JP2010095783A - Horizontal electroplating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a horizontal electroplating apparatus capable of achieving reduction in the cost of power supply equipment through suppression of power supply capacity and reduction in the running cost of electrical energy by reducing the distance between an energizing roll and an anode electrode and suppressing the voltage loss of a conductive strip plate to be electroplated. <P>SOLUTION: A horizontal electroplating apparatus 10 includes an energizing roll 12 and a pressing roll 13 which carry a conductive strip plate 11 and anode electrodes 14 and 15 arranged by having a space on the surface of the conductive strip plate 11, wherein a plating solution 16 is fed between the conductive strip plate 11 and the anode electrodes 14 and 15 to electroplate the conductive strip plate 11. The outer diameter D of energized parts 21 and 22 on both sides in the axial direction of the energizing roll 12 is larger than the outer diameter d of other portions of the energizing roll 12. The energized parts 21 and 22 abut on the surface of the conductive strip plate 11. The anode electrode 14 has been arranged with a space in a space part 23 formed by the energizing roll 12 and the surface of the conductive strip plate 11 in the inside of the energized parts 21 and 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to a horizontal electroplating apparatus that continuously performs electroplating on a conductive belt-like plate (for example, a steel strip, a copper foil, or a stainless steel foil) conveyed in the horizontal direction.

Conventionally, as shown in FIG. 8, on the upper side and the lower side of the steel strip 110 that runs in the horizontal direction, or on one side thereof, an anode electrode 111 that is disposed in close proximity to the surface of the steel strip 110, and the anode A horizontal electroplating apparatus 113 having current-carrying rolls (also referred to as conductor rolls or CDRs) 112 disposed on the upstream side and the downstream side of the electrode 111 with a gap from the anode electrode 111 is disclosed (for example, (See Patent Documents 1 and 2). Reference numeral 114 denotes a pressing roll (also referred to as a backup roll) of the steel strip 110, 115 denotes a plating tank through which a plating solution flows, and 116 denotes a plating solution supply header that supplies the plating solution to the plating tank 115.
By supplying a plating solution from the plating solution supply header 116 between the anode electrode 111 and the steel strip 110 and supplying power to the energizing roll 112, the steel strip 110 can be electroplated.

Japanese Examined Patent Publication No. 61-21319 Japanese Patent Laid-Open No. 11-256393

However, since the outer diameter (diameter) of the energizing roll 112 used in the conventional horizontal electroplating apparatus 113 is generally large (for example, φ200 to 500 mm), from the center position of the energizing roll 112 in plan view. The distance X to the end of the anode electrode 111 is increased. Thus, as the distance X increases, the voltage loss due to the electrical resistance of the steel strip 110 itself increases, so that a large-capacity power supply is required. As a result, the power supply facility cost increases and the electrical energy consumption increases. There is a problem that the running cost also increases. In particular, when electroplating is performed on a conductive strip having a high electrical resistivity, the power supply equipment cost and the running cost of electrical energy are compared with the conductive strip having a low electrical resistivity when the distance X increases. Increase significantly.

On the other hand, if the energizing roll 112 and the anode electrode 111 are arranged close to each other and the distance X is shortened, the energizing roll 112 and the anode electrode 111 interfere with each other, so that there is a limit to shortening the distance X. Here, it is conceivable to reduce the outer diameter of the energizing roll and shorten the distance X, but in this case, the rigidity of the energizing roll is reduced. Usually, the energizing roll is pressed by the pressing roll through the steel strip so that the energizing roll can feed the steel strip uniformly in the width direction. For this reason, when the rigidity of the energizing roll is lowered, the amount of deflection of the energizing roll increases, so that uniform energization cannot be performed on the steel strip, and the plating thickness in the width direction of the steel strip becomes non-uniform.

The present invention has been made in view of such circumstances, and by reducing the distance between the current-carrying roll and the anode electrode as compared with the prior art and suppressing the voltage loss of the conductive strip plate for electroplating, the power supply by suppressing the power supply capacity It is an object of the present invention to provide a horizontal electroplating apparatus that can realize reduction in equipment cost and reduction in running cost of electric energy.

The horizontal electroplating apparatus according to the present invention that meets the above object has a gap between the upper and lower energizing rolls and pressing rolls that sandwich the conductive strips and transport them in the horizontal direction, and the surface of the conductive strips. In a horizontal electroplating apparatus that has an anode electrode disposed opposite to the electroplating plate, supplies a plating solution between the electroconductive strip plate and the anode electrode, and performs electroplating on the electroconductive strip plate,
The energizing roll has an outer diameter of energizing portions provided on both sides in the axial direction larger than an outer diameter of other portions of the energizing roll, and the energizing portion is in contact with the surface of the conductive belt-like plate. In addition, the anode electrode was disposed with a gap in a space formed by the energizing roll and the surface of the conductive strip plate inside the energizing portion on both sides.
Here, the surface of the conductive belt-shaped plate means one side (front side or back side) or both sides of the conductive strip.

In the horizontal electroplating apparatus according to the present invention, the pressing roll has an outer diameter of the pressing portion provided on both sides in the axial direction larger than an outer diameter of the other portion of the pressing roll, and the pressing portion is The anode electrode is placed in contact with the surface of the conductive strip, and a space is formed in the space formed by the pressing roll and the surface of the conductive strip inside the pressing portion on both sides. It is preferable to do.
In the horizontal electroplating apparatus according to the present invention, it is preferable that the rotational center position of the energizing roll is in a range from the upstream end position to the downstream end position of the anode electrode in plan view.
In the horizontal electroplating apparatus according to the present invention, the anode electrode is divided into three or more electrode portions in the width direction of the conductive strip plate, and the width of the conductive strip plate among the divided electrode portions. It is preferable to make the current value of the electrode part located in the center of the direction larger than the current value of the electrode parts located on both sides thereof.

In the horizontal electroplating apparatus according to the present invention, the anode electrode has a V-shaped cross section, and the interval between the anode electrode and the conductive strip is directed from the widthwise center of the conductive strip to both sides. It is preferable to gradually widen.
In the horizontal electroplating apparatus according to the present invention, on the upstream side or the downstream side of the anode electrode, a plurality of plating solution supply ports capable of individually controlling the supply amount of the plating solution are provided in the width direction of the conductive strip plate. The plating solution supply provided at the both sides of the flow rate of the plating solution supplied from the plating solution supply port located at the center in the width direction of the conductive belt-like plate is divided into three or more groups. It is preferable to make it faster than the flow rate of the plating solution supplied from the mouth.

The horizontal electroplating apparatus according to any one of claims 1 to 6, wherein the outer diameter of the current-carrying portion provided on both sides in the axial direction of the current-carrying roll is made larger than the outer diameter of other portions of the current-carrying roll, Since the anode electrode is disposed in the space formed by the current-carrying roll and the surface of the conductive belt-like plate, the distance between the anode electrode and the current-carrying roll can be made much smaller than before.
As a result, the voltage loss of the conductive strip can be reduced, so that it is possible to provide a horizontal electroplating apparatus that can reduce the power supply capacity compared to the prior art and can reduce the power supply facility cost and the running cost of electrical energy. Compared with the method in which the energizing roll is divided in the width direction (the energizing portions on both sides in the width direction of the conductive strip plate are energized by independent energizing rolls), it is easier to ensure the mounting position accuracy of the energizing roll. The rotation of the energizing rolls (energizing parts) on both sides in the width direction is always synchronized. As a result, it is possible to avoid the occurrence of defects such as wrinkles and tears due to poor plate-through properties of the conductive strip. Furthermore, in the system in which the energizing roll is divided in the width direction, a device for synchronizing the rotation of the energizing rolls on both sides in the width direction is separately required, and the structure becomes complicated.

In particular, in the horizontal electroplating apparatus according to claim 2, the outer diameters of the pressing portions provided on both sides in the axial direction of the pressing roll are made larger than the outer diameters of other portions of the pressing roll, and the inner sides of the pressing portions on both sides. The anode electrode is disposed in the space formed by the pressing roll and the surface of the conductive strip, and the energizing portion of the energizing roll and the pressing portion of the pressing roll are disposed at positions facing each other around the conductive strip. Therefore, the distance between the anode electrode and the pressing roll can be made much smaller than before.
As a result, the voltage loss of the conductive strip can be reduced, so that it is possible to provide a horizontal electroplating apparatus that can reduce the power supply capacity compared to the prior art and can reduce the power supply facility cost and the running cost of electrical energy.
In the horizontal electroplating apparatus according to claim 3, since the rotation center position of the energizing roll is in a range from the upstream end position to the downstream end position of the anode electrode in plan view, the distance between the anode electrode and the energizing roll is minimized. Can be.

In the horizontal electroplating apparatus according to claim 4, since the anode electrode is divided into three or more electrode portions in the width direction of the conductive strip, the current value of each electrode portion is changed in the width direction of the conductive strip. Can do.
At the time of electroplating, in order to supply power to the conductive strip from the energizing roll, the current flowing through the conductive strip is caused by bringing both ends in the width direction of the energizing roll (energized portion) into contact with the surface of the conductive strip. Compared with the widthwise central portion of the conductive strip, it becomes easier to flow on both sides in the widthwise direction. For this reason, the plating thickness on the conductive belt-shaped plate tends to be thicker on both sides in the width direction than on the center portion in the width direction.
Therefore, by making the current value of the electrode portion located in the center portion in the width direction of the conductive strip plate larger than the current value of the electrode portions located on both sides thereof, the energization amount in the width direction of the conductive strip plate is substantially reduced. It can be controlled to be uniform, and the plating thickness in the width direction of the conductive strip can be made substantially uniform.

In the horizontal electroplating apparatus according to claim 5, the anode electrode has a V-shaped cross section, and the interval between the anode electrode and the conductive strip is gradually increased from the widthwise center of the conductive strip to both sides. Voltage loss due to the plating solution existing between the anode electrode and the conductive strip can be reduced from both sides in the width direction of the conductive strip to the center in the width direction. This is because the voltage loss increases in proportion to the increase in the distance between the anode electrode and the conductive strip.
As a result, the plating current value can be increased from both ends in the width direction to the center in the width direction of the conductive strip, so that the amount of energization in the width direction of the conductive strip can be made substantially uniform. The plating thickness in the width direction can be made substantially uniform.

The horizontal electroplating apparatus according to claim 6 is provided with a plurality of plating solution supply ports divided into three or more groups in the width direction of the conductive strip on the upstream side or downstream side of the anode electrode. The supply flow rate of the plating solution to the conductive strip can be changed in the width direction of the plate.
When the supply flow rate of the plating solution is increased, the supply amount of metal ions to be plated per unit time increases, and plating with a high current becomes possible.
Therefore, by making the flow rate of the plating solution in the central portion in the width direction of the conductive strip plate faster than the flow rate of the plating solution on both sides thereof, from both ends in the width direction of the conductive strip plate toward the central portion in the width direction, Since the plating current value can be increased, the plating thickness in the width direction of the conductive strip can be made substantially uniform.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
Here, FIGS. 1A to 1C are a plan view, a partial front sectional view, a partial side sectional view, and FIGS. 2A and 2B, respectively, of the horizontal electroplating apparatus according to the first embodiment of the present invention. FIG. 3B is a plan view and a partial front sectional view of a horizontal electroplating apparatus according to the second embodiment of the present invention. FIG. 3 is a partial front sectional view of the horizontal electroplating apparatus according to the third embodiment of the present invention. 4A and 4B are a plan view and a partial cross-sectional view of a horizontal electroplating apparatus according to a fourth embodiment of the present invention, respectively, and FIGS. 5A and 5B are the present invention. FIG. 6A is a plan view of a horizontal electroplating apparatus according to a fifth embodiment of the present invention, FIG. 6A to FIG. 6E are views of a first method for forming a mesh pattern by a conductive portion on a support film. FIGS. 7A and 7B are diagrams illustrating the formation of a mesh pattern by a conductive portion on a support film. It is an illustration of the method.

As shown in FIGS. 1A to 1C, a horizontal electroplating apparatus (hereinafter also simply referred to as a plating apparatus) 10 according to a first embodiment of the present invention includes a conductive strip (hereinafter simply referred to as a strip). An energizing roll 12 (also referred to as a conductor roll) and a pressing roll (also referred to as a backup roll) 13 which are paired up and down and sandwiched and conveyed in a horizontal direction while sandwiching the plate 11, and both surfaces (front side surface) of the conductive strip 11 And the back side surface) are provided with anode electrodes 14 and 15 that are opposed to each other with a gap between them, and a plating solution 16 is supplied between the conductive strip plate 11 and the anode electrodes 14 and 15 to form a conductive strip shape. An apparatus for performing electroplating on the plate 11. This will be described in detail below.

The horizontal electroplating apparatus 10 has a plating tank 17 in which a plating solution 16 is flowed in the transport direction and the reverse direction of the conductive strip plate 11.
On the upstream side of the plating tank 17, an entrance 18 for the conductive strip 11 is provided, and on the downstream side of the plating tank 17, a discharge port (not shown) for the conductive strip 11 is provided. . The plating solution 16 is placed in the plating tank 17 at the center in the transport direction of the conductive strip 11 in the plating tank 17 and on both sides in the thickness direction of the conductive strip 11 (upper and lower portions of the plating tank 17). Plating solution supply headers (plating solution supply means) 19 and 20 having a plating solution supply port to be supplied are provided.
The plating tank 17 is rotatably provided with an energizing roll 12 that comes into contact with the upper surface of the conductive strip 11 conveyed into the plating tank 17 and a pressing roll 13 that comes into contact with the lower surface.

The energizing roll 12 feeds power to the conductive strip plate 11. The energizing portions 21 and 22 are provided on both sides in the axial direction, and the surface of the energizing portions 21 and 22 contacts the surface of the conductive strip plate 11. An insulating film (not shown) for preventing plating on the energizing roll 12 is formed on the surface of the energizing roll 12 except.
The length W1 in the axial direction of the energizing roll 12, that is, the length between the outer ends of the energizing portions 21 and 22 on both sides may be any length that can contact the surface of the conductive strip plate 11, for example, conductive It is the same as the width W of the belt-like plate 11 or wider than that, for example, in the range of 100 mm or less. In addition, the length (width) W2 of the part which contact | abuts the conductive strip | belt-shaped board 11 of the electricity supply parts 21 and 22 of the electricity supply roll 12 is 0.05 each from the outer end of the electricity supply parts 21 and 22 of the electricity supply roll 12, for example. It is adjusted within the range of × W to 0.2 × W.
Further, the outer diameter D of the energizing portions 21 and 22 of the energizing roll 12 is larger than the outer diameter d of other portions of the energizing roll 12. Here, the outer diameter d of the other part of the energizing roll 12 is adjusted within a range of 0.2 × D to 0.5 × D, for example. Note that the outer diameter D of the energization portions 21 and 22 of the energization roll 12 is, for example, about 200 mm or more and 500 mm or less.

In this way, the current-carrying portions 21 and 22 of the current-carrying roll 12 come into contact with both ends of the conductive belt-like plate 11, so that the upper surfaces of the current-carrying roll 12 and the conductive belt-like plate 11 are inside the current-carrying portions 21 and 22 on both sides. A space 23 is formed in a region surrounded by. Note that the shape of the pressing roll 13 is substantially the same as that of the energizing roll 12, and pressing portions 24 and 25 are provided on both sides in the axial direction, respectively, and pressing is performed inside the pressing portions 24 and 25 on both sides. A space 26 is formed in a region surrounded by the roll 13 and the lower surface of the conductive strip 11.
In these space portions 23 and 26, anode electrodes 14 and 15 are arranged with a gap so as not to contact the energizing roll 12 and the pressing roll 13, respectively. The anode electrodes 14 and 15 are attached and fixed to the plating tank 17 and positioned.

At this time, the rotational center position of the energizing roll 12 is set within the range from the upstream end position to the downstream end position of the anode electrode 14 in plan view. That is, when the distance from the upstream end position of the anode electrode 14 to the rotation center position of the energizing roll 12 is L in plan view, the distance L is the distance from the upstream end position of the anode electrode 14 to the downstream end position. It is within the range of L _0.
The same applies to the pressing roll 13.
As described above, the energizing portions 21 and 22 of the energizing roll 12 are brought into contact with the conductive strip plate 11, and an electric circuit is formed between the anode electrodes 14 and 15 via the conductive strip plate 11. The conductive belt-like plate 11 can be electroplated by supplying power to the conductive belt-like plate 11.

Next, a method for performing electroplating using the horizontal electroplating apparatus 10 according to the first embodiment of the present invention will be described.
First, the concentration-adjusted plating solution 16 is continuously supplied into the plating tank 17 from the plating solution supply ports of the plating solution supply headers 19 and 20, and power is supplied from the energizing roll 12 to the conductive strip plate 11. As this plating solution, for example, zinc sulfate, copper sulfate or the like can be used.
Next, by rotating the energizing roll 12 and the pressing roll 13 in opposite directions, the conductive strip 11 is continuously entered into the plating tank 17 through the entrance 18. For example, a steel strip, a copper foil, or a stainless steel foil can be used as the conductive strip.

Thereby, the distance between the current-carrying roll 12 and the anode electrodes 14 and 15 can be made shorter than before, voltage loss of the conductive belt-like plate 11 for performing electroplating can be suppressed, and power supply facility cost can be reduced by suppressing power supply capacity. In addition, since the running cost of electrical energy can be reduced, the plating layer can be formed on the surface of the conductive strip 11 with good economic efficiency.
In addition, since the electroplating is not performed on the contact surface between the energizing roll 12 and the pressing roll 13 and the conductive strip plate 11 or the plating thickness is thin, the both end portions of the conductive strip plate 11 after plating are cut. You can throw it away.
Note that the thickness and properties of the plating layer depend on, for example, the concentration of the conductive strip 11, the concentration of the plating solution 16, the supply rate of the plating solution 16 into the plating tank 17, and the current values of the anode electrodes 14 and 15. Alternatively, it can be controlled by adjusting the conveyance speed of the conductive strip 11 or the like.

Next, a horizontal electroplating apparatus 30 according to a second embodiment of the present invention will be described with reference to FIGS. 2 (A) and 2 (B). In the above-described first embodiment of the present invention, FIG. The same members as those of the horizontal electroplating apparatus 10 are denoted by the same reference numerals, and only different portions will be described.
In the space portions 23 and 26 formed on both sides in the thickness direction of the conductive strip 11, anode electrodes 31 and 32 are arranged, respectively. Each of the anode electrodes 31 and 32 is divided into three electrode portions 33 to 35 and electrode portions 36 to 38 in the width direction of the conductive strip 11. The electrode portions 33 to 35 (the same applies to the electrode portions 36 to 38) may have different widths (for example, the width of the electrode portion 34 located in the center is set to the electrode portions 33 located on both sides thereof). , 35 wider than 35). An insulator is sandwiched between the electrode portions 33 to 35 and 36 to 38.

At this time, among the electrode portions 33 to 35 constituting the anode electrode 31 (also the anode electrode 32) disposed above the conductive strip plate 11, the electrode portion located at the center in the width direction of the conductive strip plate 11. The current value A1 of 34 is made larger than the current value A2 of the electrode portions 33 and 35 located on both sides thereof (for example, the current value A1 exceeds 1 time of the current value A2 and is 1.5 times or less). Thereby, a plating layer having a uniform thickness can be formed across the width direction of the conductive belt-like plate 11.
In addition, although the case where the anode electrode was divided into three electrode portions in the width direction of the conductive belt-like plate was described, it may be divided into four or more electrode portions. For example, when the anode electrode is divided into four electrode parts, the electrode part located at the center part in the width direction of the conductive strip 11 means two parts at the center part excluding both side parts. Further, when the anode electrode is divided into five or more electrode portions, each current value is gradually increased from the electrode portions located on both sides in the width direction of the conductive strip 11 to the electrode portion located in the center portion. Good. Thereby, a plating layer having a more uniform thickness can be formed in the width direction of the conductive belt-like plate 11.

A horizontal electroplating apparatus 40 according to the third embodiment of the present invention will be described with reference to FIG. 3, but the same member as the horizontal electroplating apparatus 10 according to the first embodiment of the present invention described above is used. Are given the same numbers, and only different parts will be described.
In the space portions 23 and 26 formed on both sides in the thickness direction of the conductive strip 11, anode electrodes 41 and 42 are arranged, respectively. The anode electrode 41 (also the anode electrode 42) has a V-shaped cross section, and the distance between the anode electrode 41 and the conductive strip plate 11 is determined from the central portion (center position) of the conductive strip plate 11 in the width direction. and gradually increased toward the both sides (for example, the minimum interval _{G 1,} 0.8 times 0.1 times the maximum distance _{G 2).}
Thereby, a plating layer having a more uniform thickness can be formed in the width direction of the conductive belt-like plate 11.

A horizontal electroplating apparatus 50 according to the fourth embodiment of the present invention will be described with reference to FIGS. 4A and 4B. The horizontal electric plating apparatus according to the first embodiment of the present invention described above will be described. The same members as those of the plating apparatus 10 are denoted by the same reference numerals, and only different portions will be described.
A plating solution 16 is supplied into the plating tank 17 at the center in the transport direction of the conductive strip 11 in the plating tank 17 and on both sides in the thickness direction of the conductive strip 11 (upper and lower portions of the plating tank 17). Plating solution supply headers 51 and 52 having a plurality of plating solution supply ports are provided. Accordingly, the plating solution supply headers 51 and 52 are disposed downstream of the anode electrodes 31 and 32 disposed on the inlet 18 side of the plating tank 17 and disposed on the discharge port side. , 32 are arranged on the upstream side thereof.
The anode electrodes 31 and 32 divided in the width direction of the conductive belt-like plate 11 are used for the anode electrode, but the anode electrodes 14 and 15 described above are used instead of the anode electrodes 31 and 32. May be used.

Further, the horizontal electroplating apparatus 60 according to the fifth embodiment of the present invention shown in FIGS. 5A and 5B is provided in the space portions 23 and 26 formed on both sides in the thickness direction of the conductive strip 11. Anode electrodes 61 and 62 are disposed, respectively. The anode electrodes 61 and 62 are longer in the transport direction of the conductive strip 11 than the anode electrodes 31 and 32.
A plurality of plating solutions for supplying the plating solution 16 into the plating tank 17 on the upstream side of the anode electrodes 61 and 62 (on the entrance 18 side of the plating tank 17) and on both sides in the thickness direction of the conductive strip 11. Supply ports 63 and 64 are provided. For this reason, the plating solution supply header is not provided in the center part in the conveyance direction of the conductive strip 11 of the plating tank 17.

The plurality of plating solution supply ports and the plurality of plating solution supply ports 63 and 64 provided in the plating solution supply headers 51 and 52 described above can control the supply amount of the plating solution 16 by, for example, a valve (not shown). Individual control is possible.
Thus, the plurality of plating solution supply ports are divided into three groups (that is, one group has one or a plurality of plating solution supply ports) in the width direction of the conductive strip plate 11, and the width of the conductive strip plate 11 is divided. The flow rate of the plating solution supplied from the plating solution supply port of the group located in the center in the direction can be made higher than the flow rate of the plating solution supplied from the plating solution supply port of the group located on both sides thereof (for example, the minimum flow rate) In the range of 0.1 to 0.8 times the maximum flow rate).
The arrows from the plating solution supply headers 51 and 52 shown in FIGS. 4A and 4B and the arrows from the plating solution supply ports 63 and 64 shown in FIGS. 5A and 5B are respectively plated. The direction in which the liquid flows is shown.

Here, the case where the plurality of plating solution supply ports are divided into three groups in the width direction of the conductive belt-shaped plate has been described, but may be divided into four or more groups. For example, when a plurality of plating solution supply ports are divided into four groups, the plating solution supply port located in the central portion in the width direction of the conductive strip 11 is the plating of two groups in the central portion excluding the groups on both sides. It means the liquid supply port. Further, when the plurality of plating solution supply ports are divided into five or more groups, from the group of plating solution supply ports located on both sides in the width direction of the conductive belt-like plate 11, the group of plating solution supply ports located in the center portion , The flow rate of each plating solution should be gradually increased.
Thereby, a plating layer having a more uniform thickness can be formed in the width direction of the conductive belt-like plate 11.

In the horizontal electroplating apparatus according to the first to fifth embodiments of the present invention described above, it is possible to plate the conductive strip plate 11 that is the object to be plated as follows.
The conductive belt-like plate 11 has a resin support film and a conductive portion formed on the support film. The conductive portion may be formed on the entire surface of the support film, but its shape varies depending on the application. For example, in the use of a translucent electromagnetic wave shielding film, the conductive portion has a mesh pattern shape.

The conductive strip 11 has a surface resistance of 0.3Ω / sq. When it is the above, the suppression effect of the voltage loss by the horizontal type electroplating apparatus which concerns on the 1st-5th embodiment of this invention is large. In particular, from the viewpoint of the effect of suppressing voltage loss due to electrical resistance, the surface resistance is 1 Ω / sq. 5 Ω / sq. In addition, 10Ω / sq. The higher the resistance, the greater the effect of the present invention. Note that the surface resistance of the conductive strip 11 is 500 Ω / sq. If it exceeds 1, sufficient conductivity cannot be obtained, so that there is a possibility that problems such as non-uniform plating layers occur in the plating process. Therefore, the conductive strip 11 has a surface resistance of 500Ω / sq. The following are preferable, and further 100Ω / sq. The following are more preferable.

The conductive strip 11 is sandwiched between the energizing roll 12 and the pressing roll 13 and conveyed into the plating tank 17. At this time, power is supplied to the conductive strip 11 by the energizing roll 12, and the plating solution is supplied into the plating tank 17, so that the anode electrodes 14, 15, 31, 32, 41, 42, 61 are supplied. , 62 is subjected to a plating process.
By this plating treatment, a plating layer is formed on the conductive strip 11. For example, in a form in which the conductive strip has a resin support film and a conductive portion formed thereon, a plating layer is formed on the conductive portion, and the conductivity of the conductive strip can be improved. .

Here, the 1st-4th method of forming the mesh-like pattern by an electroconductive part (metal fine wire) on a support film (transparent film) is each demonstrated.

In the first method, as shown in FIGS. 6A to 6E, a metal silver portion 92 formed by exposing, developing and fixing a silver salt photosensitive layer 88 provided on a transparent film 70. In this method, the mesh pattern 94 is formed.
Specifically, as shown in FIG. 6A, a silver salt photosensitive material obtained by mixing silver halide 84 (for example, silver bromide grains, silver chlorobromide grains, or silver iodobromide grains) with gelatin 86, as shown in FIG. Layer 88 is applied over transparent film 70. 6A to 6C, the silver halide 84 is represented as “grains”, but is exaggerated to help understanding of the present invention. It does not indicate etc.

Thereafter, as shown in FIG. 6B, the silver salt photosensitive layer 88 is subjected to exposure necessary for forming the mesh pattern 94. At this time, the silver halide 84 is exposed to light energy and generates minute silver nuclei called “latent image” that cannot be observed with the naked eye.
Next, in order to amplify the latent image into a visualized image, development processing is performed as shown in FIG. Specifically, the silver salt photosensitive layer 88 on which the latent image is formed is developed with a developing solution (although both alkaline and acidic solutions are usually alkaline solutions). In this development processing, silver ions supplied from silver halide grains or a developer are reduced to metallic silver by using a reducing agent called a developing agent in the developer as a latent image silver nucleus as a catalyst nucleus. The latent image silver nuclei are amplified to form a visualized silver image (developed silver 90).

After the development processing, the silver halide 84 that can be exposed to light remains in the silver salt photosensitive layer 88. To remove this, a fixing processing solution (acidic) is used as shown in FIG. Fixing is performed by using both a solution and an alkaline solution, but usually an acidic solution is often used).
By performing this fixing process, the metal silver portion 92 is formed in the exposed portion, and only the gelatin 86 remains in the unexposed portion to become the light transmissive portion 54. That is, a mesh pattern 94 is formed on the transparent film 70 by a combination of the metallic silver portion 92 and the light transmitting portion 54.

The reaction formula of the fixing process when silver bromide is used as the silver halide 84 and the fixing process is performed with thiosulfate is shown below.
AgBr (solid) + 2 S ₂ O ₃ ions → Ag (S ₂ O ₃ ) ₂ (easily water-soluble complex)
That is, two thiosulfate ions S ₂ O ₃ and silver ions in gelatin 86 (silver ions from AgBr) form a silver thiosulfate complex. Since this silver thiosulfate complex has high water solubility, it is eluted from gelatin 86. As a result, the developed silver 90 is fixed and remains as the metallic silver portion 92.
The metallic silver portion 92 forms a mesh pattern 94.

The development step is a step of causing the reducing agent to react with the latent image to precipitate the developed silver 90, and the fixing step is a step of eluting the silver halide 84 that did not become the developed silver 90 into water. For details, see T.W. H. James, The Theory of the Photographic Process, 4th ed. , Macmillan Publishing Co. , Inc, NY, Chapter 15, pp. 438-442. See 1977.

Of course, as shown in FIG. 6 (E), after forming the metallic silver portion 92 as described above, further plating is performed so that the conductive metal 96 is supported only on the metallic silver portion 92. The mesh pattern 94 may be formed by the metal silver portion 92 and the conductive metal 96 supported on the metal silver portion 92.

Subsequently, the second method will be described.
In this method, as shown in FIG. 7A, for example, a photoresist film 100 on a copper foil 98 formed on a transparent film 70 is exposed and developed to form a resist pattern 102. FIG. As shown in FIG. 4B, the mesh pattern 94 is formed by the copper foil 98 by etching the copper foil 98 exposed from the resist pattern 102.

The third method is a method of forming a mesh pattern by printing a paste containing fine metal particles on a transparent film. Of course, the printed paste may be subjected to metal plating to form a mesh pattern by the paste and metal plating.
The fourth method is a method of forming a mesh pattern by printing a metal thin film on a transparent film with a screen printing plate or a gravure printing plate.
By these first to fourth methods, a conductive portion having a mesh-like pattern is formed, and further, by performing plating using the horizontal electroplating apparatus of the present invention, the electrical characteristics of the conductive portion can be improved.

Next, a method for forming a mesh pattern using a silver halide photographic light-sensitive material, which is a particularly preferable aspect, in the conductive belt-like plate according to the present embodiment will be described in more detail.
The mesh pattern forming method includes the following three modes depending on the photosensitive material and the form of development processing.
(1) An embodiment in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically or physically developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black and white photosensitive material containing physical development nuclei in a silver halide emulsion layer is physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material that does not contain physical development nuclei and an image-receiving sheet having a non-photosensitive layer that contains physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting electromagnetic wave shielding film or a light-transmitting conductive film is formed on the photosensitive material. The obtained developed silver is chemically developed silver or physical developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the aspect (2), the light-transmitting conductive film is formed on the photosensitive material by dissolving the silver halide near the physical development nucleus and depositing on the development nucleus in the exposed portion. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but the specific surface of developed silver is a small sphere.

In the aspect (3), the light-transmitting conductive film is formed on the image receiving sheet by dissolving and diffusing the silver halide in the unexposed area and depositing on the development nuclei on the image receiving sheet. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.
In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977).

The photosensitive material used will be described below.
[Transparent film]
A flexible plastic film can be used as the transparent film.
Examples of the raw material for the plastic film include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyvinyl chloride, polyvinylidene chloride, polyvinyl butyral, polyamide, polyether, polysulfone, polyethersulfone, polycarbonate, and polyarylate. , Polyetherimide, polyetherketone, polyetheretherketone, polyolefins such as EVA, polycarbonate, triacetylcellulose (TAC), acrylic resin, polyimide, or aramid can be used.
In the present embodiment, polyethylene terephthalate film is suitable for the plastic film from the viewpoint of translucency, heat resistance, ease of handling and price, but it is appropriately selected depending on the necessity of heat resistance and thermoplasticity. Is done.

[Protective layer]
The photosensitive material used may be provided with a protective layer on the emulsion layer described later.
The protective layer means a layer made of a binder such as gelatin or a high molecular polymer, and is formed in an emulsion layer having photosensitivity in order to exhibit an effect of preventing scratches and improving mechanical properties. The protective layer is preferably not provided for the plating treatment, and even if provided, the protective layer is preferably thin. The thickness is preferably 0.2 μm or less. The formation method of the coating method of the said protective layer is not specifically limited, A well-known coating method can be selected suitably.

[Emulsion layer]
The light-sensitive material preferably has an emulsion layer (silver salt-containing layer) containing a silver salt as an optical sensor on a transparent film.
In addition to the silver salt, the emulsion layer can contain a dye, a binder, a solvent, and the like, if necessary.

<Silver salt>
The silver salt used in the present embodiment is preferably an inorganic silver salt such as silver halide. In particular, the silver salt is preferably used in the form of silver halide grains for a silver halide photographic light-sensitive material. Silver halide is excellent in characteristics as an optical sensor.
In the present embodiment, it is preferable to use silver halide in order to function as an optical sensor, and a technique used for silver halide photographic film, photographic paper, printing plate making film, emulsion mask for photomask, etc. relating to silver halide. Can also be used in this embodiment.

<Binder>
In the emulsion layer, a binder can be used for the purpose of uniformly dispersing silver salt grains and assisting the adhesion between the emulsion layer and the support.
As the binder, either a water-insoluble polymer or a water-soluble polymer can be used, but a water-soluble polymer is preferably used. For example, gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, polyacrylic acid, polyalginic acid, polyhyaluronic acid And carboxycellulose. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the emulsion layer is preferably adjusted so that the Ag / binder volume ratio in the silver salt-containing layer is 1/4 or more, and is adjusted to be 1/2 or more. Is more preferable.

<Solvent>
The solvent used for the formation of the emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.

The silver halide photographic light-sensitive material and the method for forming a mesh pattern using the same can be used in appropriate combination with the technique disclosed in the following publication.
For example, JP-A-2004-221564, JP-A-2004-221565, JP-A-2007-200902, JP-A-2006-352073, WO2006 / 001461, JP-A-2007-129205. JP, 2007-235115, JP, 2007-207987, JP, 2006-012935, JP, 2006-010795, JP, 2006-228469, JP, 2006-332459, JP 2007-207987, JP 2007-226215, WO 2006/088059, JP 2006-261315, JP 2007-072171, JP 2007-102200, JP 2006-22 No. 473, No. 2006-267995, No. 2006-267635, No. 2006-267627, WO 2006/098333, No. 2006-324203, Japanese Patent Application No. 2007-84868. Japanese Patent Application No. 2007-91938, Japanese Patent Application No. 2007-93021, Japanese Patent Application No. 2007-93209, Japanese Patent Application No. 2007-134082, and Japanese Patent Application No. 2007-134083.

As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the configuration described in the above embodiment, and the matters described in the scope of claims. Other embodiments and modifications conceivable within the scope are also included. For example, the case where the horizontal electroplating apparatus of the present invention is configured by combining some or all of the above-described embodiments and modifications is also included in the scope of the right of the present invention.
Moreover, in the said embodiment, although the case where the anode electrode was opposingly arranged on both surfaces of the electroconductive strip | belt board was demonstrated, you may oppose and arrange | position only on the single side | surface (upper surface or lower surface) of an electroconductive strip | belt board.

(A)-(C) are the top view, the partial front sectional view, and the partial side sectional view of the horizontal type electroplating apparatus which concern on the 1st Embodiment of this invention, respectively. (A), (B) is the top view and partial front sectional view of a horizontal type electroplating apparatus which concern on the 2nd Embodiment of this invention, respectively. It is a partial front sectional view of a horizontal electroplating apparatus according to a third embodiment of the present invention. (A), (B) is the top view of the horizontal type electroplating apparatus which concerns on the 4th Embodiment of this invention, respectively, and a partial sectional side view. (A), (B) is the top view of the horizontal type electroplating apparatus which concerns on the 5th Embodiment of this invention, respectively, and a partial sectional side view. (A)-(E) are explanatory drawings of the 1st method of forming the mesh-like pattern by an electroconductive part on a support film. (A), (B) is explanatory drawing of the 2nd method of forming the mesh-like pattern by an electroconductive part on a support film. It is explanatory drawing of the horizontal type electroplating apparatus which concerns on a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Horizontal type electroplating apparatus, 11: Conductive strip, 12: Current supply roll, 13: Pressing roll, 14, 15: Anode electrode, 16: Plating solution, 17: Plating tank, 18: Entrance, 19, 20: Plating solution supply header, 21, 22: current-carrying part, 23: space part, 24, 25: pressing part, 26: space part, 30: horizontal electroplating apparatus, 31, 32: anode electrode, 33-38: electrode part, 40: Horizontal electroplating apparatus, 41, 42: Anode electrode, 50: Horizontal electroplating apparatus, 51, 52: Plating solution supply header, 54: Light transmission part, 60: Horizontal electroplating apparatus, 61, 62: Anode electrode 63, 64: plating solution supply port, 70: transparent film, 84: silver halide, 86: gelatin, 88: silver salt photosensitive layer, 90: developed silver, 92: metallic silver part, 94: mesh pattern, 96 : Conductive gold , 98: copper foil, 100: photoresist film, 102: resist pattern

Claims (6)

An energizing roll and a pressing roll which are paired up and down to sandwich the conductive strip and transport it in the horizontal direction, and an anode electrode disposed oppositely with a gap on the surface of the conductive strip, In a horizontal electroplating apparatus for supplying a plating solution between a conductive strip and the anode electrode and performing electroplating on the conductive strip,
The energizing roll has an outer diameter of energizing portions provided on both sides in the axial direction larger than an outer diameter of other portions of the energizing roll, and the energizing portion is in contact with the surface of the conductive belt-like plate. A horizontal electroplating apparatus, wherein the anode electrode is disposed with a gap in a space formed by the energizing roll and the surface of the conductive strip plate inside the energizing section on both sides. . 2. The horizontal electroplating apparatus according to claim 1, wherein the pressing roll has an outer diameter of a pressing portion provided on both sides in an axial direction larger than an outer diameter of another portion of the pressing roll, and the pressing portion has The anode electrode is in contact with the surface of the conductive belt-like plate and has a gap in a space formed by the pressure roll and the surface of the conductive belt-like plate inside the pressing portion on both sides. A horizontal electroplating apparatus characterized by being arranged. 3. The horizontal electroplating apparatus according to claim 1, wherein a rotation center position of the energizing roll is in a range from an upstream end position to a downstream end position of the anode electrode in a plan view. A feature of horizontal electroplating equipment. 4. The horizontal electroplating apparatus according to claim 1, wherein the anode electrode is divided into three or more electrode portions in the width direction of the conductive belt-shaped plate, and the divided electrode portions Among these, the horizontal electroplating apparatus is characterized in that the current value of the electrode portion located in the central portion in the width direction of the conductive strip is made larger than the current value of the electrode portions located on both sides thereof. 5. The horizontal electroplating apparatus according to claim 1, wherein the anode electrode has a V-shaped cross section, and an interval between the anode electrode and the conductive belt plate is set to be different from that of the conductive belt plate. A horizontal electroplating apparatus characterized by gradually spreading from the center in the width direction toward both sides. 6. The horizontal electroplating apparatus according to claim 1, wherein a plurality of plating solution supply ports capable of individually controlling the supply amount of the plating solution are provided on the upstream side or the downstream side of the anode electrode. The flow rate of the plating solution that is provided by being divided into three or more groups in the width direction of the conductive strip plate and that is supplied from the plating solution supply port located in the center portion in the width direction of the conductive strip plate, A horizontal electroplating apparatus characterized by being made faster than the flow rate of the plating solution supplied from the plating solution supply port located on both sides thereof.

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