JP6728084B2 - Conductive film for touch panel, display device, conductive film, touch panel and sensor body - Google Patents

Description

The present invention relates to a conductive film for a touch panel , a display device, a conductive film , a touch panel, and a sensor body .

Examples of the conductive film installed on the display panel of the display device include a conductive film for electromagnetic wave shielding (see, for example, Patent Documents 1 and 2) and a conductive film for a touch panel (see, for example, Patent Document 3). To be
These conductive films form a lattice pattern on a transparent substrate. In Patent Document 1, a moire suppressing portion is formed adjacent to an intersection of the lattice patterns, and in Patent Document 2, an electromagnetic wave having a lattice pattern is formed. By attaching a shield film and a moire suppressing film having a moire suppressing portion, the generation of moire is suppressed.

Japanese Patent Laid-Open No. 2008-28924 JP, 2009-094467, A JP, 2010-108877, A

INDUSTRIAL APPLICABILITY The present invention has a simple structure different from the above-mentioned Patent Documents 1 to 3, and even if it is attached to a display panel of a general-purpose display device, moiré is unlikely to occur, and moreover, it is a conductive touch panel that can be produced with a high yield. An object of the present invention is to provide a conductive film , a display device, a conductive film , a touch panel, and a sensor body .

[1] A conductive film for a touch panel according to a first aspect of the present invention includes a base and a conductive portion formed on one main surface of the base, and the conductive portion extends in the first direction. And has two or more conductive patterns made of thin metal wires arranged in a second direction orthogonal to the first direction, and the conductive pattern is configured by combining two or more small lattices, and each small lattice. Each have a rhombus shape, and an angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°, and at least one of each of the small lattices. The apex angle is twice the angle formed by the one side and the first direction .
[2] In the first aspect of the present invention, the metal thin wire preferably has a line width of 2 to 7 μm.
[3] In the first aspect of the present invention, it is preferable that the thin metal wire has a thickness of less than 9 μm.
[ 4 ] In the first aspect of the present invention, an angle formed by at least one side of each of the small lattices and the first direction is preferably 32° to 39°.
[ 5 ] In the first aspect of the present invention, it is preferable that an angle formed by at least one side of each of the small lattices and the first direction is 46° to 60°.
[ 6 ] In the first aspect of the present invention, it is preferable that an angle formed by at least one side of each of the small lattices and the first direction is 51° to 58°.
[ 7 ] In the first aspect of the present invention, the conductive pattern is configured by connecting two or more large lattices in series in the first direction, and each large lattice is formed by combining two or more small lattices. It may be configured as.
[8] A conductive film according to a second aspect of the present invention includes a first conductive portion and a second conductive portion that is insulated from the first conductive portion, and the first conductive portion is in the first direction. It has two or more first conductive patterns that extend and are arranged in a second direction orthogonal to the first direction, and the second conductive portions extend in the second direction, respectively, and The combination pattern of the first conductive portion and the second conductive portion is a mesh pattern in which a large number of small lattices are arranged, each of which has two or more second conductive patterns arranged in a first direction. Each of the small lattices has a rhombus shape, and an angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°, and at least each of the small lattices. One apex angle is twice the angle formed by the one side and the first direction .
[9] A conductive film according to a third aspect of the present invention includes a first conductive portion and a second conductive portion insulated from the first conductive portion, and the first conductive portion and the second conductive portion. The combination pattern with and is composed of a mesh pattern, the opening of the mesh pattern has a rhombus shape, and the apex angle portion of the rhombus shape is 60° to 88° or 92° to 120°. Is characterized by.
[10] A conductive film according to a fourth aspect of the present invention includes a first conductive portion and a second conductive portion that is insulated from the first conductive portion, and the first conductive portion has a first direction. And has two or more first conductive patterns arranged in a second direction orthogonal to the first direction, the second conductive portions each extending in the second direction, and It has two or more second conductive patterns arranged in the first direction, and each of the first conductive pattern and the second conductive pattern is configured by combining two or more small lattices, and each small lattice is , Each has a rhombus shape, and an angle between at least one side of each of the small lattices and the first direction is 30° to 44° or 46° to 60°, and at least one of each of the small lattices. The apex angle is twice the angle formed by the one side and the first direction.
[11] A conductive film according to a fifth aspect of the present invention includes a first conductive portion and a second conductive portion insulated from the first conductive portion, and the first conductive portion and the second conductive portion. Is composed of a mesh pattern, and the opening of the mesh pattern has a rhombus shape, and the apex angle portion of the rhombus shape is 60° to 88° or 92° to 120°. ..

Generally, when a display device is provided with an electromagnetic wave shielding function, a touch panel function, and the like, a conductive film is required, and for example, a conductive film having a mesh pattern may cause moire. However, according to the conductive film for a touch panel, the conductive film, the touch panel, and the sensor body according to the present invention, moire is less likely to occur even when installed on a display panel. Moreover, it can be produced with a high yield.
Further, according to the display device of the present invention, since the conductive film of the present invention is installed on the display panel, when used as an electromagnetic wave shield or a touch panel, it is possible to reduce the resistance, Moire is unlikely to occur.

It is a top view which shows an example of the electroconductive film which concerns on this Embodiment. It is sectional drawing which abbreviate|omits a part of example of a conductive film, and is shown. FIG. 3 is a plan view showing an example of a pixel array of a display device on which a conductive film is installed with a part of the pixel array omitted. It is a top view which omits a part and shows the example which installed the electroconductive film on the display apparatus. It is an exploded perspective view showing composition of a touch panel which has a lamination conductive film by a conductive film. It is an exploded perspective view which abbreviate|omits a part of laminated conductive film. FIG. 7A is a sectional view showing an example of the laminated conductive film with a part thereof omitted, and FIG. 7B is a sectional view showing another example of the laminated conductive film with a part omitted. It is a top view which shows the example of a pattern of the 1st electroconductive part formed in the 1st electroconductive film in a laminated electroconductive film. It is a top view showing a small lattice (opening of a mesh pattern). It is a top view which shows the example of a pattern of the 2nd electroconductive part formed in the 2nd electroconductive film of a laminated electroconductive film. It is a top view which abbreviate|omits a part and shows the example which made the laminated electroconductive film by combining the 1st electroconductive film and the 2nd electroconductive film. It is an explanatory view showing the state where one line was formed by the 1st auxiliary line and the 2nd auxiliary line.

Embodiments of a conductive film for a touch panel , a display device, a conductive film , a touch panel, and a sensor body according to the present invention will be described below with reference to FIGS. 1 to 12. In addition, in this specification, "-" which shows a numerical range is used as the meaning which includes the numerical value described before and after that as a lower limit and an upper limit.

As shown in FIGS. 1 and 2, the conductive film 10 according to the present embodiment has a transparent base 12 (see FIG. 2) and a conductive portion 14 formed on one main surface of the transparent base 12. .. The conductive portion 14 has a metal fine wire (hereinafter referred to as a metal fine wire 16) and a mesh pattern 20 formed by the openings 18. The thin metal wire 16 is made of, for example, gold (Au), silver (Ag) or copper (Cu).
Specifically, the conductive portion 14 extends in the first direction (x direction in FIG. 1) and is arranged in the second direction (y direction in FIG. 1) at the pitch Ps, and includes a plurality of first metal thin wires 16a. The mesh pattern 20 is formed by intersecting a plurality of second metal thin wires 16b extending in two directions and arranged at a pitch Ps in the first direction. In this case, the first direction is inclined at an angle of +30° or more and +60° or less with respect to the reference direction (horizontal direction), and the second direction is inclined at an angle of −30° or more and −60° or less with respect to the reference direction. ing. Therefore, one mesh shape 22 of the mesh pattern 20, that is, a combined shape of one opening 18 and four metal fine wires 16 surrounding the one opening 18 has an apex angle of 60° or more and 120° or less. It becomes a rhombus shape.

The conductive film 10 is used as, for example, an electromagnetic wave shielding film of the display device 30 shown in FIG. 3 or a conductive film for a touch panel. Examples of the display device 30 include a liquid crystal display, a plasma display, an organic EL, an inorganic EL and the like.
Here, the pitch Ps (also referred to as the fine line pitch Ps) can be selected from 100 μm or more and 400 μm or less. Further, the line width of the thin metal wire 16 can be selected from 30 μm or less. When the conductive film 10 is used as an electromagnetic wave shielding film, the line width of the metal thin wire 16 is preferably 1 μm or more and 20 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less. When the conductive film 10 is used as a conductive film for a touch panel, the line width of the metal fine wire 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less.

The display device 30 is configured by arranging a plurality of pixels 32 in a matrix, as shown in FIG. One pixel 32 includes three sub-pixels (red sub-pixel 32r, green sub-pixel 32g, and blue sub-pixel 32b) arranged in the horizontal direction. One sub-pixel has a rectangular shape that is vertically long in the vertical direction. The arrangement pitch of the pixels 32 in the horizontal direction (horizontal pixel pitch Ph) and the arrangement pitch of the pixels 32 in the vertical direction (vertical pixel pitch Pv) are substantially the same. That is, the shape formed by one pixel 32 and the black matrix surrounding the one pixel 32 (see the shaded area 34) is a square. Moreover, the aspect ratio of one pixel 32 is not 1, but the length in the horizontal direction (horizontal direction)>the length in the vertical direction (vertical direction).

Then, when the conductive film 10 is installed on the display panel of the display device 30 having such a pixel array, as shown in FIG. 1, a plurality of intersections of the mesh pattern 20 are horizontally aligned through the openings 18. Since the angle θ formed by the imaginary line 24 connecting to and the first metal thin wire 16a is 30° or more and 60° or less, the metal thin wire 16 is arranged in the horizontal arrangement direction of the pixels 32 in the display device 30, as shown in FIG. It has an inclination of 30° to 60° with respect to (arrangement in the m direction). In addition, the fine line pitch Ps in the conductive film 10 and the diagonal length La1 of one pixel 32 in the display device 30 (or the diagonal length La2 of two vertically adjacent pixels 32) are substantially the same or close to each other. The direction of arrangement of the metal thin wires 16 in the conductive film 10 and the direction of the diagonal line of one pixel 32 (or the diagonal line of two vertically adjacent pixels 32) in the display device 30 should be substantially the same or close to each other. Becomes As a result, the difference between the arrangement period of the pixels 32 and the arrangement period of the thin metal wires 16 becomes small, and the occurrence of moire is suppressed.
Therefore, when the conductive film 10 is used as, for example, an electromagnetic wave shielding film, the conductive film 10 is arranged on the display panel 58 of the display device 30, but as described above, the pixel arrangement period and the metal thin line are used. The deviation from the 16 arrangement periods is reduced, and the occurrence of moire is suppressed. Moreover, the pitch Ps of the metal fine wires 16 forming the mesh pattern 20 is set to 200 μm or more and 400 μm or less, and the line width of the metal thin wires 16 is set to 30 μm or less, so that high electromagnetic wave shielding properties and high light-transmitting properties are simultaneously provided. be able to.

Next, a display device having a touch panel, for example, a display device having a projected capacitive touch panel will be described with reference to FIGS.
First, the touch panel 50 has a sensor main body 52 and a control circuit (configured by an IC circuit or the like) not shown. As shown in FIGS. 5, 6 and 7A, the sensor main body 52 includes a laminated conductive film 54 formed by laminating a first conductive film 10A and a second conductive film 10B, which will be described later, and a laminated conductive film 54 thereon. And the protective layer 56 (the description of the protective layer 56 is omitted in FIG. 7A). The laminated conductive film 54 and the protective layer 56 are arranged on the display panel 58 in the display device 30 such as a liquid crystal display. When viewed from above, the sensor body 52 has a sensor portion 60 arranged in a region corresponding to the display screen 58a of the display panel 58 and a terminal wiring portion 62 arranged in a region corresponding to the outer peripheral portion of the display panel 58. (So-called frame).

As shown in FIGS. 6 and 8, the first conductive film 10A applied to the touch panel 50 has a first conductive portion 14A formed on one main surface of the first transparent substrate 12A (see FIG. 7A). The first conductive portions 14A extend in the third direction (m direction), are arranged in the fourth direction (n direction) orthogonal to the third direction, and are composed of a plurality of metal thin wires. It has two or more first conductive patterns 64A (mesh patterns) of 16 and a first auxiliary pattern 66A of metal thin wires 16 arranged around each first conductive pattern 64A.
Each first conductive pattern 64A is configured by combining two or more small lattices 70. In the example of FIGS. 6 and 8, each of the first conductive patterns 64A is configured by connecting two or more first large lattices 68A in series in the third direction, and each of the first large lattices 68A includes two or more. It is configured by combining the small lattices 70. Further, the above-described first auxiliary pattern 66A which is not connected to the first large lattice 68A is formed around the side of the first large lattice 68A. The m direction indicates, for example, a horizontal direction (or a vertical direction) of a projection capacitive touch panel 50 (see FIG. 5) described later or a horizontal direction (or a vertical direction) of a display panel 58 on which the touch panel 50 is installed.

The first conductive pattern 64A is not limited to the example using the first large lattice 68A. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small lattices 70 are arranged is divided into strips by an insulating portion and a plurality of mesh patterns are arranged in parallel. For example, you may make it have two or more strip|belt-shaped 1st electrically conductive patterns 64A extended in the m direction from each terminal, and arranged in the n direction. In addition, a pattern in which a plurality of strip-shaped mesh patterns extend for each terminal may be used. Further, as the first auxiliary pattern 66A, a mesh pattern which is arranged in parallel with the first conductive pattern 64A and in which a part of each small lattice 70 is broken may be used. In this case, it may be connected to the first conductive pattern 64A or may be separated.

Here, the small lattice 70 has the smallest rhombus shape, and has the same shape as or similar to one mesh shape 22 (see FIG. 1) described above. As shown in FIG. 9, in the small lattice 70, an angle θ between at least one side (first side 70a to fourth side 70d) and the first direction (m direction) is set to 30° to 60°. .. If the m direction is the same as the pixel arrangement direction of the display device 30 (see FIG. 5) on which the touch panel 50 is installed, the angle θ described above is set to 30° to 44° or 46° to 60°. It is preferably set to 32° to 39° or 51° to 58°.
The line width of the small lattice 70 (the line width of the thin metal wire 16) can be selected from 30 μm or less. As described above, when used in the touch panel 50, the line width of the metal thin wire 16 is preferably 0.1 μm or more and 15 μm or less, more preferably 1 μm or more and 9 μm or less, and further preferably 2 μm or more and 7 μm or less.
The length of one side of the small grating 70 can be selected from 100 μm or more and 400 μm or less. Here, the direction along the first side 70a and the third side 70c (side facing the first side 70a) of the small lattice 70 is the first direction (x direction), and the second side 70b and the fourth side 70d. The direction along the (side facing the second side 70b) is the second direction (y direction).

When the first large lattice 68A is used as the first conductive pattern 64A, for example, as shown in FIG. 8, between the adjacent first large lattices 68A, the thin metal wires 16 electrically connecting the first large lattices 68A are provided. The first connecting portion 72A is formed. The first connecting portion 72A is configured by arranging an intermediate lattice 74 having a size in which n small lattices 70 (n is a real number larger than 1) are arranged in the second direction (y direction). Of the sides along the first direction of the first large lattice 68A, a first cutout portion 76A in which one side of the small lattice 70 is cut is formed in a portion adjacent to the middle lattice 74. In the example of FIG. 8, the middle grid 74 has a size in which three small grids 70 are arranged in the second direction.
Further, a first insulating portion 78A that is electrically insulated is arranged between the adjacent first conductive patterns 64A.
Here, the first auxiliary pattern 66A has a plurality of first auxiliary lines 80A arranged along the first direction among the sides of the first large lattice 68A (the second direction is the axial direction). A plurality of first auxiliary lines 80A arranged along the second direction among the sides of the first large lattice 68A (the first direction being the axial direction), and the first insulating portion 78A. , A pattern in which two first L-shaped patterns 82A in which two first auxiliary lines 80A are combined in an L-shape are arranged to face each other.

The length of one side of the first large lattice 68A is preferably 3 to 10 mm, and more preferably 4 to 6 mm. If the length of one side is less than the above lower limit value, when the first conductive film 10A is used for, for example, a touch panel, the capacitance of the first large grid 68A at the time of detection decreases, which may result in detection failure. Will be more likely. On the other hand, if the upper limit is exceeded, the position detection accuracy may decrease. From the same viewpoint, the length of one side of the small lattice 70 forming the first large lattice 68A is preferably 100 to 400 μm, more preferably 150 to 300 μm, and most preferably, as described above. It is 210 to 250 μm or less. When the small grid 70 is in the above range, it is possible to further maintain good transparency, and it is possible to visually recognize the display when attached to the front surface of the display device.

In the first conductive film 10A configured as described above, as shown in FIG. 6, the open end of the first large grid 68A existing on one end side of each first conductive pattern 64A has the first connection. The shape is such that the portion 72A does not exist. The end of the first large lattice 68A existing on the other end side of each first conductive pattern 64A is electrically connected to the first terminal wiring pattern 86a by the thin metal wire 16 via the first connection portion 84a. There is.
That is, in the first conductive film 10A applied to the touch panel 50, as shown in FIGS. 5 and 6, a large number of the above-described first conductive patterns 64A are arranged in a portion corresponding to the sensor portion 60, and the terminal wiring portion is formed. In 62, a plurality of first terminal wiring patterns 86a derived from the respective first connection portions 84a are arranged.
In the example of FIG. 5, the outer shape of the first conductive film 10A has a rectangular shape when viewed from the upper surface, and the outer shape of the sensor unit 60 also has a rectangular shape. A plurality of first terminals 88a are formed in the central portion in the longitudinal direction of the peripheral portion of the terminal wiring portion 62 on one long side of the first conductive film 10A in the longitudinal direction of the one long side. The array is formed. Further, the plurality of first connection portions 84a are linearly arranged along one long side of the sensor unit 60 (the long side closest to one long side of the first conductive film 10A: the n direction). The first terminal wiring pattern 86a derived from each first connection portion 84a is routed toward substantially the center of one long side of the first conductive film 10A and electrically connected to the corresponding first terminal 88a. It is connected to the.

On the other hand, the second conductive film 10B has a second conductive portion 14B formed on one main surface of the second transparent substrate 12B (see FIG. 7A), as shown in FIGS. 6, 7A and 10. The second conductive portions 14B extend in the fourth direction (n-direction) and are arranged in the third direction (m-direction), and each of the two or more second thin conductive wires 16 is composed of a plurality of grids. The second conductive pattern 64B (mesh pattern) and the second auxiliary pattern 66B formed by the thin metal wires 16 arranged around each second conductive pattern 64B are included.
Each second conductive pattern 64B is formed by combining two or more small lattices 70. In the example of FIG. 6 and FIG. 10, the second conductive pattern 64B is configured by connecting two or more second large lattices 68B in series in the fourth direction (n direction), and each second large lattice 68B is respectively formed. It is configured by combining two or more small lattices 70. Further, the above-mentioned second auxiliary pattern 66B which is not connected to the second large lattice 68B is formed around the side of the second large lattice 68B.

The second conductive pattern 64B is not limited to the example using the second large lattice 68B. For example, it is possible to use a conductive pattern in which a mesh pattern in which a large number of small lattices 70 are arranged is divided into strips by an insulating portion and a plurality of mesh patterns are arranged in parallel. For example, you may make it have two or more strip|belt-shaped 2nd conductive patterns 64B extended in the n direction from each terminal and arranged in the m direction. In addition, a pattern in which a plurality of strip-shaped mesh patterns extend for each terminal may be used. The second auxiliary pattern 66B may also be a mesh pattern that is arranged in parallel with the second conductive pattern 64B and has, for example, a part of each small lattice 70 broken. In this case, it may be connected to the second conductive pattern 64B or may be separated.

When the second large grid 68B is used as the second conductive pattern 64B, for example, as shown in FIG. 10, between the adjacent second large grids 68B, the thin metal wires 16 electrically connecting the second large grids 68B are provided. The second connecting portion 72B is formed. The second connecting portion 72B is configured by arranging an intermediate lattice 74 having a size in which n small lattices 70 (n is a real number larger than 1) are arranged in the first direction (x direction). A second cutout portion 76B in which one side of the small lattice 70 is cut is formed in a portion of the side of the second large lattice 68B along the second direction that is adjacent to the middle lattice 74.
In addition, a second insulating portion 78B that is electrically insulated is arranged between the adjacent second conductive patterns 64B.
The second auxiliary pattern 66B includes a plurality of second auxiliary lines 80B (the second direction being the axial direction) arranged along the first direction among the sides of the second large lattice 68B. Of the sides of the two large lattices 68B, a plurality of second auxiliary lines 80B arranged along the side along the second direction (the first direction being the axial direction) and the second insulating portion 78B each have two lines. Two second L-shaped patterns 82B in which one second auxiliary line 80B is combined in an L shape are arranged to face each other.

The second conductive film 10B configured as described above is, as shown in FIGS. 5 and 6, the second conductive film 10B that is present on one end side of every second (for example, odd-numbered) second conductive pattern 64B. The open ends of the large lattices 68B and the open ends of the second large lattices 68B that are present on the other end side of the even-numbered second conductive patterns 64B have no second connecting portion 72B. .. On the other hand, the end of the second large grid 68B existing on the other end side of each odd-numbered second conductive pattern 64B and the second end existing on the one end side of each even-numbered second conductive pattern 64B. The ends of the large lattices 68B are electrically connected to the second terminal wiring patterns 86b of the thin metal wires 16 via the second connection portions 84b.
That is, in the second conductive film 10B applied to the touch panel 50, as shown in FIG. 6, a large number of second conductive patterns 64B are arranged in a portion corresponding to the sensor portion 60, and the terminal wiring portion 62 has each first conductive pattern 64B. A plurality of second terminal wiring patterns 86b derived from the two connection portions 84b are arranged.

As shown in FIG. 5, in the terminal wiring portion 62, a plurality of second terminals 88b are provided at the central portion in the lengthwise direction at the peripheral portion on one long side of the second conductive film 10B. The long sides are arrayed in the length direction. In addition, a plurality of second connection portions 84b (for example, odd-numbered second connection portions) along one short side of the sensor unit 60 (shortest side closest to one short side of the second conductive film 10B: m direction). 84b) are arranged in a straight line, and a plurality of second connection portions 84b (for example, the shortest side closest to the other short side of the second conductive film 10B: m direction) of the sensor section 60 are formed. The even second connection parts 84b) are arranged in a straight line.
Of the plurality of second conductive patterns 64B, for example, the odd-numbered second conductive patterns 64B are connected to the corresponding odd-numbered second connection portions 84b, and the even-numbered second conductive patterns 64B are the corresponding even-numbered areas. It is connected to the second second connection portion 84b. The second terminal wiring pattern 86b derived from the odd-numbered second connection portions 84b and the second terminal wiring pattern 86b derived from the even-numbered second connection portions 84b are one long side of the second conductive film 10B. Are routed toward substantially the central portion of each and are electrically connected to the corresponding second terminals 88b.
The derivation form of the first terminal wiring pattern 86a may be the same as that of the second terminal wiring pattern 86b described above, and the derivation form of the second terminal wiring pattern 86b may be the same as that of the first terminal wiring pattern 86a described above.

The length of one side of the second large lattice 68B is preferably 3 to 10 mm, and more preferably 4 to 6 mm, as in the case of the first large lattice 68A described above. If the length of one side is less than the above lower limit value, the capacitance of the second large lattice 68B at the time of detection decreases, and the possibility of detection failure increases. On the other hand, if the upper limit is exceeded, the position detection accuracy may decrease. From the same viewpoint, the length of one side of the small lattice 70 that constitutes the second large lattice 68B is preferably 100 to 400 μm or less, more preferably 150 to 300 μm, and most preferably 210 to 250 μm or less. When the small grid 70 is in the above range, it is possible to further maintain good transparency, and when the small grid 70 is mounted on the display panel 58 of the display device 30, it is possible to visually recognize the display.
The line widths of the first auxiliary pattern 66A (first auxiliary line 80A) and the second auxiliary pattern 66B (second auxiliary line 80B) are each 0.1 to 15 μm. In this case, the line width of the first conductive pattern 64A and the line width of the second conductive pattern 64B may be the same or different. However, it is preferable that the first conductive pattern 64A, the second conductive pattern 64B, the first auxiliary pattern 66A, and the second auxiliary pattern 66B have the same line width.

Then, for example, when the first conductive film 10A is laminated on the second conductive film 10B to form the laminated conductive film 54, as shown in FIG. 11, the first conductive pattern 64A and the second conductive pattern 64B are The first connecting portion 72A of the first conductive pattern 64A and the second connecting portion 72B of the second conductive pattern 64B are arranged to intersect each other. Specifically, the first transparent base 12A (see FIG. 7A). The first insulating portion 78A of the first conductive portion 14A and the second insulating portion 78B of the second conductive portion 14B face each other with the first transparent substrate 12A in between.
When the laminated conductive film 54 is viewed from above, as shown in FIG. 11, the second conductive film 10B is provided with the second conductive film 10B with the second conductive film 10B so as to fill the gaps between the first large lattices 68A formed in the first conductive film 10A. The large lattices 68B are arranged. At this time, a combination pattern 90 is formed between the first large grid 68A and the second large grid 68B by the first auxiliary pattern 66A and the second auxiliary pattern 66B facing each other. As shown in FIG. 12, in the combination pattern 90, the first axis 92A of the first auxiliary line 80A and the second axis 92B of the second auxiliary line 80B coincide with each other, and the first auxiliary line 80A and the second auxiliary line 80B. 80B does not overlap, and one end of the first auxiliary line 80A and one end of the second auxiliary line 80B coincide with each other, thereby forming one side of the small lattice 70 (mesh shape). That is, the combination pattern 90 has a form in which two or more small lattices 70 (mesh shape) are combined. As a result, when the laminated conductive film 54 is viewed from above, as shown in FIG. 11, a large number of small lattices 70 (mesh shape) are spread.

At this time, as shown in FIG. 4, the metal thin wires 16 forming the large number of small lattices 70 are inclined at an angle of 30° to 60° with respect to the horizontal arrangement direction of the pixels 32 in the display device 30 (arrangement in the m direction). Will have. Further, the fine line pitch Ps in the laminated conductive film 54 and the diagonal length La1 of one pixel 32 in the display device 30 (or the diagonal length La2 of two vertically adjacent pixels 32) are substantially the same or The values are close to each other, and the arrangement direction of the thin metal wires 16 in the laminated conductive film 54 and the direction of the diagonal line of one pixel 32 (or the diagonal line of two vertically adjacent pixels 32) in the display device 30 are substantially the same or close to each other. Will be done. As a result, the difference between the arrangement period of the pixels 32 and the arrangement period of the thin metal wires 16 becomes small, and the occurrence of moire is suppressed. Further, it is possible to obtain the effect that moiré is unlikely to occur even if there is variation in the inclination angle between the laminated conductive films 54, and the yield of the laminated conductive films 54 can be improved.

When the laminated conductive film 54 is used as a touch panel, the protective layer 56 is formed on the first conductive film 10A, and the first conductive pattern 64A of the first conductive film 10A is led out. The 1-terminal wiring pattern 86a and the second terminal wiring pattern 86b derived from the large number of second conductive patterns 64B of the second conductive film 10B are connected to, for example, a control circuit that controls scanning.
As a touch position detection method, a self-capacitance method or a mutual capacitance method can be preferably adopted. That is, in the case of the self-capacitance method, the voltage signal for detecting the touch position is sequentially supplied to the first conductive pattern 64A, and the voltage signal for detecting the touch position is sequentially supplied to the second conductive pattern 64B. Supply. When the fingertip comes into contact with or comes close to the upper surface of the protective layer 56, the capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position and the GND (ground) increases, so that the first conductive pattern. The waveforms of the transmission signals from 64A and the second conductive pattern 64B are different from the waveforms of the transmission signals from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signal supplied from the first conductive pattern 64A and the second conductive pattern 64B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for touch position detection is sequentially supplied to the first conductive pattern 64A, and sensing (detection of a transmission signal) is sequentially performed to the second conductive pattern 64B. To do. Since the fingertip is brought into contact with or close to the upper surface of the protective layer 56, the stray capacitance of the finger is added in parallel to the parasitic capacitance between the first conductive pattern 64A and the second conductive pattern 64B facing the touch position. The waveform of the transmission signal from the second conductive pattern 64B is different from the waveform of the transmission signal from the other second conductive pattern 64B. Therefore, in the control circuit, the touch position is calculated based on the order of the first conductive patterns 64A supplying the voltage signal and the supplied transmission signal from the second conductive pattern 64B. By adopting such a self-capacitance type or mutual capacitance type touch position detection method, each touch position can be detected even if two fingertips are simultaneously brought into contact with or brought close to the upper surface of the protective layer 56. Become. Note that, as prior art documents relating to the detection circuit of the projection type electrostatic capacitance method, US Pat. No. 4,582,955, US Pat. No. 4,686,332, US Pat. No. 4,733,222. The specification, US Pat. No. 5,374,787, US Pat. No. 5,543,588, US Pat. No. 7,030,860, US Published Patent No. 2004/01555871, etc. is there.

In the above-mentioned laminated conductive film 54, as shown in FIGS. 6 and 7A, the first conductive portion 14A is formed on one main surface of the first transparent base 12A, and the second conductive base 14B is formed on the second main surface of the second transparent base 12B. Although the conductive portion 14B is formed, in addition, as shown in FIG. 7B, the first conductive portion 14A is formed on one main surface of the first transparent substrate 12A, and the other is formed on the other main surface of the first transparent substrate 12A. The two conductive parts 14B may be formed. In this case, the second transparent substrate 12B does not exist, the first transparent substrate 12A is stacked on the second conductive portion 14B, and the first conductive portion 14A is stacked on the first transparent substrate 12A. Other layers may exist between the first conductive film 10A and the second conductive film 10B, and if the first conductive portion 14A and the second conductive portion 14B are in an insulating state, they are You may arrange|position oppositely.
As shown in FIG. 5, for positioning at the time of sticking the first conductive film 10A and the second conductive film 10B to, for example, each corner of the first conductive film 10A and the second conductive film 10B. It is preferable to form the first alignment mark 94a and the second alignment mark 94b. The first alignment mark 94a and the second alignment mark 94b become a new composite alignment mark when the first conductive film 10A and the second conductive film 10B are attached to each other to form the laminated conductive film 54. The alignment mark also functions as a positioning alignment mark used when the laminated conductive film 54 is installed on the display panel 58.

In the example described above, the first conductive film 10A and the second conductive film 10B are applied to the projected capacitive touch panel 50, but in addition, a surface capacitive touch panel or a resistor is used. It can also be applied to a film type touch panel.
In the above example, the conductive film 10 is mainly used as the electromagnetic wave shielding film and the laminated conductive film for the touch panel. However, as another optical film installed on the display panel 58 of the display device 30, Can also be used. In this case, the conductive film having the mesh pattern formed on the entire display panel 58 may be used, or the conductive film 10 having the mesh pattern 20 formed on the entire display screen 58a may be used. The conductive film 10 may have a mesh pattern corresponding to a part of the display screen 58a (corner, center, etc.).

Next, a method for manufacturing the conductive film 10 will be described. As a method for producing the conductive film 10, for example, a transparent substrate 12 is exposed to a light-sensitive material having an emulsion layer containing a light-sensitive silver halide salt and subjected to a development treatment to form an exposed portion and an unexposed portion, respectively. The mesh pattern 20 may be formed by forming the metallic silver portion and the light transmissive portion. The metallic silver portion may be further subjected to physical development and/or plating treatment so that the metallic silver portion may carry the conductive metal.

Alternatively, a photosensitive plated layer is formed on the first transparent substrate 12A and the second transparent substrate 12B by using a pretreatment material for plating, and then exposed and developed, and then subjected to a plating process to form an exposed portion and You may make it form a 1st conductive pattern 64A and a 2nd conductive pattern 64B by forming a metal part and a light transmission part in an unexposed part, respectively. In addition, you may make it carry an electroconductive metal by further subjecting a metal part to physical development and/or a plating process.
Two more preferable forms of the method using the pretreatment material for plating include the following forms. The following more specific contents are disclosed in JP-A-2003-213437, JP-A-2006-64923, JP-A-2006-58797, JP-A-2006-135271 and the like.
(A) A layer to be plated containing a functional group that interacts with a plating catalyst or its precursor is applied on a transparent substrate, and then exposed and developed, and then plated to form a metal part on the material to be plated. Aspect.
(B) An underlayer containing a polymer and a metal oxide and a layer to be plated containing a functional group that interacts with a plating catalyst or a precursor thereof are laminated in this order on a transparent substrate, and then after exposure and development, A mode in which a metal part is formed on a material to be plated by plating.

As another method, a photoresist film on a copper foil formed on the transparent substrate 12 is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched to form the mesh pattern 20. May be formed.
Alternatively, the mesh pattern 20 may be formed by printing a paste containing fine metal particles on the transparent substrate 12 and performing metal plating on the paste.
Alternatively, the mesh pattern 20 may be formed on the transparent substrate 12 by screen printing or gravure printing.
Alternatively, the mesh pattern 20 may be formed on the transparent substrate 12 by inkjet.

Next, in the conductive film 10 according to the present embodiment, a method of using a silver halide photographic light-sensitive material which is a particularly preferable embodiment will be mainly described.
The method of manufacturing the conductive film 10 according to the present embodiment includes the following three types depending on the type of the photosensitive material and the development processing.
(1) A mode in which a photosensitive silver halide black-and-white light-sensitive material containing no physical development nuclei is chemically or thermally developed to form a metallic silver portion on the light-sensitive material.
(2) A mode in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is subjected to dissolution physical development to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white light-sensitive material containing no physical development nuclei and an image-receiving sheet having a non-photosensitive layer containing physical development nuclei are superposed and diffusion-transfer-developed to produce a non-photosensitive image-receiving sheet of metallic silver. Form to be formed on.

The aspect of the above (1) is an integrated black-and-white development type, in which a transparent conductive film such as a transparent conductive film is formed on a photosensitive material. The developed silver thus obtained is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament having a high specific surface.
In the aspect (2), the silver halide grains near the physical development nuclei are dissolved and deposited on the development nuclei in the exposed area, whereby a light-transmissive conductive film such as a light-transmissive conductive film is formed on the photosensitive material. Film is formed. This is also an integrated black and white development type. The developing action is highly active because it is precipitation on the physical development nuclei, but developed silver is spherical with a small specific surface.
In the aspect of the above (3), the silver halide grains are dissolved and diffused in the unexposed area to be deposited on the development nuclei on the image receiving sheet, whereby the light transmitting property such as a light transmitting conductive film is formed on the image receiving sheet. A conductive film is formed. It is a so-called separate type in which the image receiving sheet is used by peeling it from the photosensitive material.

In either mode, either negative development processing or reversal development processing can be selected (in the case of diffusion transfer method, negative development processing can be performed by using an auto-positive photosensitive material as the photosensitive material). ..
The chemical development, thermal development, dissolution physical development, and diffusion transfer development described here have the same meanings as are commonly used in the art, and include general textbooks of photography chemistry, such as Shinichi Kikuchi's "Photochemistry" (Kyoritsu Shuppan). , 1955), C.I. E. K. It is described in “The Theory of Photographic Processes, 4th ed.” edited by Mees (Mcmillan, published in 1977). Although the present invention is an invention relating to liquid processing, it is also possible to refer to a technique of applying a heat development method as another development method. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184693, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 may be applied. it can.

Here, the configuration of each layer of the conductive film 10 according to the present embodiment will be described in detail below.
[Transparent substrate 12]
Examples of the transparent substrate 12 include a plastic film, a plastic plate, a glass plate and the like.
As the raw material of the plastic film and the plastic plate, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); triacetyl cellulose (TAC) and the like can be used.
As the transparent substrate 12, a plastic film or a plastic plate having a melting point of about 290° C. or lower is preferable, and PET is particularly preferable from the viewpoint of light transmittance and processability.

[Silver salt emulsion layer]
The silver salt emulsion layer serving as the metal fine wires 16 of the conductive film 10 contains an additive such as a solvent and a dye, in addition to the silver salt and the binder.
Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide which has excellent characteristics as an optical sensor.
Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / ^{m 2} in terms of silver, more preferably 1 to 25 g / ^{m 2,} more preferably 5 to 20 g / ^{m 2} .. By setting the coating silver amount within the above range, desired surface resistance can be obtained when the conductive film 10 is formed.

Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and its derivatives, polyethylene oxide, polyvinylamine, chitosan, polylysine, polyacryl. Acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like can be mentioned. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.
The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range that can exhibit dispersibility and adhesiveness. The content of the binder in the silver salt emulsion layer is preferably 1/4 or more, more preferably 1/2 or more in terms of silver/binder volume ratio. The silver/binder volume ratio is preferably 100/1 or less, more preferably 50/1 or less. Further, the silver/binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver/binder volume ratio in the silver salt emulsion layer within this range, it is possible to suppress the dispersion of the resistance value even when the amount of coated silver is adjusted, and obtain the conductive film 10 having a uniform surface resistance. .. The silver/binder volume ratio is obtained by converting the raw material silver halide amount/binder amount (weight ratio) into silver amount/binder amount (weight ratio), and further converting silver amount/binder amount (weight ratio) to silver amount. / It can be determined by converting into the binder amount (volume ratio).

<Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited, and examples thereof include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide). Etc., esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
<Other additives>
The various additives used in the present embodiment are not particularly limited, and known ones can be preferably used.
[Other layer configurations]
A protective layer (not shown) may be provided on the silver salt emulsion layer. Further, for example, an undercoat layer can be provided below the silver salt emulsion layer.

Next, each step of the method for producing the conductive film 10 will be described.
[exposure]
In the present embodiment, the case where the conductive portion 14 is applied by the printing method is included. However, except for the printing method, the conductive portion 14 is formed by exposure and development. That is, the photosensitive material having the silver salt-containing layer provided on the transparent substrate 12 or the photosensitive material coated with the photopolymer for photolithography is exposed. The exposure can be performed using electromagnetic waves. Examples of electromagnetic waves include visible light, light such as ultraviolet rays, and radiation such as X-rays. Further, a light source having a wavelength distribution may be used for the exposure, or a light source having a specific wavelength may be used.
[Development processing]
In this embodiment, after the emulsion layer is exposed, further development processing is performed. For the development processing, a general development processing technique used for silver salt photographic film, printing paper, film for printing plate making, emulsion mask for photomask, etc. can be used.
The development processing in the present invention may include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic films, photographic papers, films for printing plate making, emulsion masks for photomasks and the like can be used.
The light-sensitive material that has undergone development and fixing treatment is preferably washed with water and stabilized.

The mass of the metallic silver portion contained in the exposed area after the development treatment is preferably 50 mass% or more, and 80 mass% or more with respect to the mass of silver contained in the exposed area before the exposure. It is more preferable that there is. When the mass of silver contained in the exposed area is 50 mass% or more with respect to the mass of silver contained in the exposed area before exposure, high conductivity can be obtained, which is preferable.

The conductive film 10 is obtained through the above steps. The surface resistance of the obtained conductive film 10 is 0.1 to 300 ohm/sq. It is preferably in the range of. The surface resistance varies depending on the use of the conductive film 10, but in the case of electromagnetic wave shield use, the surface resistance is 10 ohm/sq. It is preferably not more than 0.1 to 3 ohm/sq. Is more preferable. Further, in the case of a touch panel application, 1 to 70 ohm/sq. Is preferably 5 to 50 ohm/sq. Is more preferable, and 5 to 30 ohm/sq. Is more preferable. Further, the conductive film 10 after the development treatment may be further subjected to calendar treatment, and the desired surface resistance can be adjusted by the calendar treatment.

[Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development treatment, physical development and/or plating treatment for supporting the conductive metallic particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development or plating treatment, and the conductive metal particles may be supported on the metallic silver portion by combining physical development and plating treatment. Good. The metallic silver portion including physical development and/or plating treatment is referred to as “conductive metal portion”.
The "physical development" in the present embodiment means that metal particles such as silver ions are reduced on the nuclei of a metal or a metal compound with a reducing agent to deposit metal particles. This physical phenomenon is used in the production of instant B&W films, instant slide films, printing plates, etc., and the technique can be used in the present invention. The physical development may be performed simultaneously with the development treatment after exposure or separately after the development treatment.
In the present embodiment, electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating can be used for the plating treatment. The electroless plating in the present embodiment can use a known electroless plating technique, for example, the electroless plating technique used in a printed wiring board or the like can be used. It is preferably plating.

[Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by the physical development and/or the plating treatment to the oxidation treatment. By performing the oxidation treatment, for example, when a slight amount of metal is deposited on the light transmissive portion, the metal can be removed and the transmissivity of the light transmissive portion can be made almost 100%.

[Conductive metal part]
The line width of the conductive metal portion (line width of the thin metal wire 16) of the present embodiment can be selected to be 30 μm or less, and the lower limit is 0.1 μm or more, 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more. Preferably, the upper limit is 30 μm or less, 15 μm or less, 10 μm or less, 9 μm or less, 8 μm or less. When the line width is less than the lower limit value, the conductivity becomes insufficient, and thus the detection sensitivity becomes insufficient when used in the touch panel 50. On the other hand, if the upper limit is exceeded, moire caused by the conductive metal portion becomes remarkable, or the visibility becomes poor when used in the touch panel 50. It should be noted that when the amount is within the above range, the moire of the conductive metal portion is improved and the visibility is particularly improved. The length of one side of the small lattice 70 is preferably 100 μm or more and 400 μm or less, more preferably 150 μm or more and 300 μm or less, and most preferably 210 μm or more and 250 μm or less. Further, the conductive metal portion may have a portion having a line width wider than 200 μm for the purpose of ground connection or the like.
The aperture ratio of the conductive metal portion in the present embodiment is preferably 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is a ratio of the light-transmissive portion excluding the thin metal wires 16 to the whole. For example, the aperture ratio of a rhombus having a line width of 6 μm and a side length of 240 μm is 95%.

[Light transmitting part]
The “light-transmitting portion” in the present embodiment means a portion of the conductive film 10 having a light-transmitting property other than the conductive metal portion. As described above, the transmittance of the light-transmissive portion is 90% or more, preferably the transmittance shown by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the transparent substrate 12. 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.
Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

[Conductive film 10]
The thickness of the transparent substrate 12 in the conductive film 10 according to the present embodiment is preferably 5 to 350 μm, more preferably 30 to 150 μm. If it is in the range of 5 to 350 μm, a desired visible light transmittance can be obtained, and handling is easy.
The thickness of the metallic silver portion provided on the transparent substrate 12 can be appropriately determined according to the coating thickness of the silver salt-containing layer coating material coated on the transparent substrate 12. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. , 0.05 to 5 μm is most preferable. The metallic silver portion is preferably patterned. The metallic silver portion may have a single layer structure or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so that the metallic silver portions can be exposed to different wavelengths. This allows different patterns to be formed in each layer by changing the exposure wavelength and exposing.

As for the thickness of the conductive metal portion, the thinner the use of the touch panel 50 is, the wider the viewing angle of the display panel 58 is, and the thinness is also required from the viewpoint of improving the visibility. From such a viewpoint, the thickness of the layer made of the conductive metal supported on the conductive metal portion is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and 0.1 μm or more. More preferably, it is less than 3 μm.
In the present embodiment, the coating thickness of the above-mentioned silver salt-containing layer is controlled to form a metallic silver portion having a desired thickness, and the thickness of the layer made of conductive metal particles is further subjected to physical development and/or plating treatment. Since it can be controlled freely, even a conductive film having a thickness of less than 5 μm, preferably less than 3 μm can be easily formed.
In addition, in the manufacturing method of the conductive film 10 which concerns on this Embodiment, steps, such as plating, do not necessarily need to be performed. This is because in the method for manufacturing the conductive film 10 according to the present embodiment, a desired surface resistance can be obtained by adjusting the amount of silver coated in the silver salt emulsion layer and the silver/binder volume ratio. In addition, you may perform a calendar process etc. as needed.

(Hardening treatment after development)
After the silver salt emulsion layer is developed, it is preferably immersed in a hardening agent to carry out the hardening treatment. Examples of the hardener include glutaraldehyde, adipaldehyde, dialdehydes such as 2,3-dihydroxy-1,4-dioxane, and boric acid described in JP-A-2-141279. ..
The conductive film 10 according to this embodiment may be provided with a functional layer such as an antireflection layer or a hard coat layer.

[Calendar processing]
The developed metallic silver portion may be calendered to be smoothed. This markedly increases the conductivity of the metallic silver portion. The calendar treatment can be performed with a calendar roll. The calender roll usually consists of a pair of rolls.
As a roll used for the calendar treatment, a plastic roll made of epoxy, polyimide, polyamide, polyimide amide, or the like, or a metal roll is used. In particular, when the emulsion layers are provided on both sides, it is preferable to perform the treatment with metal rolls. When the emulsion layer is provided on one side, a combination of a metal roll and a plastic roll may be used from the viewpoint of preventing wrinkles. The upper limit value of the linear pressure is 1960 N/cm (200 kgf/cm, 699.4 kgf/cm ² when converted to surface pressure) or more, and more preferably 2940 N/cm (300 kgf/cm, 935.8 kgf/cm ² when converted to surface pressure). ) That is all. The upper limit of the linear pressure is 6880 N/cm (700 kgf/cm) or less.
The application temperature of the smoothing treatment represented by a calender roll is preferably 10°C (no temperature control) to 100°C, and the more preferable temperature depends on the image density and shape of the metal mesh pattern or the metal wiring pattern, and the binder type. , Approximately 10°C (no temperature control) to 50°C.

The present invention can be used in appropriate combination with the techniques of the publications and international publications listed in Tables 1 and 2 below. The notations such as “JP”, “Gazette” and “Pamphlet” are omitted.

Hereinafter, the present invention will be described more specifically with reference to Examples of the present invention. The materials, usage amounts, ratios, processing contents, processing procedures and the like shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted by the following specific examples.
In this example, the aperture ratios of the laminated conductive films 54 according to Comparative Examples 1 to 6 and Examples 1 to 60 were calculated, and moire was evaluated. Table 3 shows the breakdown of Comparative Examples 1 to 6 and Examples 1 to 60, as well as the calculation results and evaluation results.

<Examples 1 to 60, Comparative Examples 1 to 6>
(Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains (I=0.2 mol %, Br=40 mol %) having an average equivalent spherical diameter of 0.1 μm was prepared. ..
Further, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added to this emulsion at a concentration of 10 ⁻⁷ (mol/mol silver), and the silver bromide grains were doped with Rh ions and Ir ions. .. After Na ₂ PdCl ₄ was added to this emulsion and gold sulfur sensitization was further performed using chloroauric acid and sodium thiosulfate, the coating amount of silver was adjusted to 10 g/m ² together with the gelatin hardening agent. It was coated on a transparent substrate (here, polyethylene terephthalate (PET)). At this time, the Ag/gelatin volume ratio was 2/1.
A PET support having a width of 30 cm was coated with a width of 25 cm for 20 m, and both ends were cut off by 3 cm so that a central portion of the coating of 24 cm was left to obtain a roll-shaped silver halide photosensitive material.

(exposure)
The pattern of exposure is the pattern shown in FIGS. 6 and 8 for the first conductive film 10A, and the pattern shown in FIGS. 6 and 10 for the second conductive film 10B, and the pattern of A4 size (210 mm×297 mm) The procedure was performed for the first transparent substrate 12A and the second transparent substrate 12B. The exposure was performed using parallel light with a high pressure mercury lamp as a light source through a photomask having the above pattern.

(Development processing)
・Developer 1 L prescription Hydroquinone 20 g
Sodium sulfite 50 g
40 g of potassium carbonate
Ethylenediamine/tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3, 1 L fixer formulation Ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-Diaminopropane/tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
The pH of the exposed photosensitive material was adjusted to 6.2 using the above processing agent using an automatic processor FG-710PTS manufactured by Fuji Film Co., Ltd. Processing conditions: development 35° C. 30 seconds, fixing 34° C. 23 seconds, washing with running water (5 L /Min) for 20 seconds.

(Example 1)
The angle θ formed between the first side 70a of the small lattice 70 and the first direction (x direction) in the first conductive portion 14A of the first conductive film 10A and the second conductive portion 14B of the second conductive film 10B thus produced is The laminated conductive film according to Example 1 was produced at 30°, the length of one side of the small lattice 70 was 200 μm, and the line width of the small lattice 70 was 6 μm.
(Examples 2 to 4)
In Examples 2, 3 and 4, laminated conductive films were produced in the same manner as in Example 1 except that the lengths of the sides of the small grating 70 were 220 μm, 240 μm and 400 μm, respectively.
(Example 5)
The angle θ formed by the first side 70a of the small lattice 70 and the first direction is 32°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 6 to 8)
In Examples 6, 7, and 8, laminated conductive films were produced in the same manner as in Example 5, except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm, and 400 μm, respectively.

(Example 9)
The laminated conductive film according to Example 9 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 36°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 10 to 12)
In Examples 10, 11 and 12, laminated conductive films were produced in the same manner as in Example 9 except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm and 400 μm, respectively.
(Example 13)
The laminated conductive film according to Example 13 in which the angle θ between the first side 70a of the small lattice 70 and the first direction is 37°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 14 to 16)
In Examples 14, 15, and 16, laminated conductive films were produced in the same manner as in Example 13 except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm, and 400 μm, respectively.

(Example 17)
The laminated conductive film according to Example 17 in which the angle θ between the first side 70a of the small lattice 70 and the first direction is 39°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 18 to 20)
In Examples 18, 19, and 20, laminated conductive films were produced in the same manner as in Example 17, except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm, and 400 μm, respectively.
(Example 21)
The laminated conductive film according to Example 21 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 40°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 22 to 24)
In Examples 22, 23, and 24, laminated conductive films were produced in the same manner as in Example 21, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 25)
The laminated conductive film according to Example 25 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 44°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 26 to 28)
In Examples 26, 27 and 28, laminated conductive films were produced in the same manner as in Example 25 except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm and 400 μm, respectively.
(Example 29)
The laminated conductive film according to Example 29 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 45°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 30 to 32)
In Examples 30, 31, and 32, laminated conductive films were produced in the same manner as in Example 29, except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 33)
The laminated conductive film according to Example 33 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 46°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 34 to 36)
In Examples 34, 35 and 36, laminated conductive films were produced in the same manner as in Example 33, except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm and 400 μm, respectively.
(Example 37)
The laminated conductive film according to Example 37 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction was 50°, the length of one side of the small lattice 70 was 200 μm, and the line width of the small lattice 70 was 6 μm. Was produced.
(Examples 38-40)
In Examples 38, 39, and 40, laminated conductive films were produced in the same manner as in Example 37, except that the side lengths of the small lattice 70 were 220 μm, 240 μm, and 400 μm, respectively.

(Example 41)
The angle θ formed by the first side 70a of the small lattice 70 and the first direction is 51°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 42 to 44)
In Examples 42, 43 and 44, laminated conductive films were produced in the same manner as in Example 41, except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm and 400 μm, respectively.
(Example 45)
The angle θ formed between the first side 70a of the small lattice 70 and the first direction is 53°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 46 to 48)
In Examples 46, 47 and 48, laminated conductive films were produced in the same manner as in Example 45 except that the length of one side of the small lattice 70 was 220 μm, 240 μm and 400 μm, respectively.

(Example 49)
The angle θ formed by the first side 70a of the small lattice 70 and the first direction is 54°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 50 to 52)
In Examples 50, 51, and 52, laminated conductive films were produced in the same manner as in Example 49 except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.
(Example 53)
The angle θ formed between the first side 70a of the small lattice 70 and the first direction is 58°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 54 to 56)
In Examples 54, 55, and 56, laminated conductive films were produced in the same manner as in Example 53 except that the length of one side of the small lattice 70 was 220 μm, 240 μm, and 400 μm, respectively.

(Example 57)
The laminated conductive film according to Example 57 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 60°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Examples 58-60)
In Examples 58, 59 and 60, laminated conductive films were produced in the same manner as in Example 57 except that the lengths of the sides of the small lattice 70 were 220 μm, 240 μm and 400 μm, respectively.

(Comparative Example 1)
The angle θ formed by the first side 70a of the small lattice 70 and the first direction is 29°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Comparative examples 2 and 3)
In Comparative Examples 2 and 3, laminated conductive films were produced in the same manner as Comparative Example 1 except that the length of one side of the small lattice 70 was 300 μm and 400 μm, respectively.
(Comparative Example 4)
The laminated conductive film according to Comparative Example 4 in which the angle θ formed by the first side 70a of the small lattice 70 and the first direction is 61°, the length of one side of the small lattice 70 is 200 μm, and the line width of the small lattice 70 is 6 μm. Was produced.
(Comparative Examples 5 and 6)
In Comparative Examples 5 and 6, laminated conductive films were prepared in the same manner as Comparative Example 4 except that the lengths of the sides of the small lattice 70 were 300 μm and 400 μm, respectively.

[Evaluation]
(Calculation of aperture ratio)
In order to confirm the quality of transparency, the transmittance of each of the laminated conductive films was measured using a spectrophotometer for Comparative Examples 1 to 6 and Examples 1 to 60, and the aperture ratio was calculated by proportional calculation. ..
(Evaluation of moire)
Regarding Comparative Examples 1 to 6 and Examples 1 to 60, after laminating the laminated conductive film on the display panel 58 of the display device 30, the display device 30 is installed on a rotating disk, and the display device 30 is driven to produce white. Is displayed. In that state, the turntable was rotated at a bias angle of −20° to +20°, and the moire was visually observed and evaluated. The horizontal pixel pitch Ph and the vertical pixel pitch Pv of the display device 30 were both about 192 μm. As a display for evaluation, Pavilion Notebook PC dm1a (11.6 inch gloss liquid crystal WXGA/1366×768) manufactured by HP was used.
The moire was evaluated at an observation distance of 0.5 m from the display screen of the display device 30, and when the moire did not become apparent, it was ○, when the moire was seen only at a level where there was no problem, the moire became apparent. When it did, it marked x. Then, as a general score, when the angle range of ◯ is 10° or more, it is A, when the angle range of ◯ is less than 10°, there is no angle range of ◯, and the angle range of × is less than 30°. In the case of, the case of C was given, and in the case of X, there was no angle range of 0, and the case of the angle range of 30 or more was taken as D.

From Tables 3 and 4, it was found that Comparative Examples 1 to 6 all had an evaluation of D, and moire was apparent. On the other hand, in Examples 1 to 60, Moire was slightly manifested in Examples 1, 4, 21, 24, 25, 28 to 33, 36, 37, 40, 57, 60, but at a level without any problem. It was Of the other examples, examples 2, 3, 5, 8, 9, 12, 13, 16, 17, 20, 22, 23, 26, 27, 34, 35, 38, 39, 41, 44, About 45, 48, 49, 52, 53, 56, 58 and 59, there was almost no moire and it was good. In particular, Examples 6, 7, and 10 in which the angle θ between the first side 70a of the small lattice 70 and the first direction is 32° to 39° and the length of one side of the small lattice 70 is 220 μm and 240 μm. , 11, 14, 15, 18, 19, 19, 42, 43, 46, 47, 50, 51, 54, 55 did not generate moire.

Moreover, each of the projected capacitive touch panels 50 was manufactured using the conductive film 10 according to the above-described Examples 1 to 60. When operated by touching with a finger, it was found that the response speed was fast and the detection sensitivity was excellent. Moreover, when two or more points were touched and operated, similarly good results were obtained, and it was confirmed that multi-touch can be supported.
The conductive film for a touch panel , the display device, the conductive film , the touch panel, and the sensor body according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention. Of course.

10... Conductive film 10A... 1st conductive film 10B... 2nd conductive film 12... Transparent base 12A... 1st transparent base 12B... 2nd transparent base 14... Conductive part 14A... 1st conductive part 14B... 2nd conductive Part 16... Metal thin wire 30... Display device 32... Pixel 50... Touch panel 52... Sensor body 54... Laminated conductive film 64A... First conductive pattern 64B... Second conductive pattern 68A... First large lattice 68B... Second large lattice 70 … Small grid

Claims (23)

A substrate,
A conductive portion formed on one main surface of the base,
The conductive portions each have two or more conductive patterns formed of metal wires extending in the first direction and arranged in a second direction orthogonal to the first direction,
The conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A conductive film for a touch panel, which is separated from the conductive pattern and has a mesh pattern-shaped auxiliary pattern in which a part of the small lattice is broken. The conductive film for a touch panel according to claim 1,
The conductive film for a touch panel, wherein the metal thin wire has a line width of 2 to 7 μm. The conductive film for a touch panel according to claim 2,
The conductive film for a touch panel, wherein the thin metal wire has a thickness of less than 9 μm. The conductive film for a touch panel according to any one of claims 1 to 3,
The conductive film for a touch panel, wherein an angle formed by at least one side of each of the small lattices and the first direction is 32° to 39°. The conductive film for a touch panel according to any one of claims 1 to 3,
The conductive film for a touch panel, wherein an angle between at least one side of each of the small lattices and the first direction is 46° to 58°. The conductive film for a touch panel according to any one of claims 1 to 3,
The conductive film for a touch panel, wherein an angle formed by at least one side of each of the small lattices and the first direction is 51° to 58°. The conductive film for a touch panel according to any one of claims 1 to 6,
The conductive pattern is configured by connecting two or more large lattices in series in the first direction,
A conductive film for a touch panel, wherein each of the large lattices is configured by combining two or more of the small lattices. A display device comprising the conductive film for a touch panel according to claim 1 and a display panel. The display device according to claim 8,
A display device in which the first direction is the same as the arrangement direction of the pixels of the display panel. A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
The combination pattern of the first conductive portion and the second conductive portion is a mesh pattern in which a large number of small lattices are arranged,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
The conductive film in which at least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction. A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
Each of the first conductive pattern and the second conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
An angle between at least one side of each of the small lattices and the first direction is 30° to 44° or 46° to 60°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A conductive film in which a large number of the small lattices are uniformly spread by combining the first conductive portion and the second conductive portion. Conductive film according to claim 10 or 1 1 Symbol mounting and comprising a display panel, a display device. The display device according to claim 12 ,
A display device in which the first direction is the same as the arrangement direction of the pixels of the display panel. A touch panel having a conductive film,
The conductive film,
A substrate,
A conductive portion formed on one main surface of the base,
The conductive portions each have two or more conductive patterns formed of metal wires extending in the first direction and arranged in a second direction orthogonal to the first direction,
The conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A touch panel having a mesh pattern-shaped auxiliary pattern that is separated from the conductive pattern and has a part of the small lattice broken. A touch panel having a conductive film,
The conductive film,
A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
The combination pattern of the first conductive portion and the second conductive portion is a mesh pattern in which a large number of small lattices are arranged,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
The touch panel, wherein at least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction. A touch panel having a conductive film,
The conductive film,
A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
Each of the first conductive pattern and the second conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
An angle between at least one side of each of the small lattices and the first direction is 30° to 44° or 46° to 60°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A touch panel having a configuration in which a large number of the small lattices are uniformly spread by combining the first conductive portion and the second conductive portion. And a display panel and a touch panel according to any one of claims 14 to 16, a display device. The display device according to claim 17 ,
A display device in which the first direction is the same as the arrangement direction of the pixels of the display panel. A sensor body having a conductive film,
The conductive film,
A substrate,
A conductive portion formed on one main surface of the base,
The conductive portions each have two or more conductive patterns formed of metal wires extending in the first direction and arranged in a second direction orthogonal to the first direction,
The conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A sensor body having a mesh pattern-shaped auxiliary pattern which is separated from the conductive pattern and in which a part of the small lattice is broken. A sensor body having a conductive film,
The conductive film,
A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
The combination pattern of the first conductive portion and the second conductive portion is a mesh pattern in which a large number of small lattices are arranged,
Each of the small lattices has a rhombus shape,
The angle between at least one side of each of the small lattices and the first direction is 32° to 44° or 46° to 58°,
The sensor body, wherein at least one apex angle of each of the small gratings is twice the angle formed by the one side and the first direction. A sensor body having a conductive film,
The conductive film,
A first conductive portion,
Having a first conductive portion and a second conductive portion insulated from each other,
Each of the first conductive portions has two or more first conductive patterns that extend in the first direction and are arranged in a second direction orthogonal to the first direction.
The second conductive portions each have two or more second conductive patterns extending in the second direction and arranged in the first direction,
Each of the first conductive pattern and the second conductive pattern is configured by combining two or more small lattices,
Each of the small lattices has a rhombus shape,
An angle between at least one side of each of the small lattices and the first direction is 30° to 44° or 46° to 60°,
At least one apex angle of each of the small lattices is twice the angle formed by the one side and the first direction,
A sensor body having a configuration in which a large number of the small lattices are uniformly spread by combining the first conductive portion and the second conductive portion. And a display panel and the sensor body according to any one of claims 19-21, display device. The display device according to claim 22 ,
A display device in which the first direction is the same as the arrangement direction of the pixels of the display panel.

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