sequentially arranged in the electroplating bath along the first direction, the anode assemblies are electrically connected to a power supply, and currents which are led in by at least part of the anode assemblies in the plurality of anode assemblies are gradually increased along the first direction.
The current that this electroplating equipment's at least some anode assembly lets in along the first direction increases gradually, i.e. the current that the anode assembly that is close to the play groove side of electroplating equipment lets in is greater than the current that the anode assembly that is close to the income groove side of electroplating equipment lets in, when electroplating to electrically conductive base film, electrically conductive base film gets into to the plating bath from the income groove side of electroplating equipment and transports to play groove side rolling, the cladding thickness of the part that electrically conductive base film lies in the income groove side is thinner, the current-carrying capacity is weaker, thereby can match in less current density, the metal coating of the part that electrically conductive base film lies in play groove side has great current-carrying capacity through electroplating thickening, thereby through the current that the increase is close to the anode assembly that goes in of play groove side is with the increase current density that increases to electrically conductive base film applys, improve electroplating efficiency, in order to improve production efficiency.
As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the number of anode assemblies is m, each anode assembly includes n anode units arranged along the second direction, the anode units are arranged in n rows and m columns in matrix, two adjacent anode units are separated by an insulating medium, and the anode units are electrically connected to the power supply;
In the first direction, the current flowing into at least one row of anode units is gradually increased;
Wherein the second direction is perpendicular to or inclined to the first direction, m is a natural number greater than 1, and n is a natural number greater than 0. The current which is introduced into at least one row of anode units along the first direction is gradually increased, so that the current applied by the anode units can be correspondingly increased along with the thickening of the plating thickness and the enhancement of the current carrying capacity of the conductive base film, the current density of the conductive base film is increased, and the electroplating rate is further increased.
In an alternative embodiment, in an example of the first aspect of the invention, along the first direction,
The current passing through at least one row of the anode units in the row A in the middle area of the anode assembly is gradually increased;
The current flowing in at least one row of the anode units in the row B of the two end areas of the anode assembly is increased and then decreased;
Wherein A, B is a natural number greater than 0.
The electric resistance of the two sides of the conductive base film along the second direction is smaller, the electric resistance of the middle part is larger, so that the conditions of large current density of the two sides of the conductive base film along the second direction and small current density of the middle part are easily caused, along the first direction, the current of the anode units of the row A and the row B gradually increases, the increasing speed of the plating thickness of the two sides of the conductive base film corresponding to the row B is larger than that of the plating thickness of the middle part of the conductive base film corresponding to the row B, and the current introduced by the first anode units of the row is gradually reduced, so that the increasing speed of the plating thickness of the two sides of the conductive base film along the second direction is reduced, and the plating uniformity is improved while the plating rate is improved.
As an alternative embodiment, in the embodiment of the first aspect of the present invention, at least one of the anode units of the B rows gradually increases the current flowing in the first direction from the inlet side to the first position;
at the first position to the cell outlet side, the current flowing into at least one row of the anode units in the row B along the first direction gradually decreases;
When the conductive base film is at the first position, the thickness of a metal coating on the edge of the conductive base film is d1, the thickness of a metal coating on the middle part of the conductive base film is d2, the thickness of a target metal coating of the conductive base film is d3, d1-d2 is more than or equal to 20% d3, d1 is more than or equal to 40% d3, or d1 is more than or equal to 400mm. Through ingenious setting up the electric current of going the first positive pole unit of line B in first position department become gradually the reduction by increasing gradually, can avoid first positive pole module to the plating layer that both sides of electrically conductive base film electroplated too thick, the middle part position plated the thinner condition of plating layer, also can avoid the plating layer thickness of first positive pole module to the plating layer thickness of electrically conductive base film both sides too thin, the middle part position plated the plating layer thickness too thick condition, promptly, can effectively improve electrically conductive base film along the electroplating homogeneity of second direction.
As an alternative implementation manner, in an embodiment of the first aspect of the present invention, the anode assembly is an anode plate, and the anode assembly includes a first anode module, where the first anode module is electrically connected to the power source, and a current flowing into a middle area of the first anode module is greater than a current flowing into two end areas of the first anode module along a second direction, so that a thickness of a plating layer of the conductive base film along a direction perpendicular to the first direction tends to be uniform;
Wherein the second direction is inclined or perpendicular to the first direction.
The first anode module arranged in the electroplating bath is connected with the power supply to electroplate the conductive base film, when the conductive base film is arranged in the electroplating bath, the two end areas of the first anode module correspond to the two ends of the conductive base film in the width direction, the middle area of the first anode module corresponds to the middle of the conductive base film in the width direction, and the current introduced into the middle area of the first anode module is larger than the current introduced into the two end areas of the first anode module.
As an alternative embodiment, in an embodiment of the first aspect of the present invention, the first anode module includes a plurality of anode units aligned in the second direction, and two adjacent anode units are separated by an insulating medium;
the plurality of anode units comprise one or more second anode units positioned in the middle area of the first anode module, one or more first anode units positioned in the one end area of the first anode module and one or more third anode units positioned in the other end area of the first anode module;
the second anode unit is electrically connected to the power supply, and
The first anode unit and/or the third anode unit are/is electrically connected to the power supply, and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit are/is not electrically connected to the power supply.
It is understood that the second anode unit located at the middle region of the first anode module corresponds to the middle position of the conductive base film for electroplating, and the first anode unit and the third anode unit located at the both end regions of the first anode module correspond to both sides of the conductive base film in the width direction. When the second anode unit is electrically connected with a power supply, radial power lines generated by the second anode unit can be radiated to two sides of the conductive base film in the width direction while electroplating the middle position of the conductive base film, so that electroplating is performed on the two sides of the conductive base film in the width direction.
When the current introduced by the first anode unit and/or the third anode unit is smaller than the current introduced by the second anode unit, the middle part of the conductive base film is electroplated through the second anode unit with larger current, the two sides of the conductive base film in the width direction are electroplated through the radiation of the power line of the second anode unit and the first anode unit and the third anode unit with smaller current, so that the electroplating uniformity of the conductive base film in the width direction is balanced, and the thickness uniformity of the plating layer of the conductive base film in the width direction is improved.
When the first anode unit and the second anode unit are not electrically connected with the power supply, namely, the first anode unit and the third anode unit cannot be electrified, so that the first anode unit and the third anode unit cannot electroplate the two sides of the conductive base film along the second direction, the two sides of the conductive base film along the second direction are electroplated through the power line radiated by the second anode unit positioned in the middle of the first anode module, the current density of the two sides of the conductive base film along the second direction can be effectively reduced, the current density of the two sides of the conductive base film along the second direction and the current density of the middle of the conductive base film are more similar, namely, the current density distribution of the conductive base film along the second direction is more uniform, and the electroplating uniformity of the conductive base film is improved.
In an alternative embodiment, in an embodiment of the first aspect of the present invention, the first anode module includes a plurality of anode units, two adjacent anode units are separated by an insulating medium, the plurality of anode units of the first anode module are arranged in a matrix of a plurality of rows and a plurality of columns,
Wherein the plurality of anode units form a plurality of columns extending in the second direction, the anode units of each column including one or more second anode units located in a middle region of the first anode module, one or more first anode units located in an end region of the first anode module, one or more third anode units located in an other end region of the first anode module;
the second anode unit is electrically connected to the power supply, and
The first anode unit and/or the third anode unit are/is electrically connected to the power supply, and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit are/is not electrically connected to the power supply;
the plurality of anode units form a plurality of rows extending along the first direction, and the anode units positioned in the same row are connected in parallel.
Since the plurality of first anode cells of the first anode module are arranged in a matrix, the first anode module has a plurality of anode cells, and control of uniformity of current density applied to the conductive base film can be improved by controlling current supplied to each anode cell electrically connected to the power source, respectively. Moreover, since the resistances of the conductive base films corresponding to the plurality of anode units arranged along the first direction are the same, the current density applied to the conductive base films does not need to be balanced by controlling the current flowing through the plurality of first anode units along the first direction, and therefore, the plurality of first anode units along the first direction can be connected to the same power supply in parallel, thereby being beneficial to reducing the number of the power supplies used and further reducing the cost.
In an alternative embodiment, in an embodiment of the first aspect of the present invention, the middle area of the first anode module includes a plurality of anode units arranged along the second direction, a plurality of anode units are separated by an insulating medium, the plurality of anode units are electrically connected to the power source respectively, and the current flowing into the anode units located in the middle of the middle area is greater than the current flowing into the anode units located at two ends of the middle area along the direction perpendicular to the first direction. In this way, the uniformity of the current density applied to the conductive base film by the second anode module can be further improved to improve the uniformity of the conductive base film plating.
In an optional implementation manner, in an embodiment of the first aspect of the present invention, projections of the first anode module and the conductive base film on a bottom surface of the plating tank are a first projection and a second projection, respectively, where the first projection is located in the second projection. In other words, along the second direction, two sides of the conductive base film along the second direction protrude from two sides of the first anode module, so that two sides of the conductive base film along the second direction are electroplated through the electric lines of force radiated by the first anode module, the problem that the density of the electric lines of force of the two sides of the conductive base film along the second direction is high can be avoided, and the uniformity of the thickness of the conductive base film along the second direction is improved.
As an alternative embodiment, in an embodiment of the first aspect of the invention, the anode assembly further comprises a second anode module, and the second anode module is closer to the inlet side than the first anode module;
the second anode module comprises a plurality of fourth anode units, two adjacent fourth anode units are separated by an insulating medium, and at least part of the fourth anode units are connected in parallel with the same power supply. At least part of the fourth anode units are connected in parallel with the same power supply, so that the currents fed by the fourth anode units are the same, the number of power supplies can be reduced, and the cost is reduced.
In a second aspect, an embodiment of the present invention further discloses a plating machine, including a plating apparatus according to the first aspect, and a transport mechanism, where the plating apparatus is used for plating a conductive base film, and the transport mechanism is used for clamping the conductive base film and moving the conductive base film in the plating tank of the plating apparatus along the first direction. It will be appreciated that a coating machine comprising a plating apparatus as described in the first aspect above has all technical effects of a plating apparatus as described in the first aspect above.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
By adopting the electroplating equipment and the coating machine provided by the embodiment, the current which is introduced into at least part of the anode assembly of the electroplating equipment along the first direction is gradually increased, namely, the current which is introduced into the anode assembly close to the outlet side of the electroplating equipment is larger than the current which is introduced into the anode assembly close to the inlet side of the electroplating equipment, when the conductive base film is electroplated, the conductive base film enters the electroplating tank from the inlet side of the electroplating equipment and is transported to the outlet side for rolling, the plating thickness of the part of the conductive base film, which is positioned on the inlet side, is thinner, the current carrying capacity is weaker, so that the metal plating layer of the part of the conductive base film, which is positioned on the outlet side, has larger current carrying capacity through electroplating thickening, and the current density which is applied to the conductive base film is increased through increasing the current which is introduced into the anode assembly close to the outlet side is increased, so that the electroplating efficiency is improved, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a related art coating machine;
FIG. 2 is a schematic view of the structure of the plating apparatus provided by the present application;
FIG. 3 is a schematic view showing the construction of a first plating apparatus according to the present application;
FIG. 4 is a schematic view showing the construction of a second plating apparatus according to the present application;
FIG. 5 is a schematic view showing the construction of a third plating apparatus according to the present application;
FIG. 6 is a schematic view showing a structure of a fourth plating apparatus according to the present application;
FIG. 7 is a schematic view showing a structure of a fifth plating apparatus according to the present application;
FIG. 8 is a schematic view showing a partial structure of the plating apparatus of FIG. 3;
FIG. 9 is a schematic view of a first anode module and conductive base film provided by the present application projected onto the bottom surface of a plating bath;
Fig. 10 is a schematic structural diagram of the coating machine provided by the application.
Icon: 1. electroplating equipment; 1a, a groove entering side; 1b, a groove outlet side; 11. plating bath; 12. a first anode module; 120. a first anode unit; 121. a first anode unit; 122. a second anode unit; 123. a third anode unit; 12a, a first anode unit; 12b, a second anode unit; 12c, a third anode unit; 12d, a fourth anode unit; 12e, a fifth anode unit; 12f, a sixth anode unit; 12g, seventh anode unit; 12h, eighth anode unit; 12i, a ninth anode unit; 12j, a tenth anode unit; a. a first projection; 1201. a first row of anode units; 1202. a second row of anode units; 1203. a third row of anode units, 1204 and a fourth row of anode units; 1205. a fifth row anode unit; 13. a second anode module; 131. a second anode unit; x, a first direction; y, the second direction; 2. a conductive base film; b. a second projection; 3. a power supply; 100. a film plating machine; 4. a transport mechanism; 41-driving means; 42-conveyor belt; 43-conductive clips.
Detailed Description
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present invention and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present invention will be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of devices, elements, or components indicated. Unless otherwise indicated, the meaning of "a plurality" is two or more.
The conductive base film is a film with metal layers attached to two sides of an insulating material, and can be used for preparing a current collector of a lithium battery after electroplating the thickened metal layers.
As shown in fig. 1, in the related art, a plating machine 10 is used to plate a conductive base film 20, the plating machine 10 includes a plating tank 101, the plating tank 101 is filled with a plating solution, an anode plate 102 (in order not to block other structures, shown in a form of a dashed frame in the drawing, actually a solid structure) is disposed in the plating tank 101, when the conductive base film 20 is plated, the anode plate 102 is disposed corresponding to the conductive base film 20, the anode plate 102 is electrically connected to an anode of a power supply, and the conductive base film 20 is electrically connected to a cathode of the power supply, so as to realize plating of the conductive base film 20.
Specifically, the plating machine 10 has opposite inlet and outlet sides 10a and 10b, the other two opposite sides of the plating machine 10 are further provided with a transport mechanism 103, the transport mechanism 103 is provided with a conductive clip 131, when the conductive base film 20 is plated, the conductive base film 20 is unwound from the inlet side 10a to enter the plating tank 101 and immersed in the plating solution in the plating tank 101, the conductive clip 131 is clamped on the two opposite sides of the conductive base film 20 in the width direction, and the conductive clip 131 is electrically connected to the negative electrode of the power supply to negatively charge the conductive base film 20. The conductive clip 131 holds the conductive base film 20 to move in the direction from the in-groove side 10a to the out-groove side 10b, so that the plating is completed when the conductive base film 20 is transported to the out-groove side 10b, and is wound up at the out-groove side 10 b.
It will be appreciated that when the conductive base film 20 is not electroplated, the metal layer attached to the insulating material of the conductive base film 20 is thinner, resulting in weaker conductivity and less current carrying capacity, so that when the conductive base film 20 is just started to enter the electroplating bath 101, only a smaller current can be applied to the anode plate 102 in order to match the current carrying capacity of the conductive base film 20, resulting in slower electroplating rate and affecting the production efficiency.
In addition, since the conductive clips 131 are clamped at opposite sides of the conductive base film 20, the middle part of the conductive base film 20 is longer in distance from the conductive clips 131 and larger in resistance than the two sides of the conductive base film 20 in the width direction of the conductive base film 20, and thus the current density of the middle part of the conductive base film 20 is smaller and the current density of the two sides of the conductive base film in the width direction is larger, the plating thickness of the middle part of the conductive base film 20 is thinner and the plating of the two sides of the conductive base film 20 in the width direction is thicker, which causes the problem of uneven plating thickness of the conductive base film.
Based on the above, the application provides the electroplating equipment and the coating machine, which can effectively improve the electroplating rate to improve the production efficiency and can improve the problem of uneven plating thickness of electroplating of the conductive base film.
The technical scheme of the invention will be further described with reference to the examples and the accompanying drawings.
Referring to fig. 2, the first aspect of the present invention discloses an electroplating apparatus 1, the electroplating apparatus 1 includes an electroplating tank 11 and a plurality of anode assemblies 12, the electroplating tank 11 is used for electroplating a conductive base film 1 entering therein, a film entering direction of the conductive base film 2 is a first direction x, the plurality of anode assemblies 12 are disposed in the electroplating tank 11 at intervals along the first direction x, the anode assemblies 12 are electrically connected to a power source 3, and current flowing into at least part of the anode assemblies 12 is gradually increased along the first direction x.
By arranging that the current introduced into at least part of the anode assembly 12 in the first direction x gradually increases, that is, along with the gradual increase of the plating thickness of the electroplating of the conductive base film 2, the current carrying capacity of the conductive base film 2 gradually increases, and correspondingly the current introduced into at least part of the anode assembly 12 increases, the electroplating speed of the conductive base film 2 can be increased, and the production efficiency can be further improved.
It should be noted that, the "the current flowing through at least a portion of the anode assemblies 12 gradually increases" is understood to mean that, among the plurality of anode assemblies 12 disposed along the first direction x, the current flowing through a portion of the anode assemblies 12 gradually increases, or the current flowing through all of the anode assemblies 12 gradually increases. The film feeding direction of the conductive base film 2 is understood to be the film feeding direction of the conductive base film 2, in which the side of the conductive base film 2 entering the plating tank 11 is the in-tank side 1a, the side of the conductive base film leaving the plating tank 11 is the out-tank side 1b, and the direction from the in-tank side 1a to the out-tank side 1b is the film feeding direction of the conductive base film 2.
As shown in fig. 3, alternatively, the anode assemblies 12 are provided in m, each anode assembly 12 includes n anode units 120 arranged at intervals along the second direction y, the anode units 120 are arranged in a matrix of n rows and m columns, and two adjacent anode units 120 are separated by an insulating medium, where m is a natural number greater than 1, n is a natural number greater than 0, and in the first direction x, the current flowing into at least one row of anode units 120 gradually increases. Since the current flowing through at least one row of anode units 120 along the first direction x gradually increases, the current applied by the anode units 120 can be correspondingly increased along with the thickening of the plating thickness and the enhancement of the current carrying capacity of the conductive base film 2, so as to increase the current density of the conductive base film 2 and further increase the electroplating rate. For example, when n=1, the anode assembly 12 is a monolithic anode unit 120, the current flowing through the plurality of anode assemblies 12 increases gradually along the first direction x, when n > 1, the anode units 120 of the plurality of anode assemblies 12 form a plurality of rows, and when n=2, the current flowing through at least one row of the first anode units 120 increases gradually along the first direction x, for example, when n=2, the current flowing through each row of the two rows of anode units 120 increases gradually along the first direction x, and for example, when n=5, the current flowing through 3 rows of anode units 120 located in the middle of the anode assembly 12 increases gradually along the first direction x.
It is to be understood that the plating tank 11 is generally a rectangular plating tank 11, the anode assembly 12 has a rectangular plate-like structure, and when the anode assembly 12 is disposed in the plating tank 11, the length direction of the anode assembly 12 can be set along the width direction of the plating tank 11, so that a plurality of anode assemblies 12 can be disposed in the plating tank 11 along the first direction x at intervals, at this time, the second direction y is perpendicular to the first direction x, and when the conductive base film 2 is disposed in the plating tank 11, the second direction y can also be regarded as the width direction of the conductive base film 2. Of course, in other embodiments, the anode assembly 12 may be disposed in the plating tank 11 in an inclined manner, and the second direction y may be inclined with respect to the first direction x.
It will be appreciated that the insulating medium between two adjacent anode units 120 may be an insulating tape, although in other embodiments, the insulating medium may be other insulating materials. The anode units 120 can be prevented from being electroplated by providing an insulating medium between adjacent two anode units 120
Further, in the first direction x, the current flowing in at least one row of the anode units 120 in the a-row located in the middle area 12a1 of the anode assembly 12 gradually increases, and the current flowing in at least one row of the anode units 120 in the B-row located in the two end areas 12a2 of the anode assembly 12 increases and then decreases, wherein A, B is a natural number greater than 0. As can be seen from the foregoing, the resistance of the conductive base film 2 along the second direction y is smaller, the resistance of the middle portion is larger, and thus the current density of the conductive base film 2 along the second direction y is larger, and the current density of the middle portion is smaller, so that the plating thickness of the conductive base film 2 along the second direction y is more uniform, and the plating uniformity is improved while the plating rate is improved, by gradually reducing the current flowing into the first anode unit 120 along the B line, as the current of the anode units 120 along the a line and the B line is gradually increased, the plating thickness of the conductive base film 2 along the second direction y is increased at a higher speed than the plating thickness of the middle portion of the conductive base film 2 along the B line. As shown in fig. 3, the anode assembly 12 is illustrated as having a trapezoidal structure, with m=3 and n=5. For example, a=3, b=1, where, in the second direction y, the 5-row anode units 120 are respectively called a first-row anode unit 1201, a second-row anode unit 1202, a third-row anode unit 1203, a fourth-row anode unit 1204, and a fifth-row anode unit 1205, and the currents flowing in the first direction x through the second-row anode unit 1202, the third-row anode unit 1203, and the fourth-row anode unit 1204 located in the middle of the first anode module 12a gradually increase, and the currents flowing in the first-row anode unit 1201 and the fifth-row anode unit 1205 located on both sides of the first anode module 12a first increase and then decrease.
It should be noted that, the above-mentioned middle region 12a1 and two end regions 12a2 of the anode assembly 12 may be understood that the middle region 12a1 of the anode assembly 12 is farther from two edges of the anode assembly 12 in the width direction than the two end regions 12a2 of the anode assembly 12, and the concept that the middle region 12a1 and the two end regions 12a2 are two opposite positions is not used to define a certain absolute position of the anode assembly 12, in other words, the current of the anode assembly 12 increases and decreases in the second direction y.
Further, the current flowing into at least one row of the anode units 120 of the row B is gradually increased from the inlet side 1a to the first position, the current flowing into at least one row of the anode units 120 of the row B is gradually reduced from the first position to the outlet side along the first direction x, wherein when the conductive base film 2 is at the first position, the thickness of the metal coating on the edge of the conductive base film 2 is d1, the thickness of the metal coating on the middle part of the conductive base film 2 is d2, the thickness of the target metal coating on the conductive base film 2 is d3, d1-d2 is more than or equal to 20% d3, or d1 is more than or equal to 40% d3, or d1 is more than or equal to 400nm. Through ingenious setting up the electric current of going first positive pole unit 120 of line B in first position department change from increase gradually to reduce gradually, can avoid first positive pole module 12a to the condition that the both sides of electrically conductive base film 2 electroplate the cladding material is too thick, the cladding material that middle part position electroplate is thinner, also can avoid the first positive pole module 12a to the both sides of electrically conductive base film 2 electroplate the cladding material thickness that the cladding material thickness is too thin, the cladding material thickness that middle part position electroplate is too thick, namely, can effectively improve electrically conductive base film 2 along the electroplating homogeneity of second direction y.
It will be appreciated that the first position is related to the plating thickness of the middle and edge of the conductive base film 2 and the target thickness, and the plating thickness of the middle and edge of the conductive base film 2 is related to the parameters of plating, the running speed of the conductive base film, the concentration of the plating solution, the temperature of the plating solution, etc., so that the first position is not a fixed position, but may be changed according to the actual situation, for example, the first position may be located at the second anode assembly 12 in the direction from the in-slot side 1a toward the out-slot side 1b, and may be located at the third anode assembly 12a in the direction from the in-slot side 1a toward the out-slot side 1b, and the user may adjust according to the actual situation of plating.
In some embodiments, the anode assembly 12 is an anode plate, and the anode assembly includes a first anode module 12a, where the first anode module 12a is electrically connected to the power source 3, and in the second direction y, the current flowing through the middle area 12a1 of the first anode module 12a is greater than the current flowing through the two end areas 12a2 of the first anode module, so that the thickness of the plating layer of the conductive base film 2 along the direction perpendicular to the first direction tends to be uniform.
The first anode module 12a arranged in the electroplating tank 11 is connected to the power supply 3 to electroplate the conductive base film 2, when the conductive base film 2 is arranged in the electroplating tank 11, the two end areas 12a 2of the first anode module 12a correspond to two sides of the conductive base film 2 in the width direction, the middle area 12a1 of the first anode module 12a corresponds to the middle position of the conductive base film 2 in the width direction, and the current flowing through the middle area 12a1 of the first anode module 12a is larger than the current flowing through the two end areas 12a 2of the first anode module 12a, so that when the conductive base film 2 is electroplated, the current density of the middle position of the conductive base film 2 can be improved, the condition that the current density of the middle part of the conductive base film 2 is smaller than the current density of two sides of the conductive base film 2 when the current of the first anode unit is equal due to the fact that the middle resistance of the conductive base film 2 is larger is effectively relieved, and the uniformity of the thickness of the plating layer of the conductive base film 2 along the direction perpendicular to the first direction is improved.
It should be further noted that, the thickness of the plating layer of the conductive base film 2 along the direction perpendicular to the first direction x tends to be uniform, which is to be understood that in the embodiment of the present invention, the thickness of the plating layer of the conductive base film 2 along the direction perpendicular to the first direction x is not exactly the same, and may have a certain difference, compared to the manner in which the portions of the first anode module 12a are supplied with the same current, when the electroplating apparatus 1 in the embodiment of the present invention is used to electroplate the conductive base film 2, the thickness of the plating layer of the conductive base film along the direction perpendicular to the first direction x is more uniform.
Alternatively, the first anode module 12a includes a plurality of anode units 120 arranged along the second direction y, two adjacent anode units 120 are separated by an insulating medium, and at least part of the anode units 120 are electrically connected to the power source 3. Since the first anode module 12a includes the plurality of anode units 120 arranged in the second direction, the plurality of anode units 120 are electrically connected to the power source 3 so as to control the currents of the plurality of anode units 120, respectively, as compared with the case where the first anode module 12a is provided as a whole, for example, the current flowing into the corresponding anode units 120 can be adjusted according to the requirement of the plating uniformity of the conductive base film 2 or the requirement of the plating thickness at different positions of the conductive base film 2.
In order to realize that the current flowing through the middle region 12a1 of the conductive base film 2 in the second direction y is greater than the current flowing through the two end regions 12a2 thereof, as an alternative embodiment, the first anode module 12a includes three or more anode units 120, the anode units 120 are electrically connected to the power source 3, respectively, and the anode units 120 supply current in a manner of gradually decreasing the current from the middle to the two ends of the first anode module 12 a. Since the plurality of anode units 120 gradually decrease in current from the middle of the first anode module 12a to both ends, the current density applied to the middle of the conductive base film 2 by the anode units 120 can be made larger than the current applied to both ends of the conductive base film 2 in the width direction, thereby alleviating the problem that the current density at both ends of the conductive base film 2 is larger than that at the middle position due to the electrical connection of both ends of the conductive base film 2, making the current density of the conductive base film 2 in the width direction more uniform, and improving the thickness of the plating layer of the conductive base film 2 in the width direction more uniform.
Further, the middle region 12a1 of the first anode module 12a has a plurality of anode units 120, and the plurality of anode units 120 are electrically connected to the power source 3, and the current flowing into the anode units 120 located in the middle of the middle region 12a1 is greater than the current flowing into the anode units 120 located at two ends of the middle region 12a1 along the direction perpendicular to the first direction x. In this way, by further applying different currents to different positions of the middle region 12a1 of the first anode module 12a, the current in the middle of the middle region 12a1 of the first anode module 12a is made larger than the current at both ends thereof, further improving the uniformity of the first anode module for the conductive base film plating.
Referring to fig. 4 to 7, in other embodiments, the plurality of anode units 120 includes one or more second anode units 122 located in a middle region 12a1 of the first anode module 12a, one or more first anode units 121 located in an end region of the first anode module 12a, and one or more third anode units 123 located in an other end region of the first anode module 12 a; the second anode unit 122 is electrically connected to the power source 3, and the first anode unit 121 and/or the third anode unit 123 is electrically connected to the power source and the current connected to the first anode unit 121 is smaller than the current connected to the second anode unit 122, or the current in the first anode unit 121 and/or the third anode unit 123, which is not electrically connected to the power source 3, is zero. In other words, the second anode unit 122 is electrically connected to the power source 3, the first anode unit 121 and/or the third anode unit 123 is electrically connected to the power source 3 and the current connected is smaller than the current connected to the second anode unit 122, or the second anode unit 122 is electrically connected to the power source 3, the first anode unit 121 and/or the third anode unit 123 is not electrically connected to the power source 3 or the current connected is zero.
It is understood that the second anode unit 122 located at the middle region 12a1 of the first anode module 12a corresponds to a middle position of the conductive base film 2 for plating, and the first anode unit 121 and the third anode unit 123 located at the both end regions 12a2 of the first anode module 12a correspond to both sides of the conductive base film 2 in the width direction. When the second anode unit 122 is electrically connected to the power supply 3, the radial electric lines of force generated by the second anode unit 122 can be radiated to both sides of the conductive base film 2 in the width direction while plating the middle position of the conductive base film 2, so as to plate both sides of the conductive base film 2 in the width direction.
When the current flowing in the first anode unit 121 and/or the third anode unit 123 is smaller than the current flowing in the second anode unit 122, the middle part of the conductive base film 2 is electroplated by the second anode unit 122 with larger current, both sides of the conductive base film 2 in the width direction are electroplated by the radiation of the electric line of force of the second anode unit 122 and are electroplated by the first anode unit 121 and the third anode unit 123 with smaller current, so that the electroplating uniformity of the conductive base film 2 in the width direction is balanced, and the thickness uniformity of the plating layer of the conductive base film 2 in the width direction is improved.
When the first anode unit 121 and the second anode unit 122 are not connected with the power supply 3 or the current is zero, the first anode unit 121 and the third anode unit 123 do not plate the two sides of the conductive base film 2 along the second direction y, and the two sides of the conductive base film 2 along the second direction y are plated through the power lines radiated by the second anode unit 122 positioned in the middle of the first anode module 12a, so that the current density of the two sides of the conductive base film 2 along the second direction y can be effectively reduced, so that the current density of the two sides and the middle of the conductive base film 2 along the second direction y are more similar, that is, the current density distribution of the conductive base film 2 along the second direction y is more uniform, and the uniformity of plating the conductive base film 2 is improved. This embodiment will be described by taking this mode as an example.
As can be seen from the foregoing, the first anode unit 121, the second anode unit 122, and the third anode unit 123 may be one or more, the first anode unit 121 and the third anode unit 123 are respectively located at two end regions 12a2 of the first anode module 12a, the second anode unit 122 is located at a middle region 12a1 of the first anode module 12a, and then the first anode unit 121 and the third anode unit 123 are respectively located at two sides of the second anode unit 122, and there is a positional relative relationship among the first anode unit 121, the second anode unit 122, and the third anode unit 123, but various dividing manners may be included, which will be illustrated below.
As shown in fig. 4, when the first anode module 12a includes three anode units 120 arranged at intervals in the second direction y in order, the three anode units 120 include one first anode unit 121, one second anode unit 122, and one third anode unit 123, respectively, as a first example. As shown in fig. 5, as a second example, when the first anode module 12a includes four anode units 120 arranged at intervals in the second direction y in order, the four anode units 120 include one first anode unit 121, two second anode units 122, and one third anode unit 123, respectively. As shown in fig. 6, as a third example, when the first anode module 12a includes five anode units 120 arranged at intervals in the second direction y in order, the five anode units 120 include one first anode unit 121, three second anode units 122, and one third anode unit 123, respectively. As shown in fig. 7, when the first anode module 12a includes five anode units 120 arranged at intervals in the second direction y in order, as a fourth example, the five anode units 120 may further include two first anode units 121, one second anode unit 122, and two third anode units 123, respectively. It is to be understood that the number of the first anode units 120 included in the first anode unit 121, the second anode unit 122, and the third anode unit 123 may be one or a plurality of, the same or different, and the above is merely illustrative, as long as the first anode unit 121, the second anode unit 122, and the third anode unit 123 are sequentially arranged along the second direction y. In this embodiment, a division manner in a third example is described as an example.
Further, when the second anode units 122 are provided in plurality, the current flowing through the second anode units 122 located in the middle of the middle region 12a1 is greater than the current flowing through the second anode units 122 located at both ends of the middle region 12a1 in the direction perpendicular to the first direction x. In this way, by further applying different currents to different positions of the second anode unit 122 of the first anode module 12, the current in the middle of the middle region 12a112a1 of the first anode module 12 is made greater than the current at both ends thereof, further improving the uniformity of the first anode module for the conductive base film plating.
Further, in the first anode module 12, the sum of the conductive areas of the first anode unit 121 is S1, the sum of the conductive areas of the second anode unit 122 is S2, the sum of the conductive areas of the third anode unit 123 is S3, when the first anode unit 121 and the third anode unit 123 of the first anode module 12 are not electrically connected to the power source or the current to be connected thereto is zero, 1.5% s2.ltoreq.s1+s3.ltoreq.16% S2, when the first anode unit 121 of the first anode module 12 is not electrically connected to the power source or the current to be connected thereto is zero, 1.5% (s2+s3). Ltoreq.s1.ltoreq.16% (s2+s3) when the third anode unit 123 of the first anode module 12 is not electrically connected to the power source or the current to be connected thereto is zero, 1.5% (s1+s2). Ltoreq.16% (s1+s2) when the first anode unit 121 is electrically connected to the power source 3. In other words, the sum of the conductive areas of the anode units that are not energized is 1.5% -16% of the sum of the conductive areas of the anode units that are energized, and illustratively, the sum of the conductive areas of the anode units that are not energized is 1.5%, 5%, 10%, 16% of the sum of the conductive areas of the anode units that are energized. By reasonably setting the ratio of the sum of the conductive areas of the anode units which are not electrified with current to the sum of the conductive areas of the anode units which are electrified with current, the situation that the plating thickness of the two sides of the conductive base film 2 is too thick and the plating thickness of the middle position is too thin can not be caused when the first anode module 12 is used for electroplating the conductive base film 2, and the situation that the plating thickness of the two sides of the conductive base film 2 is too thin and the plating thickness of the middle position is too thick can not be caused, namely, the uniformity of the current density of the two sides of the conductive base film 2 along the second direction y can be effectively controlled, so that the uniformity of electroplating the conductive base film 2 is improved. The above-mentioned conductive area is the area of the surface of the anode unit 120 for plating the conductive base film 2, in other words, the area of the surface of the anode unit 120 facing the conductive base film 2.
As can be seen from the foregoing description, in some embodiments, the first anode module 12a includes a plurality of anode units 120 disposed at intervals, and two adjacent anode units 120 are separated by an insulating medium, alternatively, in order to improve the uniformity of electroplating the conductive base film 2 by the first anode module 12a, the first anode module 12a may be divided into more anode units 120, so that the current density applied to the conductive base film 2 can be controlled more accurately by controlling the current flowing into each anode unit 120. As shown in fig. 8, alternatively, the plurality of anode units 120 may be arranged in a matrix of a plurality of rows and a plurality of columns, wherein the plurality of anode units 120 may form a plurality of columns extending in the second direction y, and each column of anode units includes one or more second anode units 122 located in the middle region 12a1 of the first anode module 12a, one or more first anode units 121 located in one end region of the first anode module 12a, and one or more third anode units 123 located in the other end region of the first anode module 12a as described above; the plurality of anode cells 120 may form a plurality of rows extending in the first direction, and the anode cells 120 located in the same row are connected in parallel. Since the plurality of first anode units 120 of the first anode module 12a are arranged in a matrix, the first anode module 12a has a plurality of anode units 120, and can improve control of uniformity of current density applied to the conductive base film 2 by controlling current supplied to each anode unit electrically connected to a power source, respectively. Moreover, since the resistances of the conductive base films 2 corresponding to the plurality of anode units 120 disposed along the first direction x are the same, it is not necessary to control the current flowing through the plurality of first anode units 120 along the first direction x to balance the current density applied to the conductive base films 2, and therefore, the plurality of first anode units 120 along the first direction x can be connected in parallel to the same power supply 3, thereby being beneficial to reducing the number of power supplies 3 used and further reducing the cost.
As can be seen from the foregoing, the first anode unit group 121 and the third anode unit group 123 located at both sides of the first anode module 12a are not connected, the second anode unit group 122 located at the middle part of the first anode module 12a is connected, and the current flowing from the middle part to both sides of the plurality of first anode units 120 of the second anode unit group 122 is gradually reduced. As an example, as shown in fig. 8, for convenience of distinction, lines in which different power sources 3 are electrically connected to the anode unit 120 are represented by different lines. The first anode module 12a includes ten anode units 120, ten anode units 120 are arranged in two rows, the first row of anode units located at the inlet side 1a is called a first anode unit 120a, a second anode unit 120b, a third anode unit 120c, a fourth anode unit 120d, a fifth anode unit 120e, the first row of anode units located at the outlet side 1b is called a sixth anode unit 120f, a seventh anode unit 120g, an eighth anode unit 120h, a ninth anode unit 120i, a tenth anode unit 120j, and are respectively corresponding to the first anode unit 120a, the second anode unit 120b, the third anode unit 120c, the fourth anode unit 120d, and the fifth anode unit 120e, and then the first anode unit 120a and the sixth anode unit 120f located at the side of the first anode module 12a, the fifth anode unit 120e and the tenth anode unit 120j are respectively referred to as a sixth anode unit 120f, a seventh anode unit 123, a third anode unit 123, a fourth anode unit 123, a third anode unit 120c, a fourth anode unit 120d, and a fourth anode unit 120e are respectively connected in parallel with the third anode unit 3 and a fourth anode unit 3, and a fourth anode unit 120e are connected in parallel with the power supply unit 3, and the fourth anode unit 120a is connected in parallel with the power supply unit 3.
The inventors have found that the electric lines of force of the first anode module 12a during electroplating of the conductive base film 2 are distributed like the radiation of the magnetic field lines, and that the electric lines of force generated by the anode unit 120 located in the middle area 12a1 of the first anode module 12a are also radiated to both sides of the conductive base film 2 along the second direction y, and that the first projection a is located within the second projection b due to the fact that both sides of the conductive base film 2 along the second direction y are closer to the conductive clamp, which results in a smaller resistance and a larger current on both sides of the conductive base film 2 along the second direction y, thereby resulting in a thicker plating layer on both sides of the conductive base film 2 along the second direction y, based on which, in some embodiments, as shown in fig. 9, the projections of the first anode module 12a, the conductive base film 2 on the bottom surface of the plating bath 11 are the first projection a, the second projection b, respectively, in some embodiments. In other words, in the second direction y, the two sides of the conductive base film 2 along the second direction y protrude from the two sides of the first anode module 12a, so that the two sides of the conductive base film 2 along the second direction y are electroplated through the electric lines of force radiated by the first anode module 12a, which can avoid the problem of greater density of the electric lines of force on the two sides of the conductive base film 2 along the second direction y, and is beneficial to improving the uniformity of the thickness of the conductive base film 2 along the second direction y.
Further, the distances between the two edges of the first projection a perpendicular to the first direction and the corresponding edges of the second projection b perpendicular to the first direction are L1, L2, 20 mm.ltoreq.L1.ltoreq.300mm, 20 mm.ltoreq.L2.ltoreq.300 mm, and L1 is, illustratively, 20mm, 100mm, 150mm, 250mm, 300mm, etc., and L2 is 20mm, 100mm, 150mm, 250mm, 300mm, etc. By setting the distance between the two edges of the first projection a and the two edges of the second projection b to be 20-300 mm, the density uniformity of the electric lines of force on the two opposite sides of the conductive base film 2 along the second direction y when the conductive base film 2 is electroplated by the first anode plate is further improved, and the uniformity of the plating thickness of the conductive base film 2 is improved.
Still further, 50 mm.ltoreq.L1.ltoreq.200mm, 50 mm.ltoreq.L2.ltoreq.200mm, and L1 is, illustratively, 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc., and L2 is 50mm, 80mm, 120mm, 140mm, 170mm, 200mm, etc. By setting the distance L between the two edges of the first projection a and the two edges of the second projection b to be 50-200 mm, the density uniformity of the electric lines of force on the two opposite sides of the conductive base film 2 along the second direction y when the conductive base film 2 is electroplated by the first anode plate is further improved, so that the uniformity of the plating thickness of the conductive base film 2 is improved.
Referring to fig. 3 again, in some embodiments, the anode assembly 12 further includes a second anode module 12b, the second anode module 12b is disposed in the plating tank 11, and the second anode module 12b is closer to the tank inlet side 1a than the first anode module 12a, the second anode module 12b includes a plurality of fourth anode units 12b1, and two adjacent fourth anode units 12b1 are separated by an insulating medium, the plurality of fourth anode units 12b1 are electrically connected to the power source 3, wherein at least a portion of the fourth anode units 12b1 are connected in parallel to the same power source. Since at least part of the fourth anode units 12b1 are connected in parallel to the same power supply, the currents supplied by the fourth anode units 12b1 are the same, and the number of power supplies can be reduced, which is beneficial to cost reduction. In addition, in order to have a faster plating rate, the current flowing into the plurality of second anode modules 12b may be the maximum value of the current carrying capacity of the conductive base film 2, so that the plating rate may be increased, and then a larger current is flowing into the middle region 12a1 of the first anode module 12a located on the outlet side 1b of the second anode module 12b, and smaller current is flowing into the two side regions, so as to balance the plating thickness of the conductive base film 2 along the second direction y, thereby ensuring a faster plating rate and achieving better plating uniformity.
Illustratively, the plurality of fourth anode units 12b1 is divided into two groups, and the two groups of fourth anode units 12b1 are electrically connected to the two power sources 3, respectively. By dividing the fourth anode unit 12b1 into two groups to be electrically connected to the two power supplies 3, the second anode module is only required to be electrically connected to the two power supplies 3, the number of the used power supplies 3 is small, the production cost can be reduced, the wiring mode can be simplified, and in addition, the two groups of fourth anode unit groups 122 are controlled by the two power supplies 3, compared with the case that only the second anode module is connected to only one power supply 3, the output current of each power supply 3 is easier to control, so that the stability of the current control of each anode unit is improved.
According to the electroplating equipment 1 provided by the embodiment of the invention, the current which is introduced into at least part of the anode assembly 12 along the first direction x is gradually increased, so that the electroplating speed of the conductive base film 2 can be increased, and the production efficiency is further improved. Moreover, by setting the current flowing in the middle portion of the first anode module 12a to be larger than the current flowing in both ends of the first anode module 12a of the first anode structure, when the conductive base film 2 is plated, the current density to the middle portion of the conductive base film 2 can be increased, thereby improving the uniformity of the plating of the conductive base film 2.
Example two
As shown in fig. 10, a second embodiment of the present invention discloses a plating machine 100, which includes a plating apparatus 1 and a transporting mechanism 4 according to the first aspect, wherein the plating apparatus 1 is used for plating a conductive base film 2, and the transporting mechanism 4 is used for clamping the conductive base film 2 and moving the conductive base film 2 along a first direction x in a plating tank 11 of the plating apparatus 1.
It will be appreciated that the plating machine 100 including the plating apparatus 1 according to the above embodiment has all the technical effects of the plating apparatus 1 according to the first aspect, and will not be described herein.
Specifically, the transporting mechanism 4 may include a driving device 41, a conveyor belt 42, and a conductive clip 43 connected to the conveyor belt 42, where the driving device 41 is used to drive the conveyor belt 42 to move so as to drive the conductive clip 43 to move along the first direction x, and the conductive clip 43 is used to clip on the conductive base film 2. Of course, in other embodiments, the transporting mechanism 4 may have other structures as long as the conductive base film 2 can be transported to move the conductive base film 2 along the first direction x.
The electroplating equipment and the coating machine disclosed by the embodiment of the invention are described in detail, and specific examples are applied to illustrate the principle and the implementation mode of the invention, and the description of the above examples is only used for helping to understand the electroplating equipment and the coating machine and the core idea of the invention; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present invention, the present disclosure should not be construed as limiting the present invention in summary.
Claims (8)
1. An electroplating apparatus, comprising:
The electroplating device comprises an electroplating bath, a first electrode and a second electrode, wherein the electroplating bath is used for electroplating a conductive base film entering the electroplating bath, the film entering direction of the conductive base film is a first direction, one side of the conductive base film entering the electroplating bath is a groove entering side, and one side of the conductive base film leaving the electroplating bath is a groove exiting side; and
The anode assemblies are sequentially arranged in the electroplating bath along the first direction, the anode assemblies are electrically connected to a power supply, and currents led in at least part of the anode assemblies in the plurality of anode assemblies are gradually increased along the first direction;
The anode assembly comprises a first anode module, wherein the first anode module is electrically connected with the power supply, and the current flowing into the middle area of the first anode module is larger than the current flowing into the two end areas of the first anode module along the second direction, so that the thickness of a plating layer of the conductive base film along the direction perpendicular to the first direction tends to be uniform;
Wherein the second direction is inclined or perpendicular to the first direction;
The anode assembly further includes a second anode module, and the second anode module is closer to the inlet side than the first anode module;
the second anode module comprises a plurality of fourth anode units, two adjacent fourth anode units are separated by an insulating medium, and at least part of the fourth anode units are connected in parallel with the same power supply;
The number of the anode assemblies is m, each anode assembly comprises n anode units which are arranged along the second direction, the anode units are arranged in a matrix of n rows and m columns, two adjacent anode units are separated by an insulating medium, and the anode units are electrically connected to the power supply;
In the first direction, the current flowing into at least one row of anode units is gradually increased;
Wherein the second direction is perpendicular to or inclined to the first direction, m is a natural number greater than 1, and n is a natural number greater than 0;
In the direction of the first direction of the flow,
The current passing through at least one row of the anode units in the row A in the middle area of the anode assembly is gradually increased;
The current flowing in at least one row of the anode units in the row B of the two end areas of the anode assembly is increased and then decreased;
Wherein A, B is a natural number greater than 0.
2. The plating apparatus as recited in claim 1, wherein at least one of said anode units of said B rows is gradually increased in current passing in said first direction from said inlet side to a first position;
at the first position to the cell outlet side, the current flowing into at least one row of the anode units in the row B along the first direction gradually decreases;
When the conductive base film is at the first position, the thickness of a metal coating on the edge of the conductive base film is d1, the thickness of a metal coating on the middle part of the conductive base film is d2, the thickness of a target metal coating of the conductive base film is d3, d1-d2 is more than or equal to 20% d3, d1 is more than or equal to 40% d3, or d1 is more than or equal to 400mm.
3. Electroplating apparatus according to claim 1 or claim 2, wherein the anode assembly is an anode plate.
4. A plating apparatus according to claim 3, wherein said first anode module includes a plurality of anode units arranged in said second direction, adjacent two of said anode units being separated by an insulating medium;
The plurality of anode units comprise one or more second anode units positioned in the middle area of the first anode module, one or more first anode units positioned in the one end area of the first anode module and one or more third anode units positioned in the other end area of the first anode module;
the second anode unit is electrically connected to the power supply, and
The first anode unit and/or the third anode unit is/are electrically connected to the power supply and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit is/are not electrically connected to the power supply or the connected current is zero.
5. The plating apparatus as recited in claim 3, wherein said first anode module comprises a plurality of anode units, adjacent two of said anode units are separated by an insulating medium, said plurality of anode units of said first anode module are arranged in a matrix arrangement of a plurality of rows and a plurality of columns,
Wherein the plurality of anode units form a plurality of columns extending in the second direction, the anode units of each column including one or more second anode units located in a middle region of the first anode module, one or more first anode units located in an end region of the first anode module, one or more third anode units located in an other end region of the first anode module;
the second anode unit is electrically connected to the power supply, and
The first anode unit and/or the third anode unit are/is electrically connected to the power supply and the connected current is smaller than the connected current of the second anode unit, or the first anode unit and/or the third anode unit are/is not electrically connected to the power supply;
the plurality of anode units form a plurality of rows extending along the first direction, and the anode units positioned in the same row are connected in parallel.
6. A plating apparatus according to claim 3, wherein the central region of said first anode module includes a plurality of anode units arranged in said second direction, a plurality of said anode units being separated from each other by an insulating medium, a plurality of said anode units being electrically connected to said power source, respectively, and a current flowing through said anode units located in the middle of the central region in a direction perpendicular to said first direction being greater than a current flowing through said anode units located at both ends of said central region.
7. The plating apparatus as recited in claim 3, wherein the projections of the first anode module and the conductive base film on the bottom surface of the plating tank are a first projection and a second projection, respectively, and the first projection is located in the second projection.
8. A film plating machine comprising a plating apparatus according to any of the claims 1-7 for plating a conductive base film and a transport mechanism for clamping the conductive base film and moving the conductive base film in the first direction in the plating tank of the plating apparatus.
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