JP7164642B2 - Display device with conductive film - Google Patents

Description

TECHNICAL FIELD The present invention relates to a display device having a conductive film .

Examples of the conductive film installed on the display panel of the display device include conductive films for electromagnetic wave shielding (see, for example, Patent Documents 1 and 2) and conductive films for touch panels (see, for example, Patent Document 3). be done.
These conductive films form a lattice pattern on a transparent substrate. In Patent Document 1, moire suppressing portions are formed adjacent to intersections of the lattice pattern. By attaching the shield film and the moire suppression film having the moire suppression portion, the occurrence of moire is suppressed.

JP 2008-282924 A JP 2009-094467 A JP 2010-108877 A

The present invention has a simple configuration different from the above-mentioned Patent Documents 1 to 3, and a conductive film that is less likely to cause moire even when attached to a display panel of a general-purpose display device and can be produced with a high yield. An object of the present invention is to provide a display device including a system.

[1] A display device according to a first aspect of the present invention is a display device comprising a conductive film provided on a display panel in which a plurality of pixels are arranged in a matrix, wherein the conductive film has a base, a first conductive part formed on one main surface of the base, and a second conductive part insulated from the first conductive part, the first conductive part and a first mesh pattern of thin metal wires extending in the first direction and thin metal wires extending in the second direction. The openings of the first mesh pattern and the second mesh pattern have a rhombus shape, and the apex of the rhombus shape is 60° to 88° or 92°. 120°, and the angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 30° to 44°.
[2] In the display device according to the second aspect of the present invention, the display device comprises a conductive film placed on a display panel in which a plurality of pixels are arranged in a matrix, wherein the conductive film has a base, a first conductive part formed on one main surface of the base, and a second conductive part insulated from the first conductive part, the first conductive part and a first mesh pattern of thin metal wires extending in the first direction and thin metal wires extending in the second direction. The openings of the first mesh pattern and the second mesh pattern have a rhombus shape, and the apex of the rhombus shape is 60° to 88° or 92°. 120°, and the angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 46° to 60°.
[3] In the display device according to the first aspect of the present invention, an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 32° to 44 ° .
[4] In the display device according to the second aspect of the present invention, an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 46° to 58°.
[ 5 ] The display device according to the first aspect of the present invention is characterized in that an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 32° to 39°.
[ 6 ] In the display device according to the second aspect of the present invention, an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 51 ° to 58°.
[ 7 ] A display device according to the first or second aspect of the present invention, wherein the line width of the fine metal line is 2 to 7 μm.
[ 8 ] In the display device according to the first or second aspect of the present invention, at least one vertex of each of the rhombuses is the angle between one side of the rhombuses and the horizontal arrangement direction of the pixels. It is characterized by being double.
[ 9 ] In the display device according to the first or second aspect of the present invention, the conductive film has a mesh pattern in which a large number of diamond-shaped grids made of fine metal wires are laid out when viewed from above.
[ 10 ] In the display device according to the first or second aspect of the present invention, the first conductive pattern is composed of the first mesh pattern forming the first conductive portion and extends in the horizontal arrangement direction of the pixels. and a second conductive pattern formed of the second mesh pattern forming the second conductive portion and extending in a direction orthogonal to the horizontal arrangement direction of the pixels intersect.

According to the display device of the present invention, the conductive film of the present invention is installed on the display panel, so that when used as an electromagnetic wave shield or a touch panel, resistance can be reduced and moiré can be reduced. unlikely to occur.

It is a top view which shows an example of the conductive film which concerns on this Embodiment. It is sectional drawing which abbreviate|omits and shows an example of a part of electroconductive film. FIG. 2 is a partially omitted plan view showing an example of a pixel arrangement of a display device on which a conductive film is installed; FIG. 3 is a plan view showing an example in which a conductive film is placed on a display device, with some parts omitted; 1 is an exploded perspective view showing the configuration of a touch panel having a laminated conductive film of conductive films; FIG. FIG. 3 is an exploded perspective view showing a partially omitted laminated conductive film; FIG. 7A is a partially omitted cross-sectional view showing an example of the laminated conductive film, and FIG. 7B is a partially omitted cross-sectional view showing another example of the laminated conductive film. FIG. 4 is a plan view showing a pattern example of a first conductive portion formed on a first conductive film in a laminated conductive film; FIG. 4 is a plan view showing small lattices (openings of a mesh pattern); FIG. 4 is a plan view showing a pattern example of a second conductive portion formed on a second conductive film of the laminated conductive film; FIG. 4 is a plan view showing an example in which a first conductive film and a second conductive film are combined to form a laminated conductive film, partly omitted. FIG. 10 is an explanatory diagram showing a state in which one line is formed by a first auxiliary line and a second auxiliary line;

Embodiments of a conductive film and a display device using the conductive film according to the present invention will be described below with reference to FIGS. 1 to 12. FIG. In this specification, "-" indicating a numerical range is used to include the numerical values before and after it as a lower limit and an upper limit.

As shown in FIGS. 1 and 2, the conductive film 10 according to this embodiment has a transparent substrate 12 (see FIG. 2) and a conductive portion 14 formed on one main surface of the transparent substrate 12. . The conductive portion 14 has a mesh pattern 20 of fine metal wires (hereinafter referred to as fine metal wires 16 ) and openings 18 . The thin metal wires 16 are made of gold (Au), silver (Ag), or copper (Cu), for example.
Specifically, the conductive portion 14 includes a plurality of first thin metal wires 16a extending in a first direction (x direction in FIG. 1) and arranged at a pitch Ps in a second direction (y direction in FIG. 1), It has a mesh pattern 20 formed by intersecting a plurality of second thin metal wires 16b extending in two directions and arranged at a pitch Ps in the first direction. In this case, the first direction is inclined at an angle of +30° or more and +60° or less with respect to the reference direction (horizontal direction), and the second direction is inclined at an angle of -30° or more and -60° or less with respect to the reference direction. ing. Therefore, one mesh shape 22 of the mesh pattern 20, that is, a combined shape of one opening 18 and four thin metal wires 16 surrounding the one opening 18 has an apex angle of 60° or more and 120° or less. It becomes a diamond shape.

And this conductive film 10 is used, for example, as an electromagnetic wave shielding film for a display device 30 shown in FIG. 3 or a conductive film for a touch panel. Examples of the display device 30 include a liquid crystal display, a plasma display, an organic EL, an inorganic EL, and the like.
Here, the pitch Ps (also referred to as fine line pitch Ps) can be selected from 100 μm or more and 400 μm or less. Also, the line width of the thin metal wire 16 can be selected from 30 μm or less. When the conductive film 10 is used as an electromagnetic wave shielding film, the line width of the fine metal wires 16 is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 9 μm or less, and even more preferably 2 μm or more and 7 μm or less. When the conductive film 10 is used as a conductive film for a touch panel, the line width of the fine metal wires 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and even more preferably 2 μm or more and 7 μm or less.

The display device 30 is configured by arranging a plurality of pixels 32 in a matrix, as partially omitted in FIG. One pixel 32 is configured by horizontally arranging three sub-pixels (a red sub-pixel 32r, a green sub-pixel 32g and a blue sub-pixel 32b). One sub-pixel has a rectangular shape elongated in the vertical direction. The horizontal arrangement pitch (horizontal pixel pitch Ph) of the pixels 32 and the vertical arrangement pitch (vertical pixel pitch Pv) of the pixels 32 are substantially the same. That is, the shape (see the hatched area 34) formed by one pixel 32 and the black matrix surrounding the one pixel 32 is a square. Also, the aspect ratio of one pixel 32 is not 1, but the length in the horizontal direction (horizontal) > the length in the vertical direction (vertical).

Then, when the conductive film 10 is placed on the display panel of the display device 30 having such a pixel array, as shown in FIG. and the first thin metal wire 16a is 30° or more and 60° or less. Therefore, as shown in FIG. It has an inclination of 30° to 60° with respect to (the array in the m direction). In addition, the fine line pitch Ps in the conductive film 10 and the diagonal length La1 of one pixel 32 in the display device 30 (or the diagonal length La2 of two vertically adjacent pixels 32) are substantially the same or close to each other. The direction of arrangement of the fine metal wires 16 in the conductive film 10 and the direction of the diagonal line of one pixel 32 in the display device 30 (or the diagonal line of two vertically adjacent pixels 32) should be substantially the same or close to each other. becomes. As a result, the deviation between the arrangement period of the pixels 32 and the arrangement period of the thin metal wires 16 is reduced, and the occurrence of moire is suppressed.
Therefore, when the conductive film 10 is used as, for example, an electromagnetic wave shielding film, the conductive film 10 is arranged on the display panel 58 in the display device 30. The deviation from the arrangement period of 16 is reduced, and the occurrence of moire is suppressed. Moreover, the pitch Ps of the fine metal wires 16 constituting the mesh pattern 20 is set to 200 μm or more and 400 μm or less, and the line width of the metal fine wires 16 is set to 30 μm or less, so that high electromagnetic wave shielding properties and high translucency are provided at the same time. be able to.

Next, a display device having a touch panel, for example, a display device having a projected capacitive touch panel will be described with reference to FIGS. 5 to 12. FIG.
First, the touch panel 50 has a sensor main body 52 and a control circuit (not shown) (constituted by an IC circuit or the like). As shown in FIGS. 5, 6, and 7A, the sensor body 52 includes a laminated conductive film 54 configured by laminating a first conductive film 10A and a second conductive film 10B, which will be described later, and and a protective layer 56 (illustration of the protective layer 56 is omitted in FIG. 7A). The laminated conductive film 54 and protective layer 56 are arranged on a display panel 58 in a display device 30 such as a liquid crystal display. When viewed from above, the sensor main body 52 has a sensor portion 60 arranged in an area corresponding to the display screen 58a of the display panel 58, and a terminal wiring portion 62 arranged in an area corresponding to the outer peripheral portion of the display panel 58. (so-called picture frame).

As shown in FIGS. 6 and 8, the first conductive film 10A applied to the touch panel 50 has a first conductive portion 14A formed on one main surface of the first transparent substrate 12A (see FIG. 7A). Each of the first conductive portions 14A extends in the third direction (m direction) and is arranged in the fourth direction (n direction) orthogonal to the third direction, and is composed of a large number of fine metal wires. It has two or more first conductive patterns 64A (mesh patterns) of 16 and first auxiliary patterns 66A of thin metal wires 16 arranged around each first conductive pattern 64A.
Each first conductive pattern 64A is configured by combining two or more small lattices 70, respectively. In the examples of FIGS. 6 and 8, each first conductive pattern 64A is configured by connecting two or more first large lattices 68A in series in the third direction, and each first large lattice 68A includes two or more Small gratings 70 are combined to form a structure. Further, the first auxiliary pattern 66A, which is not connected to the first large grating 68A, is formed around the sides of the first large grating 68A. The m direction indicates, for example, the horizontal direction (or vertical direction) of a projected capacitive touch panel 50 (see FIG. 5), which will be described later, or the horizontal direction (or vertical direction) of a display panel 58 on which the touch panel 50 is installed.

The first conductive pattern 64A is not limited to the example using the first large lattice 68A. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small gratings 70 are arranged is partitioned into strips by insulating portions, and a plurality of such strips are arranged in parallel. For example, it may have two or more strip-shaped first conductive patterns 64A each extending from the terminal in the m direction and arranged in the n direction. Alternatively, a pattern in which a plurality of belt-like mesh patterns extend for each terminal may be used. As the first auxiliary pattern 66A, a mesh pattern arranged in parallel with the first conductive pattern 64A and in which, for example, a part of each small grid 70 is disconnected may be used. In this case, it may be connected to or separated from the first conductive pattern 64A.

The small lattice 70 is the smallest rhombus here, and has the same shape as or a similar shape to the single mesh shape 22 (see FIG. 1) described above. As shown in FIG. 9, the small grating 70 has an angle θ between at least one side (first side 70a to fourth side 70d) and the first direction (m direction) set to 30° to 60°. . If the m direction is the same as the pixel arrangement direction of the display device 30 (see FIG. 5) on which the touch panel 50 is installed, the above-mentioned angle θ is set to 30° to 44° or 46° to 60°. It is preferably set to 32° to 39° or 51° to 58°.
The line width of the small grating 70 (the line width of the thin metal wires 16) can be selected from 30 μm or less. As described above, when used in the touch panel 50, the line width of the fine metal wires 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and even more preferably 2 μm or more and 7 μm or less.
The length of one side of the small grating 70 can be selected from 100 μm or more and 400 μm or less. Here, the direction along the first side 70a and the third side 70c (the side facing the first side 70a) of the small lattice 70 is the first direction (x direction), and the second side 70b and the fourth side 70d. The direction along (the side opposite to the second side 70b) is the second direction (y direction).

When the first large gratings 68A are used as the first conductive patterns 64A, for example, as shown in FIG. A first connecting portion 72A is formed by. The first connection portion 72A is configured by arranging a medium lattice 74 having a size in which n (n is a real number greater than 1) small lattices 70 are arranged in the second direction (y direction). Of the sides of the first large grating 68A along the first direction, a first cutout portion 76A is formed by removing one side of the small grating 70 at a portion adjacent to the middle grating 74 . In the example of FIG. 8, the medium lattice 74 has a size in which three small lattices 70 are arranged in the second direction.
A first insulating portion 78A electrically insulated is provided between adjacent first conductive patterns 64A.
Here, the first auxiliary pattern 66A includes a plurality of first auxiliary lines 80A arranged along the sides of the first large lattice 68A along the first direction (the second direction is the axial direction). , a plurality of first auxiliary lines 80A arranged along the sides along the second direction among the sides of the first large grating 68A (the first direction is the axial direction), and the first insulating portion 78A , and a pattern in which two first L-shaped patterns 82A in which two first auxiliary lines 80A are combined in an L-shape are arranged to face each other.

The length of one side of the first large grating 68A is preferably 3 to 10 mm, more preferably 4 to 6 mm. If the length of one side is less than the above lower limit, when the first conductive film 10A is used for a touch panel, for example, the capacitance of the first large lattice 68A during detection decreases, which may result in detection failure. become more sexual. On the other hand, if the upper limit value is exceeded, there is a possibility that the position detection accuracy will be lowered. From the same point of view, the length of one side of the small gratings 70 constituting the first large grating 68A is preferably 100 to 400 μm, more preferably 150 to 300 μm, most preferably 150 to 300 μm, as described above. 210 to 250 μm or less. When the small lattice 70 is within the above range, it is possible to maintain good transparency, and the display can be visually recognized without discomfort when attached to the front surface of the display device.

In the first conductive film 10A configured as described above, as shown in FIG. 6, the open end of the first large lattice 68A present on one end side of each first conductive pattern 64A is the first connection It has a shape in which the portion 72A does not exist. The end portion of the first large grid 68A present on the other end side of each first conductive pattern 64A is electrically connected to the first terminal wiring pattern 86a by the fine metal wire 16 via the first connection portion 84a. there is
That is, the first conductive film 10A applied to the touch panel 50, as shown in FIGS. In 62, a plurality of first terminal wiring patterns 86a led out from the respective first connection portions 84a are arranged.
In the example of FIG. 5, the outer shape of the first conductive film 10A has a rectangular shape when viewed from above, and the outer shape of the sensor section 60 also has a rectangular shape. In the terminal wiring portion 62, a plurality of first terminals 88a extend in the length direction of the one long side of the peripheral edge portion of the first conductive film 10A along the lengthwise central portion thereof. An array is formed. A plurality of first connection portions 84a are linearly arranged along one long side of the sensor portion 60 (long side closest to one long side of the first conductive film 10A: n direction). The first terminal wiring pattern 86a led out from each first connection portion 84a is routed toward a substantially central portion on one long side of the first conductive film 10A, and is electrically connected to the corresponding first terminal 88a. It is connected to the.

On the other hand, as shown in FIGS. 6, 7A and 10, the second conductive film 10B has a second conductive portion 14B formed on one main surface of the second transparent substrate 12B (see FIG. 7A). Each of the second conductive portions 14B extends in the fourth direction (n direction), is arranged in the third direction (m direction), and is composed of two or more thin metal wires 16 formed of a large number of grids. It has two conductive patterns 64B (mesh pattern) and second auxiliary patterns 66B made of fine metal wires 16 arranged around each second conductive pattern 64B.
Each second conductive pattern 64B is configured by combining two or more small lattices 70 . In the examples of FIGS. 6 and 10, the second conductive pattern 64B is configured by connecting two or more second large lattices 68B in series in the fourth direction (n direction), and each of the second large lattices 68B is Two or more small gratings 70 are combined. In addition, the above-described second auxiliary pattern 66B that is not connected to the second large grating 68B is formed around the sides of the second large grating 68B.

The second conductive pattern 64B is also not limited to the example using the second large lattice 68B. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small gratings 70 are arranged is partitioned into strips by insulating portions, and a plurality of such strips are arranged in parallel. For example, it may have two or more strip-shaped second conductive patterns 64B each extending from the terminal in the n direction and arranged in the m direction. Alternatively, a pattern in which a plurality of belt-like mesh patterns extend for each terminal may be used. Also, for the second auxiliary pattern 66B, a mesh pattern arranged in parallel with the second conductive pattern 64B and in which, for example, a part of each small grid 70 is disconnected may be used. In this case, it may be connected to or separated from the second conductive pattern 64B.

When the second large gratings 68B are used as the second conductive patterns 64B, for example, as shown in FIG. A second connecting portion 72B is formed by. The second connection portion 72B is configured by arranging a medium lattice 74 having a size in which n (n is a real number greater than 1) small lattices 70 are arranged in the first direction (x direction). Of the sides of the second large grating 68B along the second direction, a second cutout portion 76B is formed by cutting one side of the small grating 70 at a portion adjacent to the middle grating 74 .
A second insulating portion 78B electrically insulated is arranged between adjacent second conductive patterns 64B.
The second auxiliary pattern 66B includes a plurality of second auxiliary lines 80B (with the second direction as the axial direction) arranged along the sides of the second large lattice 68B that extend in the first direction, and the second auxiliary pattern 66B. A plurality of second auxiliary lines 80B arranged along the sides along the second direction among the sides of the two large lattices 68B (the first direction is the axial direction) and the second insulating portions 78B each have two lines. and a pattern in which two second L-shaped patterns 82B in which two second auxiliary lines 80B are combined in an L-shape are arranged to face each other.

As shown in FIGS. 5 and 6, the second conductive film 10B configured as described above is the second conductive pattern 64B present on one end side of every second (for example, odd-numbered) second conductive pattern 64B. The open ends of the large lattices 68B and the open ends of the second large lattices 68B existing on the other end side of the even-numbered second conductive patterns 64B are shaped so that the second connecting portions 72B do not exist. . On the other hand, the ends of the second large gratings 68B present on the other end side of the odd-numbered second conductive patterns 64B and the second large gratings 68B present on one end side of the even-numbered second conductive patterns 64B. The ends of the large lattice 68B are electrically connected to the second terminal wiring pattern 86b by the fine metal wires 16 via the second connection portions 84b.
That is, in the second conductive film 10B applied to the touch panel 50, as shown in FIG. A plurality of second terminal wiring patterns 86b led out from the second connection portion 84b are arranged.

As shown in FIG. 5, in the terminal wiring portion 62, a plurality of second terminals 88b are formed in the longitudinal central portion of the peripheral portion on one long side of the second conductive film 10B. They are arranged in the length direction of the long side. In addition, a plurality of second connection portions 84b (for example, odd-numbered second connection portions 84b) are arranged in a straight line, and a plurality of second connection portions 84b (for example, Even-numbered second connection portions 84b) are arranged in a straight line.
Among the plurality of second conductive patterns 64B, for example, the odd-numbered second conductive patterns 64B are connected to the corresponding odd-numbered second connection portions 84b, and the even-numbered second conductive patterns 64B are connected to the corresponding even-numbered second connection portions 84b. th second connection portion 84b. The second terminal wiring pattern 86b derived from the odd-numbered second wire connection portions 84b and the second terminal wiring pattern 86b derived from the even-numbered second wire connection portions 84b are formed on one long side of the second conductive film 10B. , and are electrically connected to the corresponding second terminals 88b.
The lead-out form of the first terminal wiring pattern 86a may be the same as the second terminal wiring pattern 86b described above, and the lead-out form of the second terminal wiring pattern 86b may be the same as the first terminal wiring pattern 86a described above.

The length of one side of the second large grating 68B is preferably 3 to 10 mm, more preferably 4 to 6 mm, like the first large grating 68A. If the length of one side is less than the above lower limit value, the electrostatic capacity of the second large grating 68B at the time of detection is reduced, which increases the possibility of detection failure. On the other hand, if the upper limit value is exceeded, the position detection accuracy may be lowered. From the same point of view, the length of one side of the small gratings 70 constituting the second large grating 68B is preferably 100-400 μm, more preferably 150-300 μm, and most preferably 210-250 μm. When the small lattice 70 is within the above range, it is possible to maintain good transparency, and the display can be viewed without discomfort when mounted on the display panel 58 of the display device 30 .
The line widths of the first auxiliary pattern 66A (first auxiliary line 80A) and the second auxiliary pattern 66B (second auxiliary line 80B) are 0.1 to 15 μm, respectively. In this case, the line width of the first conductive pattern 64A and the line width of the second conductive pattern 64B may be the same or different. However, it is preferable that the first conductive pattern 64A, the second conductive pattern 64B, the first auxiliary pattern 66A and the second auxiliary pattern 66B have the same line width.

Then, for example, when the first conductive film 10A is laminated on the second conductive film 10B to form the laminated conductive film 54, the first conductive pattern 64A and the second conductive pattern 64B are separated as shown in FIG. Specifically, the first connection portion 72A (see FIG. 8) of the first conductive pattern 64A and the second connection portion 72B (see FIG. 10 ) of the second conductive pattern 64B are arranged to cross each other. are opposed to each other with the first transparent substrate 12A (see FIG. 7A) interposed therebetween, the first insulating portion 78A (see FIG. 8) of the first conductive portion 14A and the second large grating 68B (see FIG. 10 ) of the second conductive portion 14B. ) are opposed to each other with the first transparent substrate 12A interposed therebetween.
When the laminated conductive film 54 is viewed from above, as shown in FIG. 11, the second conductive film 10B is formed so as to fill the gaps between the first large gratings 68A formed in the first conductive film 10A. It becomes a form in which the large gratings 68B are arranged. At this time, a combination pattern 90 is formed between the first large grating 68A and the second large grating 68B by the first auxiliary pattern 66A and the second auxiliary pattern 66B facing each other. In the combination pattern 90, as shown in FIG. 12, the first axis 92A of the first auxiliary line 80A and the second axis 92B of the second auxiliary line 80B are aligned, and the first auxiliary line 80A and the second auxiliary line 80B do not overlap, and one end of the first auxiliary line 80A coincides with one end of the second auxiliary line 80B, thereby forming one side of the small lattice 70 (mesh shape). That is, the combination pattern 90 has a form in which two or more small lattices 70 (mesh shape) are combined. As a result, when the laminated conductive film 54 is viewed from above, as shown in FIG. 11, a large number of small lattices 70 (mesh shape) are laid out.

At this time, as shown in FIG. 4, the fine metal wires 16 forming the large number of small lattices 70 are tilted at an angle of 30° to 60° with respect to the horizontal arrangement direction (m-direction arrangement) of the pixels 32 in the display device 30. will have In addition, the fine line pitch Ps in the laminated conductive film 54 and the diagonal length La1 of one pixel 32 in the display device 30 (or the diagonal length La2 of two vertically adjacent pixels 32) are approximately the same or The values are close to each other, and the arrangement direction of the fine metal wires 16 in the laminated conductive film 54 and the direction of the diagonal line of one pixel 32 in the display device 30 (or the diagonal line of two vertically adjacent pixels 32) are substantially the same or close to each other. It will be done. As a result, the deviation between the arrangement period of the pixels 32 and the arrangement period of the thin metal wires 16 is reduced, and the occurrence of moire is suppressed. In addition, it is possible to obtain the effect that moire is less likely to occur even if there is a variation in the inclination angle between the laminated conductive films 54, and the yield of the laminated conductive film 54 can be improved.

When this laminated conductive film 54 is used as a touch panel, a protective layer 56 is formed on the first conductive film 10A, and the first conductive pattern 64A derived from the numerous first conductive patterns 64A of the first conductive film 10A. A one-terminal wiring pattern 86a and a second terminal wiring pattern 86b derived from a large number of second conductive patterns 64B of the second conductive film 10B are connected to, for example, a control circuit for controlling scanning.
As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably employed. That is, in the case of the self-capacitance method, voltage signals for touch position detection are sequentially supplied to the first conductive patterns 64A, and voltage signals for touch position detection are sequentially supplied to the second conductive patterns 64B. supply. When the fingertip touches or approaches the upper surface of the protective layer 56, the capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position and GND (ground) increases. The waveforms of the transmission signals from 64A and the second conductive pattern 64B are different from the waveforms of the transmission signals from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signals supplied from the first conductive pattern 64A and the second conductive pattern 64B. On the other hand, in the case of the mutual capacitance method, for example, voltage signals for touch position detection are sequentially supplied to the first conductive patterns 64A, and sensing (transmission signal detection) is sequentially performed to the second conductive patterns 64B. conduct. When the fingertip touches or approaches the upper surface of the protective layer 56, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position. The waveform of the transmission signal from the second conductive pattern 64B becomes a waveform different from the waveform of the transmission signal from the other second conductive patterns 64B. Therefore, the control circuit calculates the touch position based on the order of the first conductive patterns 64A to which the voltage signals are supplied and the transmitted signal from the supplied second conductive pattern 64B. By adopting such a self-capacitance or mutual-capacitance touch position detection method, each touch position can be detected even if two fingertips are brought into contact with or close to the upper surface of the protective layer 56 at the same time. Become. Prior art documents relating to the projected capacitive detection circuit include US Pat. No. 4,582,955, US Pat. No. 4,686,332, and US Pat. specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. be.

In the laminated conductive film 54 described above, as shown in FIGS. 6 and 7A, the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A, and the second conductive portion 14A is formed on one main surface of the second transparent substrate 12B. In addition to forming the conductive portion 14B, as shown in FIG. Two conductive portions 14B may be formed. In this case, the second transparent substrate 12B does not exist, the first transparent substrate 12A is laminated on the second conductive portion 14B, and the first conductive portion 14A is laminated on the first transparent substrate 12A. Further, another layer may exist between the first conductive film 10A and the second conductive film 10B, and if the first conductive portion 14A and the second conductive portion 14B are in an insulated state, they They may be arranged facing each other.
As shown in FIG. 5, for example, each corner portion of the first conductive film 10A and the second conductive film 10B is provided with a positioning adhesive used when bonding the first conductive film 10A and the second conductive film 10B. It is preferable to form the first alignment mark 94a and the second alignment mark 94b. When the first conductive film 10A and the second conductive film 10B are laminated to form the laminated conductive film 54, the first alignment mark 94a and the second alignment mark 94b become a new composite alignment mark. The alignment mark also functions as a positioning alignment mark used when installing the laminated conductive film 54 on the display panel 58 .

In the above example, an example in which the first conductive film 10A and the second conductive film 10B are applied to the projected capacitive touch panel 50 is shown. It can also be applied to a film type touch panel.
In the above example, the conductive film 10 is mainly used as an electromagnetic wave shielding film and a laminated conductive film for a touch panel. can also be used. In this case, the conductive film may be formed with a mesh pattern corresponding to the entire surface of the display panel 58, or the conductive film 10 may be formed with a mesh pattern 20 corresponding to the entire surface of the display screen 58a. The conductive film 10 may have a mesh pattern formed corresponding to a partial region (corner, central portion, etc.) within the display screen 58a.

Next, a method for manufacturing the conductive film 10 will be described. As a method for producing the conductive film 10, for example, a photosensitive material having an emulsion layer containing a photosensitive silver halide salt on the transparent substrate 12 is exposed to light, and subjected to a development process to form an exposed portion and an unexposed portion. The mesh pattern 20 may be formed by forming a metallic silver portion and a light transmissive portion. Further, the metallic silver portion may be made to carry a conductive metal by subjecting the metallic silver portion to physical development and/or plating treatment.

Alternatively, a photosensitive plated layer is formed on the first transparent substrate 12A and the second transparent substrate 12B using a pretreatment material for plating, and then exposed and developed, followed by plating, thereby forming the exposed portion and the second transparent substrate 12B. The first conductive pattern 64A and the second conductive pattern 64B may be formed by forming a metal portion and a light-transmitting portion in the unexposed portion, respectively. In addition, the metal portion may carry the conductive metal by subjecting the metal portion to physical development and/or plating treatment.
More preferable forms of the method using the pretreatment material for plating include the following two forms. More specific details below are disclosed in Japanese Patent Application Laid-Open Nos. 2003-213437, 2006-64923, 2006-58797, and 2006-135271.
(a) A layer to be plated containing a functional group that interacts with a plating catalyst or its precursor is coated on a transparent substrate, then exposed and developed, followed by plating to form a metal portion on the material to be plated. Manner.
(b) On a transparent substrate, a base layer containing a polymer and a metal oxide, and a plated layer containing a functional group that interacts with a plating catalyst or its precursor are laminated in this order, and then exposed and developed. A mode in which a metal portion is formed on a material to be plated by plating.

As another method, a photoresist film on the copper foil formed on the transparent substrate 12 is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched to obtain the mesh pattern 20. may be formed.
Alternatively, the mesh pattern 20 may be formed by printing a paste containing fine metal particles on the transparent substrate 12 and plating the paste with a metal.
Alternatively, the mesh pattern 20 may be printed on the transparent substrate 12 using a screen printing plate or a gravure printing plate.
Alternatively, the mesh pattern 20 may be formed on the transparent substrate 12 by inkjet.

Next, a method of using a silver halide photographic light-sensitive material, which is a particularly preferred embodiment, in the conductive film 10 according to the present embodiment will be mainly described.
The method for manufacturing the conductive film 10 according to the present embodiment includes the following three forms depending on the form of the photosensitive material and development processing.
(1) A mode in which a silver halide black-and-white photosensitive material containing no physical development nuclei is chemically or thermally developed to form a metallic silver portion on the photosensitive material.
(2) A mode in which a silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image-receiving sheet having a non-photosensitive layer containing physical development nuclei are superimposed, and diffusion transfer development is performed to convert the metallic silver portion to a non-photosensitive image-receiving sheet. Embodiment formed on.

The mode (1) is an integrated black-and-white development type, in which a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is either chemically developed silver or thermally developed silver, which is highly active in subsequent plating or physical development processes in that it is a filament with a high specific surface.
In the above aspect (2), in the exposed area, the silver halide grains in the vicinity of the physical development nuclei are dissolved and deposited on the development nuclei, thereby forming a translucent conductive film such as a light-transmitting conductive film on the photosensitive material. A sexual membrane is formed. This is also an integrated black-and-white development type. Since the developing action is deposition on the physical development nuclei, it is highly active, but the developed silver is spherical with a small specific surface.
In the above-mentioned mode (3), the silver halide grains are dissolved and diffused in the unexposed areas and deposited on the development nuclei on the image receiving sheet, thereby forming a transparent conductive film or the like on the image receiving sheet. A conductive film is formed. This is a so-called separate type, in which the image-receiving sheet is separated from the photosensitive material.

In either embodiment, either negative type development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative type development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The terms chemical development, thermal development, dissolution physical development, and diffusion transfer development referred to here have the same meanings as those commonly used in the industry, and can be found in general textbooks on photographic chemistry, such as "Shashin Kagaku" by Shinichi Kikuchi (Kyoritsu Shuppan Publishing Co., Ltd.). Publishing Co., Ltd., 1955); E. K. Mees, ed., "The Theory of Photographic Processes, 4th ed." (Mcmillan, 1977). Although this invention relates to liquid processing, it is also possible to refer to a technique that applies a thermal development method as another development method. For example, it is possible to apply the techniques described in the specifications of JP-A-2004-184693, JP-A-2004-334077, JP-A-2005-010752, JP-A-2004-244080, and JP-A-2004-085655. can.

Here, the structure of each layer of the conductive film 10 according to this embodiment will be described in detail below.
[Transparent substrate 12]
Examples of the transparent substrate 12 include plastic films, plastic plates, glass plates, and the like.
Examples of raw materials for the plastic film and plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); triacetyl cellulose (TAC) and the like.
As the transparent substrate 12, a plastic film or a plastic plate having a melting point of about 290° C. or lower is preferable, and PET is particularly preferable from the viewpoint of light transmittance and workability.

[Silver salt emulsion layer]
The silver salt emulsion layer that forms the fine metal wires 16 of the conductive film 10 contains additives such as solvents and dyes in addition to the silver salt and binder.
Silver salts used in this embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide which has excellent properties as a photosensor.
The coated silver amount (coated amount of silver salt) of the silver salt emulsion layer is preferably 1 to 30 g/m ² , more preferably 1 to 25 g/m ² , and still more preferably 5 to 20 g/m ² in terms of silver. . By setting the coating amount of silver within the above range, a desired surface resistance can be obtained when the conductive film 10 is formed.

Binders used in this embodiment include, for example, gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and its derivatives, polyethylene oxide, polyvinylamine, chitosan, polylysine, polyacryl acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. They have neutral, anionic or cationic properties depending on the ionic nature of the functional groups.
The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer is preferably 1/4 or more, more preferably 1/2 or more in silver/binder volume ratio. The silver/binder volume ratio is preferably 100/1 or less, more preferably 50/1 or less. Further, the silver/binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is between 1/1 and 3/1. By setting the silver/binder volume ratio in the silver salt emulsion layer within this range, it is possible to suppress variation in resistance value even when the amount of coated silver is adjusted, and to obtain a conductive film 10 having uniform surface resistance. . The silver/binder volume ratio is obtained by converting the raw material silver halide amount/binder amount (weight ratio) into silver amount/binder amount (weight ratio), and then converting the silver amount/binder amount (weight ratio) into the silver amount. /binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited, but examples thereof include water, organic solvents (e.g., alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethylsulfoxide, etc.). sulfoxides, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
<Other additives>
Various additives used in the present embodiment are not particularly limited, and known additives can be preferably used.
[Other layer structures]
A protective layer (not shown) may be provided on the silver salt emulsion layer. Further, for example, an undercoat layer may be provided below the silver salt emulsion layer.

Next, each step of the method for producing the conductive film 10 will be described.
[exposure]
Although the present embodiment includes the case where the conductive portion 14 is applied by a printing method, the conductive portion 14 is formed by exposure, development, or the like, in a method other than the printing method. That is, a photosensitive material having a silver salt-containing layer provided on the transparent substrate 12 or a photosensitive material coated with a photopolymer for photolithography is exposed. Exposure can be performed using electromagnetic waves. Examples of electromagnetic waves include light such as visible light and ultraviolet rays, radiation such as X-rays, and the like. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source with a specific wavelength may be used.
[Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. For the development process, a usual technique of development process used for silver salt photographic film, photographic paper, printing plate-making film, emulsion mask for photomask and the like can be used.
The development processing in the present invention can include fixing processing for the purpose of removing silver salts from unexposed portions and stabilizing them. For the fixing treatment in the present invention, fixing treatment techniques used for silver salt photographic films, photographic papers, printing plate-making films, emulsion masks for photomasks, and the like can be used.
The light-sensitive material that has been developed and fixed is preferably washed with water and stabilized.

The mass of the metallic silver portion contained in the exposed area after development processing is preferably 50% by mass or more, preferably 80% by mass or more, relative to the mass of silver contained in the exposed area before exposure. It is even more preferable to have If the mass of silver contained in the exposed area is 50% by mass or more with respect to the mass of silver contained in the exposed area before exposure, high conductivity can be obtained, which is preferable.

The conductive film 10 is obtained through the above steps. The surface resistance of the obtained conductive film 10 is 0.1 to 300 ohm/sq. is preferably in the range of Although the surface resistance varies depending on the application of the conductive film 10, it is 10 ohm/sq. or less, and 0.1 to 3 ohms/sq. is more preferable. Also, in the case of touch panel applications, 1 to 70 ohms/sq. is preferably 5 to 50 ohms/sq. is more preferably 5 to 30 ohms/sq. is more preferable. Further, the electroconductive film 10 after the development treatment may be further subjected to a calendering treatment, and the surface resistance can be adjusted to a desired level by the calendering treatment.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development treatment, physical development and/or plating treatment are performed to support conductive metal particles on the metallic silver portion. may In the present invention, the conductive metal particles may be supported on the metallic silver portion only by either physical development or plating treatment, or the physical development and plating treatment may be combined to support the conductive metal particles on the metallic silver portion. good too. In addition, the term “conductive metal portion” includes a metal silver portion subjected to physical development and/or plating treatment.
"Physical development" in the present embodiment refers to depositing metal particles on the nucleus of metal or metal compound by reducing metal ions such as silver ions with a reducing agent. This physical phenomenon is used in instant B&W film, instant slide film, printing plate manufacturing, etc., and the technology can be used in the present invention. Further, physical development may be performed simultaneously with development processing after exposure, or may be performed separately after development processing.
In the present embodiment, electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating can be used for the plating treatment. For electroless plating in the present embodiment, a known electroless plating technique can be used. For example, an electroless plating technique used in printed wiring boards can be used. Plating is preferred.

[Oxidation treatment]
In the present embodiment, the metallic silver portion after development and the conductive metal portion formed by physical development and/or plating are preferably subjected to oxidation treatment. By performing the oxidation treatment, for example, when a slight amount of metal is deposited on the light-transmitting portion, the metal can be removed and the transparency of the light-transmitting portion can be made almost 100%.

[Conductive metal part]
The line width of the conductive metal portion (the line width of the thin metal line 16) in the present embodiment can be selected to be 30 μm or less, and the lower limit is 0.1 μm or more, 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more. Preferably, the upper limit is 30 µm or less, 15 µm or less, 10 µm or less, 9 µm or less, and 8 µm or less. If the line width is less than the above lower limit value, the conductivity becomes insufficient, so that when used in the touch panel 50, the detection sensitivity becomes insufficient. On the other hand, when the above upper limit is exceeded, moiré caused by the conductive metal portion becomes conspicuous, or visibility deteriorates when used in the touch panel 50 . In addition, by being in the above range, the moiré of the conductive metal portion is improved, and the visibility is particularly improved. The length of one side of the small lattice 70 is preferably 100 μm or more and 400 μm or less, more preferably 150 μm or more and 300 μm or less, and most preferably 210 μm or more and 250 μm or less. Also, the conductive metal portion may have a portion with a line width wider than 200 μm for purposes such as ground connection.
In terms of visible light transmittance, the conductive metal part in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more. The aperture ratio is the ratio of the translucent portion excluding the thin metal wires 16 to the whole. For example, the aperture ratio of a rhombus with a line width of 6 μm and a side length of 240 μm is 95%.

[Light transmissive part]
The “light-transmitting portion” in the present embodiment means a light-transmitting portion of the conductive film 10 other than the conductive metal portion. As described above, the transmittance of the light-transmitting portion is 90% or more, preferably the minimum transmittance in the wavelength region of 380 to 780 nm, excluding the contribution of light absorption and reflection of the transparent substrate 12. It is 95% or more, more preferably 97% or more, still more preferably 98% or more, and most preferably 99% or more.
As for the exposure method, a method using a glass mask or a pattern exposure method by laser drawing is preferable.

[Conductive film 10]
The thickness of the transparent substrate 12 in the conductive film 10 according to this embodiment is preferably 5-350 μm, more preferably 30-150 μm. If it is in the range of 5 to 350 μm, a desired visible light transmittance can be obtained, and handling is easy.
The thickness of the metallic silver portion provided on the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating material applied on the transparent substrate 12 . The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, preferably 30 μm or less, more preferably 20 μm or less, and even more preferably 0.01 to 9 μm. , 0.05 to 5 μm. Moreover, it is preferable that the metallic silver portion is patterned. The metallic silver portion may be one layer, or may have a multi-layer structure of two or more layers. When the metallic silver portion is patterned and has a multi-layer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thus, different patterns can be formed in each layer by exposing with different exposure wavelengths.

As for the thickness of the conductive metal portion, the thinner the conductive metal portion, the wider the viewing angle of the display panel 58 is. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal portion is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and 0.1 μm or more. More preferably less than 3 μm.
In the present embodiment, by controlling the coating thickness of the silver salt-containing layer described above, a metallic silver portion having a desired thickness is formed, and furthermore, physical development and/or plating treatment are performed to form a layer made of conductive metal particles. can be freely controlled, even a conductive film having a thickness of less than 5 μm, preferably less than 3 μm can be easily formed.
In addition, in the manufacturing method of the conductive film 10 according to the present embodiment, the steps such as plating do not necessarily need to be performed. This is because, in the method for manufacturing the conductive film 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the coated silver amount of the silver salt emulsion layer and the silver/binder volume ratio. In addition, you may perform calendar processing etc. as needed.

(Hardening treatment after development treatment)
After developing the silver salt emulsion layer, it is preferable to harden the layer by immersing it in a hardener. Examples of hardening agents include dialdehydes such as glutaraldehyde, adipaldehyde and 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .
A functional layer such as an antireflection layer or a hard coat layer may be added to the conductive film 10 according to the present embodiment.

[Calendar processing]
The developed metallic silver portion may be smoothed by calendering. This significantly increases the electrical conductivity of the metallic silver portion. Calendering can be done with calender rolls. Calender rolls usually consist of a pair of rolls.
As rolls used for calendering, plastic rolls of epoxy, polyimide, polyamide, polyimideamide, etc., or metal rolls are used. In particular, in the case of having emulsion layers on both sides, it is preferable to process between metal rolls. When an emulsion layer is provided on one side, a combination of a metal roll and a plastic roll can be used from the viewpoint of preventing wrinkles. The upper limit of the linear pressure is 1960 N/cm (200 kgf/cm, 699.4 kgf/cm ² in terms of surface pressure) or more, more preferably 2940 N/cm (300 kgf/cm, 935.8 kgf/cm ² in terms of surface pressure). ) or more. The upper limit of the linear pressure is 6880 N/cm (700 kgf/cm) or less.
The application temperature of the smoothing treatment represented by a calendar roll is preferably 10° C. (no temperature control) to 100° C. The more preferable temperature varies depending on the image line density and shape of the metal mesh pattern or metal wiring pattern, and the type of binder. , approximately in the range of 10°C (no temperature control) to 50°C.

The present invention can be used in appropriate combination with the techniques of the publications and international pamphlets shown in Tables 1 and 2 below. Notations such as “Japanese Patent Laid-Open Publication”, “Publication No.”, and “Pamphlet No.” are omitted.

EXAMPLES The present invention will be described in more detail below with reference to Examples of the present invention. The materials, amounts used, proportions, processing details, processing procedures, etc. shown in the following examples can be changed as appropriate without departing from the gist of the present invention. Therefore, the scope of the present invention should not be construed to be limited by the specific examples shown below.
In this example, the aperture ratio was calculated and moire was evaluated for the laminated conductive films 54 according to Comparative Examples 1 to 6 and Examples 1 to 60. Table 3 shows the breakdown, calculation results, and evaluation results of Comparative Examples 1 to 6 and Examples 1 to 60.

<Examples 1 to 60, Comparative Examples 1 to 6>
(Silver halide light-sensitive material)
An emulsion containing silver iodobromochloride grains (I=0.2 mol %, Br=40 mol %) having an average equivalent spherical diameter of 0.1 .mu.m and containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium was prepared. .
In addition, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added to this emulsion so that the concentration was 10 ⁻⁷ (mol/mol silver), and the silver bromide grains were doped with Rh ions and Ir ions. . Na ₂ PdCl ₄ was added to this emulsion, and gold-sulfur sensitization was performed using chloroauric ^acid and sodium thiosulfate. Coated onto a transparent substrate (here, both polyethylene terephthalate (PET)). At this time, the Ag/gelatin volume ratio was set to 2/1.
A PET support having a width of 30 cm was coated for 20 m in a width of 25 cm, and both ends were cut off by 3 cm so as to leave a central portion of 24 cm of the coating to obtain a roll-shaped silver halide photosensitive material.

(exposure)
The exposure pattern is the pattern shown in FIGS. 6 and 8 for the first conductive film 10A, and the pattern shown in FIGS. 6 and 10 for the second conductive film 10B. 1 transparent substrate 12A and the second transparent substrate 12B. Exposure was carried out using parallel light from a high-pressure mercury lamp as a light source through a photomask having the above pattern.

(Development processing)
・Developer 1L recipe Hydroquinone 20g
50 g sodium sulfite
Potassium carbonate 40g
Ethylenediamine/tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4g
Adjusted to pH 10.3 ・Fixer 1L formula Ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25g
8 g of 1,3-diaminopropane/tetraacetic acid
5 g of acetic acid
Ammonia water (27%) 1 g
Adjusted to pH 6.2 The photosensitive material exposed using the above processing agent was processed using an automatic processor FG-710PTS manufactured by FUJIFILM Corporation. /min) for 20 seconds.

(Example 1)
The angle θ formed between the first side 70a of the small lattice 70 and the first direction (x direction) in the first conductive portion 14A of the first conductive film 10A and the second conductive portion 14B of the second conductive film 10B is A laminated conductive film according to Example 1 was produced with the angle 30°, the length of one side of the small grating 70 being 200 μm, and the line width of the small grating 70 being 6 μm.
(Examples 2-4)
In Examples 2, 3, and 4, laminated conductive films were produced in the same manner as in Example 1, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.
(Example 5)
The laminated conductive film according to Example 5, where the angle θ between the first side 70a of the small lattice 70 and the first direction is 32°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. was made.
(Examples 6-8)
In Examples 6, 7, and 8, laminated conductive films were produced in the same manner as in Example 5, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.

(Example 9)
The laminated conductive film according to Example 9, with the angle θ between the first side 70a of the small grating 70 and the first direction being 36°, the length of one side of the small grating 70 being 200 μm, and the line width of the small grating 70 being 6 μm. was made.
(Examples 10-12)
In Examples 10, 11, and 12, laminated conductive films were produced in the same manner as in Example 9, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.
(Example 13)
The laminated conductive film according to Example 13, where the angle θ between the first side 70a of the small lattice 70 and the first direction is 37°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. was made.
(Examples 14-16)
In Examples 14, 15, and 16, laminated conductive films were produced in the same manner as in Example 13, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.

(Example 17)
The laminated conductive film according to Example 17, where the angle θ between the first side 70a of the small grating 70 and the first direction is 39°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 18-20)
In Examples 18, 19, and 20, laminated conductive films were produced in the same manner as in Example 17, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.
(Example 21)
The laminated conductive film according to Example 21, where the angle θ between the first side 70a of the small lattice 70 and the first direction is 40°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. was made.
(Examples 22-24)
In Examples 22, 23, and 24, laminated conductive films were produced in the same manner as in Example 21, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 25)
The laminated conductive film according to Example 25, where the angle θ between the first side 70a of the small grating 70 and the first direction is 44°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 26-28)
In Examples 26, 27, and 28, laminated conductive films were produced in the same manner as in Example 25, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.
(Example 29)
The laminated conductive film according to Example 29, where the angle θ between the first side 70a of the small grating 70 and the first direction is 45°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 30-32)
In Examples 30, 31, and 32, laminated conductive films were produced in the same manner as in Example 29, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 33)
The laminated conductive film according to Example 33, where the angle θ between the first side 70a of the small grating 70 and the first direction is 46°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 34-36)
In Examples 34, 35, and 36, laminated conductive films were produced in the same manner as in Example 33, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.
(Example 37)
The laminated conductive film according to Example 37, where the angle θ between the first side 70a of the small grating 70 and the first direction is 50°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 38-40)
In Examples 38, 39, and 40, laminated conductive films were produced in the same manner as in Example 37, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 41)
The laminated conductive film according to Example 41, where the angle θ between the first side 70a of the small grating 70 and the first direction is 51°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 42-44)
In Examples 42, 43, and 44, laminated conductive films were produced in the same manner as in Example 41, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.
(Example 45)
The laminated conductive film according to Example 45, where the angle θ between the first side 70a of the small grating 70 and the first direction is 53°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 46-48)
In Examples 46, 47, and 48, laminated conductive films were produced in the same manner as in Example 45, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.

(Example 49)
The laminated conductive film according to Example 49, where the angle θ between the first side 70a of the small grating 70 and the first direction is 54°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 50-52)
In Examples 50, 51, and 52, laminated conductive films were produced in the same manner as in Example 49, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.
(Example 53)
The laminated conductive film according to Example 53, where the angle θ between the first side 70a of the small lattice 70 and the first direction is 58°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. was made.
(Examples 54-56)
In Examples 54, 55, and 56, laminated conductive films were produced in the same manner as in Example 53, except that the length of one side of the small lattice 70 was set to 220 μm, 240 μm, and 400 μm, respectively.

(Example 57)
The laminated conductive film according to Example 57, where the angle θ between the first side 70a of the small grating 70 and the first direction is 60°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Examples 58-60)
In Examples 58, 59, and 60, laminated conductive films were produced in the same manner as in Example 57, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Comparative example 1)
The laminated conductive film according to Comparative Example 1, where the angle θ between the first side 70a of the small grating 70 and the first direction is 29°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Comparative Examples 2 and 3)
In Comparative Examples 2 and 3, laminated conductive films were produced in the same manner as in Comparative Example 1 except that the length of one side of the small lattice 70 was 300 μm and 400 μm, respectively.
(Comparative Example 4)
The laminated conductive film according to Comparative Example 4, where the angle θ between the first side 70a of the small grating 70 and the first direction is 61°, the length of one side of the small grating 70 is 200 μm, and the line width of the small grating 70 is 6 μm. was made.
(Comparative Examples 5 and 6)
In Comparative Examples 5 and 6, laminated conductive films were produced in the same manner as in Comparative Example 4, except that the length of one side of the small lattice 70 was set to 300 μm and 400 μm, respectively.

〔evaluation〕
(Calculation of aperture ratio)
In order to confirm the quality of transparency, the transmittance of each of the laminated conductive films of Comparative Examples 1 to 6 and Examples 1 to 60 was measured using a spectrophotometer, and the aperture ratio was calculated by proportional calculation. .
(Evaluation of Moire)
For Comparative Examples 1 to 6 and Examples 1 to 60, after the laminated conductive film was attached on the display panel 58 of the display device 30, the display device 30 was placed on a rotating plate, and the display device 30 was driven to turn white. display. In this state, the rotating disc was rotated between a bias angle of -20° and +20°, and moiré was visually observed and evaluated. Both the horizontal pixel pitch Ph and the vertical pixel pitch Pv of the display device 30 were about 192 μm. As a display for evaluation, HP Pavilion Notebook PC dm1a (11.6 inch glossy liquid crystal WXGA/1366×768) was used.
Evaluation of moire was performed at an observation distance of 0.5 m from the display screen of the display device 30. ○ when moire did not become apparent, Δ when moire was seen at a non-problematic level, and moire became apparent. The case where it was done was set to x. Then, as a total score, A when the angle range of ○ is 10 ° or more, B when the angle range of ○ is less than 10 °, there is no angle range of ○ and the angle range of × is less than 30 ° In the case of C, the case where there was no angular range of ○ and the angular range of × was 30° or more was evaluated as D.

From Tables 3 and 4, all of Comparative Examples 1 to 6 were evaluated as D, indicating that moiré was conspicuous. On the other hand, in Examples 1 to 60, moire was slightly conspicuous in Examples 1, 4, 21, 24, 25, 28 to 33, 36, 37, 40, 57, and 60, but the level was not problematic. rice field. Among other examples, Examples 2, 3, 5, 8, 9, 12, 13, 16, 17, 20, 22, 23, 26, 27, 34, 35, 38, 39, 41, 44, 45, 48, 49, 52, 53, 56, 58 and 59 were good with almost no moire. In particular, Examples 6, 7, and 10 in which the angle θ between the first side 70a of the small grating 70 and the first direction is 32° to 39° and the length of one side of the small grating 70 is 220 μm and 240 μm. , 11, 14, 15, 18, 19, 42, 43, 46, 47, 50, 51, 54, and 55, no moiré occurred.

Further, using the conductive films 10 according to Examples 1 to 60 described above, a projected capacitive touch panel 50 was produced. When operated by touching with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. Also, when two or more points were touched and operated, similarly good results were obtained, confirming that multi-touch can also be handled.
The conductive film according to the present invention and the display device including the same are not limited to the above-described embodiments, and can of course adopt various configurations without departing from the gist of the present invention.

REFERENCE SIGNS LIST 10 Conductive film 10A First conductive film 10B Second conductive film 12 Transparent base 12A First transparent base 12B Second transparent base 14 Conductive portion 14A First conductive portion 14B Second conductive Part 16... Fine metal wire 30...Display device 32...Pixel 50...Touch panel 52...Sensor body 54...Laminated conductive film 64A...First conductive pattern 64B...Second conductive pattern 68A...First large grid 68B...Second large grid 70 …small lattice

Claims (10)

A display device comprising a conductive film placed on a display panel in which a plurality of pixels are arranged in a matrix,
The conductive film is
a substrate;
a first conductive portion formed on one main surface of the base;
a second conductive portion insulated from the first conductive portion;
The first conductive portion is composed of a first mesh pattern of thin metal wires extending in a first direction and thin metal wires extending in a second direction,
The second conductive portion is composed of a second mesh pattern of thin metal wires extending in the first direction and thin metal wires extending in the second direction,
The openings of the first mesh pattern and the second mesh pattern have a rhombus shape, and the apex angle of the rhombus shape is 60° to 88° or 92° to 120°,
A display device, wherein an angle between one side of each rhombus and a horizontal arrangement direction of pixels is 30° to 44°. A display device comprising a conductive film placed on a display panel in which a plurality of pixels are arranged in a matrix,
The conductive film is
a substrate;
a first conductive portion formed on one main surface of the base;
a second conductive portion insulated from the first conductive portion;
The first conductive portion is composed of a first mesh pattern of thin metal wires extending in a first direction and thin metal wires extending in a second direction,
The second conductive portion is composed of a second mesh pattern of thin metal wires extending in the first direction and thin metal wires extending in the second direction,
The openings of the first mesh pattern and the second mesh pattern have a rhombus shape, and the apex angle of the rhombus shape is 60° to 88° or 92° to 120°,
A display device, wherein an angle between one side of each rhombus and a horizontal arrangement direction of pixels is 46° to 60°. The display device according to claim 1,
A display device, wherein an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 32° to 44 ° . The display device according to claim 2,
A display device, wherein an angle between one side of each of the rhombuses and the horizontal arrangement direction of the pixels is 46° to 58°. The display device according to claim 1,
A display device, wherein an angle between one side of each rhombus and the horizontal arrangement direction of the pixels is 32° to 39°. The display device according to claim 2 ,
A display device, wherein an angle formed by one side of each rhombus and the horizontal arrangement direction of the pixels is 51 ° to 58°. In the display device according to any one of claims 1 to 6 ,
A display device, wherein the line width of the metal fine line is 2 to 7 μm. In the display device according to any one of claims 1 to 7 ,
A display device, wherein at least one apex of each rhombus is twice the angle formed by one side of the rhombus and the horizontal arrangement direction of the pixels. In the display device according to any one of claims 1 to 8 ,
A display device, wherein the conductive film has a mesh pattern in which a large number of diamond-shaped lattices of fine metal wires are laid out when viewed from above. In the display device according to any one of claims 1 to 9 ,
The first conductive pattern is composed of the first mesh pattern that constitutes the first conductive portion and extends in the horizontal arrangement direction of the pixels, and the second mesh pattern that constitutes the second conductive portion. and a second conductive pattern extending in a direction orthogonal to the horizontal arrangement direction of the pixels.

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