JP6053184B2 - Touch panel - Google Patents

Description

  The present invention relates to a touch panel provided in, for example, a multi-function mobile phone such as a smartphone or a portable game machine.

  For example, smartphones and notebook mobile devices are used in various environments by being carried around.

  A conventional touch panel uses, for example, an ITO (indium tin oxide) film as a sensing electrode as disclosed in Patent Document 1.

  Conventionally, a touch panel having a tertiary polyhedral shape formed by bending an end of a plane has been disclosed (see Patent Document 2). Furthermore, a cube-shaped information processing device in which electrostatic touch sensors are provided on the surface and four side surfaces of the mobile terminal device is also disclosed (see Patent Document 3).

JP 2009-259003 A Japanese Patent Laid-Open No. 2001-154592 JP 2010-262557 A

  By the way, when the touch panel is used in a low humidity environment, charging due to static electricity or discharging due to electricity storage occurs. They may become noise and enter the capacitive sensing electrode portion, causing malfunctions such as malfunction and electrostatic breakdown of the sensor.

  On the other hand, measures have been taken to reduce the influence of noise contamination by using a shielding metal member for the housing part or providing a shield line on the sensor board. Since the weight is increased and the cost of parts is high, the usage is limited.

  Further, the shield line on the sensor substrate also requires a large shield layer in order to sufficiently remove noise, and none of the shield lines with a limited area can sufficiently exhibit the shielding effect.

  In particular, in a touch panel having a third-order polyhedral shape described in Patent Document 2 and an information processing apparatus in which electrostatic touch sensors are provided on a plurality of surfaces described in Patent Document 3, in addition to a shield for each touch panel, Shielding between adjacent touch panels is also necessary, and the formation of shield lines is complicated.

  The present invention has been made in order to solve the above-described problem, and in a touch panel having touch panel portions on two or more surfaces, a touch panel capable of obtaining a shielding effect while securing the area of the touch surface of each touch panel portion. The purpose is to provide.

[1] A touch panel according to the present invention has a plurality of touch panel units respectively installed on at least a main surface of an electronic device and at least one side surface adjacent to the main surface among a plurality of surfaces of the electronic device. The plurality of touch panel units each have a plurality of sensing electrodes, and the plurality of sensing electrodes are formed on a flexible substrate common to the plurality of touch panel units. A shield film is disposed on at least a part of the portion corresponding to the ridgeline.

  Here, the ridge line of the electronic device indicates a side shared by the main surface and the side surface of the electronic device and a side shared by two adjacent side surfaces. The side includes a straight line and a curved line. In addition, there is a case where a constant potential is applied to the shield film, a case where it is grounded, and a case where it is floating.

  Furthermore, “on the flexible substrate” includes the case where the sensing electrode is directly formed on the flexible substrate and the case where the sensing electrode is not directly formed on the flexible substrate. Further, “on the flexible substrate” includes a case where the shield film is directly provided on the flexible substrate and a case where the shield film is not directly provided on the flexible substrate.

[2] In the present invention, the shield film may be disposed on a surface opposite to the electronic device among the two opposing surfaces of the flexible substrate. The “arrangement on the surface” includes a case where it is arranged directly on the surface and a case where it is not arranged directly on the surface. The same applies hereinafter.

[3] In the present invention, the shield film may be disposed on the surface facing the electronic device among the two opposing surfaces of the flexible substrate.

[4] In the present invention, the plurality of sensing electrodes corresponding to each touch panel unit may be independent in each touch panel unit.

[5] In the present invention, the flexible substrate has a through hole that electrically connects the side having the shield film and the opposite side, and at least the wiring of the sensing electrode is connected to the opposite side through the through hole. You may concentrate.

[6] In the present invention, at least one of the plurality of sensing electrodes may be common to two or more touch panel units.

[7] In the present invention, a protective layer that covers the plurality of sensing electrodes may be further provided, and a shield film may be formed on the protective layer.

[8] In the present invention, each touch panel unit may have a sensor region in which a plurality of sensing electrodes are formed, and the shield film may be formed in a region surrounding the sensor region in each touch panel unit.

[9] In the present invention, the plurality of sensing electrodes formed on the flexible substrate may include a plurality of first sensing electrodes and a plurality of second sensing electrodes.

[10] In this case, both the first sensing electrode and the second sensing electrode may be formed on one main surface of the flexible substrate.

[11] Alternatively, the first sensing electrode may be formed on one main surface of the flexible substrate, and the second sensing electrode may be formed on the other main surface of the flexible substrate.

[12] In [9], the plurality of first sensing electrodes and the plurality of second sensing electrodes are provided on the surfaces of different flexible substrates, respectively, and the first possible electrode having the plurality of first sensing electrodes is provided. A flexible substrate and a second flexible substrate provided with a plurality of second sensing electrodes may be stacked.

[13] In the present invention, the plurality of sensing electrodes include a plurality of first sensing electrodes and a plurality of second sensing electrodes, and the plurality of second sensing electrodes are provided on one main surface of the flexible substrate. The insulating film may be provided on the plurality of second sensing electrodes, and the plurality of first sensing electrodes may be formed on the insulating film.

[14] In the present invention, the plurality of sensing electrodes may be configured by combining a large number of cells made of fine metal wires.

  According to the touch panel according to the present invention, in a touch panel having touch panel portions on two or more surfaces, it is possible to obtain a shielding effect while ensuring the area of the touch surface of each touch panel portion.

FIG. 1A is a perspective view showing an electronic device provided with a touch panel according to the present embodiment, and FIG. 1B is a cross-sectional view thereof. 2A is a cross-sectional view showing an example of a main part of the touch panel according to the present embodiment, and FIG. 2B is a cross-sectional view showing another example. It is a top view which shows the principal part of an electroconductive film seeing from the top. 4A is a cross-sectional view showing a main part of a touch panel according to a first modification, and FIG. 4B is a cross-sectional view showing a main part of a touch panel according to a second modification. It is a top view which shows the principal part of the electroconductive film of the touchscreen which concerns on a 1st modification seeing from the top. It is a top view which shows the principal part of the electroconductive film of the touchscreen which concerns on a 2nd modification seeing from the top. It is a top view which shows the principal part of the electroconductive film of the touchscreen which concerns on a 3rd modification seeing from the top. FIG. 8A is a cross-sectional view showing the main part of the touch panel according to the fourth modification, FIG. 8B is a cross-sectional view showing the main part of the touch panel according to the fifth modification, and FIG. 8C is a touch panel according to the sixth modification. It is sectional drawing which shows the principal part. FIG. 9A is a cross-sectional view showing a main part of a touch panel according to a seventh modification, and FIG. 9B is a cross-sectional view showing a main part of a touch panel according to an eighth modification. FIG. 10A is a cross-sectional view showing the main part of the touch panel according to the ninth modification, and FIG. 10B is a cross-sectional view showing the main part of the touch panel according to the tenth modification. FIG. 11A is a cross-sectional view showing the main part of the touch panel according to the eleventh modification, and FIG. 11B is a cross-sectional view showing the main part of the touch panel according to the twelfth modification. 12A is a cross-sectional view showing a main part of a touch panel according to a thirteenth modification, and FIG. 12B is a cross-sectional view showing a main part of a touch panel according to a fourteenth modification.

  Hereinafter, embodiments of a touch panel according to the present invention will be described with reference to FIGS. 1A to 12B. The present invention is not limited to the following embodiments. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.

  First, the touch panel 10 according to the first embodiment is installed between the electronic device 12 and the housing 14 as shown in FIGS. 1A and 1B.

  The electronic device 12 includes a surface 16a that is a main surface, a back surface 16b that faces the surface 16a, and four side surfaces 18a to 18d that are adjacent to the surface 16a. The electronic device 12 includes a display panel 20 that displays at least an image, text, and the like, and the display surface of the display panel 20 constitutes a main surface (front surface 16a) of the electronic device. Examples of the display panel 20 include a liquid crystal display and an organic EL display (Organic Electro-Luminescence). In the electronic device 12, a circuit board 22 on which an electronic circuit for controlling the display panel 20, a touch panel 10 to be described later, control of data communication, and the like is mounted on the back side of the display panel 20.

  The housing 14 is configured by a cover layer 24 having transparency and flexibility, and protects the front surface 16a, four side surfaces (first side surface 18a to fourth side surface 18d) and the back surface 16b of the electronic device 12. The cover layer 24 may be a resin layer having a single-layer structure or a laminate in which resin layers are laminated in multiple layers.

  The touch panel 10 includes a conductive film 26 that is a sensor body and a control circuit 28 (configured by an IC circuit or the like). The control circuit 28 is mounted on the circuit board 22.

  The conductive film 26 is formed in a three-dimensional shape so as to follow the shape of the housing 14 on the inner surface of the housing 14, that is, the portion facing the electronic device 12. For example, in the example of FIG. 1A, since the outer shape of the electronic device 12 has a quadrangular pyramid shape, the conductive film 26 constituting the touch panel 10 is also formed in a three-dimensional shape so as to follow the shape of the electronic device 12. ing.

  As shown in FIGS. 2A to 3, the conductive film 26 includes a transparent and flexible substrate (hereinafter referred to as a flexible substrate 30) and one surface (for example, a surface) of the flexible substrate 30. 30a) and a plurality of second sensing electrodes 32b formed on the other surface (for example, the back surface 30b) of the flexible substrate 30. In addition, FIG. 3 has shown the state which expand | deployed the electroconductive film 26 shape | molded by the three-dimensional shape in planar shape. The same applies to FIGS. 5 to 7.

  Each of the first sensing electrode 32a and the second sensing electrode 32b preferably has a mesh pattern 36 formed by combining a number of cells 34. The first sensing electrodes 32a extend in the first direction (y direction) and are arranged in a second direction (x direction) orthogonal to the first direction. The second sensing electrodes 32b extend in the second direction (x direction) and are arranged in a first direction (y direction) orthogonal to the second direction. Here, the “cell” refers to a shape two-dimensionally partitioned by a plurality of fine metal wires 38.

  As shown in FIG. 3, the first sensor region 40A facing the surface 16a of the electronic device 12 in the conductive film 26 has a first sensing electrode 32a and a plurality of second sensing electrodes 32b. A touch panel unit 42A is configured. Similarly, the second touch panel portion 42B is configured in the second sensor region 40B facing the first side surface 18a of the electronic device 12, and the third sensor region 40C facing the second side surface 18b of the electronic device 12 is third. A touch panel unit 42C is configured. The fourth touch panel portion 42D is configured in the fourth sensor region 40D facing the third side surface 18c of the electronic device 12, and the fifth touch panel is formed in the fifth sensor region 40E facing the fourth side surface 18d of the electronic device 12. Part 42E is configured.

  In the first sensor region 40A to the fifth sensor region 40E, the first sensing electrode 32a and the second sensing electrode 32b are independently formed. That is, the first sensing electrodes 32a and the second sensing electrodes 32b in the first to fifth touch panel units 42A to 42E are formed on the flexible substrate 30 that is common to the first to fifth touch panel units 42A to 42E. Is done.

  Further, the conductive film 26 has a first terminal wiring area 44A to a fifth terminal wiring area 44E corresponding to the first sensor area 40A to the fifth sensor area 40E. In the first terminal wiring region 44A, the first terminal wiring portions 46a from the plurality of first sensing electrodes 32a and the second terminal wiring portions 46b from the plurality of second sensing electrodes 32b in the first sensor region 40A are formed. .

  That is, in the surface 30a of the flexible substrate 30, the first terminal wiring region 44A has a thin metal wire 38 electrically connected to the end of each first sensing electrode 32a via the first connection portion 48a. A first terminal wiring portion 46a is formed. The first terminal wiring portions 46a led out from the respective first connection portions 48a are routed toward the side on the second sensor region 40B side of the flexible substrate 30 and are electrically connected to the corresponding first terminal portions 50a. Connected to.

  Of the back surface 30b of the flexible substrate 30, the first terminal wiring region 44A is provided with a first metal wire 38 electrically connected to the end of each second sensing electrode 32b via the second connection portion 48b. A two-terminal wiring portion 46b is formed. The second terminal wiring part 46b led out from each second connection part 48b is routed toward the side on the third sensor region 40C side in the flexible substrate 30 and electrically connected to the corresponding second terminal part 50b. Connected to.

  Similarly, the first terminal wiring portion 46a and the second terminal wiring portion 46b from the second sensor region 40B are formed in the second terminal wiring region 44B, and the side on the second sensor region 40B side of the flexible substrate 30 is formed. And are electrically connected to the corresponding first terminal portion 50a and second terminal portion 50b.

  In the third terminal wiring region 44C, the first terminal wiring portion 46a and the second terminal wiring portion 46b from the third sensor region 40C are formed, and toward the side of the flexible substrate 30 on the third sensor region 40C side. It is routed and electrically connected to the corresponding first terminal portion 50a and second terminal portion 50b.

  In the fourth terminal wiring region 44D, the first terminal wiring portion 46a and the second terminal wiring portion 46b from the fourth sensor region 40D are formed, and toward the side of the flexible substrate 30 on the fourth sensor region 40D side. It is routed and electrically connected to the corresponding first terminal portion 50a and second terminal portion 50b.

  In the fifth terminal wiring region 44E, the first terminal wiring portion 46a and the second terminal wiring portion 46b from the fifth sensor region 40E are formed, and toward the side of the flexible substrate 30 on the fifth sensor region 40E side. It is routed and electrically connected to the corresponding first terminal portion 50a and second terminal portion 50b.

  The routing of the first terminal wiring portion 46a and the second terminal wiring portion 46b described above is merely an example, and the three-dimensional shape of the electronic device 12 and the first sensing electrode 32a and the second sensing electrode in each of the sensor regions 40A to 40E. Various forms are conceivable depending on the formation range of the electrode 32b.

  By attaching the conductive film 26 to the electronic device 12, the first terminal portion 50a and the second terminal portion 50b in the first terminal wiring region 44A to the fifth terminal wiring region 44E are on the back surface 16b side of the electronic device 12, that is, It will be located on the circuit board 22 side. Therefore, at least the first terminal portion 50a and the second terminal portion 50b (see FIG. 3) of the conductive film 26 can be electrically connected to the control circuit 28 (see FIG. 1B) through, for example, a connector. That is, the wiring from the five touch panel units 42A to 42E can be easily integrated into one, and complicated wiring is not necessary.

  In the present embodiment, as shown in FIGS. 1A to 2B, at least a part of the portion corresponding to the ridgeline 52 of the electronic device 12 on the flexible substrate 30 (see FIGS. 2A and 2B). A shield film 54 is disposed. The shield film 54 is disposed on the surface 30 a opposite to the electronic device 12 among the two opposing surfaces 30 a and 30 b of the flexible substrate 30. That is, the shield film 54 is formed in each of the regions surrounding the sensor regions 40A to 40E in the touch panel portions 42A to 42E, as indicated by a two-dot chain line in FIG.

  Here, “on the flexible substrate” and “on the surface” means that the shield film 54 does not have to be formed directly on the flexible substrate 30. In the example of FIGS. The example which formed the shield film 54 in the ridgeline 52 of the cover layer 24 to comprise is shown.

  Further, the ridgeline 52 of the electronic device 12 refers to a side shared by the main surface (front surface 16a, back surface 16b) and side surface of the electronic device 12, and a side shared by two adjacent side surfaces. The side includes a straight line and a curved line. Further, when the cross-sectional shape having the normal direction as the direction of the ridge line 52 is seen, even if the ridge line shape is bent at the ridge line 52 as shown in FIG. 2A or the curved shape as shown in FIG. Good.

  The shield film 54 may be applied with a constant potential, connected to the ground (including a case where a ground potential is applied), or may be floating. Further, the shield film 54 may be constituted by one continuous metal film, or may be constituted by the mesh pattern 36 by the thin metal wires 38, similarly to the first sensing electrode 32a and the second sensing electrode 32b. .

  In general, when a touch panel is used in a low humidity environment, charging due to static electricity or discharging due to power storage occurs. They may become noise and enter the capacitive sensing electrode portion, causing malfunctions such as malfunction and electrostatic breakdown of the sensor. In particular, since the electric field concentrates on the ridge line portion of the electronic device 12, charging and storage due to static electricity occur in the ridge line portion of the electronic device 12.

  Therefore, in the present embodiment, since the shield film 54 is disposed in a portion corresponding to the ridgeline 52 of the electronic device 12 in the cover layer 24 laminated on the flexible substrate 30, the ridgeline portion of the electronic device 12. The concentration of the electric field is avoided, and charging and storage due to static electricity can be effectively reduced. As a result, it is possible to suppress a failure such as malfunction or electrostatic breakdown of the sensor, and to provide a highly reliable touch panel.

  In the present embodiment, the shield film 54 is formed on the cover layer 24 to form the wiring of the first terminal wiring portion 46 a on the front surface 30 a of the flexible substrate 30 and to the back surface 30 b of the flexible substrate 30. The second terminal wiring portion 46 b can be formed without being restricted by the shield film 54.

  As the first sensing electrode 32a and the second sensing electrode 32b, a transparent electrode film made of ITO (indium tin oxide), which has been conventionally used, is used in addition to the structure having the mesh pattern 36 by the metal thin wires 38 described above. May be. Moreover, an air layer may be interposed between the back surface side of the conductive film 26 and the surface or side surface of the electronic device 12 facing the back surface side, or a transparent adhesive may be interposed.

  Next, a modified example of the touch panel 10 according to the present embodiment will be described with reference to FIGS. 4A to 12B.

  First, the touch panel 10A according to the first modified example has substantially the same configuration as the touch panel 10 according to the present embodiment, but the shield film 54 is the surface of the flexible substrate 30 as shown in FIGS. 4A and 5. It differs in that it is formed in 30a.

  In this case, since the shield film 54 can be formed on the surface 30a of the flexible substrate 30 together with the first sensing electrode 32a and the first connection portion 48a, the process can be simplified. Further, when the shield film 54 is formed, the same exposure mask as that of the first sense electrode 32a is used by forming the shield film 54 with the mesh pattern 36 of the fine metal wires 38 in the same manner as the first sense electrode 32a. And further simplification of the process can be achieved.

  Since the formation of the first terminal wiring part 46a on the surface 30a of the flexible substrate 30 is restricted by the shield film 54, at least the first terminal wiring part 46a in the first touch panel part 42A is passed through the through hole 56 (. It is preferable to lead out to the back surface 30b of the flexible substrate 30 through a through hole in which a conductive material is formed on the inner wall. 5 shows an example in which the first terminal wiring portions 46a of the first to fifth touch panel portions 42A to 42E are led out to the back surface 30b of the flexible substrate 30 through the through holes 56, respectively.

  The touch panel 10B according to the second modified example has substantially the same configuration as the touch panel 10A described above, but a shield film 54 is formed on the back surface 30b of the flexible substrate 30 as shown in FIGS. 4B and 6. It is different in point.

  Also in this case, since the shield film 54 can be formed on the back surface 30b of the flexible substrate 30 together with the second sensing electrode 32b and the second connection portion 48b, the process can be simplified.

  Since the formation of the second terminal wiring portion 46 b on the back surface 30 b of the flexible substrate 30 is restricted by the shield film 54, the second terminal wiring portion 46 b is connected to the flexible substrate 30 through the through hole 56. It is preferable to lead to the surface 30a. In the example of FIG. 6, an example is shown in which the second terminal wiring portions 46 b of the first to fifth touch panel portions 42 </ b> A to 42 </ b> E are led out to the surface 30 a of the flexible substrate 30 through the through holes 56.

  In the touch panel 10 </ b> A described above, the shield film 54 is disposed on a portion of the surface 30 a of the flexible substrate 30 corresponding to the ridgeline 52 of the electronic device 12. In the touch panel 10 </ b> B, the shield film 54 is disposed on the portion of the back surface 30 b of the flexible substrate 30 corresponding to the ridgeline 52 of the electronic device 12. Therefore, also in these touch panels 10A and 10B, concentration of the electric field at the ridge line portion of the electronic device 12 is avoided, and charging and storage due to static electricity can be effectively reduced.

  Next, the touch panel 10C according to the third modified example has substantially the same configuration as the touch panel 10 according to the present embodiment. However, as shown in FIG. 7, the second touch panel 10C is arranged along the first direction (y direction). A plurality of first sensing electrodes 32a are continuously formed across the sensor region 40B, the first sensor region 40A, and the third sensor region 40C, and are arranged in the second direction (x direction). The difference is that a plurality of second sensing electrodes 32b are formed continuously over the region 40A and the fifth sensor region 40E.

  That is, the plurality of first sensing electrodes 32a are common to the first touch panel unit 42A, the second touch panel unit 42B, and the third touch panel unit 42C, and the plurality of second sensing electrodes 32b are the first touch panel unit 42A and the fourth touch panel unit 42A. The touch panel unit 42D and the fifth touch panel unit 42E are common.

  In this case, since it is not necessary to partition the first terminal wiring area 44A and the second terminal wiring area 44B on the outer peripheral portion of the first touch panel portion 42A, it is possible to make almost the entire surface of the electronic device 12 the sensor area. Become.

  In the touch panel 10C, the first sensing electrode 32a and the second sensing electrode 32b are formed so as to straddle the portion corresponding to the ridgeline 52 of the electronic device 12, and therefore, as shown in FIG. 2A and FIG. A shield film 54 is preferably formed on a portion other than the substrate 30, for example, on the cover layer 24.

  Moreover, it is preferable to use the mesh pattern 36 by the metal fine wire 38 rather than using ITO as the 1st sensing electrode 32a and the 2nd sensing electrode 32b. That is, the conventionally used ITO has a problem that when it is deformed into a three-dimensional shape due to insufficient formability, cracking, disconnection, or the like occurs.

  That is, it is difficult to form the first sensing electrode 32a and the second sensing electrode 32b on the flexible substrate 30 formed into a three-dimensional shape, and there are problems in terms of productivity and cost. Therefore, after forming the first sensing electrode 32a and the second sensing electrode 32b on the planar flexible substrate 30 to form the conductive film 26, the conductive film 26 itself is formed into a three-dimensional shape, thereby obtaining the tertiary. The conductive film 26 having the original shape can be easily produced. However, as described above, in the case where the first sensing electrode 32a and the second sensing electrode 32b are made of ITO, there is a problem that cracking, disconnection, etc. occur during molding into a three-dimensional shape, and the yield is greatly reduced. is there. On the other hand, the mesh pattern 36 formed of the fine metal wires 38 is excellent in workability and has an advantage that disconnection or the like hardly occurs when deformed into a three-dimensional shape. Therefore, the conductive film 26 having a three-dimensional shape can be easily manufactured with almost no disconnection or the like. Further, it is preferable that the shield film 54 is constituted by the mesh pattern 36 made of the fine metal wires 38, so that disconnection of the shield film 54 can be prevented.

  Next, the touch panel 10D according to the fourth modified example has substantially the same configuration as the touch panel 10 according to the present embodiment, but as shown in FIG. 8A, the front surface 30a (the back surface 30b may be used) of the flexible substrate 30. ) In that the first sensing electrode 32a and the second sensing electrode 32b are formed.

  The touch panel 10E according to the fifth modified example has substantially the same configuration as the touch panel 10D described above, but differs in that the shield film 54 is formed on the surface 30a of the flexible substrate 30 as shown in FIG. 8B. .

  In this case, since the wiring formation of the first terminal wiring part 46a and the second terminal wiring part 46b on the surface 30a of the flexible substrate 30 is restricted by the shield film 54, the first terminal wiring part 46a and the second terminal It is preferable to lead out the wiring part 46 b to the back surface 30 b of the flexible substrate 30 through the through hole 56.

  The touch panel 10F according to the sixth modification has substantially the same configuration as the touch panel 10D described above, but differs in that the shield film 54 is formed on the back surface 30b of the flexible substrate 30 as shown in FIG. 8C. .

  In this case, the wiring formation of the first terminal wiring portion 46 a and the second terminal wiring portion 46 b can be performed without being restricted by the shield film 54.

  Also in the touch panels 10D to 10F described above, concentration of an electric field at the ridge line portion of the electronic device 12 is avoided, and charging and storage due to static electricity can be effectively reduced.

  Next, the touch panel 10G according to the seventh modified example has substantially the same configuration as the touch panel 10 according to the present embodiment, but as shown in FIG. 9A, the conductive film 26 is different as follows.

  That is, the conductive film 26 may be a conductive film 26 of a type in which two flexible substrates (the first flexible substrate 30A and the second flexible substrate 30B) are bonded together. In the conductive film 26, a first sensing electrode 32a, a first terminal wiring portion 46a, and a first connection portion 48a are formed on the surface 30Aa of the first flexible substrate 30A, and the surface 30Ba of the second flexible substrate 30B. The second sensing electrode 32b, the second terminal wiring portion 46b, and the second connection portion 48b are formed. Then, the conductive film 26 is configured by laminating, for example, a transparent adhesive between the back surface 30Ab of the first flexible substrate 30A and the front surface 30Ba of the second flexible substrate 30B.

  The touch panel 10H according to the eighth modification has substantially the same configuration as the touch panel 10G described above, but the shield film 54 is formed on the surface 30Aa of the first flexible substrate 30A as shown in FIG. 9B. It is different.

  In this case, since the formation of the wiring of the first terminal wiring portion 46a on the surface 30Aa of the first flexible substrate 30A is restricted by the shield film 54, the first terminal wiring portion 46a is connected to the first via the through hole 56. It is preferable to lead out to the back surface 30Ab of the flexible substrate 30A.

  The touch panel 10I according to the ninth modified example has substantially the same configuration as the touch panel 10G described above, but the shield film 54 is formed on the surface 30Ba of the second flexible substrate 30B as shown in FIG. 10A. It is different.

  In this case, since the formation of the wiring of the second terminal wiring part 46b on the surface 30Ba of the second flexible substrate 30B is restricted by the shield film 54, the second terminal wiring part 46b is connected to the second terminal via the through hole 56. It is preferable to lead out to the back surface 30Bb of the flexible substrate 30B.

  The touch panel 10J according to the tenth modification has substantially the same configuration as the touch panel 10G described above, but as shown in FIG. 10B, the shield film 54 is formed on the back surface 30Bb of the second flexible substrate 30B. It is different.

  In this case, the wiring formation of the first terminal wiring portion 46 a and the second terminal wiring portion 46 b can be performed without being restricted by the shield film 54.

  In these touch panels 10G to 10J, similarly to the touch panels 10D to 10F described above, concentration of an electric field at the ridge line portion of the electronic device 12 is avoided, and charging and storage due to static electricity can be effectively reduced.

  Next, touch panel 10K according to the eleventh modification has substantially the same configuration as touch panel 10 according to the present embodiment, but as shown in FIG. 11A, conductive film 26 is different as follows.

  That is, the conductive film 26 may be a type of the conductive film 26 in which the insulating layer 58 is laminated on the surface 30 a of one flexible substrate 30. In the conductive film 26, the first sensing electrode 32 a, the first terminal wiring part 46 a, and the first connection part 48 a are formed on the surface 58 a of the insulating layer 58, and the second sensing electrode 32 b is formed on the surface 30 a of the flexible substrate 30. A second terminal wiring portion 46b and a second connection portion 48b are formed.

  The touch panel 10L according to the twelfth modification has substantially the same configuration as the touch panel 10K described above, but differs in that the shield film 54 is formed on the surface 58a of the insulating layer 58 as shown in FIG. 11B.

  In this case, since the formation of the first terminal wiring portion 46 a on the surface 58 a of the insulating layer 58 is restricted by the shield film 54, the first terminal wiring portion 46 a is connected to the flexible substrate 30 through the through hole 56. It is preferable to lead out to the surface 30a.

  The touch panel 10M according to the thirteenth modification has substantially the same configuration as the touch panel 10K described above, but differs in that the shield film 54 is formed on the surface 30a of the flexible substrate 30 as shown in FIG. 12A. .

  In this case, since the wiring formation of the second terminal wiring portion 46 b on the surface 30 a of the flexible substrate 30 is restricted by the shield film 54, the second terminal wiring portion 46 b is connected to the flexible substrate through the through hole 56. 30 is preferably led out to the back surface 30b.

  The touch panel 10N according to the fourteenth modification has substantially the same configuration as the touch panel 10K described above, but differs in that the shield film 54 is formed on the back surface 30b of the flexible substrate 30 as shown in FIG. 12B. .

  In this case, the wiring formation of the first terminal wiring portion 46 a and the second terminal wiring portion 46 b can be performed without being restricted by the shield film 54.

  In these touch panels 10K to 10N, similarly to the touch panels 10G to 10J described above, concentration of the electric field at the ridge line portion of the electronic device 12 is avoided, and charging and storage due to static electricity can be effectively reduced.

  Next, the preferable aspect of the electroconductive film 26 which concerns on this Embodiment is demonstrated below.

  Each cell 34 is formed of a polygon. Examples of polygons include triangles, quadrangles (squares, rectangles, parallelograms, rhombuses, etc.), pentagons, hexagons, random polygons, and the like. Further, a part of the sides constituting the polygon may be a curved line. The length of one side of the cell 34 is preferably 50 to 500 μm. When the length of one side is too short, there is a problem that the aperture ratio and the transmittance are reduced, and accordingly, the transparency is deteriorated. On the other hand, if the length of one side is too long, the fine metal wires 38 may be easily recognized.

  The line width of the fine metal wire 38 is preferably 1 μm or more and 5 μm or less, and more preferably 1 μm or more and 4 μm or less. The surface resistance of the first sensing electrode 32a and the second sensing electrode 32b is 0.1-100 ohm / sq. It is preferable that it exists in the range. The lower limit is 1 ohm / sq. 3 ohm / sq. 5 ohm / sq. 10 ohm / sq. The above is preferable. The upper limit is 70 ohm / sq. Hereinafter, 50 ohm / sq. The following is preferable.

  The metal wires constituting the first terminal wiring portion 46a, the second terminal wiring portion 46b, the first terminal portion 50a, the second terminal portion 50b, etc., and the metals constituting the first sensing electrode 32a and the second sensing electrode 32b. Each thin wire is preferably made of a single conductive material. The single conductive material is preferably made of a metal made of one of silver, copper, gold, and aluminum, or an alloy containing at least one of them.

  The conductive film 26 in the present embodiment preferably has an aperture ratio of at least the first sensor region 40A of 85% or more, more preferably 90% or more, and 95% or more from the viewpoint of visible light transmittance. Most preferably. The aperture ratio is the ratio of the entire light-transmitting portion excluding the thin metal wires 38. For example, the aperture ratio of a square lattice having a line width of 6 μm and a fine line pitch of 240 μm is 95%.

  In the above-described example, the example in which the conductive film 26 is applied to the projected capacitive touch panel 10 has been described. However, the conductive film 26 may also be applied to a surface capacitive touch panel or a resistive touch panel. Can do.

  In addition to the touch panel 10 of the electronic device 12, the housing 14 can be used as an electromagnetic wave shielding film of a display device or an optical film installed on a display panel of the display device. Examples of the display device include a liquid crystal display, a plasma display, an organic EL, and an inorganic EL.

  As a method for producing the conductive film 26, for example, an exposed portion and an unexposed portion are obtained by exposing a photosensitive material having an emulsion layer containing a photosensitive silver halide to the flexible substrate 30 and performing development processing. The first sensing electrode 32a and the second sensing electrode 32b may be formed by forming a metal part and a light transmissive part respectively. Further, a conductive metal may be supported on the metal part by further performing physical development and / or plating treatment on the metal part.

  Alternatively, a photosensitive layer to be plated is formed on the flexible substrate 30 using a pre-plating treatment material, and then exposed and developed, and then subjected to a plating treatment, whereby the exposed portion and the unexposed portion are respectively metal parts. In addition, the first sensing electrode 32a and the second sensing electrode 32b may be formed by forming a light transmitting portion. Further, a conductive metal may be supported on the metal part by further performing physical development and / or plating treatment on the metal part.

  The following two forms are mentioned as a more preferable form of the method using a plating pretreatment material. The following more specific contents are disclosed in JP 2003-213437 A, JP 2006-64923 A, JP 2006-58797 A, JP 2006-135271 A, and the like.

(A) A plating layer containing a functional group that interacts with the plating catalyst or its precursor is applied on the flexible substrate 30, and then exposed to light and developed, and then subjected to plating to form a metal part on the material to be plated. A mode to be formed.

(B) On the flexible substrate 30, a base layer containing a polymer and a metal oxide and a layer to be plated containing a functional group that interacts with a plating catalyst or a precursor thereof are laminated in this order. A mode in which the metal part is formed on the material to be plated by plating after development.

  As another method, the photoresist film on the metal foil formed on the flexible substrate 30 is exposed and developed to form a resist pattern, and the metal foil exposed from the resist pattern is etched to form a first pattern. The first sensing electrode 32a and the second sensing electrode 32b may be formed.

  Alternatively, the mesh pattern 36 may be formed by printing a paste containing metal fine particles on the flexible substrate 30 and performing metal plating on the paste.

  Alternatively, the mesh pattern 36 may be printed on the flexible substrate 30 by a screen printing plate or a gravure printing plate.

  Alternatively, the first sensing electrode 32a and the second sensing electrode 32b may be formed on the flexible substrate 30 by inkjet.

  Alternatively, a resin layer is formed on the film, a mold having an emboss pattern formed thereon is pressed onto the resin layer to form an intaglio pattern on the resin layer, and then an electrode material is applied to the entire surface of the resin layer including the intaglio pattern. Thereafter, by removing the electrode material on the surface of the resin layer, a mesh pattern made of the electrode material filled in the intaglio pattern of the resin layer may be formed.

  Next, in the conductive film 26 according to the present embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable embodiment will be mainly described.

  The manufacturing method of the conductive film 26 according to the present embodiment includes the following three modes depending on the photosensitive material and the type of development processing.

(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.

(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.

(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive Form formed on top.

  The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.

  In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.

  In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

  In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .

  The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

  Here, the configuration of each layer of the conductive film 26 according to the present embodiment will be described in detail below.

[Flexible substrate 30]
As the flexible substrate 30, for example, various materials used as substrate materials for optical disks can be arbitrarily selected and used. Specifically, acrylic resins such as polycarbonate and polymethyl methacrylate; vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers; epoxy resins; amorphous polyolefins; polyesters; COC (cycloolefin copolymers); Cycloolefin polymer) and the like, and these may be used in combination as desired. Among these materials, thermoplastic resins such as amorphous polyolefin and polycarbonate are preferable from the viewpoint of moisture resistance, dimensional stability, and low price. For example, when the flexible substrate 30 is produced by insert molding, polycarbonate, COC, COP and the like are preferable, and among them, polycarbonate having high fluidity advantageous for thin-wall formation is particularly preferable.

[Silver salt emulsion layer]
The silver salt emulsion layer to be the fine metal wires 38 of the conductive film 26 contains additives such as a solvent and a dye in addition to the silver salt and the binder.

  Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / m ² in terms of silver, more preferably 1 to 25 g / m ^2, more preferably 5 to 20 g / m ² . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the conductive film 26 is used.

  Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

  The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The binder content in the silver salt emulsion layer is preferably ¼ or more, more preferably ½ or more in terms of the silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in the resistance value can be suppressed, and the conductive film 26 having a uniform surface resistance can be obtained. . The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.

<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.

[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. An undercoat layer, for example, can be provided below the silver salt emulsion layer.

  Next, each process of the manufacturing method of the electroconductive film 26 is demonstrated.

[exposure]
This embodiment includes the case where the first sensing electrode 32a and the like are applied by a printing method, but the first sensing electrode 32a and the like are formed by exposure, development, and the like except for the printing method. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the flexible substrate 30 or a photosensitive material coated with a photopolymer for photolithography. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for a silver salt photographic film, photographic paper, a printing plate-making film, a photomask emulsion mask, or the like can be used.

  The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment.

  The mass of the metal part contained in the exposed part after the development treatment is preferably 50% by mass or more, and 80% by mass or more, based on the mass of the metal contained in the exposed part before exposure. More preferably. If the mass of the metal contained in the exposed portion is 50% by mass or more based on the mass of the metal contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The conductive film 26 is obtained through the above steps. The conductive film 26 after the development process may be further subjected to a calendar process, and the surface resistance of each transparent conductive layer is set to a desired surface resistance (range of 0.1 to 100 ohm / sq.) By the calendar process. Can be adjusted.

[Physical development and plating]
In the present embodiment, physical development and / or plating treatment for supporting conductive metal particles on the metal part may be performed for the purpose of improving the conductivity of the metal part formed by exposure and development processing. In the present invention, the conductive metal particles may be supported on the metal silver portion by only one of physical development and plating treatment, or the conductive metal particles may be supported on the metal portion by combining physical development and plating treatment. Good. In addition, the thing which performed the physical development and / or the plating process to the metal part is called a "conductive metal part."

  “Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

  In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, it is preferable to oxidize the metal part after the development process and the conductive metal part formed by physical development and / or plating process. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

[Thickness of flexible substrate, etc.]
The thickness of the flexible substrate 30 in the conductive film 26 according to the present embodiment is preferably 5 to 350 μm, and more preferably 30 to 150 μm. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

  The thickness of the metal part (metal fine wire or the like) provided on the flexible substrate 30 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating applied on the flexible substrate 30. The thickness of the metal part can be selected from 0.01 to 200 μm, preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 to 9 μm, Most preferably, it is 05-5 micrometers. Moreover, it is preferable that a metal part is pattern shape. The metal part may be a single layer or a multilayer structure of two or more layers.

  In the method for manufacturing the conductive film 26 according to the present embodiment, steps such as plating are not necessarily performed. This is because in the method for producing the conductive film 26 according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount of the silver salt emulsion layer and the silver / binder volume ratio. In addition, you may perform a calendar process etc. as needed. In addition, after forming a fine metal wire, the fine metal wire may include at least metal particles and a binder. In this case, the first sensing electrode 32a and the second sensing electrode 32b configured by the fine metal wires can be deformed following the three-dimensional shape of the flexible substrate 30 with almost no disconnection of the fine metal wires. it can.

[Hardening after development]
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. it can.

  The conductive film 26 according to the present embodiment may be provided with a functional layer such as an antireflection layer.

[Calendar processing]
You may make it smooth by giving a calendar process to a metal part. This significantly increases the conductivity of the metal part. The calendar process can be performed by a calendar roll. In general, the calendar roll is preferably composed of a pair of rolls.

As a roll used for the calendering process, a plastic roll such as epoxy, polyimide, polyamide, polyimide amide or a metal roll is preferably used. In particular, when emulsion layers are provided on both sides, it is preferable to treat with metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit of the linear pressure is 1960 N / cm (200 kgf / cm, converted to a surface pressure of 699.4 kgf / cm ² ) or more, more preferably 2940 N / cm (300 kgf / cm, converted to a surface pressure of 935.8 kgf / cm ^2). ) That's it. The upper limit of the linear pressure is 6880 N / cm (700 kgf / cm) or less.

  The application temperature of the smoothing treatment represented by the calender roll is preferably 10 ° C. (no temperature control) to 100 ° C., and the more preferable temperature varies depending on the line density and shape of the metal mesh pattern and metal wiring pattern, and the binder type. , Approximately 10 ° C. (no temperature control) to 50 ° C.

  In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

  Note that the touch panel according to the present invention is not limited to the above-described embodiment, but can of course have various configurations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10, 10A-10N ... Touch panel 12 ... Electronic device 14 ... Housing | casing 16a, 30a ... Front surface 16b, 30b ... Back surface 18a-18d ... Side surface 24 ... Cover layer 26 ... Conductive film 30 ... Flexible board 32a ... 1st sensing Electrode 32b ... 2nd sensing electrode 34 ... Cell 36 ... Mesh pattern 38 ... Metal fine wire 40A-40E ... 1st sensor area-5th sensor area 42A-42E ... 1st touch panel part-5th touch panel part 44A-44E ... 1st Terminal wiring region to fifth terminal wiring region 46a, 46b: first terminal wiring part, second terminal wiring part 52 ... ridge line 54 ... shield film 56 ... through hole 58 ... insulating layer

Claims (14)

Among a plurality of surfaces of an electronic device, the electronic device has a plurality of touch panel units respectively installed on at least a main surface of the electronic device and one or more side surfaces adjacent to the main surface;
Each of the plurality of touch panel units includes a plurality of sensing electrodes,
The plurality of sensing electrodes are formed on a flexible substrate common to the plurality of touch panel units,
A touch panel, wherein a shield film is disposed on at least a part of a portion corresponding to a ridge line of the electronic device on the flexible substrate. The touch panel according to claim 1.
The touch panel, wherein the shield film is disposed on a surface opposite to the electronic device among two opposing surfaces of the flexible substrate. The touch panel according to claim 1.
The touch panel, wherein the shield film is disposed on a surface facing the electronic device among two opposing surfaces of the flexible substrate. The touch panel according to any one of claims 1 to 3,
The plurality of sensing electrodes corresponding to each of the touch panel units are independent in each of the touch panel units. In the touch panel of any one of Claims 1-4,
The flexible substrate has a through hole that electrically connects the side having the shield film and the opposite side, and at least the wiring of the sensing electrode is concentrated on the opposite side through the through hole. A touch panel characterized by being. The touch panel according to any one of claims 1 to 3,
The touch panel, wherein at least one of the plurality of sensing electrodes is common to the two or more touch panel units. In the touch panel according to any one of claims 1 to 6,
A protective layer covering the plurality of sensing electrodes;
The touch panel, wherein the shield film is formed on the protective layer. In the touch panel of any one of Claims 1-7,
Each of the touch panel units has a sensor region in which the plurality of sensing electrodes are formed,
The touch panel, wherein the shield film is formed in a region surrounding the sensor region in each touch panel unit. The touch panel according to any one of claims 1 to 8,
The touch panel, wherein the plurality of sensing electrodes formed on the flexible substrate includes a plurality of first sensing electrodes and a plurality of second sensing electrodes. The touch panel according to claim 9,
The touch panel, wherein the first sensing electrode and the second sensing electrode are both formed on one main surface of the flexible substrate. The touch panel according to claim 9,
The first sensing electrode is formed on one main surface of the flexible substrate,
The touch panel, wherein the second sensing electrode is formed on the other main surface of the flexible substrate. The touch panel according to claim 9,
The plurality of first sensing electrodes and the plurality of second sensing electrodes are provided on the surfaces of different flexible substrates, respectively.
A touch panel comprising: a first flexible substrate provided with the plurality of first sensing electrodes; and a second flexible substrate provided with the plurality of second sensing electrodes. The touch panel according to any one of claims 1 to 8,
The plurality of sensing electrodes include a plurality of first sensing electrodes and a plurality of second sensing electrodes;
The plurality of second sensing electrodes are provided on one main surface of the flexible substrate,
An insulating film is provided on the plurality of second sensing electrodes;
The touch panel, wherein the plurality of first sensing electrodes are formed on the insulating film. The touch panel according to any one of claims 1 to 13,
The touch panel, wherein the plurality of sensing electrodes are configured by combining a large number of cells made of fine metal wires.

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