JP2012163951A - Display device having conductive film and the conductive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device with a conductive film which can suppress generation of moire even when installed on a display panel of a display device, with a simple configuration; and the conductive film.SOLUTION: A conductive film 10 is a conductive film that is installed on a display panel of a display device and includes a transparent base body 12 and a conductive part 14 formed on one principal plane of the transparent base body 12. The conductive part 14 includes a mesh pattern 20 formed with thin metallic wires 16, and the thin metallic wires 16 have an inclination of 30 to 44 degrees with respect to the arrangement direction of pixels of the display device.

Description

  The present invention relates to a display device including a conductive film and a conductive film.

Examples of the conductive film installed on the display panel of the display device include a conductive film for electromagnetic wave shielding (see, for example, Patent Documents 1 and 2) and a conductive film for a touch panel (for example, see Patent Document 3). It is done.
In these conductive films, a lattice pattern is formed on a transparent substrate. In Patent Document 1, a moire suppressing portion is formed adjacent to an intersection of the lattice patterns. In Patent Document 2, an electromagnetic wave having a lattice pattern is formed. The generation of moire is suppressed by attaching a shield film and a moire suppression film in which a moire suppression portion is arranged.
Moreover, in patent document 3, it is an electroconductive film for touchscreens which has the lattice pattern formed with the conductive layer containing silver, Comprising: Generation | occurrence | production of a moire is suppressed by making the pitch of a lattice pattern 600 micrometers or more. I am doing so.

JP 2008-282924 A JP 2009-094467 A JP 2010-108877 A

  The present invention is a conductive film that has a simple configuration different from those of the above-mentioned Patent Documents 1 to 3 and is less likely to cause moire even when attached to a display panel of a general-purpose display device, and can be produced with a high yield. It is an object of the present invention to provide a display device and a conductive film including the above.

[1] A display device according to a first aspect of the present invention is a display device including a conductive film installed on a display panel, and the conductive film includes a conductive portion having a mesh pattern of metal thin lines. The thin line has an inclination of 30 ° to 44 ° with respect to an arrangement direction of pixels of the display device.
[2] In the first aspect of the present invention, the thin line has an inclination of 32 ° to 39 ° with respect to an arrangement direction of pixels of the display device.
[3] In the first aspect of the present invention, the pitch of the fine wires is 100 to 400 μm.
[4] In the first aspect of the present invention, the thin wire has a line width of 30 μm or less.
[5] In the first aspect of the present invention, the pixel includes a plurality of sub-pixels.
The pixel arrangement direction is the same as the sub-pixel arrangement direction.
[6] In the first aspect of the present invention, a line that virtually connects a plurality of intersections of the mesh pattern via openings and an arrangement direction of the pixels coincide with each other.
[7] In the first aspect of the present invention, the mesh pattern extends in the first direction, extends in the second direction, and includes two or more first metal fine wires arranged in the second direction. Two or more second metal wires arranged in one direction, wherein the first direction is inclined with respect to the reference direction at an angle of + 30 ° to + 44 °, and the second direction is relative to the reference direction. It is inclined at an angle of not less than −30 ° and not more than −44 °.
[8] In the first aspect of the present invention, one mesh shape of the mesh pattern is a rhombus.
[9] In the first aspect of the present invention, the aspect ratio of the pixel is different from 1.
[10] In the first aspect of the present invention, the vertical arrangement pitch of the pixels and the horizontal arrangement pitch of the pixels are the same.
[11] In the first aspect of the present invention, the conductive film has an electromagnetic wave shielding function.
[12] In the first aspect of the present invention, the conductive film is made of a first conductive part having a mesh pattern of metal fine wires on one main surface on a transparent support, and a metal made on the other main surface. It has the touch sensor function which has the 2nd electroconductive part which has the mesh pattern by a thin wire | line, It is characterized by the above-mentioned.
[13] A conductive film according to a second aspect of the present invention is a conductive film installed on a display panel of a display device, and includes a conductive portion having a mesh pattern of metal fine lines, The display device has an inclination of 30 ° to 44 ° with respect to a pixel arrangement direction.
[14] In the second aspect of the present invention, the pitch of the thin wires is 100 to 400 μm.
[15] In the second aspect of the present invention, the thin wire has a line width of 30 μm or less.
[16] In the second aspect of the present invention, the pixel includes a plurality of subpixels,
The pixel arrangement direction is the same as the sub-pixel arrangement direction.
[17] The second aspect of the present invention is characterized in that a line that virtually connects a plurality of intersections of the mesh pattern via openings and an arrangement direction of the pixels coincide with each other.
[18] In the second aspect of the present invention, the mesh pattern extends along the first direction, and extends along the second direction with two or more first metal fine wires arranged in the second direction. Two or more second metal wires arranged in one direction, wherein the first direction is inclined with respect to the reference direction at an angle of + 30 ° to + 44 °, and the second direction is relative to the reference direction. It is inclined at an angle of not less than −30 ° and not more than −44 °.
[19] In the second aspect of the present invention, one mesh shape of the mesh pattern is a rhombus.

According to the display device of the present invention, it is possible to suppress the occurrence of moire. In general, when an electromagnetic wave shielding function, a touch panel function, or the like is given to a display device, a conductive film is required. For example, a conductive film having a mesh pattern may cause moire. According to the display device of the present invention, moire is less likely to occur by inclining the thin line at a predetermined angle with respect to the pixel arrangement direction of the display device.
Further, according to the conductive film of the present invention, moire is hardly generated even when the conductive film is attached on the display panel of the display device.

It is a top view which shows an example of the electroconductive film which concerns on this Embodiment. It is sectional drawing which abbreviate | omits and shows an example of a conductive film. It is a top view which abbreviate | omits and shows an example of the pixel arrangement | sequence of a display apparatus with which a conductive film is installed. It is a top view which abbreviate | omits and shows the example which installed the electroconductive film on the display apparatus. It is a disassembled perspective view which shows the structure of the touchscreen which has the lamination | stacking electroconductive film by an electroconductive film. It is a disassembled perspective view which abbreviate | omits and shows a laminated conductive film. FIG. 7A is a cross-sectional view showing a part of the laminated conductive film with a part omitted, and FIG. 7B is a cross-sectional view showing another example of the laminated conductive film, with a part omitted. It is a top view which shows the example of a pattern of the 1st electroconductive part formed in the 1st electroconductive film in a laminated electroconductive film. It is a top view which shows the example of a pattern of the 2nd electroconductive part formed in the 2nd electroconductive film in a laminated electroconductive film. It is a top view which abbreviate | omits and shows the example which made the laminated conductive film combining the 1st conductive film and the 2nd conductive film. It is explanatory drawing which shows the state in which one line was formed of the 1st auxiliary line and the 2nd auxiliary line.

Embodiments of a display device using a conductive film and a conductive film according to the present invention will be described below with reference to FIGS. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.
As shown in FIGS. 1 and 2, the conductive film 10 according to the present embodiment includes a transparent substrate 12 (see FIG. 2) and a conductive portion 14 formed on one main surface of the transparent substrate 12. . The conductive portion 14 has a mesh pattern 20 including a metal fine wire (hereinafter referred to as a metal fine wire 16) and an opening 18. The thin metal wire 16 is made of, for example, gold (Au), silver (Ag), or copper (Cu).
Specifically, the conductive portion 14 includes a plurality of first metal thin wires 16a extending in the first direction (x direction in FIG. 1) and arranged at a pitch Ps in the second direction (y direction in FIG. 1), It has a mesh pattern 20 that extends in two directions and intersects with a plurality of second thin metal wires 16b arranged in the first direction at a pitch Ps. In this case, the first direction is inclined at an angle of + 30 ° to + 44 ° with respect to the reference direction (horizontal direction), and the second direction is inclined at an angle of −30 ° to −44 ° with respect to the reference direction. ing. Therefore, one mesh shape 22 of the mesh pattern 20, that is, a combined shape of one opening 18 and the four fine metal wires 16 surrounding the one opening 18 is a rhombus.

Here, the pitch Ps (also referred to as a fine line pitch Ps) can be selected from 100 μm to 400 μm. Moreover, the line width of the metal fine wire 16 can be selected from 30 μm or less. When the conductive film 10 is used as an electromagnetic wave shielding film, the line width of the fine metal wire 16 is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less. When the conductive film 10 is used as a conductive film for a touch panel, the line width of the fine metal wire 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less.
Moreover, the angle which bisects two narrow apex angles among the four apex angles of the rhombus which is the mesh shape 22 can be selected from 30 ° to 44 °. That is, the angle θ formed by the virtual line 24 connecting the plurality of intersections of the mesh pattern 20 in the horizontal direction via the openings 18 and the first metal thin wires 16a is 30 ° or more and 44 ° or less.
The conductive film 10 is used as, for example, an electromagnetic wave shielding film of the display device 30 shown in FIG. 3 or a conductive film for a touch panel. Examples of the display device 30 include a liquid crystal display, a plasma display, an organic EL, and an inorganic EL.

  The display device 30 includes a plurality of pixels 32 arranged in a matrix as shown in FIG. One pixel 32 includes three subpixels (a red subpixel 32r, a green subpixel 32g, and a blue subpixel 32b) arranged in the horizontal direction. One sub-pixel has a rectangular shape that is vertically long in the vertical direction. The horizontal arrangement pitch (horizontal pixel pitch Ph) of the pixels 32 and the vertical arrangement pitch (vertical pixel pitch Pv) of the pixels 32 are substantially the same. That is, the shape (see the shaded area 34) configured by one pixel 32 and a black matrix surrounding the one pixel 32 is a square. Also, the aspect ratio of one pixel 32 is not 1, but the length in the horizontal direction (horizontal)> the length in the vertical direction (vertical).

Then, when the conductive film 10 is installed on the display panel of the display device 30 having such a pixel arrangement, as shown in FIG. Since the angle θ formed by the imaginary line 24 and the first metal thin line 16a is 30 ° or more and 44 ° or less, the metal thin line 16 is arranged in the horizontal arrangement direction of the pixels 32 in the display device 30 as shown in FIG. It has an inclination of 30 ° to 44 ° with respect to (m-direction array). Further, the fine line pitch Ps in the conductive film 10 and the diagonal length La of one pixel 32 in the display device 30 are substantially the same or close to each other, and the arrangement direction of the fine metal lines 16 in the conductive film 10 and the display The diagonal direction of one pixel 32 in the device 30 is also substantially the same or close to each other. As a result, the difference between the pixel arrangement period and the metal thin line 16 arrangement period is reduced, and the occurrence of moire is suppressed.
Therefore, when the conductive film 10 is used as, for example, an electromagnetic wave shielding film, the conductive film 10 is disposed on the display panel in the display device 30, but as described above, the pixel arrangement period and the fine metal wires 16 are arranged. The deviation from the arrangement period is reduced, and the generation of moire is suppressed. In addition, since the pitch Ps of the fine metal wires 16 constituting the mesh pattern 20 is set to 200 μm or more and 400 μm or less, and the line width of the fine metal wires 16 is set to 30 μm or less, high electromagnetic shielding properties and high translucency are provided at the same time. be able to.

Next, a display device having a touch panel, for example, a display device having a projected capacitive touch panel will be described with reference to FIGS.
First, the touch panel 50 includes a sensor main body 52 and a control circuit (configured by an IC circuit or the like) (not shown). As shown in FIGS. 5, 6 and 7A, the sensor body 52 includes a laminated conductive film 54 formed by laminating a first conductive film 10A and a second conductive film 10B, which will be described later, and a top thereof. And a protective layer 56 (the description of the protective layer 56 is omitted in FIG. 7A). The laminated conductive film 54 and the protective layer 56 are arranged on a display panel 58 in the display device 30 such as a liquid crystal display. When viewed from above, the sensor main body 52 includes a sensor unit 60 disposed in a region corresponding to the display screen 58 a of the display panel 58 and a terminal wiring unit 62 disposed in a region corresponding to the outer peripheral portion of the display panel 58. (So-called picture frame).

As shown in FIGS. 6 and 8, the first conductive film 10A applied to the touch panel 50 has a first conductive portion 14A formed on one main surface of the first transparent substrate 12A (see FIG. 7A). The first conductive portions 14A extend in the third direction (m direction) and are arranged in a fourth direction (n direction) orthogonal to the third direction, and are formed of a large number of lattices. 16 includes two or more first conductive patterns 64A (mesh patterns), and first auxiliary patterns 66A formed of fine metal wires 16 arranged around each first conductive pattern 64A.
Each first conductive pattern 64A is configured by combining two or more small lattices 70, respectively. 6 and 8, the first conductive pattern 64A is configured by connecting two or more first large lattices 68A in series in the third direction, and each first large lattice 68A includes two or more small lattices. A lattice 70 is combined. Further, the above-described first auxiliary pattern 66A that is not connected to the first large lattice 68A is formed around the side of the first large lattice 68A.

  The first conductive pattern 64A is not limited to the example using the first large lattice 68A. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small lattices 70 are arranged is partitioned in a strip shape by an insulating portion and a plurality of them are arranged in parallel. For example, two or more strip-shaped first conductive patterns 64A each extending in the m direction from the terminals and arranged in the n direction may be provided. In addition, a pattern in which a plurality of band-shaped mesh patterns extend for each terminal may be used. Further, as the first auxiliary pattern 66A, a mesh pattern that is arranged in parallel with the first conductive pattern 64A and in which, for example, a part of each small lattice 70 is disconnected may be used. In this case, it may be connected to the first conductive pattern 64A or may be separated.

When the first large lattice 68A is used as the first conductive pattern 64A, for example, as shown in FIG. 8, between the adjacent first large lattices 68A, the fine metal wires 16 that electrically connect the first large lattices 68A. Thus, the first connection portion 72A is formed. 72 A of 1st connection parts are comprised by the middle lattice 74 of the magnitude | size by which n pieces (n is a real number larger than 1) small lattice 70 was arranged in the 2nd direction (y direction). Of the sides along the first direction of the first large lattice 68A, a portion adjacent to the middle lattice 74 is formed with a first notched portion 76A in which one side of the small lattice 70 is removed. Here, the small lattice 70 is the smallest rhombus, and has the same shape as the one mesh shape 22 (see FIG. 1) described above. In the example of FIG. 8, the medium lattice 74 has a size in which three small lattices 70 are arranged in the second direction.
In addition, a first insulating portion 78A that is electrically insulated is disposed between adjacent first conductive patterns 64A.
Here, the first auxiliary pattern 66A includes a plurality of first auxiliary lines 80A arranged along the side along the first direction among the sides of the first large lattice 68A (the second direction is defined as the axial direction). Among the sides of the first large lattice 68A, a plurality of first auxiliary lines 80A (the first direction is the axial direction) arranged along the side along the second direction, and the first insulating portion 78A , And two first L-shaped patterns 82A in which two first auxiliary lines 80A are combined in an L shape.

As shown in FIG. 6, the first conductive film 10A configured as described above has an open end of the first large lattice 68A existing on one end side of each first conductive pattern 64A as a first connection. The shape is such that the portion 72A does not exist. The end portion of the first large lattice 68A existing on the other end portion side of each first conductive pattern 64A is electrically connected to the first terminal wiring pattern 86a by the metal thin wire 16 through the first connection portion 84a. Yes.
That is, in the first conductive film 10A applied to the touch panel 50, as shown in FIGS. 5 and 6, the first conductive patterns 64A described above are arranged at portions corresponding to the sensor unit 60, and the terminal wiring unit 62 is arranged with a plurality of first terminal wiring patterns 86a led out from the first connection portions 84a.
In the example of FIG. 5, the outer shape of the first conductive film 10 </ b> A has a rectangular shape when viewed from above, and the outer shape of the sensor unit 60 also has a rectangular shape. In the terminal wiring portion 62, the first conductive film 10A has a peripheral portion on one long side of the first conductive film 10A and a plurality of first terminals 88a in the length direction of the one long side. An array is formed. In addition, a plurality of first connection portions 84a are linearly arranged along one long side of the sensor unit 60 (long side closest to one long side of the first conductive film 10A: n direction). The first terminal wiring pattern 86a derived from each first connection portion 84a is routed toward a substantially central portion on one long side of the first conductive film 10A, and is electrically connected to the corresponding first terminal 88a. It is connected to the.

On the other hand, as shown in FIGS. 5 and 9, the second conductive film 10 </ b> B has a second conductive portion 14 </ b> B formed on one main surface of the second transparent base 12 </ b> B (see FIG. 7A). Each of the second conductive portions 14B extends in the fourth direction (n direction) and is arranged in the third direction (m direction). 2 conductive patterns 64B (mesh patterns), and second auxiliary patterns 66B made of fine metal wires 16 arranged around the second conductive patterns 64B.
Each second conductive pattern 64B is configured by combining two or more small lattices 70. In the example of FIGS. 6 and 10, the second conductive pattern 64B is configured by connecting two or more second large lattices 68B in series in the fourth direction (n-direction). Two or more small lattices 70 are combined. Further, the above-described second auxiliary pattern 66B that is not connected to the second large lattice 68B is formed around the side of the second large lattice 68B.

The second conductive pattern 64B is not limited to the example using the second large lattice 68B. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small lattices 70 are arranged is partitioned in a strip shape by an insulating portion and a plurality of them are arranged in parallel. For example, two or more strip-shaped second conductive patterns 64B extending from the terminals in the n direction and arranged in the m direction may be provided. In addition, a pattern in which a plurality of band-shaped mesh patterns extend for each terminal may be used. The second auxiliary pattern 66B may also be a mesh pattern that is arranged in parallel with the second conductive pattern 64B and in which a part of each small lattice 70 is disconnected, for example. In this case, it may be connected to the second conductive pattern 64B or may be separated.
When the second large lattice 68B is used as the second conductive pattern 64B, for example, as shown in FIG. 10, between the adjacent second large lattices 68B, the fine metal wires 16 that electrically connect the second large lattices 68B. Thus, the second connection portion 72B is formed. The second connection portion 72B is configured by arranging a medium lattice 74 having a size in which n (n is a real number larger than 1) small lattices 70 are arranged in the first direction (x direction). Of the sides along the second direction of the second large lattice 68B, a portion adjacent to the middle lattice 74 is formed with a second notched portion 76B from which one side of the small lattice 70 is missing.
Further, a second insulating portion 78B that is electrically insulated is disposed between the adjacent second conductive patterns 64B.
The second auxiliary pattern 66B includes a plurality of second auxiliary lines 80B (the second direction is defined as the axial direction) arranged along the side along the first direction among the sides of the second large lattice 68B, Among the sides of the two large lattices 68B, each of the second auxiliary lines 80B (the first direction is the axial direction) arranged along the side along the second direction and the second insulating portion 78B are 2 respectively. Two second L-shaped patterns 82B in which two second auxiliary lines 80B are combined in an L shape have a pattern arranged to face each other.

As shown in FIGS. 5 and 6, the second conductive film 10 </ b> B configured as described above has a second conductive film 10 </ b> B present on one end side of every second (for example, odd number) second conductive pattern 64 </ b> B. The open end of the large lattice 68B and the open end of the second large lattice 68B existing on the other end side of the even-numbered second conductive pattern 64B have a shape in which the second connection portion 72B does not exist. . On the other hand, the second large lattice 68B that exists on the other end side of each odd-numbered second conductive pattern 64B and the second end that exists on the one end side of each even-numbered second conductive pattern 64B. The ends of the large lattice 68B are electrically connected to the second terminal wiring pattern 86b formed by the fine metal wires 16 via the second connection portions 84b.
That is, in the second conductive film 10B applied to the touch panel 50, as shown in FIG. 6, a large number of second conductive patterns 64B are arranged in a portion corresponding to the sensor unit 60, and each of the second wiring patterns 62B is arranged in the terminal wiring unit 62. A plurality of second terminal wiring patterns 86b led out from the two connection portions 84b are arranged.

As shown in FIG. 5, among the terminal wiring portions 62, a plurality of second terminals 88 b are arranged in the central portion in the longitudinal direction on the peripheral portion on one long side of the second conductive film 10 </ b> B. The long side is arranged in the length direction. A plurality of second connection portions 84b (for example, odd-numbered second connection portions) along one short side of the sensor unit 60 (short side closest to one short side of the second conductive film 10B: m direction). 84b) are arranged in a straight line, and a plurality of second connection portions 84b (for example, along the other short side of the sensor unit 60 (short side closest to the other short side of the second conductive film 10B: m direction)). Even-numbered second connection portions 84b) are arranged in a straight line.
Among the plurality of second conductive patterns 64B, for example, odd-numbered second conductive patterns 64B are connected to the corresponding odd-numbered second connection portions 84b, and even-numbered second conductive patterns 64B are respectively corresponding even-numbered. It is connected to the second second connection portion 84b. The second terminal wiring pattern 86b derived from the odd-numbered second connection portion 84b and the second terminal wiring pattern 86b derived from the even-numbered second connection portion 84b are one long side of the second conductive film 10B. And are electrically connected to the corresponding second terminals 88b.
The first terminal wiring pattern 86a may be derived in the same manner as the second terminal wiring pattern 86b described above, and the second terminal wiring pattern 86b may be derived in the same manner as the first terminal wiring pattern 86a.

The length of one side of the first large lattice 68A and the second large lattice 68B is preferably 3 to 10 mm, and more preferably 4 to 6 mm. If the length of one side is less than the above lower limit value, the capacitance of the first large lattice 68A and the second large lattice 68B at the time of detection decreases, so the possibility of detection failure increases. On the other hand, if the upper limit is exceeded, the position detection accuracy may be reduced. From the same viewpoint, the length of one side of the small lattice 70 constituting the first large lattice 68A and the second large lattice 68B is preferably 100 to 400 μm or less, more preferably 150 to 300 μm, and most preferably 210 to 250 μm. It is as follows. When the small lattice 70 is in the above range, the transparency can be further kept good, and the display can be visually recognized without discomfort when mounted on the display panel 58 of the display device 30.
The line width of the first conductive pattern 64A (first large lattice 68A, medium lattice 74, small lattice 70) and the line width of the second conductive pattern 64B (second large lattice 68B, medium lattice 74, small lattice 70). Can be selected from 30 μm or less. As described above, when used for a touch panel, the line width of the fine metal wire 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less.
The line widths of the first auxiliary pattern 66A (first auxiliary line 80A) and the second auxiliary pattern 66B (second auxiliary line 80B) are 1 to 15 μm, respectively. In this case, the line width of the first conductive pattern 64A and the line width of the second conductive pattern 64B may be the same or different. However, it is preferable that the line widths of the first conductive pattern 64A, the second conductive pattern 64B, the first auxiliary pattern 66A, and the second auxiliary pattern 66B are the same.

For example, when the first conductive film 10A is laminated on the second conductive film 10B to form the laminated conductive film 54, the first conductive pattern 64A and the second conductive pattern 64B are formed as shown in FIG. Specifically, the first connecting portion 72A of the first conductive pattern 64A and the second connecting portion 72B of the second conductive pattern 64B are in the first transparent substrate 12A (see FIG. 7A). The first insulating portion 78A of the first conductive portion 14A and the second insulating portion 78B of the second conductive portion 14B are opposed to each other with the first transparent base 12A interposed therebetween.
When the laminated conductive film 54 is viewed from the upper surface, as shown in FIG. 10, the second conductive film 10B has the second conductive film 10B so as to fill the gaps of the first large lattice 68A formed in the first conductive film 10A. The large lattice 68B is arranged. At this time, a combination pattern 90 is formed between the first large lattice 68A and the second large lattice 68B by the first auxiliary pattern 66A and the second auxiliary pattern 66B facing each other. In the combination pattern 90, as shown in FIG. 11, the first axis 92A of the first auxiliary line 80A and the second axis 92B of the second auxiliary line 80B coincide, and the first auxiliary line 80A and the second auxiliary line 80B does not overlap and one end of the first auxiliary line 80A coincides with one end of the second auxiliary line 80B, thereby constituting one side of the small lattice 70 (mesh shape). That is, the combination pattern 90 has a form in which two or more small lattices 70 (mesh shape) are combined. As a result, when the laminated conductive film 54 is viewed from above, a large number of small lattices 70 (mesh shape) are spread as shown in FIG.

At this time, as shown in FIG. 4, the thin metal wires 16 constituting the large number of small lattices 70 are inclined by 30 ° to 44 ° with respect to the horizontal arrangement direction (m-direction arrangement) of the pixels 32 in the display device 30. Will have. Further, the fine line pitch Ps in the conductive film 10 and the diagonal length La of one pixel 32 in the display device 30 are substantially the same or close to each other, and the arrangement direction of the fine metal lines 16 in the conductive film 10 and the display The diagonal direction of one pixel 32 in the device 30 is also substantially the same or close to each other. As a result, the difference between the pixel arrangement period and the metal thin line 16 arrangement period is reduced, and the occurrence of moire is suppressed.
When this laminated conductive film 54 is used as a touch panel, a protective layer 56 is formed on the first conductive film 10A, and the first conductive pattern 64A derived from the multiple first conductive patterns 64A of the first conductive film 10A. The one-terminal wiring pattern 86a and the second terminal wiring pattern 86b derived from the multiple second conductive patterns 64B of the second conductive film 10B are connected to, for example, a control circuit that controls scanning.

  As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the self-capacitance method, voltage signals for touch position detection are sequentially supplied to the first conductive pattern 64A, and voltage signals for touch position detection are sequentially supplied to the second conductive pattern 64B. Supply. Since the capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position and GND (ground) is increased by bringing the fingertip into contact with or close to the upper surface of the protective layer 56, the first conductive pattern The waveforms of the transmission signals from 64A and the second conductive pattern 64B are different from the waveforms of the transmission signals from the other conductive patterns. Accordingly, the control circuit calculates the touch position based on the transmission signal supplied from the first conductive pattern 64A and the second conductive pattern 64B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 64A, and sensing (detection of a transmission signal) is sequentially performed on the second conductive pattern 64B. Do. Since the fingertip contacts or approaches the upper surface of the protective layer 56, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position. The waveform of the transmission signal from the second conductive pattern 64B is different from the waveform of the transmission signal from the other second conductive pattern 64B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive patterns 64A supplying the voltage signal and the transmission signal from the supplied second conductive pattern 64B. By adopting such a self-capacitance type or mutual capacitance type touch position detection method, it is possible to detect each touch position even if two fingertips are simultaneously in contact with or close to the upper surface of the protective layer 56. Become. As prior art documents related to a projection type capacitance detection circuit, US Pat. No. 4,582,955, US Pat. No. 4,686,332, US Pat. No. 4,733,222 Specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. No. 7,030,860, US Published Patent No. 2004/0155871, etc. is there.

In the above-described laminated conductive film 54, as shown in FIGS. 6 and 7A, the first conductive pattern 64A is formed on one main surface of the first transparent substrate 12A, and the second conductive substrate 64B has a second surface on the main surface. Although the conductive pattern 64B is formed, as shown in FIG. 7B, the first conductive portion 14A is formed on one main surface of the first transparent base 12A, and the first main surface 14A is formed on the other main surface. The two conductive portions 14B may be formed. In this case, the second transparent substrate 12B does not exist, the first transparent substrate 12A is laminated on the second conductive portion 14B, and the first conductive portion 14A is laminated on the first transparent substrate 12A. Further, the first conductive film 10A and the second conductive film 10B may have other layers between them, and if the first conductive part 14A and the second conductive part 14B are in an insulated state, they are You may arrange | position facing.
As shown in FIG. 5, for positioning, for example, when the first conductive film 10A and the second conductive film 10B are attached to each corner portion of the first conductive film 10A and the second conductive film 10B. The first alignment mark 94a and the second alignment mark 94b are preferably formed. The first alignment mark 94a and the second alignment mark 94b become a new composite alignment mark when the first conductive film 10A and the second conductive film 10B are bonded to form a laminated conductive film 54. The alignment mark also functions as an alignment mark for positioning used when the laminated conductive film 54 is installed on the display panel 58.

In the above-described example, the first conductive film 10A and the second conductive film 10B are applied to the projected capacitive touch panel 50. However, in addition, the surface capacitive touch panel, the resistance It can also be applied to a membrane touch panel.
Moreover, although the example which used the electroconductive film 10 for the electromagnetic wave shield film and the laminated electroconductive film for touch panels was shown in the above-mentioned example, as an optical film installed in the display panel 58 of the display apparatus 30 other than that, Can also be used. In this case, it may be a conductive film in which a mesh pattern is formed corresponding to the entire display panel 58, or may be a conductive film 10 in which the mesh pattern 20 is formed corresponding to the entire display screen 58a. It is good also as the electroconductive film 10 in which the mesh pattern was formed corresponding to the one part area | region (a corner part, a center part, etc.) in the display screen 58a.

  Next, a method for manufacturing the conductive film 10 will be described. As a method for producing the conductive film 10, for example, the transparent substrate 12 is exposed to a photosensitive material having an emulsion layer containing a photosensitive silver halide salt and subjected to a development treatment, whereby an exposed area and an unexposed area are respectively exposed. The metallic silver part and the light transmissive part may be formed to form the mesh pattern 20. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further.

Alternatively, a photosensitive plating layer is formed on the first transparent substrate 12A and the second transparent substrate 12B using a pretreatment material for plating, and then exposed and developed, and then subjected to a plating treatment, whereby an exposed portion and The first conductive pattern 64A and the second conductive pattern 64B may be formed by forming a metal part and a light transmissive part in the unexposed part, respectively. Further, a conductive metal may be supported on the metal part by further performing physical development and / or plating treatment on the metal part.
The following two forms are mentioned as a more preferable form of the method using a plating pretreatment material. The following more specific contents are disclosed in JP 2003-213437 A, JP 2006-64923 A, JP 2006-58797 A, JP 2006-135271 A, and the like.
(A) A plated layer containing a functional group that interacts with a plating catalyst or its precursor is applied on a transparent substrate, and then exposed and developed, and then plated to form a metal part on the material to be plated. Aspect.
(B) After laminating a base layer containing a polymer and a metal oxide and a layer to be plated containing a functional group that interacts with a plating catalyst or a precursor thereof in this order on a transparent substrate, and then exposing and developing A mode in which a metal part is formed on a material to be plated by plating.

As another method, the photoresist film on the copper foil formed on the transparent substrate 12 is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched to form the mesh pattern 20. May be formed.
Alternatively, the mesh pattern 20 may be formed by printing a paste containing metal fine particles on the transparent substrate 12 and performing metal plating on the paste.
Alternatively, the mesh pattern 20 may be printed on the transparent substrate 12 by a screen printing plate or a gravure printing plate.
Alternatively, the mesh pattern 20 may be formed on the transparent substrate 12 by inkjet.

Next, in the conductive film 10 according to the present embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable embodiment will be mainly described.
The manufacturing method of the conductive film 10 according to the present embodiment includes the following three forms depending on the photosensitive material and the form of development processing.
(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

Here, the configuration of each layer of the conductive film 10 according to the present embodiment will be described in detail below.
[Transparent substrate 12]
Examples of the transparent substrate 12 include a plastic film, a plastic plate, and a glass plate.
Examples of raw materials for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); triacetyl cellulose (TAC) and the like.
As the transparent substrate 12, a plastic film or a plastic plate having a melting point of about 290 ° C. or less is preferable, and PET is particularly preferable from the viewpoints of light transmittance, workability, and the like.

[Silver salt emulsion layer]
The silver salt emulsion layer to be the fine metal wires 16 of the conductive film 10 contains additives such as a solvent and a dye in addition to the silver salt and the binder.
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.
Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / ^{m 2} in terms of silver, more preferably 1 to 25 g / ^{m 2,} more preferably 5 to 20 g / ^{m 2} . By setting the amount of coated silver in the above range, a desired surface resistance can be obtained when the conductive film 10 is used.
Examples of the binder used in this embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The binder content in the silver salt emulsion layer is preferably ¼ or more, more preferably ½ or more in terms of the silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in the resistance value can be suppressed, and the conductive film 10 having a uniform surface resistance can be obtained. . The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.
[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. An undercoat layer, for example, can be provided below the silver salt emulsion layer.

Next, each process of the manufacturing method of the electroconductive film 10 is demonstrated.
[exposure]
In the present embodiment, the case where the mesh pattern 20 is applied by a printing method is included, but the mesh pattern 20 is formed by exposure, development, and the like except for the printing method. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the transparent substrate 12 or a photosensitive material coated with a photopolymer for photolithography. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like.
The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.
The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment.
The mass of the metallic silver part contained in the exposed part after the development treatment is preferably a content of 50% by mass or more with respect to the mass of silver contained in the exposed part before the exposure, and is 80% by mass or more. More preferably it is. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.
The conductive film 10 is obtained through the above steps. The obtained conductive film 10 has a surface resistance of 0.1 to 300 ohm / sq. It is preferable that it exists in the range. The surface resistance varies depending on the use of the conductive film 10, but in the case of the electromagnetic wave shielding use, it is 10 ohm / sq. Or less, preferably 0.1 to 3 ohm / sq. It is more preferable that In the case of touch panel use, 1 to 70 ohm / sq. It is preferable that it is 5-50 ohm / sq. More preferably, it is 5-30 ohm / sq. More preferably. Further, the conductive film 10 after the development process may be further subjected to a calendar process, and the desired surface resistance can be adjusted by the calendar process.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. Also good. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".
“Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.
In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.
[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

[Conductive metal part]
The line width of the conductive metal portion of this embodiment (the line width of the fine metal wire 16) can be selected from 30 μm or less. When the conductive film 10 is used as an electromagnetic wave shielding film, the line width of the fine metal wire 16 is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less. When the conductive film 10 is used as a conductive film for a touch panel, the lower limit is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is preferably 15 μm, 10 μm or less, 9 μm or less, or 8 μm or less. When the line width is less than the above lower limit value, the conductivity becomes insufficient, so that when used for a touch panel, the detection sensitivity becomes insufficient. On the other hand, when the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or visibility is deteriorated when used for a touch panel. In addition, by being in the said range, the moire of an electroconductive metal part is improved and visibility becomes especially good. The fine wire pitch Ps (arrangement pitch of the fine metal wires 16) is preferably from 100 μm to 400 μm, more preferably from 150 μm to 300 μm, and most preferably from 210 μm to 250 μm. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.
The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the entire light-transmitting portion excluding the thin metal wires. For example, the aperture ratio of a square lattice having a line width of 6 μm and a fine wire pitch of 240 μm is 95%.
[Light transmissive part]
The “light transmissive part” in the present embodiment means a part having a light transmissive property other than the conductive metal part in the conductive film 10. As described above, the transmittance in the light transmissive portion is 90% or more, preferably the transmittance indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the transparent substrate 12, 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[Conductive film 10]
The thickness of the transparent substrate 12 in the conductive film 10 according to the present embodiment is preferably 5 to 350 μm, and more preferably 30 to 150 μm. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.
The thickness of the metallic silver portion provided on the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating applied on the transparent substrate 12. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.
The thickness of the conductive metal portion is preferable for the use of the touch panel 50 because the viewing angle of the display panel 58 increases as the thickness of the conductive metal portion decreases. A thin film is also required from the viewpoint of improving the visibility. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.
In the present embodiment, the thickness of the layer made of conductive metal particles is formed by controlling the coating thickness of the silver salt-containing layer described above to form a metallic silver portion having a desired thickness, and further by physical development and / or plating treatment. Therefore, even a conductive film having a thickness of less than 5 μm, preferably less than 3 μm can be easily formed.
In the method for manufacturing the conductive film 10 according to the present embodiment, the steps such as plating are not necessarily performed. This is because in the method for manufacturing the conductive film 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount and silver / binder volume ratio of the silver salt emulsion layer. In addition, you may perform a calendar process etc. as needed.

(Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .
The conductive film 10 according to the present embodiment may be provided with a functional layer such as an antireflection layer or a hard coat layer.
[Calendar processing]
The developed silver metal portion may be smoothed by calendaring. This significantly increases the conductivity of the metallic silver part. The calendar process can be performed by a calendar roll. The calendar roll usually consists of a pair of rolls.
As a roll used for the calendar process, a plastic roll or a metal roll such as epoxy, polyimide, polyamide, polyimide amide or the like is used. In particular, when emulsion layers are provided on both sides, it is preferable to treat with metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit value of the linear pressure is 1960 N / cm (200 kgf / cm, converted to a surface pressure of 699.4 kgf / cm ² ) or more, more preferably 2940 N / cm (300 kgf / cm, converted to a surface pressure of 935.8 kgf / cm ^2). ) That's it. The upper limit of the linear pressure is 6880 N / cm (700 kgf / cm) or less.
The application temperature of the smoothing treatment represented by the calender roll is preferably 10 ° C. (no temperature control) to 100 ° C., and the more preferable temperature varies depending on the line density and shape of the metal mesh pattern and metal wiring pattern, and the binder type. , Approximately 10 ° C. (no temperature control) to 50 ° C.

  In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.
In this example, for the conductive films according to Comparative Examples 1 to 6 and Examples 1 to 36, the aperture ratio was calculated, and the moire was evaluated. Tables 3 and 4 show the details of Comparative Examples 1 to 6 and Examples 1 to 36, the calculation results, and the evaluation results.

<Examples 1-36 and Comparative Examples 1-6>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .
In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver was 10 g / m ^2. It was coated on a transparent substrate (here, both polyethylene terephthalate (PET)). At this time, the volume ratio of Ag / gelatin was 2/1.
Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)
The pattern of exposure was the mesh pattern 20 shown in FIG. 1, and was performed on an A4 size (210 mm × 297 mm) transparent substrate. The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.
(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.

Example 1
The inclination of the fine metal wires 16 (the angle θ formed by the imaginary line 24 connecting the plurality of intersections of the mesh pattern 20 in the horizontal direction via the openings 18 and the first fine metal wires 16a) is 30 °, and the fine wire pitch Ps is 200 μm. A conductive film according to Example 1 was fabricated with the line width of the fine metal wires 16 being 6 μm.
(Examples 2 to 6)
In Examples 2, 3, 4, 5, and 6, conductive films were produced in the same manner as in Example 1 except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm, and 400 μm, respectively.
(Example 7)
The conductive film according to Example 7 was manufactured with the inclination of the fine metal wires 16 being 36 °, the fine wire pitch Ps being 200 μm, and the width of the fine metal wires 16 being 6 μm.
(Examples 8 to 12)
In Examples 8, 9, 10, 11, and 12, conductive films were produced in the same manner as in Example 7, except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm, and 400 μm, respectively.
(Example 13)
The conductive film according to Example 13 was manufactured with the inclination of the fine metal wires 16 being 37 °, the fine wire pitch Ps being 200 μm, and the width of the fine metal wires 16 being 6 μm.
(Examples 14 to 18)
In Examples 14, 15, 16, 17, and 18, conductive films were produced in the same manner as in Example 13 except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm, and 400 μm, respectively.
(Example 19)
A conductive film according to Example 19 was manufactured by setting the inclination of the fine metal wires 16 to 39 °, the fine wire pitch Ps to 200 μm, and the line width of the fine metal wires 16 to 6 μm.
(Examples 20 to 24)
In Examples 20, 21, 22, 23, and 24, conductive films were produced in the same manner as in Example 19 except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm, and 400 μm, respectively.
(Example 25)
A conductive film according to Example 25 was manufactured by setting the inclination of the fine metal wires 16 to 40 °, the fine wire pitch Ps to 200 μm, and the width of the fine metal wires 16 to 6 μm.
(Examples 26 to 30)
In Examples 26, 27, 28, 29 and 30, conductive films were produced in the same manner as in Example 25 except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm and 400 μm, respectively.
(Example 31)
A conductive film according to Example 31 was fabricated with the inclination of the fine metal wires 16 being 44 °, the fine wire pitch Ps being 200 μm, and the width of the fine metal wires 16 being 6 μm.
(Examples 32-36)
In Examples 32, 33, 34, 35 and 36, conductive films were produced in the same manner as in Example 31 except that the fine wire pitch Ps was 220 μm, 240 μm, 260 μm, 300 μm and 400 μm, respectively.

(Comparative Example 1)
A conductive film according to Comparative Example 1 was fabricated with the inclination of the fine metal wires 16 being 29 °, the fine wire pitch Ps being 200 μm, and the width of the fine metal wires 16 being 6 μm.
(Comparative Examples 2 and 3)
In Comparative Examples 2 and 3, conductive films were produced in the same manner as Comparative Example 1 except that the fine wire pitch Ps was 300 μm and 400 μm, respectively.
(Comparative Example 4)
A conductive film according to Comparative Example 4 was fabricated with the inclination of the fine metal wires 16 being 45 °, the fine wire pitch Ps being 200 μm, and the width of the fine metal wires 16 being 6 μm.
(Comparative Examples 5 and 6)
In Comparative Examples 5 and 6, conductive films were produced in the same manner as in Comparative Example 4 except that the fine wire pitch Ps was 300 μm and 400 μm, respectively.

[Evaluation]
(Calculation of aperture ratio)
In order to confirm the quality of transparency, the transmittance of the conductive film was measured for each of Comparative Examples 1 to 6 and Examples 1 to 36 using a spectrophotometer, and the aperture ratio was further calculated by proportional calculation.
(Evaluation of moire)
About Comparative Examples 1-6 and Examples 1-36, after sticking a conductive film on the display panel 58 of the display apparatus 30, the display apparatus 30 is installed in a turntable, the display apparatus 30 is driven, and white is produced. Display. In this state, the rotating disk was rotated between a bias angle of −20 ° and + 20 °, and the moire was visually observed and evaluated. The horizontal pixel pitch Ph and the vertical pixel pitch Pv of the display device 30 were both about 192 μm. As a display for evaluation, Pavilion Notebook PC dm1a (11.6 inch glossy liquid crystal WXGA / 1366 × 768) manufactured by HP was used.
Moire is evaluated at an observation distance of 0.5 m from the display screen of the display device 30. If the moire is not manifested, ○, if the moire is seen at a level with no problem, Δ, and the moire is revealed. The case where it did is made x. And, as an overall score, A when the angle range that becomes ◯ is 10 ° or more, B when the angle range that becomes ◯ is less than 10 °, and there is no angle range that becomes ○, and the angle range that becomes × is less than 30 ° In the case of D, the case where there was no angle range for C and ◯ and the angle range for X was 30 ° or more was defined as D.

From Table 3 and Table 4, it was found that all of Comparative Examples 1 to 6 were evaluated as D, and moire was evident. On the other hand, in Examples 1 to 36, in Examples 1, 4 to 7, 25, 28 to 31, and 34 to 36, moire was slightly apparent, but at a level with no problem. Of the other examples, Examples 2, 3, 10-13, 16-19, 22-24, 26, 27, 32, 33 were good with almost no moire. In particular, in Examples 8, 9, 14, 15, 20, and 21 in which the inclination of the fine metal wire 16 was 36 ° to 39 ° and the fine wire pitch Ps was 220 μm and 240 μm, no moire was generated.
In addition, each of the projected capacitive touch panels 50 was manufactured using the conductive films according to Examples 1 to 36 described above. When touched with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. In addition, when two or more points were touched and operated, good results were obtained in the same manner, and it was confirmed that multi-touch could be supported.
Of course, the display device and the conductive film including the conductive film according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Conductive film 10A ... 1st conductive film 10B ... 2nd conductive film 12 ... Transparent base 12A ... 1st transparent base 12B ... 2nd transparent base 14 ... Conductive part 14A ... 1st conductive part 14B ... 2nd conductive Part 16 ... Metal fine wire 16a ... First metal fine wire 16b ... Second metal fine wire 18 ... Opening 20 ... Mesh pattern 22 ... Mesh shape 24 ... Virtual line 30 ... Display device 32 ... Pixel 32r ... Red subpixel 32g ... Green subpixel 32b ... Blue subpixel 50 ... Touch panel 52 ... Sensor body 54 ... Laminated conductive film

Claims (19)

A display device comprising a conductive film installed on a display panel,
The conductive film includes a conductive portion having a mesh pattern made of fine metal wires,
The display device, wherein the thin line has an inclination of 30 ° to 44 ° with respect to a pixel arrangement direction of the display device. The display device according to claim 1,
The display device, wherein the thin line has an inclination of 32 ° to 39 ° with respect to a pixel arrangement direction of the display device. The display device according to claim 1 or 2,
A display device characterized in that a pitch of the fine lines is 100 to 400 μm. The display device according to any one of claims 1 to 3,
A display device characterized in that a line width of the fine line is 30 μm or less. The display device according to any one of claims 1 to 4,
The pixel is composed of a plurality of subpixels,
The display device according to claim 1, wherein an arrangement direction of the pixels is the same as an arrangement direction of the sub-pixels. In the display device according to any one of claims 1 to 5,
A display device characterized in that a line that virtually connects a plurality of intersections of the mesh pattern via openings respectively coincides with an arrangement direction of the pixels. The display device according to any one of claims 1 to 6,
The mesh pattern extends along a first direction and two or more first metal fine wires arranged in a second direction;
Two or more second metal wires extending in the second direction and arranged in the first direction;
The first direction is inclined at an angle of + 30 ° to + 44 ° with respect to the reference direction,
The display device, wherein the second direction is inclined at an angle of −30 ° to −44 ° with respect to a reference direction. The display device according to any one of claims 1 to 7,
A display device, wherein one mesh shape of the mesh pattern is a rhombus. The display device according to any one of claims 1 to 8,
A display device, wherein an aspect ratio of the pixel is different from 1. The display device according to any one of claims 1 to 9,
The display device, wherein the vertical arrangement pitch of the pixels and the horizontal arrangement pitch of the pixels are the same. In the display device according to any one of claims 1 to 10,
The display device according to claim 1, wherein the conductive film has an electromagnetic wave shielding function. In the display device according to any one of claims 1 to 10,
The conductive film has a first conductive part having a mesh pattern of metal fine lines on one main surface on a transparent support, and a second conductive part having a mesh pattern of metal fine lines on the other main surface. A display device having a touch sensor function. A conductive film installed on a display panel of a display device,
Provided with a conductive part having a mesh pattern of fine metal wires,
The conductive film according to claim 1, wherein the thin line has an inclination of 30 ° to 44 ° with respect to a pixel arrangement direction of the display device. The conductive film according to claim 13.
The conductive film characterized in that the pitch of the fine wires is 100 to 400 μm. The conductive film according to claim 13 or 14,
The conductive film according to claim 1, wherein the fine wire has a line width of 30 μm or less. In the electroconductive film of any one of Claims 13-15,
The pixel is composed of a plurality of subpixels,
The conductive film is characterized in that the arrangement direction of the pixels is the same as the arrangement direction of the sub-pixels. The conductive film according to any one of claims 13 to 16, wherein
A conductive film characterized in that a line that virtually connects a plurality of intersections of the mesh pattern via openings and an arrangement direction of the pixels coincide with each other. In the electroconductive film of any one of Claims 13-17,
The mesh pattern extends along a first direction and two or more first metal fine wires arranged in a second direction;
Two or more second metal wires extending in the second direction and arranged in the first direction;
The first direction is inclined at an angle of + 30 ° to + 44 ° with respect to the reference direction,
The conductive film is characterized in that the second direction is inclined at an angle of not less than -30 ° and not more than -44 ° with respect to a reference direction. In the electroconductive film of any one of Claims 13-18,
The conductive film according to claim 1, wherein one mesh shape of the mesh pattern is a rhombus.

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