JP5711606B2 - Conductive sheet and touch panel - Google Patents

Description

  The present invention relates to a conductive sheet and a touch panel, and more particularly to a conductive sheet and a touch panel suitable for use in a projected capacitive touch panel.

As for the transparent conductive film using a thin metal wire, for example, as disclosed in Patent Documents 1 and 2, research continues.
Recently, the touch panel has attracted attention. The touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but it is considered that the touch panel will be increased in size by being applied to a display for a personal computer.
In such future trends, since conventional electrodes use ITO (Indium Tin Oxide), as the resistance increases and the application size increases, the current transfer speed between the electrodes decreases, and the response speed There is a problem that the time from when the fingertip is touched until the position is detected is delayed.
Therefore, it is conceivable to reduce the surface resistance by arranging an electrode by arranging a large number of grids made of metal fine wires (metal fine wires). For example, Patent Documents 3 to 9 are known as touch panels using metal fine wires as electrodes.

US Patent Application Publication No. 2004/0229028 International Publication No. 2006/001461 Pamphlet JP-A-5-224818 US Pat. No. 5,130,041 International Publication No. 1995/27334 Pamphlet US Patent Application Publication No. 2004/0239650 US Pat. No. 7,202,859 International Publication No. 1997/18508 Pamphlet JP 2003-099185 A

By the way, like patent documents 3-9, when using a metal fine wire as an electrode of a touch panel, since a metal fine wire is produced with an opaque material, transparency and visibility become a problem.
The present invention has been made in consideration of such problems, and in a touch panel, even when an electrode is configured with a pattern of fine metal wires, high transparency can be ensured and visibility can be improved. It is another object of the present invention to provide a conductive sheet for a touch panel and a touch panel that can improve detection sensitivity.

[1] A conductive sheet according to a first aspect of the present invention includes a base and a conductive portion formed on one main surface of the base, and the conductive portion is formed of fine metal wires arranged in one direction. It has two or more conductive patterns, and the conductive pattern is configured by connecting two or more sensing units by metal thin wires, and each hypotenuse of the sensing unit has one or more steps.
[2] In the first aspect of the present invention, each hypotenuse of the sensing unit has a stepped pattern having one or more steps.
[3] In the first aspect of the present invention, the sensing unit has a substantially rhombus shape.
[4] In the first aspect of the present invention, the sensing unit is configured by arranging a plurality of small lattices having a rhombus shape, and the step of the sensing unit is equal to an integral multiple of the height of the small lattice. It is characterized by.
[5] In the first aspect of the present invention, the conductive pattern has a connection portion for connecting the adjacent sensing portions to each other, and between the adjacent conductive patterns, between the sensing portions of the conductive patterns. Are connected to each other, and the step-like pattern is formed on the small lattice through the step from the apex portion on the non-connecting portion side toward the apex portion on the connecting portion side. Characterized by increasing columns.
[6] In the first aspect of the present invention, the conductive pattern has a connection part for connecting the adjacent sensing parts to each other, and between the adjacent conductive patterns, between the sensing parts of the conductive pattern. Are connected to each other, and the step-like pattern is formed on the small lattice through the step from the apex portion on the non-connecting portion side toward the apex portion on the connecting portion side. Characterized by decreasing columns.
[7] In the first aspect of the present invention, a portion where the apex angle portion on the connection portion side of the sensing portion and the oblique side are adjacent has a notch portion in which one side of the small lattice is missing. Features.
[8] In the first aspect of the present invention, the conductive portion has an auxiliary pattern arranged along the stepped pattern, and the auxiliary pattern is a plurality of auxiliary lines disconnected from the sensing portion. The auxiliary line has a length smaller than one side of the small lattice, and is arranged at equal intervals with the interval between two opposing sides of the small lattice.
[9] In the first aspect of the present invention, the auxiliary pattern includes an L-shaped pattern in which two auxiliary lines are combined in an L shape in the vicinity of the step and opposed to a corner of the step. To do.
[10] In the first aspect of the present invention, between the adjacent conductive patterns, a non-connecting portion that disconnects the sensing portions of the conductive patterns from each other is disposed. The two auxiliary lines are combined in an L shape, and two L-shaped patterns arranged to face each other along the second direction are provided.
[11] In the conductive sheet according to the second aspect of the present invention, the first conductive portion and the second conductive portion are arranged to face each other with the base interposed therebetween, and the first conductive portion is a metal arranged in one direction. The first conductive pattern includes two or more first conductive patterns formed of fine wires, and the second conductive portion includes two or more second conductive patterns formed of metal thin wires arranged in a direction orthogonal to the one direction. Is formed by connecting two or more first sensing units using metal thin wires, and the second conductive pattern is formed by connecting two or more second sensing units using metal thin wires, Each hypotenuse of the unit has one or more steps, and each hypotenuse of the second sensing unit has one or more steps.
[12] In the second aspect of the present invention, each hypotenuse of the first sensing unit has a first stepped pattern having one or more steps, and each hypotenuse of the second sensing unit is 1 It has the 2nd step-like pattern which has the above level | step difference, It is characterized by the above-mentioned.
[13] In the second aspect of the present invention, the first sensing unit and the second sensing unit have a substantially rhombus shape.
[14] In the second aspect of the present invention, the first sensing unit and the second sensing unit are configured by arranging a plurality of small lattices having a rhombus shape, and the step difference of the first sensing unit. The step of the second sensing unit is equal to an integral multiple of the height of the small lattice.
[15] In the second aspect of the present invention, the first conductive pattern has a first connection portion that connects the adjacent first sensing portions to each other, and the second conductive pattern is adjacent to the second conductive pattern. A second connecting part for connecting the first sensing parts to each other, and between the adjacent first conductive patterns, the first sensing parts of the first conductive patterns are not connected to each other. A non-connecting portion is disposed, and between the adjacent second conductive patterns, a second non-connecting portion is disposed to disconnect each of the second sensing portions of the second conductive pattern from each other. In the first staircase pattern, a row of the small lattices increases from the apex angle portion on the first non-connection portion side toward the apex angle portion on the first connection portion side through the step, and the second pattern The step-like pattern of the second connecting portion side from the apex corner portion on the second non-connecting portion side The rows of the small lattices decrease through the step toward the apex portion.
[16] In the second aspect of the present invention, the apex angle portion on the first connecting portion side in the first sensing portion and the portion where the oblique side of the first sensing portion is adjacent to each other, the second sensing At least one of the apex angle portion on the second connection portion side of the portion and the portion where the oblique side of the second sensing portion is adjacent is provided with a notch portion in which one side of the small lattice is missing. It is characterized by having.
[17] In the second aspect of the present invention, the first conductive portion has a first auxiliary pattern arranged along the first step-like pattern, and the first auxiliary pattern includes the first auxiliary pattern. A plurality of first auxiliary lines disconnected from the sensing unit; and the second conductive unit includes a second auxiliary pattern arranged along the second stepped pattern; The auxiliary pattern includes a plurality of second auxiliary lines that are not connected to the second sensing unit, and the first auxiliary line has a length smaller than one side of the small lattice and is opposed to the small lattice. The second auxiliary lines have a length smaller than one side of the small lattice and are arranged at equal intervals with the two opposite sides of the small lattice. Features.
[18] In the second aspect of the present invention, the first auxiliary pattern includes two first auxiliary lines combined in an L shape in the vicinity of the step of the first stepped pattern, and a corner portion of the step. The second auxiliary pattern includes two second auxiliary lines combined in an L shape in the vicinity of the step of the second stepped pattern, and a corner of the step. It includes a second L-shaped pattern facing the part.
[19] In the second aspect of the present invention, between the adjacent first conductive patterns, a first non-connecting portion is provided that disconnects the first sensing portions of the first conductive patterns from each other. Between the adjacent second conductive patterns, there is disposed a second non-connecting portion that disconnects the second sensing portions of the second conductive patterns from each other, and the first non-connecting portion includes , Each of the two first auxiliary lines is combined in an L shape, and two third L-shaped patterns are provided opposite to each other along a direction orthogonal to the one direction, and the second non-connection is provided. The part is characterized in that two second auxiliary lines are combined in an L shape, and two fourth L-shaped patterns are provided so as to face each other along the one direction.
[20] In the second aspect of the present invention, when viewed from above, the portion where the first conductive pattern and the second conductive pattern face each other has a form in which a plurality of the small lattices are combined. To do.
[21] The second aspect of the present invention is characterized in that the arrangement pitch of each of the small lattices is 100 to 400 μm.
[22] In the second aspect of the present invention, the thin metal wire has a line width of 15 μm or less.
[23] A touch panel according to a third aspect of the present invention is a touch panel including a conductive sheet installed on a display panel, and the conductive sheet is formed on a base and one main surface of the base. A conductive portion, wherein the conductive portion has two or more conductive patterns made of fine metal wires arranged in one direction, and the conductive pattern is configured by connecting two or more sensing portions made of fine metal wires, Each hypotenuse of the sensing unit has one or more steps.
[24] In the third aspect of the present invention, each hypotenuse of the sensing unit has a stepped pattern having one or more steps.
[25] In the third aspect of the present invention, the sensing section has a substantially rhombus shape.
[26] A touch panel according to a fourth aspect of the present invention is a touch panel including a conductive sheet placed on a display panel, and the conductive sheet includes a first conductive part and a second conductive part via a base. The first conductive part has two or more first conductive patterns formed of fine metal wires arranged in one direction, and the second conductive part is arranged in a direction orthogonal to the one direction. Two or more second conductive patterns are formed by the thin metal wires, and the first conductive pattern is configured by connecting two or more first sensing units by the thin metal wires, and the second conductive pattern is formed by the thin metal wires. Two or more second sensing units are connected to each other, each hypotenuse of the first sensing unit has one or more steps, and each hypotenuse of the second sensing unit has one or more steps. It is characterized by having.
[27] In the fourth aspect of the present invention, each hypotenuse of the first sensing unit has a first stepped pattern having one or more steps, and each hypotenuse of the second sensing unit is 1 It has the 2nd step-like pattern which has the above level | step difference, It is characterized by the above-mentioned.
[28] In the fourth aspect of the present invention, the first sensing unit and the second sensing unit have a substantially rhombus shape.
[29] In the fourth aspect of the present invention, the first sensing unit and the second sensing unit are configured by arranging a plurality of small lattices having a rhombus shape, and when viewed from above, the first conductive unit A portion where the pattern and the second conductive pattern face each other has a form in which a plurality of the small lattices are combined.
[30] In the third or fourth aspect of the present invention, the arrangement pitch of the thin metal wires is 100 to 400 μm.
[31] In the third or fourth aspect of the present invention, the thin metal wire has a line width of 15 μm or less.

  According to the conductive sheet and the touch panel of the present invention, in the touch panel, even when the electrode is configured with a thin metal wire pattern, high transparency can be ensured and the visibility can be improved. The detection sensitivity can be improved.

It is a disassembled perspective view which shows the structure of the touchscreen which has the laminated electroconductive sheet by the electroconductive sheet which concerns on this Embodiment. It is a disassembled perspective view which abbreviate | omits and shows a laminated conductive sheet. 3A is a cross-sectional view showing an example of a laminated conductive sheet with a part omitted, and FIG. 3B is a cross-sectional view showing another example of the laminated conductive sheet, with a part omitted. It is a top view which shows the example of a pattern of the 1st electroconductive part formed in the 1st electroconductive sheet in a laminated electroconductive sheet. It is a figure for demonstrating the magnitude | size (aspect ratio) of a 1st large lattice and a 1st unit pattern. It is a top view which shows the example of a pattern of the 2nd electroconductive part formed in the 2nd electroconductive sheet of a laminated electroconductive sheet. It is a figure for demonstrating the magnitude | size (aspect ratio) of a 2nd large lattice and a 2nd unit pattern. It is a top view which abbreviate | omits and shows the example which made the laminated conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet. It is explanatory drawing which shows the state in which one line was formed of the 1st auxiliary line and the 2nd auxiliary line. It is a top view which shows the modification of the pattern of the 1st electroconductive part formed in the 1st electroconductive sheet in a laminated electroconductive sheet. It is a figure for demonstrating the magnitude | size (aspect ratio) of the 1st large lattice which concerns on the modification shown in FIG. 10, and a 1st unit pattern. It is a top view which shows the modification of the pattern of the 2nd electroconductive part formed in the 2nd electroconductive sheet of a laminated electroconductive sheet. It is a figure for demonstrating the magnitude | size (aspect ratio) of the 2nd large lattice which concerns on the modification shown in FIG. 12, and a 2nd unit pattern. The first conductive sheet on which the pattern of the first conductive part according to the modification of FIG. 10 is formed and the second conductive sheet on which the pattern of the second conductive part according to the modification of FIG. It is a top view which abbreviate | omits and shows the example used as the electroconductive sheet. It is a flowchart which shows the manufacturing method by double-sided exposure of an electroconductive sheet. FIG. 16A is a cross-sectional view in which a part of the produced photosensitive material is omitted, and FIG. 16B is an explanatory view showing double-sided simultaneous exposure on the photosensitive material. The first exposure process and the second exposure process are performed so that the light irradiated to the first photosensitive layer does not reach the second photosensitive layer and the light irradiated to the second photosensitive layer does not reach the first photosensitive layer. FIG.

  Hereinafter, embodiments of a touch panel using a conductive sheet and a conductive sheet according to the present invention will be described with reference to FIGS. In the present specification, “˜” indicating a numerical range is used as a meaning including numerical values described before and after the numerical value as a lower limit value and an upper limit value.

First, a touch panel 50 in which the conductive sheet according to the present embodiment is used will be described with reference to FIG.
The touch panel 50 includes a sensor body 52 and a control circuit (configured by an IC circuit or the like) not shown. The sensor main body 52 includes a conductive sheet for a touch panel according to the present embodiment (hereinafter referred to as a laminated conductive sheet 54) and a protective layer 56 laminated thereon. The laminated conductive sheet 54 and the protective layer 56 are arranged on a display panel 58 in the display device 30 such as a liquid crystal display. When viewed from above, the sensor main body 52 includes a sensor unit 60 disposed in a region corresponding to the display screen 58 a of the display panel 58 and a terminal wiring unit 62 disposed in a region corresponding to the outer peripheral portion of the display panel 58. (So-called picture frame).

As shown in FIG. 1, the laminated conductive sheet 54 is configured by laminating a first conductive sheet 10A and a second conductive sheet 10B.
As shown in FIGS. 2, 3A, and 4, the first conductive sheet 10A has a first conductive portion 14A formed on one main surface of the first transparent base 12A (see FIG. 3A). Each of the first conductive portions 14A extends in the horizontal direction (m direction) and is arranged in a vertical direction (n direction) orthogonal to the horizontal direction, and is configured by a large number of grids (sensing portions). Two or more first conductive patterns 64A (mesh patterns) formed by the thin wires 16 and first auxiliary patterns 66A formed by the metal thin wires 16 arranged around each first conductive pattern 64A. The horizontal direction (m direction) indicates, for example, the horizontal direction (or vertical direction) of a projected capacitive touch panel 50 described later or the horizontal direction (or vertical direction) of the display panel 58 on which the touch panel 50 is installed. Here, the small lattice 74 is the smallest rhombus. The apex angle of the small lattice can be appropriately selected from 60 ° to 120 °. The length of one side of the small lattice 74 is preferably 50 to 500 μm, and more preferably 150 to 300 μm.
The thin metal wire 16 is made of, for example, gold (Au), silver (Ag), or copper (Cu). The lower limit of the line width of the fine metal wire 16 is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is preferably 15 μm or less, 10 μm or less, 9 μm or less, or 8 μm or less. When the line width is less than the above lower limit, the conductivity becomes insufficient, so that when used for the touch panel 50, the detection sensitivity becomes insufficient. On the other hand, if the above upper limit is exceeded, moire caused by the fine metal wires 16 becomes noticeable, or the visibility is deteriorated when the touch panel 50 is used. In addition, by being in the said range, the moire of the conductive pattern by the metal fine wire 16 is improved, and visibility becomes especially good. The thickness of at least the first transparent substrate 12A is preferably 75 μm or more and 350 μm or less, more preferably 80 μm or more and 250 μm, and particularly preferably 100 μm or more and 200 μm or less.

  Each first conductive pattern 64A includes two or more first large lattices 68A (sensing units) connected in series in the horizontal direction (m direction), and each first large lattice 68A includes two or more small lattices. 74 is combined. Further, the above-described first auxiliary pattern 66A that is not connected to the first large lattice 68A is formed around the side of the first large lattice 68A.

  The first large lattice 68A has a substantially rhombus shape, and a first stepped pattern 72A having one or more steps 70 is formed on each hypotenuse. The height of the step 70 is equal to an integral multiple of the height of the small lattice 74. In the example of FIG. 4, two stepped portions 70 are formed on the hypotenuse of the first large lattice 68 </ b> A from the vertical apex portion to the horizontal apex portion of the third and seventh small lattices 74. A step 70 is formed at the position, and the height of the step 70 is equal to the height of one small lattice 74. In addition, the first stepped pattern 72A has a configuration in which the rows of the small lattices 74 decrease through the step 70 from the vertical apex portion of the first large lattice 68A toward the horizontal apex portion. ing.

  The first large lattice 68A has a substantially rhombus shape as described above, but more specifically, has a Soroban bead shape (hexagonal shape) from which the small lattice 74 of the vertical apex in the horizontal direction is omitted. That is, the first top bottom portion 76A in which r small lattices 74 (r is an integer larger than 1) are arranged in the vertical direction is formed at the two vertical corner portions in the horizontal direction. In the part, one small lattice 74 is located and forms an apex angle. In FIG. 4, four small lattices 74 are arranged in the vertical direction at two vertical corners of the first large lattice 68A in the horizontal direction to form a first upper bottom portion 76A.

  Further, in the portion where the two first upper bottom portions 76A in the horizontal direction of the first large lattice 68A and the hypotenuse in the second inclined direction (y direction) are adjacent, the first missing portion in which one side of the small lattice 74 is omitted. A removal portion 78A is provided.

  As shown in FIG. 4, a first connection portion 80A is formed between the first large lattices 68A adjacent in the horizontal direction by the fine metal wires 16 that connect the first large lattices 68A. The first connection portion 80A includes a first middle lattice 82A having a size in which n (n is an integer greater than 1) small lattices 74 are arranged in the first inclination direction (x direction), and the small lattices 74 are first. It is configured by first medium lattice 84A having a size of p × q (p is an integer greater than 1) in the tilt direction and q (q is an integer greater than 1) p × q in the second tilt direction. . In the example of FIG. 4, the first medium lattice 82A has a size in which n is 7, seven small lattices 74 are arranged in the first inclination direction, and the first medium lattice 84A is the first medium lattice 84A. The inclination direction p is 3, the second inclination direction q is 5, and a total of 15 small lattices 74 are arranged.

  Further, a first notched portion 78A in which one side of the small lattice 74 is removed is located at a portion where the first medium lattice 84A and the first large lattice 68A are adjacent to each other.

  Further, between the first conductive patterns 64A adjacent in the horizontal direction, first non-connecting portions 86A are arranged to disconnect the first large lattices 68A from each other.

  In the first conductive portion 14A, the above-described first auxiliary pattern 66A that is not connected to the first large lattice 68A is formed around the side of the first large lattice 68A. Here, the first auxiliary pattern 66A includes a plurality of first auxiliary lines 88A (the first auxiliary lines 88A) arranged along the first stepped pattern 72A of the oblique side along the first inclination direction among the oblique sides of the first large lattice 68A. Of the first auxiliary line 88A (the first inclination direction is the axial direction) and the hypotenuse of the first large lattice 68A, the first step of the hypotenuse along the second tilt direction. A plurality of first auxiliary lines 88A arranged along the pattern 72A (the first inclination direction is the axial direction) and the first auxiliary lines 88A (the second inclination direction is the axial direction), One auxiliary line 88A has a first L-shaped pattern 90A combined in an L-shape.

  The first auxiliary line 88 </ b> A is shorter than one side of the small lattice 74 and is arranged at equal intervals with two opposing sides in the small lattice 74. In the example of FIG. 4, the length of the first auxiliary line 88 </ b> A is half of the length of one side of the small lattice 74. In addition, the plurality of first auxiliary lines 88A having the second inclination direction and the second inclination direction arranged along the first stepwise pattern 72A along the first inclination direction as the axial direction are separated from the distance between two opposing sides of the small lattice 74. The first auxiliary lines 88A, which are arranged at equal intervals and have the first inclination direction as the axial direction, are arranged on one parallel side of the small lattice 74 facing each other with the same interval as the above interval.

  The first L-shaped pattern 90A includes a first auxiliary line 88A having the first inclined direction as the axial direction and a first auxiliary line 88A having the second inclined direction as the axial direction in the vicinity of the step 70 of the first stepped pattern 72A. And a first L-shaped pattern 90A facing the corner of the step 70, and a first L-shaped pattern 90A disposed in the first non-connecting portion 86A between the first large lattices 68A. As shown in FIG. 4, the first L-shaped pattern 90A arranged in the first non-connecting portion 86A includes two first auxiliary lines arranged in the vicinity of the vertical apex portion of one first large lattice 68A. 88A and two first auxiliary lines 88A arranged in the vicinity of the apex portion of the other adjacent first large lattice 68A are combined to form two first L-shaped patterns 90A along the horizontal direction. So as to face each other.

  As described above, the first conductive portion 14A includes the first conductive pattern 64A extending in the horizontal direction with the first large lattice 68A connected in the horizontal direction via the first connection portion 80A, and the first conductive pattern 64A. A first auxiliary pattern 66A arranged along a substantially rhombus shape of the first large lattice 68A constituting the conductive pattern 64A. Since these are regularly arranged, the first conductive portion 14A has a configuration in which the first unit patterns 92A are continuous. Here, the first unit pattern 92A will be described with reference to FIG. The first unit pattern 92A includes one first large lattice 68A, a first connection portion 80A connected to one first upper bottom portion 76A of the first large lattice 68A, and four oblique sides of the first large lattice 68A. The first auxiliary pattern 66A is arranged. The size of the first unit pattern 92A is in the horizontal direction from the other first upper bottom portion 76A of the first large lattice 68A to the end connected to the adjacent first large lattice 68A in the first connection portion 80A. A distance Lva, and a vertical distance Lha between two first auxiliary lines 88A provided in the vicinity of one apex portion in the vertical direction and two first auxiliary lines 88A in the vicinity of the other apex portion Can be represented by

In this case, the size of the first unit pattern 92A, that is, the aspect ratio (Lva / Lha) of the first unit pattern 92A is
0.57 <Lva / Lha <1.74
Is set to satisfy.
If the horizontal direction (m direction) is the same as the pixel arrangement direction of the display device 30 on which the touch panel 50 is installed, the aspect ratio (Lva / Lha) of the first large lattice 68A is 0.57 <Lva /. Lha <1.00 or 1.00 <Lva / Lha <1.74 is set, more preferably 0.62 <Lva / Lha <0.81 or 1.23 <Lva / Lha <1.61. The

  The lower limit value of the horizontal distance Lva and the vertical distance Lha of the first unit pattern 92A is preferably 2 mm or more, 3 mm or more, or 4 mm or more, and the upper limit value is 16 mm or less, 12 mm or less, Or it is preferable that it is 8 mm or less. If each distance is less than the lower limit value, when the first conductive sheet 10A is used for a touch panel, the capacitance of the first large lattice 68A constituting the unit pattern at the time of detection is reduced, so that the detection failure Is likely to become. On the other hand, if the upper limit is exceeded, the position detection accuracy may be reduced.

  From the same viewpoint, the length of one side of the small lattice 74 constituting the first large lattice 68A is preferably 50 μm or more, more preferably 100 to 400 μm, and more preferably 150 to 300 μm, as described above. More preferably, it is most preferably 210 to 250 μm or less. When the small lattice 74 is in the above range, it is possible to keep the transparency better, and when the small lattice 74 is attached to the front surface of the display device 30, the display can be visually recognized without a sense of incongruity.

As shown in FIG. 2, the first conductive sheet 10 </ b> A configured as described above has an open end of the first large lattice 68 </ b> A existing on one end side of each first conductive pattern 64 </ b> A as a first connection. The portion 80A does not exist. The end portion of the first large lattice 68A existing on the other end portion side of each first conductive pattern 64A is connected to the first terminal wiring pattern 96a formed by the fine metal wires 16 through the first connection portion 94a.
That is, in the first conductive sheet 10A applied to the touch panel 50, as shown in FIGS. 1 and 2, the first conductive patterns 64A described above are arranged at portions corresponding to the sensor unit 60, and the terminal wiring unit 62 is arranged with a plurality of first terminal wiring patterns 96a led out from the first connection portions 94a.
In the example of FIG. 1, the outer shape of the first conductive sheet 10 </ b> A has a rectangular shape when viewed from above, and the outer shape of the sensor unit 60 also has a rectangular shape. In the terminal wiring portion 62, a plurality of first terminals 98a are arranged in the longitudinal direction of the one long side of the peripheral portion on the one long side of the first conductive sheet 10A in the longitudinal direction of the one long side. An array is formed. In addition, a plurality of first connection portions 94a are linearly arranged along one long side of the sensor unit 60 (long side closest to one long side of the first conductive sheet 10A: n direction). The first terminal wiring pattern 96a derived from each first connection portion 94a is routed toward the substantially central portion of one long side of the first conductive sheet 10A and is connected to the corresponding first terminal 98a. ing.

  On the other hand, as shown in FIGS. 2, 3A and 6, the second conductive sheet 10B has a second conductive portion 14B formed on one main surface of the second transparent base 12B (see FIG. 3A). Each of the second conductive portions 14B extends in the vertical direction (n direction) and is arranged in the horizontal direction (m direction), and two or more second conductives are formed by the thin metal wires 16 configured by a number of grids. It has a pattern 64B and a second auxiliary pattern 66B made of fine metal wires 16 arranged around each second conductive pattern 64B.

  Each second conductive pattern 64B includes two or more second large lattices 68B (sensing units) connected in series in the vertical direction (n direction), and each second large lattice 68B includes two or more small lattices. 74 is combined. Further, the above-described second auxiliary pattern 66B that is not connected to the second large lattice 68B is formed around the side of the second large lattice 68B.

  The second large lattice 68B has a substantially rhombus shape, and a second stepped pattern 72B having one or more steps 70 is formed on each hypotenuse. The height of the step 70 is equal to an integral multiple of the height of the small lattice 74. In the example of FIG. 6, two steps 70 are formed on the hypotenuse of the second large lattice 68 </ b> B at intervals of four small lattices 74, and the height of the step 70 is one small lattice 74. Is equal to the height of Further, the second stepped pattern 72B has a configuration in which the rows of the small lattices 74 increase through the step 70 from the horizontal apex portion of the second large lattice 68B toward the vertical apex portion. ing.

  As described above, the second large lattice 68B has a substantially rhombus shape, but more specifically, has a Soroban bead shape (hexagonal shape) from which the small lattice 74 having the vertical apex is omitted. That is, the two top corners 76B in which r small lattices 74 (r is an integer larger than 1) are arranged in the horizontal direction are formed at the two vertical corners in the vertical direction. In the part, one small lattice 74 is located and forms an apex angle. In FIG. 6, four small lattices 74 are arranged in the horizontal direction at two vertical corner portions of the second large lattice 68B in the vertical direction, thereby constituting a second upper bottom portion 76B.

  Furthermore, in the portion where the two second upper bottom portions 76B in the vertical direction of the second large lattice 68B are adjacent to the oblique side in the first inclined direction, a second notched portion 78B in which one side of the small lattice 74 is missing is provided. Is provided.

  As shown in FIG. 6, a second connection portion 80B is formed between the second large lattices 68B adjacent in the vertical direction by the fine metal wires 16 that connect the second large lattices 68B. The second connecting portion 80B includes a second middle lattice 82B having a size in which n (n is an integer greater than 1) small lattices 74 are arranged in the second inclined direction (y direction), and the small lattices 74 are second. It is constituted by second medium lattices 84B having a size of p × q (p is an integer greater than 1) in the tilt direction and q (q is an integer greater than 1) p × q in the first tilt direction. . In the example of FIG. 6, the second medium lattice 82B has a size in which n is 7, and the seven small lattices 74 are arranged in the second inclination direction, and the second medium lattice 84B includes the second medium lattice 84B. The inclination direction p is 3, the first inclination direction q is 5, and a total of 15 small lattices 74 are arranged.

  Further, a second notched portion 78B in which one side of the small lattice 74 is removed is located at a portion where the second middle lattice 84B and the second large lattice 68B are adjacent to each other.

  Furthermore, between the second conductive patterns 64B adjacent in the horizontal direction, second non-connecting portions 86B are arranged to disconnect the second large lattices 68B from each other.

  In the second conductive portion 14B, the above-described second auxiliary pattern 66B that is not connected to the second large lattice 68B is formed around the side of the second large lattice 68B. Here, the second auxiliary pattern 66B includes a plurality of second auxiliary lines 88B (first auxiliary lines 88B) arranged along the second stepped pattern 72B of the oblique side along the second inclination direction among the oblique sides of the second large lattice 68B. Among the hypotenuses of the second auxiliary line 88B (the second tilt direction is the axial direction) and the hypotenuse of the second large lattice 68B, the second step of the hypotenuse along the second tilt direction. A plurality of second auxiliary lines 88B arranged along the pattern 72B (with the second inclined direction as the axial direction) and a second auxiliary line 88B (with the second inclined direction as the axial direction), 2 auxiliary lines 88B have a second L-shaped pattern 90B combined in an L-shape.

  The second auxiliary lines 88B are shorter than one side of the small lattice 74 and are arranged at equal intervals with two opposing sides in the small lattice 74. In the example of FIG. 6, the length of the second auxiliary line 88 </ b> B is half of the length of one side of the small lattice 74. A plurality of second auxiliary lines 88B arranged along the second step-like pattern 72B along the second inclination direction and having the first inclination direction as the axial direction are spaced from each other between the two opposing sides of the small lattice 74. The second auxiliary lines 88B, which are arranged at equal intervals and have the second inclined direction as the axial direction, are arranged on one parallel side of the small lattice 74 facing each other with the same interval as the above interval.

  In the second L-shaped pattern 90B, in the vicinity of the step 70 of the second stepped pattern 72B, a second auxiliary line 88B having the second inclined direction as the axial direction and a second auxiliary line 88B having the second inclined direction as the axial direction. And a second L-shaped pattern 90B facing the corner of the step 70, and a second L-shaped pattern 90B disposed in the second non-connecting portion 86B between the second large lattices 68B. As shown in FIG. 6, the 2nd L-shaped pattern 90B arrange | positioned at the 2nd non-connecting part 86B is two 2nd auxiliary lines arrange | positioned in the vicinity of the apex part of the horizontal direction of one 2nd large lattice 68B. 88B and two second auxiliary lines 88B arranged in the vicinity of the apex portion of the other adjacent second large lattice 68B are combined, whereby two second L-shaped patterns 90B are formed along the vertical direction. So as to face each other.

  As described above, the second conductive portion 14B includes the second conductive pattern 64B extending in the vertical direction with the second large lattice 68B connected through the second connection portion 80B, and the second conductive pattern 64B arranged in the horizontal direction. And a second auxiliary pattern 66B arranged along a substantially rhombus shape of the second large lattice 68B constituting the conductive pattern 64B. Since these are regularly arranged, the second conductive portion 14B has a configuration in which the second unit patterns 92B are continuous. Here, the second unit pattern 92B will be described with reference to FIG. The second unit pattern 92B includes one second large lattice 68B, a second connection portion 80B connected to one second upper bottom portion 76B of the second large lattice 68B, and four oblique sides of the second large lattice 68B. The second auxiliary pattern 66B is arranged. The size of the second unit pattern 92B is in the vertical direction from the other second upper bottom portion 76B of the second large lattice 68B to the end connected to the adjacent second large lattice 68B of the second connection portion 80B. Distance Lvb, horizontal distance Lhb between two second auxiliary lines 88B provided in the vicinity of one apex angle portion in the horizontal direction, and two second auxiliary lines 88B in the vicinity of the other apex angle portion, Can be represented by

In this case, the size of the second unit pattern 92B, that is, the aspect ratio (Lvb / Lhb) of the second unit pattern 92B is
0.57 <Lvb / Lhb <1.74
Is set to satisfy.
If the vertical direction (m direction) is the same as the pixel arrangement direction of the display device 30 on which the touch panel 50 is installed, the aspect ratio (Lvb / Lhb) of the second large lattice 68B is 0.57 <Lvb / Lhb <1.00 or 1.00 <Lvb / Lhb <1.74, more preferably 0.62 <Lvb / Lhb <0.81 or 1.23 <Lvb / Lhb <1.61 The

  The lower limit values of the vertical distance Lvb and the horizontal distance Lhb of the second unit pattern 92B are preferably 2 mm or more, 3 mm or more, or 4 mm or more, and the upper limit values are 16 mm or less, 12 mm or less, Or it is preferable that it is 8 mm or less. If each distance is less than the above lower limit value, when the second conductive sheet 10B is used for a touch panel, the capacitance of the first large lattice 68A constituting the unit pattern at the time of detection decreases, so that the detection failure Is likely to become. On the other hand, if the upper limit is exceeded, the position detection accuracy may be reduced.

  From the same viewpoint, the length of one side of the small lattice 74 constituting the second large lattice 68B is preferably 50 μm or more, more preferably 100 to 400 μm, and more preferably 150 to 300 μm, as described above. More preferably, it is most preferably 210 to 250 μm or less. When the small lattice 74 is in the above range, it is possible to keep the transparency better, and when the small lattice 74 is attached to the front surface of the display device 30, the display can be visually recognized without a sense of incongruity.

As shown in FIGS. 1 and 2, the second conductive sheet 10 </ b> B configured as described above is the second conductive sheet 10 </ b> B that exists on one end side of every second (for example, odd number) second conductive pattern 64 </ b> B. The open end of the large lattice 68B and the open end of the second large lattice 68B existing on the other end side of the even-numbered second conductive pattern 64B have a shape in which the second connection portion 80B does not exist. . On the other hand, the second large lattice 68B that exists on the other end side of each odd-numbered second conductive pattern 64B and the second end that exists on the one end side of each even-numbered second conductive pattern 64B. The ends of the large lattice 68B are connected to the second terminal wiring pattern 96b by the fine metal wires 16 through the second connection portions 94b.
That is, as shown in FIG. 2, the second conductive sheet 10 </ b> B applied to the touch panel 50 has a large number of second conductive patterns 64 </ b> B arranged in portions corresponding to the sensor unit 60, and each of the terminal wiring portions 62 has a second conductive sheet 64 </ b> B. A plurality of second terminal wiring patterns 96b derived from the two connection portions 94b are arranged.

As shown in FIG. 1, among the terminal wiring portions 62, a plurality of second terminals 98 b are provided at the peripheral portion on one long side of the second conductive sheet 10 </ b> B in the center portion in the length direction. The long side is arranged in the length direction. Also, a plurality of second connection portions 94b (for example, odd-numbered second connection portions) along one short side of the sensor unit 60 (short side closest to one short side of the second conductive sheet 10B: m direction). 94b) are arranged in a straight line, and a plurality of second connection portions 94b (for example, the short side closest to the other short side of the second conductive sheet 10B: m direction) of the sensor unit 60 (for example, Even-numbered second connection portions 94b) are arranged linearly.
Among the plurality of second conductive patterns 64B, for example, odd-numbered second conductive patterns 64B are connected to the corresponding odd-numbered second connection portions 94b, respectively, and even-numbered second conductive patterns 64B are respectively corresponding even-numbered. It is connected to the second second connection portion 94b. The second terminal wiring pattern 96b derived from the odd-numbered second connection portion 94b and the second terminal wiring pattern 96b derived from the even-numbered second connection portion 94b are one long side of the second conductive sheet 10B. Are routed substantially toward the center and are connected to the corresponding second terminals 98b.
The first terminal wiring pattern 96a may be derived in the same manner as the second terminal wiring pattern 96b described above, and the second terminal wiring pattern 96b may be derived in the same manner as the first terminal wiring pattern 96a.

  The line widths of the first auxiliary pattern 66A (first auxiliary line 88A) and the second auxiliary pattern 66B (second auxiliary line 88B) are each 30 μm or less, more preferably 15 μm or less. In this case, the line width of the first conductive pattern 64A and the line width of the second conductive pattern 64B may be the same or different. However, it is preferable that the line widths of the first conductive pattern 64A, the second conductive pattern 64B, the first auxiliary pattern 66A, and the second auxiliary pattern 66B are the same.

  For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the laminated conductive sheet 54, the first conductive pattern 64A and the second conductive pattern 64B are formed as shown in FIG. Specifically, the first connecting portion 80A of the first conductive pattern 64A and the second connecting portion 80B of the second conductive pattern 64B are formed in the first transparent base 12A (see FIG. 3A). The first non-connecting portion 86A of the first conductive portion 14A and the second non-connecting portion 86B of the second conductive portion 14B are opposed to each other with the first transparent base 12A interposed therebetween. .

  When the laminated conductive sheet 54 is viewed from the upper surface, as shown in FIG. 8, the second conductive sheet 10B has the second conductive sheet 10B so as to fill the gaps in the first large lattice 68A formed in the first conductive sheet 10A. The large lattice 68B is arranged.

  At this time, the first connection portion 80A and the second connection portion 80B face each other, that is, the first middle lattice 82A and the second middle lattice 82B face each other, and the first middle lattice 84A and the second middle lattice 84B , The substantially rectangular combination pattern 100 is formed. In this combination pattern 100, the first medium lattice 82A and the second medium lattice 82B are arranged diagonally. The combination pattern 100 formed by the first connection portion 80A and the second connection portion 80B shown in FIGS. 5 and 7 has seven small lattices 74 arranged on a diagonal line and four small lattices 74 arranged on four sides. It is composed of a total of 25 small lattices 74. Note that one side of the small lattice 74 of the first medium lattice 82A located at the apex angle of the combination pattern 100 supplements one side of the second large lattice 68B that the first lack portion 78A lacks, and the second medium lattice One side of the small lattice 74 of 82B supplements one side of the first large lattice 68A that is lacked by the first lacking portion 78A.

  Further, a combination pattern 102 is formed between the first large lattice 68A and the second large lattice 68B by the first auxiliary pattern 66A and the second auxiliary pattern 66B facing each other. As shown in FIG. 9, in the combination pattern 102, the first axis 104A of the first auxiliary line 88A matches the second axis 104B of the second auxiliary line 88B, and the first auxiliary line 88A and the second auxiliary line 88B does not overlap, and one end of the first auxiliary line 88A and one end of the second auxiliary line 88B coincide with each other, thereby constituting one side of the small lattice 74 (mesh shape).

  That is, the combination patterns 100 and 102 have a form in which two or more small lattices 74 (mesh shape) are combined. As a result, when the laminated conductive sheet 54 is viewed from above, a large number of small lattices 74 (mesh shape) are spread as shown in FIG.

  Here, for example, when the hypotenuses of the first large lattice 68A and the second large lattice 68B are not formed as the first and second step-like patterns 72A and 72B having the step 70, but are formed as straight lines without the step 70, Due to the slight misalignment of the alignment position, the width of the overlapping portion of the hypotenuses of the straight line becomes large (thickening of the line), and the boundary between the first large lattice 68A and the second large lattice 68B becomes conspicuous. In the present embodiment, the first large lattice 68A and the second large lattice 68B are arranged by arranging the first and second stepped patterns 72A and 72B having the step 70 in the present embodiment. The boundary between and becomes inconspicuous, improving visibility.

When this laminated conductive sheet 54 is used as a touch panel, a protective layer 56 is formed on the first conductive sheet 10A, and the first terminals derived from the multiple first conductive patterns 64A of the first conductive sheet 10A. The wiring pattern 96a and the second terminal wiring pattern 96b derived from the multiple second conductive patterns 64B of the second conductive sheet 10B are connected to, for example, a control circuit that controls scanning.
As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the self-capacitance method, voltage signals for touch position detection are sequentially supplied to the first conductive pattern 64A, and voltage signals for touch position detection are sequentially supplied to the second conductive pattern 64B. Supply. Since the capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position and GND (ground) is increased by bringing the fingertip into contact with or close to the upper surface of the protective layer 56, the first conductive pattern The waveforms of the transmission signals from 64A and the second conductive pattern 64B are different from the waveforms of the transmission signals from the other conductive patterns. Accordingly, the control circuit calculates the touch position based on the transmission signal supplied from the first conductive pattern 64A and the second conductive pattern 64B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 64A, and sensing (detection of a transmission signal) is sequentially performed on the second conductive pattern 64B. Do. Since the fingertip contacts or approaches the upper surface of the protective layer 56, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position. The waveform of the transmission signal from the second conductive pattern 64B is different from the waveform of the transmission signal from the other second conductive pattern 64B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive patterns 64A supplying the voltage signal and the transmission signal from the supplied second conductive pattern 64B. By adopting such a self-capacitance type or mutual capacitance type touch position detection method, it is possible to detect each touch position even if two fingertips are simultaneously in contact with or close to the upper surface of the protective layer 56. Become. As prior art documents related to a projection type capacitance detection circuit, US Pat. No. 4,582,955, US Pat. No. 4,686,332, US Pat. No. 4,733,222 Specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. No. 7,030,860, US Published Patent No. 2004/0155871, etc. is there.

  In the above-mentioned laminated conductive sheet 54, as shown in FIGS. 2 and 3A, the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A, and the second conductive substrate 54B is formed on the second main surface. Although the conductive portion 14B is formed, as shown in FIG. 3B, the first conductive portion 14A is formed on one main surface of the first transparent base 12A, and the first main surface 14A is formed on the other main surface. The two conductive portions 14B may be formed. In this case, the second transparent substrate 12B does not exist, the first transparent substrate 12A is laminated on the second conductive portion 14B, and the first conductive portion 14A is laminated on the first transparent substrate 12A. Further, the first conductive sheet 10A and the second conductive sheet 10B may have other layers between them, and if the first conductive pattern 64A and the second conductive pattern 64B are in an insulating state, they are You may arrange | position facing.

The first stepped pattern 72A of the first large lattice 68A has a small lattice 74 via a step 70 from the apex portion on the first non-connecting portion 86A side to the apex portion on the first connecting portion 80A side. On the contrary, the second stepped pattern 72B of the second large lattice 68B has a step 70 from the apex portion on the second non-connecting portion 86B side toward the apex portion on the second connecting portion 80B side. The rows of small lattices 74 are increased via Thereby, the exclusive area of the fine metal wires 16 in the first large lattice 68A and the exclusive area of the fine metal wires 16 in the second large lattice 68B can be adjusted. In the present embodiment, the occupied area of the fine metal wires 16 in the second large lattice 68B is larger than the occupied area of the fine metal wires 16 in the first large lattice 68A. That is, in this case, the occupied area of the fine metal wires 16 in the second conductive pattern 64B arranged on the display device 30 side is larger than the occupied area of the fine metal wires 16 in the first conductive pattern 64A.
Normally, the second conductive pattern 64B on the display device 30 side can suppress the influence of noise due to electromagnetic waves. That is, the skin current flows in the direction that cancels the electric field component of the electromagnetic wave, and the eddy current flows in the direction that cancels the magnetic field component of the electromagnetic wave, so that the influence of noise due to the electromagnetic wave can be suppressed. In this laminated conductive sheet 54, the occupied area of the fine metal wires 16 in the second conductive pattern 64B on the display device 30 side is larger than the occupied area of the fine metal wires 16 in the first conductive pattern 64A, so the second conductive pattern 64B. Surface resistance of 70 ohm / sq. For example, it is advantageous in suppressing the influence of noise due to electromagnetic waves from the display device 30 or the like.

As described above, in the present embodiment, the occupied area of the fine metal wires 16 in the second large lattice 68B is set larger than the occupied area of the fine metal wires 16 in the first large lattice 68A. Therefore, for example, when the self-capacitance method is adopted as the detection method of the finger touch position, the second conductive pattern 64B far from the finger touch position has a relatively large area. The signal charge of the same level as that of the first conductive pattern 64A can be accumulated, the detection sensitivity of the first conductive pattern 64A and the detection sensitivity of the second conductive pattern 64B can be made substantially equal, The burden can be reduced and the detection accuracy can be improved. Further, even when the mutual capacitance method is adopted as a detection method of the finger touch position, for example, the second conductive pattern 64B having a large occupied area is used as the drive electrode, and the first conductive pattern 64A is used as the reception electrode. It becomes possible to increase the receiving sensitivity of the one conductive pattern 64A. Even if the first conductive pattern 64A and the second conductive pattern 64B partially face each other and a parasitic capacitance is formed, the thickness of the first transparent substrate 12A is set to 75 μm or more and 350 μm or less. It can be suppressed low, and a decrease in detection sensitivity can be suppressed.
Thus, in the conductive sheet 10 for a touch panel, even when the electrode is configured with the pattern of the fine metal wires 16, high transparency can be ensured, and the S / N ratio of the detection signal can be improved. It is possible to improve detection sensitivity and detection accuracy.
Here, when the occupied area of the fine metal wires 16 in the first conductive pattern 64A is A1, and the occupied area of the fine metal wires 16 in the second conductive pattern 64B is A2, it is preferable that 1 <A2 / A1 ≦ 20. More preferably, 1 <A2 / A1 ≦ 10, and particularly preferably 2 ≦ A2 / A1 ≦ 10.
Further, when the occupied area of the fine metal wires 16 in the first large lattice 68A is a1, and the occupied area of the fine metal wires 16 in the second large lattice 68B is a2, it is preferable that 1 <a2 / a1 ≦ 20. More preferably, 1 <a2 / a1 ≦ 10, and particularly preferably 2 ≦ a2 / a1 ≦ 10.

The sizes of the first large lattice 68A and the second large lattice 68B are not particularly limited, and are large enough to sense the touch position of a human finger or the touch position of a pen input type pen tip. If there is,
Moreover, although the shape of the small lattice 74 is a rhombus, it may be a triangle or a polygon. In the case of forming a triangle, for example, it can be easily produced by bridging the straight metal thin wires 16 along each diagonal line of the diamond-shaped small lattice 74. Further, the shape of one side of the small lattice 74 may be a curved shape or a circular arc shape in addition to a linear shape. In the case of the arc shape, for example, the two opposing sides may have an outwardly convex arc shape, and the other two opposing sides may have an inwardly convex arc shape. The shape of each side may be a wavy shape in which an outwardly convex arc and an inwardly convex arc are continuous. Of course, the shape of each side may be a sine curve.
Further, the size of the small lattice 74 (the length of one side, the length of the diagonal line, etc.), the number of small lattices constituting the first large lattice 68A, and the number of small lattices constituting the second large lattice 68B are also applied. It can be set appropriately according to the size and resolution (number of wires) of the touch panel 50.

As shown in FIG. 1, for positioning, for example, when the first conductive sheet 10A and the second conductive sheet 10B are bonded to each corner portion of the first conductive sheet 10A and the second conductive sheet 10B. The first alignment mark 106a and the second alignment mark 106b are preferably formed. The first alignment mark 106a and the second alignment mark 106b become a new composite alignment mark when the first conductive sheet 10A and the second conductive sheet 10B are bonded to form a laminated conductive sheet 54. The alignment mark also functions as an alignment mark for positioning used when the laminated conductive sheet 54 is installed on the display panel 58.
In the above example, the first conductive sheet 10 </ b> A and the second conductive sheet 10 </ b> B are applied to the projected capacitive touch panel 50. It can also be applied to a membrane touch panel.
In the above-described laminated conductive sheet 54, as shown in FIG. 3A, the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A, and the second conductive portion 14B is formed on one main surface of the second transparent substrate 12B. In addition, as shown in FIG. 3B, the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A, and the other main surface of the first transparent substrate 12A is formed. The second conductive portion 14B may be formed. In this case, the second transparent substrate 12B does not exist, the first transparent substrate 12A is laminated on the second conductive portion 14B, and the first conductive portion 14A is laminated on the first transparent substrate 12A. Further, the first conductive sheet 10A and the second conductive sheet 10B may have other layers between them, and if the first conductive part 14A and the second conductive part 14B are in an insulated state, they are You may arrange | position facing.

  Note that the patterns (conductive pattern, auxiliary pattern) in the first conductive portion 14A and the second conductive portion 14B according to the present invention are not limited to the above-described embodiment, and various patterns exemplified below. Deformation is possible.

  10 to 13 show a first conductive portion 14C and a second conductive portion 14D according to a modification of the present embodiment. In addition, detailed description is abbreviate | omitted about the structure same as the above-mentioned 1st electroconductive part 14A and 2nd electroconductive part 14B, or a common structure.

  Each first conductive pattern 64C in the first conductive portion 14C is configured by connecting two or more first large lattices 68C (sensing portions) in series in the horizontal direction (m direction), and each first large lattice 68C includes: Two or more small lattices 74 are combined to each other. Further, the above-described first auxiliary pattern 66C that is not connected to the first large lattice 68C is formed around the side of the first large lattice 68C.

  The first large lattice 68C has a substantially rhombus shape, and a first stepped pattern 72C having one or more steps 70 is formed on each oblique side. The height of the step 70 is equal to an integral multiple of the height of the small lattice 74. In the example of FIG. 10, two steps 70 are formed at intervals of four small lattices 74 on the hypotenuse of the first large lattice 68C, and the height of the step 70 is one small lattice 74. Is equal to the height of Further, the first stepped pattern 72C has a configuration in which the rows of the small lattices 74 increase through the step 70 from the vertical apex portion of the first large lattice 68C toward the horizontal apex portion. ing.

  As shown in FIG. 10, between the 1st large grating | lattices 68C adjacent to a horizontal direction, the 1st connection part 80C by the metal fine wire 16 which connects these 1st large grating | lattices 68C is formed. The first connecting portion 80C has a total of four small lattices 74, two in the first tilt direction (x direction) and two in the second tilt direction (y direction). A lattice 82C is used.

  Further, between the first conductive patterns 64C adjacent in the horizontal direction, a first non-connecting portion 86C that disconnects the first large lattices 68C from each other is disposed, and around the sides of the first large lattices 68C, A first auxiliary pattern 66C having a first auxiliary line 88C and a first L-shaped pattern 90C is formed. The first L-shaped pattern 90C includes a first L-shaped pattern 90C facing the corner of the step 70, and a first L-shaped pattern 90C arranged at the first non-connecting portion 86C between the first large lattices 68C. is there.

  The first conductive portion 14C has a configuration in which the first unit patterns 92C shown in FIG. 11 are continuous. That is, the first unit pattern 92C has one first large lattice 68C, a first middle lattice 82C connected to one apex portion of the first large lattice 68C, and four oblique sides of the first large lattice 68C. The first auxiliary pattern 66C is arranged. The size of the first unit pattern 92C is the horizontal distance Lvc from the other apex portion of the first large lattice 68C to the end connected to the adjacent first large lattice 68C in the first medium lattice 82C. And a vertical distance Lhc between two first auxiliary lines 88C provided in the vicinity of one apex angle portion in the vertical direction and two first auxiliary lines 88C in the vicinity of the other apex angle portion. be able to.

  The lower limit value, the upper limit value, and the ratio (the aspect ratio Lvc / Lhc) of the horizontal distance Lvc and the vertical distance Lhc of the first unit pattern 92C are the distance Lva in the first unit pattern 92A described above. This is the same as the range of the distance Lha and its ratio.

  On the other hand, each second conductive pattern 64D in the second conductive portion 14D is configured by connecting two or more second large lattices 68D (sensing portions) in series in the vertical direction (n direction), and each second large lattice 68D. Each is composed of two or more small lattices 74 combined. Further, the above-described second auxiliary pattern 66D that is not connected to the second large lattice 68D is formed around the side of the second large lattice 68D.

  The second large lattice 68D has a substantially rhombus shape, and a second stepped pattern 72D having one or more steps 70 is formed on each hypotenuse. The height of the step 70 is equal to an integral multiple of the height of the small lattice 74. In the example of FIG. 12, two steps 70 are formed on the hypotenuse of the second large lattice 68 </ b> D from the horizontal apex portion to the vertical apex portion of the third and seventh small lattices 74. A step 70 is formed at the position, and the height of the step 70 is equal to the height of one small lattice 74. Further, the second stepped pattern 72D has a configuration in which the rows of the small lattices 74 are reduced through the step 70 from the horizontal apex portion of the second large lattice 68D toward the vertical apex portion. ing.

  As described above, the second large lattice 68D has a substantially rhombus shape, but more specifically, has a Soroban bead shape (hexagonal shape) from which the small lattice 74 having a vertical apex angle is omitted. That is, a second upper bottom portion 76D in which three small lattices 74 are arranged in the horizontal direction is formed at two vertical corner portions in the vertical direction.

  As shown in FIG. 12, a second connection portion 80D is formed between the second large lattices 68D adjacent in the vertical direction by the fine metal wires 16 that connect the second large lattices 68D. The second connection portion 80D includes an X-shaped portion 83 formed by intersecting line segments extending from one side outside the small lattice 74 constituting both ends of the second upper bottom portion 76D. The length of the two line segments having the tolerance of the X-shaped portion 83 is equal to four times the length of one side of the small lattice 74.

  Furthermore, between the second conductive patterns 64D adjacent in the horizontal direction, a second non-connecting portion 86D that disconnects the second large lattices 68D from each other is disposed, and around the sides of the second large lattices 68D, A second auxiliary pattern 66D having a second auxiliary line 88D and a second L-shaped pattern 90D is formed. The second L-shaped pattern 90D includes a second L-shaped pattern 90D that faces the corner of the step 70, and a second L-shaped pattern 90D that is disposed in the second non-connecting portion 86D between the second large lattices 68D. is there.

  The second conductive portion 14D has a configuration in which the second unit patterns 92D shown in FIG. 13 are continuous. That is, the second unit pattern 92D includes one second large lattice 68D, an X-shaped portion 83 connected to one second upper bottom portion 76D of the second large lattice 68D, and four second large lattices 68D. It consists of a second auxiliary pattern 66D arranged on the oblique side. The size of the second unit pattern 92D is in the vertical direction from the other second upper bottom portion 76D of the second large lattice 68D to the end connected to the adjacent second large lattice 68D in the X-shaped portion 83. Distance Lvd, horizontal distance Lhd between two second auxiliary lines 88D provided in the vicinity of one apex portion in the horizontal direction, and two second auxiliary lines 88D in the vicinity of the other apex portion Can be represented by

  The lower limit value, the upper limit value, and the ratio (the aspect ratio Lvd / Lhd) of the vertical distance Lvd and horizontal distance Lhd of the second unit pattern 92D are the distance Lvb and distance in the second unit pattern 92B described above. This is the same as the range of Lhb and its ratio.

  Then, for example, the first conductive sheet on which the first conductive portion 14C is formed is laminated on the second conductive sheet on which the second conductive portion 14D according to this modification is formed, and the laminated conductive sheet 55 and As shown in FIG. 14, the first conductive pattern 64C and the second conductive pattern 64D are arranged so as to intersect each other. Specifically, the first connection portion 80C of the first conductive pattern 64C The second connection portion 80D of the second conductive pattern 64D is opposed, and the first non-connection portion 86C of the first conductive portion 14C is opposed to the second non-connection portion 86D of the second conductive portion 14D.

  When the laminated conductive sheet 55 is viewed from above, as shown in FIG. 14, the second large lattice 68D is arranged so as to fill the gaps of the first large lattice 68C.

  At this time, the first connecting portion 80C and the second connecting portion 80D face each other, that is, the first middle lattice 82C and the X-shaped portion 83 face each other, whereby the substantially rectangular combination pattern 101 is formed. The In this combination pattern 101, the tolerance portion of the X-shaped portion 83 is located at the center of the first middle lattice 82C, and the two vertical corners of the first middle lattice 82C in the vertical direction are located on the second upper bottom portion 76D. It is in contact with the apex of the small lattice 74 constituting the central portion. The combination pattern 101 formed by the first connection portion 80C and the second connection portion 80D shown in FIGS. 10 and 12 has an arrangement of three, two, and three small lattices 74 arranged in the vertical direction, respectively. It is composed of a total of eight small lattices 74 connected in the horizontal direction.

  Further, a combination pattern 103 is formed between the first large lattice 68C and the second large lattice 68D by the first auxiliary pattern 66C and the second auxiliary pattern 66D facing each other. When the laminated conductive sheet 55 is viewed from the upper surface by the combination pattern 101 and the combination pattern 103 described above, a large number of small lattices 74 (mesh shape) are spread as shown in FIG. .

  The first stepped pattern 72C of the first large lattice 68C has a small lattice 74 via a step 70 from the apex portion on the first non-connecting portion 86C side to the apex portion on the first connecting portion 80D side. On the other hand, the second stepped pattern 72D of the second large lattice 68D has a step 70 from the apex portion on the second non-connecting portion 86D side to the apex portion on the second connecting portion 80D side. The rows of small lattices 74 are reduced via Thereby, the exclusive area of the fine metal wires 16 in the first large lattice 68C and the exclusive area of the fine metal wires 16 in the second large lattice 68D can be adjusted. In this modification, the occupied area of the fine metal wires 16 in the second large lattice 68D is larger than the occupied area of the fine metal wires 16 in the first large lattice 68C. That is, when the laminated conductive sheet 55 including the first conductive portion 14C and the second conductive portion 14D is applied to the touch panel 50 shown in FIG. 1, the fine metal wires 16 in the second conductive pattern 64D disposed on the display device 30 side. Is larger than the occupied area of the fine metal wires 16 in the first conductive pattern 64C. Therefore, the surface resistance of the second conductive pattern 64D on the display device 30 side can be reduced, which is advantageous in suppressing the influence of noise due to electromagnetic waves from the display device 30 or the like.

  Next, as a method of forming the first conductive portion 14A and the second conductive portion 14B, for example, a photosensitive layer having an emulsion layer containing a photosensitive silver halide salt on the first transparent substrate 12A and the second transparent substrate 12B. By exposing the material and performing development processing, the first conductive portion 14A and the second conductive portion 14B may be formed by forming a metallic silver portion and a light transmissive portion in the exposed portion and the unexposed portion, respectively. Good. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further.

On the other hand, as shown in FIG. 3B, when the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A and the second conductive portion 14B is formed on the other main surface of the first transparent substrate 12A, When the method of exposing one principal surface first and then exposing the other principal surface according to the manufacturing method is adopted, the first conductive portion 14A and the second conductive portion 14B having a desired pattern cannot be obtained. There is. In particular, as shown in FIGS. 4 and 6, the first auxiliary pattern 66A formed between the first conductive patterns 64A, the second auxiliary pattern 66B formed between the second conductive patterns 64B, and the like are uniformly formed. That comes with difficulty.
Therefore, the following manufacturing method can be preferably employed.
That is, the photosensitive silver halide emulsion layer formed on both surfaces of the first transparent substrate 12A is collectively exposed to form the first conductive portion 14A on one main surface of the first transparent substrate 12A. The second conductive portion 14B is formed on the other main surface of the transparent substrate 12A.

A specific example of this manufacturing method will be described with reference to FIGS.
First, in step S1 of FIG. 15, a long photosensitive material 140 is produced. As shown in FIG. 16A, the photosensitive material 140 includes a first transparent substrate 12A and a photosensitive silver halide emulsion layer (hereinafter referred to as a first photosensitive layer 142a) formed on one main surface of the first transparent substrate 12A. And a photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 142b) formed on the other main surface of the first transparent substrate 12A.

  In step S2 of FIG. 15, the photosensitive material 140 is exposed. In this exposure processing, the first photosensitive layer 142a is irradiated with light toward the first transparent substrate 12A to expose the first photosensitive layer 142a along the first exposure pattern, and the second photosensitive layer. The layer 142b is subjected to a second exposure process in which light is irradiated toward the first transparent substrate 12A to expose the second photosensitive layer 142b along the second exposure pattern (double-sided simultaneous exposure). In the example of FIG. 16B, while the long photosensitive material 140 is conveyed in one direction, the first photosensitive layer 142a is irradiated with the first light 144a (parallel light) through the first photomask 146a and the second photosensitive material 140a is irradiated. The layer 142b is irradiated with the second light 144b (parallel light) through the second photomask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimator lens 150a, and the second light 144b is emitted from the second light source 148b. It is obtained by converting the light into parallel light by the second collimator lens 150b in the middle. In the example of FIG. 16B, the case where two light sources (first light source 148a and second light source 148b) are used is shown, but the light emitted from one light source is divided through the optical system to generate the first light. The first photosensitive layer 142a and the second photosensitive layer 142b may be irradiated as the 144a and the second light 144b.

  Then, in step S3 of FIG. 15, the exposed photosensitive material 140 is developed to produce the touch panel conductive sheet 10 as shown in FIG. 3B, for example. The conductive sheet 10 for a touch panel includes a first transparent base 12A, a first conductive portion 14A along a first exposure pattern formed on one main surface of the first transparent base 12A, and a first transparent base 12A. And the second conductive portion 14B along the second exposure pattern formed on the other main surface. Note that the exposure time and development time of the first photosensitive layer 142a and the second photosensitive layer 142b vary depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like. However, the exposure time and the development time are adjusted so that the development rate becomes 100%.

  In the first exposure process of the manufacturing method according to the present embodiment, as shown in FIG. 17, a first photomask 146a is disposed in close contact with the first photosensitive layer 142a, for example, and the first photomask 146a. The first photosensitive layer 142a is exposed by irradiating the first light 144a from the first light source 148a disposed opposite to the first photomask 146a. The first photomask 146a includes a glass substrate made of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the first exposure process exposes a portion of the first photosensitive layer 142a along the first exposure pattern 152a formed on the first photomask 146a. A gap of about 2 to 10 μm may be provided between the first photosensitive layer 142a and the first photomask 146a.

  Similarly, in the second exposure process, for example, the second photomask 146b is disposed in close contact with the second photosensitive layer 142b, and the second photomask 146b from the second light source 148b disposed to face the second photomask 146b. The second photosensitive layer 142b is exposed by irradiating the second light 144b toward. Similarly to the first photomask 146a, the second photomask 146b includes a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern 152b) formed on the glass substrate. Yes. Accordingly, the second exposure process exposes a portion of the second photosensitive layer 142b along the second exposure pattern 152b formed on the second photomask 146b. In this case, a gap of about 2 to 10 μm may be provided between the second photosensitive layer 142b and the second photomask 146b.

  In the first exposure process and the second exposure process, the emission timing of the first light 144a from the first light source 148a and the emission timing of the second light 144b from the second light source 148b may be made simultaneously or different. Also good. At the same time, the first photosensitive layer 142a and the second photosensitive layer 142b can be exposed simultaneously by one exposure process, and the processing time can be shortened.

By the way, when both the first photosensitive layer 142a and the second photosensitive layer 142b are not spectrally sensitized, when the photosensitive material 140 is exposed from both sides, the exposure from one side affects the image formation on the other side (back side). Will be affected.
That is, the first light 144a from the first light source 148a that has reached the first photosensitive layer 142a is scattered by the silver halide grains in the first photosensitive layer 142a, passes through the first transparent substrate 12A as scattered light, Part of it reaches the second photosensitive layer 142b. Then, the boundary portion between the second photosensitive layer 142b and the first transparent substrate 12A is exposed over a wide range, and a latent image is formed. For this reason, in the second photosensitive layer 142b, the exposure by the second light 144b from the second light source 148b and the exposure by the first light 144a from the first light source 148a are performed, and in the subsequent development processing, the conductive film for the touch panel is used. In the case of the conductive sheet 10, in addition to the conductive pattern (second conductive portion 14B) by the second exposure pattern 152b, a thin conductive layer by the first light 144a from the first light source 148a is formed between the conductive patterns. Therefore, a desired pattern (a pattern along the second exposure pattern 152b) cannot be obtained. The same applies to the first photosensitive layer 142a.

In order to avoid this, as a result of intensive studies, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b is set to a specific range, and the amount of silver applied to the first photosensitive layer 142a and the second photosensitive layer 142b is specified. By doing so, it was found that the silver halide itself absorbs light and can limit light transmission to the back surface. In the present embodiment, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Further, the coating silver amount of the first photosensitive layer 142a and the second photosensitive layer 142b was regulated to 5 to 20 g / m ² .

  In the above-described double-sided exposure method, there is a problem of image defects due to exposure inhibition due to dust or the like adhering to the sheet surface. It is known to apply a conductive material to the sheet as a dust prevention, but metal oxides remain after processing, impairing the transparency of the final product, and conductive polymers are storable. There is a problem. Thus, as a result of intensive studies, it was found that the silver halide with a reduced amount of binder provided the necessary conductivity for antistatic, and the volume ratio of silver / binder in the first photosensitive layer 142a and the second photosensitive layer 142b was defined. . That is, the silver / binder volume ratio of the first photosensitive layer 142a and the second photosensitive layer 142b is 1/1 or more, and preferably 2/1 or more.

  As described above, by setting and defining the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b, the amount of coated silver, and the volume ratio of silver / binder, the first photosensitive layer 142a can be formed as shown in FIG. The reached first light 144a from the first light source 148a does not reach the second photosensitive layer 142b. Similarly, the second light 144b from the second light source 148b that reaches the second photosensitive layer 142b is changed to the first photosensitive layer. As a result, when the conductive sheet 10 for the touch panel is formed in the subsequent development processing, as shown in FIG. 3B, the first exposure pattern 152a is formed on one main surface of the first transparent substrate 12A. Only the conductive pattern (pattern constituting the first conductive portion 14A) is formed, and the other main surface of the first transparent substrate 12A is formed with the conductive pattern (second conductive pattern) by the second exposure pattern 152b. Becomes the only pattern) constituting the 14B is formed, it is possible to obtain a desired pattern.

  Thus, in the manufacturing method using the above-described double-sided batch exposure, it is possible to obtain the first photosensitive layer 142a and the second photosensitive layer 142b that have both conductivity and suitability for double-sided exposure. The same pattern or different patterns can be arbitrarily formed on both surfaces of the first transparent substrate 12A by the exposure process on the first transparent substrate 12A, whereby the electrodes of the touch panel 50 can be easily formed, The touch panel 50 can be thinned (low profile).

The above-described example is a manufacturing method in which the first conductive portion 14A and the second conductive portion 14B are formed using a photosensitive silver halide emulsion layer. Other manufacturing methods include the following manufacturing methods. .
That is, the photoresist film on the copper foil formed on the first transparent substrate 12A and the second transparent substrate 12B is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched. The first conductive portion 14A and the second conductive portion 14B may be formed.
Alternatively, the first conductive portion 14A and the second conductive portion 14B are formed by printing a paste containing metal fine particles on the first transparent substrate 12A and the second transparent substrate 12B and performing metal plating on the paste. Also good.
Alternatively, the first conductive portion 14A and the second conductive portion 14B may be printed and formed on the first transparent substrate 12A and the second transparent substrate 12B by a screen printing plate or a gravure printing plate.
Alternatively, the first conductive portion 14A and the second conductive portion 14B may be formed by inkjet on the first transparent base 12A and the second transparent base 12B.

Next, in the conductive sheet 10 according to the present embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable aspect will be mainly described.
The manufacturing method of the conductive sheet 10 according to the present embodiment includes the following three modes depending on the photosensitive material and the mode of development processing.
(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The obtained developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

Here, the configuration of each layer of the conductive sheet 10 according to the present embodiment will be described in detail below.
[Transparent substrate 12]
Examples of the transparent substrate 12 include a plastic sheet, a plastic plate, and a glass plate.
Examples of the raw material for the plastic sheet and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); triacetyl cellulose (TAC) and the like.
As the transparent substrate 12, a plastic sheet or a plastic plate having a melting point of about 290 ° C. or less is preferable, and PET is particularly preferable from the viewpoints of light transmittance, workability, and the like.

[Silver salt emulsion layer]
The silver salt emulsion layer that becomes the fine metal wires 16 of the conductive sheet 10 contains additives such as a solvent and a dye in addition to the silver salt and the binder.
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.
Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / m ² in terms of silver, more preferably 1 to 25 g / m ^2, more preferably 5 to 20 g / m ² . By setting the amount of coated silver in the above range, a desired surface resistance can be obtained when the conductive sheet 10 is used.

Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The binder content in the silver salt emulsion layer is preferably ¼ or more, more preferably ½ or more in terms of the silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in resistance value can be suppressed, and the conductive sheet 10 having uniform surface resistance can be obtained. . The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the amount of silver. / It can obtain | require by converting into binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.
[Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. An undercoat layer, for example, can be provided below the silver salt emulsion layer.

Next, each process of the manufacturing method of the electroconductive sheet 10 is demonstrated.
[exposure]
In the present embodiment, the case where the conductive portion 14 is applied by a printing method is included, but the conductive portion 14 is formed by exposure, development, and the like except for the printing method. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the transparent substrate 12 or a photosensitive material coated with a photopolymer for photolithography. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed using a normal development processing technique used for silver salt photographic sheets, photographic paper, printing plate-making sheets, photomask emulsion masks, and the like.
The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic sheets, photographic papers, printing plate-making sheets, photomask emulsion masks and the like can be used.
The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment.
The mass of the metallic silver part contained in the exposed part after the development treatment is preferably a content of 50% by mass or more with respect to the mass of silver contained in the exposed part before the exposure, and is 80% by mass or more. More preferably it is. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The conductive sheet 10 is obtained through the above steps. The resulting conductive sheet 10 has a surface resistance of 0.1 to 100 ohm / sq. It is preferable that it exists in the range. The lower limit is 1 ohm / sq. 3 ohm / sq. 5 ohm / sq. 10 ohm / sq. It is preferable that The upper limit is 10 ohm / sq. Hereinafter, 70 ohm / sq. Hereinafter, 50 ohm / sq. The following is preferable. By adjusting the surface resistance within such a range, position detection can be performed even with a large touch panel having an area of 10 cm × 10 cm or more. Further, the first conductive sheet 10A and the second conductive sheet 10B after the development process may be further subjected to a calendar process, and can be adjusted to a desired surface resistance by the calendar process.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metal silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metal silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. Also good. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".
“Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W sheet, instant slide sheet, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.
In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.
[Conductive metal part]
As described above, the lower limit of the line width of the conductive metal portion of the present embodiment (the line width of the fine metal wire 16) is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is 15 μm or less, 10 μm. Hereinafter, it is preferably 9 μm or less and 8 μm or less. When the line width is less than the above lower limit, the conductivity becomes insufficient, so that when used for the touch panel 50, the detection sensitivity becomes insufficient. On the other hand, when the above upper limit is exceeded, moire caused by the conductive metal portion becomes noticeable, or the visibility becomes worse when used for the touch panel 50. In addition, by being in the said range, the moire of an electroconductive metal part is improved and visibility becomes especially good. The length of one side of the small lattice 74 is preferably 50 μm or more and 400 μm or less, more preferably 150 μm or more and 300 μm or less, and most preferably 210 μm or more and 250 μm or less. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.
The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is a ratio occupied by the translucent portion excluding the thin metal wires 16. For example, the aperture ratio of a rhombus having a line width of 6 μm and a side length of 240 μm is 95%.

[Light transmissive part]
The “light transmissive part” in the present embodiment means a part having light transmissivity other than the conductive metal part in the conductive sheet 10. As described above, the transmittance in the light transmissive portion is 90% or more, preferably the transmittance indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the transparent substrate 12, 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[Conductive sheet 10]
The thickness of the transparent substrate 12 in the conductive sheet 10 according to the present embodiment is preferably 5 to 350 μm, and more preferably 30 to 150 μm. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.
The thickness of the metallic silver portion provided on the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating applied on the transparent substrate 12. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.

The thickness of the thin metal wire 16 is preferable for the use of the touch panel 50 because the viewing angle of the display panel 58 is wider as it is thinner, and a thin film is also required from the viewpoint of improving the visibility. From such a viewpoint, the thickness of the fine metal wire 16 is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and further preferably 0.1 μm or more and less than 3 μm.
In the present embodiment, a metallic silver portion having a desired thickness can be formed by controlling the coating thickness of the above-described silver salt-containing layer, and the thickness of the fine metal wire can be freely controlled by physical development and / or plating treatment. Therefore, even a conductive sheet having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.
In addition, in the manufacturing method of the electroconductive sheet 10 which concerns on this Embodiment, processes, such as plating, do not necessarily need to be performed. This is because in the method for manufacturing the conductive sheet 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the amount of silver applied to the silver salt emulsion layer and the silver / binder volume ratio. In addition, you may perform a calendar process etc. as needed.

(Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardening agent include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .
The conductive sheet 10 according to the present embodiment may be provided with a functional layer such as an antireflection layer or a hard coat layer.

[Calendar processing]
The developed silver metal portion may be smoothed by calendaring. This significantly increases the conductivity of the metallic silver part. The calendar process can be performed by a calendar roll. The calendar roll usually consists of a pair of rolls.
As a roll used for the calendar process, a plastic roll or a metal roll such as epoxy, polyimide, polyamide, polyimide amide or the like is used. In particular, when emulsion layers are provided on both sides, it is preferable to treat with metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit of the linear pressure is 1960 N / cm (200 kgf / cm, converted to a surface pressure of 699.4 kgf / cm ² ) or more, more preferably 2940 N / cm (300 kgf / cm, converted to a surface pressure of 935.8 kgf / cm ^2). ) That's it. The upper limit of the linear pressure is 6880 N / cm (700 kgf / cm) or less.
The application temperature of the smoothing treatment represented by the calender roll is preferably 10 ° C. (no temperature control) to 100 ° C., and the more preferable temperature varies depending on the line density and shape of the metal mesh pattern and metal wiring pattern, and the binder type. , Approximately 10 ° C. (no temperature control) to 50 ° C.

  In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.
About the laminated conductive sheets according to Examples 1 to 8, the surface resistance and the transmittance were measured, and the moire and visibility were evaluated. Table 3 shows the breakdown of Examples 1 to 8, the measurement results, and the evaluation results.

<Examples 1-8>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .
In this emulsion, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added so as to have a concentration of 10 ⁻⁷ (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na ₂ PdCl ₄ to this emulsion and further performing gold-sulfur sensitization with chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver is 10 g / m ^2. The coating was applied on the first transparent substrate 12A and the second transparent substrate 12B (both here are polyethylene terephthalate (PET)). At this time, the volume ratio of Ag / gelatin was 2/1.
Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)
The pattern of exposure is the pattern shown in FIGS. 4 and 5 for the first conductive sheet 10A, and the pattern shown in FIGS. 6 and 7 for the second conductive sheet 10B, and is the A4 size (210 mm × 297 mm) first pattern. The test was performed on the first transparent substrate 12A and the second transparent substrate 12B. The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.

(Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.

Example 1
The line widths of the conductive portions (the first conductive pattern 68A and the second conductive pattern 68B) of the manufactured first conductive sheet 10A and second conductive sheet 10B are 1 μm, and the length of one side of the small lattice 74 is 50 μm.
(Example 2)
The first conductive sheet 10A and the second conductive sheet according to Example 2 are the same as Example 1 except that the line width of the conductive portion is 3 μm and the length of one side of the small lattice 74 is 100 μm. 10B was produced.
(Example 3)
The first conductive sheet 10A and the second conductive sheet according to Example 3 are the same as Example 1 except that the line width of the conductive portion is 4 μm and the length of one side of the small lattice 74 is 150 μm. 10B was produced.
Example 4
The first conductive sheet 10A and the second conductive sheet according to Example 4 are the same as Example 1 except that the line width of the conductive portion is 5 μm and the length of one side of the small lattice 74 is 210 μm. 10B was produced.
(Example 5)
The first conductive sheet 10A and the second conductive sheet according to Example 5 are the same as Example 1 except that the line width of the conductive portion is 8 μm and the length of one side of the small lattice 74 is 250 μm. 10B was produced.
(Example 6)
The first conductive sheet 10A and the second conductive sheet according to Example 6 are the same as Example 1 except that the line width of the conductive portion is 9 μm and the length of one side of the small lattice 74 is 300 μm. 10B was produced.
(Example 7)
The first conductive sheet 10A and the second conductive sheet according to Example 7 are the same as Example 1 except that the line width of the conductive portion is 10 μm and the length of one side of the small lattice 74 is 300 μm. 10B was produced.
(Example 8)
The first conductive sheet 10A and the second conductive sheet according to Example 8 are the same as Example 1 except that the line width of the conductive portion is 15 μm and the length of one side of the small lattice 74 is 400 μm. 10B was produced.
(Surface resistance measurement)
In order to confirm the accuracy of detection accuracy, the surface resistivity of the first conductive sheet 10A and the second conductive sheet 10B is measured with a Learstar GP (model number MCP-T610) series four-probe probe (ASP) manufactured by Dia Instruments. It is an average value of values measured at arbitrary 10 locations.
(Measurement of transmittance)
In order to confirm the quality of transparency, the transmittance of the first conductive sheet 10A and the second conductive sheet 10B was measured using a spectrophotometer.
(Evaluation of moire)
For Examples 1 to 8, the first conductive sheet 10 </ b> A is laminated on the second conductive sheet 10 </ b> B to produce the laminated conductive sheet 54, and then the laminated conductive sheet 54 is pasted on the display screen of the display device 30. In addition, the touch panel 50 is configured. Thereafter, the touch panel 50 is installed on the turntable, and the display device 30 is driven to display white. In this state, the rotating disk was rotated between a bias angle of −45 ° to + 45 °, and the moire was visually observed and evaluated.
The moiré is evaluated at an observation distance of 1.5 m from the display screen of the display device 30. When the moire does not become apparent, ○, when the moire is seen at a level having no problem, Δ, and the moire becomes apparent. The case where it did is made x.
(Visibility evaluation)
Prior to the evaluation of the moire described above, when the touch panel 50 is installed on a turntable and the liquid crystal display device 30 is driven to display white, whether or not there is a thick line or black spots, It was confirmed with the naked eye whether the boundary between the first large lattice 68A and the second large lattice portion 68B is conspicuous.

Among Examples 1 to 8, Examples 1 to 7 were good in conductivity, transmittance, moire, and visibility. In Example 8, the evaluation of moire and the evaluation of visibility are inferior to those of Examples 1 to 7, but the moire is only slightly seen at a level where there is no problem, and the display image of the display device 30 is difficult to see. It never happened.
In addition, a projected capacitive touch panel was produced using each of the laminated conductive sheets 54 according to Examples 1 to 8 described above. When touched with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. In addition, when two or more points were touched and operated, good results were obtained in the same manner, and it was confirmed that multi-touch could be supported.

  The conductive sheet and the touch panel for the touch panel according to the present invention are not limited to the above-described embodiments, and can of course have various configurations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Conductive sheet 10A ... 1st conductive sheet 10B ... 2nd conductive sheet 12 ... Transparent base 12A ... 1st transparent base 12B ... 2nd transparent base 14 ... Conductive part 14A, 14C ... 1st conductive part 14B, 14D 2nd conductive part 16 Metal fine wire 30 Display device 50 Touch panel 52 Sensor body 54, 55 Laminated conductive sheet 56 Protective layer 58 Display panel 60 Sensor part 64A, 64C First conductive pattern 64B 64D ... second conductive pattern 68A, 68C ... first large lattice 68B, 68D ... second large lattice 70 ... step 72A, 72C ... first stepped pattern 72B, 72D ... second stepped pattern 74 ... small lattice 80A, 80C ... 1st connection part 80B, 80D ... 2nd connection part 86A, 86C ... 1st non-connection part 86B, 86D ... 2nd non-connection part 88A, 88C ... 1st auxiliary line 8B, 88D ... second auxiliary lines 90A, 90C ... The 1L-shaped pattern 90B, 90D ... the 2L-shaped pattern

Claims (31)

A substrate;
Having a conductive portion formed on one main surface of the base,
The conductive part has two or more conductive patterns by fine metal wires arranged in one direction,
The conductive pattern is configured by connecting two or more sensing units composed of a large number of grids made of fine metal wires,
Each hypotenuse of the sensing part has a linear part composed of a plurality of lattices and a step composed of one or more lattices . The conductive sheet according to claim 1,
Each hypotenuse of the sensing unit has a stepped pattern having one or more steps. In the conductive sheet according to claim 1 or 2,
The conductive sheet has a substantially rhombus shape. In the electroconductive sheet of any one of Claims 1-3,
The sensing unit is configured by arranging a plurality of small lattices having a rhombus shape,
The conductive sheet according to claim 1, wherein the step of the sensing unit is equal to an integral multiple of a height of the small lattice. In the electroconductive sheet of any one of Claims 2-4,
The conductive pattern has a connection part that connects the adjacent sensing parts to each other,
Between the conductive patterns adjacent to each other, a non-connecting portion is provided that disconnects the sensing portions of the conductive patterns from each other.
The conductive sheet according to claim 1, wherein the stepped pattern has rows of small lattices that increase from the apex portion on the non-connection portion side toward the apex portion on the connection portion side through the step. In the electroconductive sheet of any one of Claims 2-4,
The conductive pattern has a connection part for connecting between the adjacent sensing parts,
Between the conductive patterns adjacent to each other, a non-connecting portion is provided that disconnects the sensing portions of the conductive patterns from each other.
In the step-like pattern, the rows of the small lattices are reduced through the step from the apex portion on the non-connection portion side toward the apex portion on the connection portion side. In the conductive sheet according to claim 5 or 6,
The conductive sheet according to claim 1, wherein a portion where the apex angle portion on the connection portion side of the sensing portion is adjacent to the oblique side has a notched portion where one side of the small lattice is missing. In the electroconductive sheet of any one of Claims 2-7,
The conductive portion has an auxiliary pattern arranged along the stepped pattern,
The auxiliary pattern has a plurality of auxiliary lines disconnected from the sensing unit,
The conductive sheet is characterized in that the auxiliary line has a length smaller than one side of the small lattice and is arranged at equal intervals with the interval between two opposing sides of the small lattice. The conductive sheet according to claim 8,
2. The conductive sheet according to claim 1, wherein the auxiliary pattern includes an L-shaped pattern in which two auxiliary lines are combined in an L shape in the vicinity of the step so as to face a corner of the step. The conductive sheet according to claim 9, wherein
Between the conductive patterns adjacent to each other, a non-connecting portion is provided that disconnects the sensing portions of the conductive patterns from each other.
The non-connecting portion is provided with two L-shaped patterns, in which two auxiliary lines are combined in an L shape, and are arranged to face each other along a direction orthogonal to the one direction. A conductive sheet. The first conductive part and the second conductive part are arranged to face each other with the base interposed therebetween,
The first conductive part has two or more first conductive patterns made of fine metal wires arranged in one direction,
The second conductive part has two or more second conductive patterns made of fine metal wires arranged in a direction orthogonal to the one direction,
The first conductive pattern is configured by connecting two or more first sensing units composed of a plurality of grids made of fine metal wires,
The second conductive pattern is configured by connecting two or more second sensing units composed of a large number of grids made of fine metal wires,
Each hypotenuse of the first sensing part has a linear part composed of a plurality of grids and a step composed of one or more grids ,
Each hypotenuse of the second sensing part has a linear part composed of a plurality of lattices and a step composed of one or more lattices . The conductive sheet according to claim 11,
Each hypotenuse of the first sensing unit has a first step-like pattern having one or more steps,
Each of the hypotenuses of the second sensing part has a second step-like pattern having one or more steps. The conductive sheet according to claim 11 or 12,
The conductive sheet, wherein the first sensing part and the second sensing part have a substantially rhombus shape. In the electroconductive sheet of any one of Claims 11-13,
The first sensing unit and the second sensing unit are configured by arranging a plurality of small lattices having a rhombus shape,
The conductive sheet according to claim 1, wherein the step of the first sensing unit and the step of the second sensing unit are equal to an integral multiple of the height of the small lattice. The conductive sheet according to claim 14, wherein
The first conductive pattern has a first connection part that connects the adjacent first sensing parts to each other,
The second conductive pattern has a second connection part that connects the adjacent second sensing parts to each other,
Between the first conductive patterns adjacent to each other, a first non-connecting portion that disconnects the first sensing portions of the first conductive patterns from each other is disposed.
Between the second conductive patterns adjacent to each other, a second non-connecting portion that disconnects the second sensing portions of the second conductive patterns from each other is disposed.
In the first step-like pattern, the rows of the small lattices increase from the apex angle portion on the first non-connection portion side toward the apex angle portion on the first connection portion side through the step,
In the second stepped pattern, the rows of the small lattices are reduced through the step from the apex angle portion on the second non-connection portion side toward the apex angle portion on the second connection portion side. A characteristic conductive sheet. The conductive sheet according to claim 14, wherein
A portion where the apex angle portion on the first connection portion side in the first sensing portion and the oblique side of the first sensing portion are adjacent to each other;
At least one of the apex angle portion on the second connecting portion side in the second sensing portion and the portion where the oblique side of the second sensing portion is adjacent is missing one side of the small lattice. A conductive sheet characterized by having a removed portion. In the electroconductive sheet of any one of Claims 13-16,
The first conductive part has a first auxiliary pattern arranged along the first stepped pattern,
The first auxiliary pattern has a plurality of first auxiliary lines disconnected from the first sensing unit,
The second conductive portion has a second auxiliary pattern arranged along the second stepped pattern,
The second auxiliary pattern has a plurality of second auxiliary lines disconnected from the second sensing unit,
The first auxiliary line is smaller in length than one side of the small lattice, and is arranged at equal intervals with the interval between two opposing sides of the small lattice,
The conductive sheet according to claim 1, wherein the second auxiliary line has a length smaller than one side of the small lattice and is arranged at equal intervals with an interval between two opposing sides of the small lattice. The conductive sheet according to claim 17,
The first auxiliary pattern includes a first L-shaped pattern in which two first auxiliary lines are combined in an L shape in the vicinity of the step of the first stepped pattern, and face the corner of the step. ,
The second auxiliary pattern includes a second L-shaped pattern in which two second auxiliary lines are combined in an L shape in the vicinity of the step of the second stepped pattern and face a corner portion of the step. A conductive sheet characterized by that. The conductive sheet according to claim 18, wherein
Between the first conductive patterns adjacent to each other, a first non-connecting portion that disconnects the first sensing portions of the first conductive patterns from each other is disposed.
Between the second conductive patterns adjacent to each other, a second non-connecting portion that disconnects the second sensing portions of the second conductive patterns from each other is disposed.
In the first non-connecting portion, two first auxiliary lines are combined in an L-shape, and two third L-shaped patterns arranged opposite to each other along a direction orthogonal to the one direction. Provided,
In the second non-connecting portion, two second auxiliary lines are respectively combined in an L shape, and two fourth L-shaped patterns arranged to face each other along the one direction are provided. A characteristic conductive sheet. The conductive sheet according to claim 18, wherein
A portion of the first conductive pattern and the second conductive pattern facing each other when viewed from above has a form in which a plurality of the small lattices are combined. The conductive sheet according to claim 4 or 14,
The conductive sheet is characterized in that the arrangement pitch of each of the small lattices is 100 to 400 μm. In the electroconductive sheet according to claim 1 or 11,
The conductive sheet according to claim 1, wherein the fine metal wire has a line width of 15 μm or less. A touch panel comprising a conductive sheet installed on a display panel,
The conductive sheet is
A substrate;
Having a conductive portion formed on one main surface of the base,
The conductive part has two or more conductive patterns by fine metal wires arranged in one direction,
The conductive pattern is configured by connecting two or more sensing units composed of a large number of grids made of fine metal wires,
Each hypotenuse of the sensing unit has a straight line part composed of a plurality of lattices and a step composed of one or more lattices .   The touch panel according to claim 23, wherein each hypotenuse of the sensing unit has a stepped pattern having one or more steps.   25. The touch panel according to claim 23, wherein the sensing unit has a substantially rhombus shape. A touch panel comprising a conductive sheet installed on a display panel,
The conductive sheet is
The first conductive part and the second conductive part are arranged to face each other with the base interposed therebetween,
The first conductive part has two or more first conductive patterns made of fine metal wires arranged in one direction,
The second conductive part has two or more second conductive patterns made of fine metal wires arranged in a direction orthogonal to the one direction,
The first conductive pattern is configured by connecting two or more first sensing units composed of a plurality of grids made of fine metal wires,
The second conductive pattern is configured by connecting two or more second sensing units composed of a large number of grids made of fine metal wires,
Each hypotenuse of the first sensing part has a linear part composed of a plurality of grids and a step composed of one or more grids ,
Each hypotenuse of the second sensing part has a straight line part made up of a plurality of grids and a step made up of one or more grids . The touch panel according to claim 26.
Each hypotenuse of the first sensing unit has a first step-like pattern having one or more steps,
Each hypotenuse of the second sensing unit has a second stepped pattern having one or more steps. The touch panel according to claim 26 or 27,
The touch panel, wherein the first sensing unit and the second sensing unit have a substantially rhombus shape. The touch panel according to any one of claims 26 to 28,
The first sensing unit and the second sensing unit are configured by arranging a plurality of small lattices having a rhombus shape,
When viewed from above, a portion where the first conductive pattern and the second conductive pattern face each other has a form in which a plurality of the small lattices are combined. The touch panel according to any one of claims 26 to 29,
The arrangement pitch of the said metal fine wire is 100-400 micrometers, The touch panel characterized by the above-mentioned. The touch panel according to any one of claims 26 to 30, wherein:
The line width of the said metal fine wire is 15 micrometers or less, The touchscreen characterized by the above-mentioned.

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