JP4820451B2 - Conductive sheet, method of using conductive sheet, and touch panel - Google Patents

Conductive sheet, method of using conductive sheet, and touch panel Download PDF

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JP4820451B2
JP4820451B2 JP2010120331A JP2010120331A JP4820451B2 JP 4820451 B2 JP4820451 B2 JP 4820451B2 JP 2010120331 A JP2010120331 A JP 2010120331A JP 2010120331 A JP2010120331 A JP 2010120331A JP 4820451 B2 JP4820451 B2 JP 4820451B2
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conductive sheet
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JP2011129501A (en
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匡志 栗城
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Fujifilm Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

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  • Theoretical Computer Science (AREA)
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  • Position Input By Displaying (AREA)
  • Non-Insulated Conductors (AREA)

Description

本発明は、導電シート、導電シートの使用方法及びタッチパルに関し、例えば投影型静電容量方式のタッチパネルに用いて好適な導電シート、導電シートの使用方法及びタッチパネルに関する。 The present invention, the conductive sheet, relates Usage及beauty data Tchiparu conductive sheet, for example, projective capacitive suitable conductive sheet using the touch panel, to a method及Beauty capacitor touch panel using the conductive sheet.

一般に、静電容量方式のタッチパネルは、人間の指先と導電膜との間での静電容量の変化を捉えて指先の位置を検出する位置入力装置であるが、この静電容量方式のタッチパネルとしては、表面型と投影型とがある。表面型は、構造が簡便ではあるが、同時に２点以上の接触（マルチタッチ）を検知することができない。一方、投影型は、例えば液晶表示装置の画素構成のように、多数の電極がマトリクス状に配列して構成され、より具体的には、垂直方向に並ぶ複数の電極が直列に接続された複数の第１電極群が水平方向に配列され、水平方向に並ぶ複数の電極が直列に接続された複数の第２電極群が垂直方向に配列されて構成され、複数の第１電極群及び複数の第２電極群で容量変化を順次検出していくことで、マルチタッチが検出できる構成となっている。この投影型静電容量方式のタッチパネルの先行技術として例えば特許文献１記載の静電容量型入力装置が挙げられる。   In general, a capacitive touch panel is a position input device that detects a fingertip position by detecting a change in capacitance between a human fingertip and a conductive film. There are surface type and projection type. The surface type has a simple structure, but cannot detect two or more contacts (multi-touch) at the same time. On the other hand, the projection type has a configuration in which a large number of electrodes are arranged in a matrix, for example, like a pixel configuration of a liquid crystal display device, and more specifically, a plurality of electrodes in which a plurality of electrodes arranged in the vertical direction are connected in series. The first electrode group is arranged in the horizontal direction, and a plurality of second electrode groups in which a plurality of electrodes arranged in the horizontal direction are connected in series are arranged in the vertical direction. Multi-touch can be detected by sequentially detecting capacitance changes with the second electrode group. As a prior art of this projected capacitive touch panel, for example, a capacitive input device described in Patent Document 1 can be cited.

特開２００８−３１０５５１号公報JP 2008-310551 A

しかしながら、特許文献１に記載の静電容量型入力装置は、基体の一主面に第１電極群及び第２電極群を形成するようにしているため、第１電極群と第２電極群との短絡防止を目的とした隙間を形成しなければならず、指先の位置の検知精度が劣るという問題がある。また、第１電極群と第２電極群とが交差する部分（交差部）が短絡しないように、例えば第１電極群を構成する電極の接続部上に絶縁層を介して第２電極群を構成する電極の接続部を形成するようにしており、その結果、各交差部が局部的に厚く形成されてしまい、タッチパネル面を見たときに、各交差部が斑点（黒い斑点）として表示され、視認性が著しく劣化するという問題もある。しかも、絶縁層並びに絶縁層上に接続部を形成するためのマスクパターンが必要になることから、製造工程が複雑になり、製造コストが高価格化するという問題がある。   However, since the capacitance-type input device described in Patent Document 1 forms the first electrode group and the second electrode group on one main surface of the substrate, the first electrode group, the second electrode group, Therefore, there is a problem that the detection accuracy of the position of the fingertip is inferior. Further, for example, the second electrode group is formed on the connection portion of the electrodes constituting the first electrode group via an insulating layer so that the portion (intersection) where the first electrode group and the second electrode group intersect is not short-circuited. As a result, each intersection is formed thick locally, and when the touch panel surface is viewed, each intersection is displayed as a spot (black spot). There is also a problem that the visibility is remarkably deteriorated. In addition, since an insulating layer and a mask pattern for forming a connection portion on the insulating layer are required, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases.

そこで、透明基板の一主面に第１電極群を形成し、透明基板の他主面に第２電極群を形成することが考えられる。
しかし、将来的な観点から見ると、以下のような問題が生じるおそれがある。現在、投影型静電容量方式のタッチパネルは、ＰＤＡ（携帯情報端末）や携帯電話等の小サイズへの適用が主となっているが、パーソナルコンピュータ（パソコン）用のオペレーションシステム（ＯＳ）がマルチタッチ方式を標準対応するようになったことから、パソコン用ディスプレイ等への適用による大サイズ化が進むと考えられる。 Therefore, it is conceivable to form the first electrode group on one main surface of the transparent substrate and form the second electrode group on the other main surface of the transparent substrate.
However, from the perspective of the future, the following problems may occur. At present, the projected capacitive touch panel is mainly applied to a small size such as a PDA (personal digital assistant) or a mobile phone, but an operation system (OS) for a personal computer (personal computer) is multi-purpose. Since the touch system is now available as a standard, it is thought that the size will increase due to the application to personal computer displays.

このような将来の動向において、従来の電極は、ＩＴＯ（酸化インジウムスズ）を用いていることから、抵抗が大きく（数１０オーム／ｓｑ．）、適用サイズが大きくなるにつれて、電極間の電流の伝達速度が遅くなり、応答速度（指先を接触してからその位置を検出するまでの時間）が遅くなるという問題がある。   In such a future trend, since the conventional electrode uses ITO (indium tin oxide), the resistance increases (several tens of ohms / sq.), And as the application size increases, the current between the electrodes increases. There is a problem that the transmission speed becomes slow and the response speed (the time from when the fingertip is touched until the position is detected) becomes slow.

本発明はこのような課題を考慮してなされたものであり、基体上に形成される透明導電パターンの低抵抗化を図ることができると共に、視認性も向上させることができ、例えば投影型静電容量方式のタッチパネルに用いて好適な導電シート及び導電シートの使用方法を提供することを目的とする。   The present invention has been made in consideration of such problems, and can reduce the resistance of the transparent conductive pattern formed on the substrate and improve the visibility. It is an object to provide a conductive sheet suitable for use in a capacitive touch panel and a method of using the conductive sheet.

また、本発明の他の目的は、基体上に形成される透明導電パターンの低抵抗化を図ることができると共に、視認性も向上させることができ、例えば投影型静電容量方式のタッチパネルの大サイズ化にも対応させることができるタッチパネルを提供することを目的とする。   Another object of the present invention is to reduce the resistance of the transparent conductive pattern formed on the substrate and to improve the visibility. For example, a large projection capacitive touch panel can be used. An object of the present invention is to provide a touch panel that can be adapted to size.

［１］ 第１の本発明に係る導電シートは、基体上に、２以上の導電性の大格子と、隣接する前記大格子間を電気的に接続する接続部とが形成され、各前記大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記接続部は、前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成されていることを特徴とする。
［２］ 第１の本発明において、前記接続部は、複数の前記中格子がジグザグ状に配列された形状を有することを特徴とする。
［３］ 第１の本発明において、前記接続部は、１つの前記小格子とＬ字状の空間が形成された複数の前記中格子を有することを特徴とする。
［４］ 第１の本発明において、前記接続部は、１つの前記小格子とＬ字状の空間が形成された第１中格子と、４つ分の前記小格子をマトリクス状に配列し、中央の十字を取り外した形状を有する第２中格子が直列に接続されて構成されていることを特徴とする。
［５］ 第１の本発明において、前記中格子の配列ピッチは、前記小格子の配列ピッチの１〜１０倍であることを特徴とする。
［６］ 第１の本発明において、前記小格子の配列ピッチをＰｓ、前記中格子の配列ピッチをＰｍとしたとき、Ｐｍ＝２×Ｐｓを満足することを特徴とする。
［７］ 第１の本発明において、２以上の前記大格子が前記接続部を介して一方向に配列されていることを特徴とする。
［８］ 第１の本発明において、２以上の前記大格子が前記接続部を介して第１方向に配列されて１つの透明導電パターンが構成され、２以上の前記透明導電パターンが前記第１方向と直交する第２方向に配列され、隣接する前記透明導電パターン間は電気的に絶縁された絶縁部が配されていることを特徴とする。
［９］ 第２の本発明に係る導電シートは、基体の一方の主面に、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、前記基体の他方の主面に、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、各前記第１大格子及び各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第１接続部及び前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成されていることを特徴とする。
［１０］ 第２の本発明において、２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、２以上の前記第１透明導電パターンが前記第２方向に配列され、２以上の前記第２透明導電パターンが前記第１方向に配列され、隣接する前記第１透明導電パターン間は電気的に絶縁された第１絶縁部が配され、隣接する前記第２透明導電パターン間は電気的に絶縁された第２絶縁部が配され、前記第１接続部と前記第２接続部とが前記基体を間に挟んで対向し、前記第１絶縁部と前記第２絶縁部とが前記基体を間に挟んで対向していることを特徴とする。
［１１］ 第２の本発明において、前記第１絶縁部と前記第２絶縁部とが前記基体を間に挟んで対向する部分は、前記小格子が２以上配列された大きさの開口が形成された形態を有することを特徴とする。
［１２］ 第２の本発明において、前記部分は、前記中格子１つ分の大きさの開口が形成された形態を有することを特徴とする。
［１３］ 第２の本発明において、前記部分は、複数の前記小格子がほぼ十字形状に配列された大きさの開口が形成された形態を有することを特徴とする。
［１４］ 第２の本発明において、前記第１大格子のうち、第１の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有し、前記第１の辺と対向する第２の辺は、該第２の辺に沿って連続する直線部が形成された形態を有し、前記第２大格子のうち、前記基体を介して前記第１大格子の前記第１の辺と対向する第３の辺は、該第３の辺に沿って連続する直線部が形成された形態を有し、前記基体を介して前記第１大格子の前記第２の辺と対向する第４の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有することを特徴とする。
［１５］ 第２の本発明において、前記小格子は正方形状であることを特徴とする。
［１６］ 第３の本発明に係る導電シートの使用方法は、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、各前記第１大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第１接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第１導電シートと、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第２導電シートとを使用する導電シートの使用方法であって、前記第１導電シートは、２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、前記第２導電シートは、２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、前記第１導電シートと前記第２導電シートとを組み合わせることで、前記第１導電シートの前記第１接続部と前記第２導電シートの前記第２接続部とが組み合わさって前記小格子の配列を形成するように配置されることを特徴とする。
［１７］ 第４の本発明に係る静電容量方式タッチパネルは、第２の本発明に係る導電シートを有することを特徴とする。 [1] In the conductive sheet according to the first aspect of the present invention, two or more conductive large lattices and a connection portion for electrically connecting the adjacent large lattices are formed on a base. Each of the lattices is formed by combining two or more small lattices, and the connection portion is formed by arranging one or more medium lattices having a pitch n times (n is a real number larger than 1) the small lattices. It is characterized by.
[2] In the first aspect of the present invention, the connecting portion has a shape in which a plurality of the intermediate lattices are arranged in a zigzag shape.
[3] In the first aspect of the present invention, the connecting portion includes a plurality of the intermediate lattices in which one small lattice and an L-shaped space are formed.
[4] In the first aspect of the present invention, the connecting portion arranges one small lattice and a first medium lattice in which an L-shaped space is formed, and four small lattices in a matrix, A second intermediate lattice having a shape obtained by removing the central cross is connected in series.
[5] In the first aspect of the present invention, the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice.
[6] In the first aspect of the present invention, when the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm, Pm = 2 × Ps is satisfied.
[7] The first aspect of the present invention is characterized in that two or more large lattices are arranged in one direction via the connection portion.
[8] In the first aspect of the present invention, two or more of the large lattices are arranged in the first direction via the connecting portion to constitute one transparent conductive pattern, and two or more of the transparent conductive patterns are the first. An insulating part arranged in a second direction orthogonal to the direction and being electrically insulated is disposed between the adjacent transparent conductive patterns.
[9] A conductive sheet according to a second aspect of the present invention is a first sheet that electrically connects two or more conductive first large lattices and the adjacent first large lattices to one main surface of the substrate. And a second connecting portion that electrically connects two or more conductive second large lattices and the adjacent second large lattices is formed on the other main surface of the base body. In addition, each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices, and each of the first connection portion and the second connection portion is n times as large as the small lattice ( It is characterized in that one or more medium lattices having a pitch (n is a real number larger than 1) are arranged.
[10] In the second aspect of the present invention, two or more first large lattices are arranged in the first direction via the first connection portion to form one first transparent conductive pattern, and two or more first transparent lattices are formed. Two large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern, and two or more first transparent conductive patterns are the second Two or more second transparent conductive patterns arranged in a direction are arranged in the first direction, and between the adjacent first transparent conductive patterns, an electrically insulated first insulating portion is arranged, and the adjacent A second insulating portion that is electrically insulated is disposed between the second transparent conductive patterns, the first connecting portion and the second connecting portion are opposed to each other with the base interposed therebetween, and the first insulating portion The second insulating portion is opposed to the base with the base interposed therebetween. The
[11] In the second aspect of the present invention, an opening having a size in which two or more small lattices are arranged is formed in a portion where the first insulating portion and the second insulating portion face each other with the base interposed therebetween. It has the form which was made.
[12] In the second aspect of the present invention, the portion has a form in which an opening having a size corresponding to one of the medium lattices is formed.
[13] In the second aspect of the present invention, the portion has a form in which an opening having a size in which the plurality of small lattices are arranged in a substantially cross shape is formed.
[14] In the second aspect of the present invention, the first side of the first large lattice has a shape in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side. And the second side opposite to the first side has a form in which a linear portion continuous along the second side is formed, and the base of the second large lattice is The third side facing the first side of the first large lattice has a form in which a linear portion continuous along the third side is formed, and the first side through the base body The fourth side opposite to the second side of one large lattice has a form in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side. To do.
[15] In the second aspect of the present invention, the small lattice has a square shape.
[16] The method of using the conductive sheet according to the third aspect of the present invention includes two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices. Each of the first large lattices is configured by combining two or more small lattices, and each of the first connecting portions has a pitch n times (n is a real number larger than 1) as the small lattice. A first conductive sheet configured by arranging the above-described middle grids, two or more conductive second large grids, and a second connection portion that electrically connects the adjacent second large grids are formed. Each of the second large lattices is configured by combining two or more small lattices, and each of the second connecting portions has a pitch n times (n is a real number greater than 1) pitch of the small lattice. A conductive sheet using the second conductive sheet having the above-described middle grid disposed thereon Wherein the first conductive sheet has two or more first large lattices arranged in a first direction via the first connection portion to constitute one first transparent conductive pattern, In the second conductive sheet, two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to form one second transparent conductive pattern, By combining the first conductive sheet and the second conductive sheet, the first connection portion of the first conductive sheet and the second connection portion of the second conductive sheet are combined to form the arrangement of the small lattices. It is arranged so that it may form.
[17] A capacitive touch panel according to the fourth aspect of the present invention includes the conductive sheet according to the second aspect of the present invention.

以上説明したように、本発明に係る導電シート及び導電シートの使用方法によれば、基体上に形成される透明導電パターンの低抵抗化を図ることができると共に、視認性も向上させることができ、例えば投影型静電容量方式のタッチパネルに用いて好適となる。
また、本発明に係るタッチパネルは、基体上に形成される透明導電パターンの低抵抗化を図ることができると共に、視認性も向上させることができ、例えば投影型静電容量方式のタッチパネルの大サイズ化にも対応させることができる。 As described above, according to the conductive sheet and the method of using the conductive sheet according to the present invention, the resistance of the transparent conductive pattern formed on the substrate can be reduced, and the visibility can be improved. For example, it is suitable for use in a projected capacitive touch panel.
In addition, the touch panel according to the present invention can reduce the resistance of the transparent conductive pattern formed on the substrate and can also improve the visibility. For example, the large size of the projected capacitive touch panel It can be made to correspond.

第１導電シートに形成される第１透明導電パターンのパターン例を示す平面図である。It is a top view which shows the example of a pattern of the 1st transparent conductive pattern formed in a 1st conductive sheet. 第１導電シートを一部省略して示す断面図である。It is sectional drawing which abbreviate | omits and shows a 1st conductive sheet. 第１タッチパネル用導電シートを一部省略して示す分解斜視図である。It is a disassembled perspective view which abbreviate | omits and shows the electrically conductive sheet for 1st touch panels. 図４Ａは第１タッチパネル用導電シートの一例を一部省略して示す断面図であり、図４Ｂは第１タッチパネル用導電シートの他の例を一部省略して示す断面図である。4A is a cross-sectional view showing a part of the first touch panel conductive sheet with a part omitted, and FIG. 4B is a cross-sectional view showing a part of another example of the first touch panel conductive sheet. 第２導電シートに形成される第２透明導電パターンのパターン例を示す平面図である。It is a top view which shows the example of a pattern of the 2nd transparent conductive pattern formed in a 2nd conductive sheet. 第１導電シートと第２導電シートを組み合わせて第１タッチパネル用導電シートとした例を一部省略して示す平面図である。It is a top view which abbreviate | omits and shows the example which combined the 1st conductive sheet and the 2nd conductive sheet, and was set as the 1st conductive sheet for touchscreens. 第２タッチパネル用導電シートを一部省略して示す分解斜視図である。It is a disassembled perspective view which abbreviate | omits and shows the electrically conductive sheet for 2nd touch panels. 第２タッチパネル用導電シートの第１導電シートに形成される第１透明導電パターンのパターン例を示す平面図である。It is a top view which shows the example of a pattern of the 1st transparent conductive pattern formed in the 1st conductive sheet of the conductive sheet for 2nd touch panels. 第２タッチパネル用導電シートの第２導電シートに形成される第２透明導電パターンのパターン例を示す平面図である。It is a top view which shows the example of a pattern of the 2nd transparent conductive pattern formed in the 2nd conductive sheet of the conductive sheet for 2nd touch panels. 第１導電シートと第２導電シートを組み合わせて第２タッチパネル用導電シートとした例を一部省略して示す平面図である。It is a top view which abbreviate | omits and shows the example which made the 2nd conductive sheet the 2nd conductive sheet combining the 1st conductive sheet and the 2nd conductive sheet.

以下、本発明に係る導電シート、導電シートの使用方法及びタッチパネルの実施の形態例を図１〜図１０を参照しながら説明する。なお、本明細書において「〜」は、その前後に記載される数値を下限値及び上限値として含む意味として使用される。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a conductive sheet, a method for using a conductive sheet, and a touch panel according to the present invention will be described with reference to FIGS. In the present specification, “to” is used as a meaning including numerical values described before and after the lower limit value and the upper limit value.

第１の実施の形態に係る導電シート（以下、第１導電シート１０Ａと記す）は、図１に示すように、第１透明基体１２Ａ（図２参照）の一主面上に、２以上の導電性の第１大格子１４Ａと、隣接する第１大格子１４Ａ間を電気的に接続する第１接続部１６Ａとが形成され、各第１大格子１４Ａは、それぞれ２以上の小格子１８が組み合わされて構成され、第１接続部１６Ａは、小格子１８のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子２０（２０ａ〜２０ｄ）が配置されて構成されている。小格子１８は、ここでは一番小さい正方形状とされている。   As shown in FIG. 1, the conductive sheet according to the first embodiment (hereinafter referred to as the first conductive sheet 10A) has two or more on one main surface of the first transparent base 12A (see FIG. 2). A conductive first large lattice 14A and a first connection portion 16A that electrically connects the adjacent first large lattices 14A are formed. Each of the first large lattices 14A includes two or more small lattices 18 respectively. The first connecting portion 16A is configured by combining one or more medium lattices 20 (20a to 20d) having a pitch n times that of the small lattice 18 (n is a real number larger than 1). . Here, the small lattice 18 has the smallest square shape.

さらに、２以上の第１大格子１４Ａが第１接続部１６Ａを介してｘ方向（第１方向）に配列されて１つの第１透明導電パターン２２Ａが構成され、２以上の第１透明導電パターン２２Ａがｘ方向と直交するｙ方向（第２方向）に配列され、隣接する第１透明導電パターン２２Ａ間は電気的に絶縁された第１絶縁部２４Ａが配されている。   Further, two or more first large lattices 14A are arranged in the x direction (first direction) via the first connection portion 16A to constitute one first transparent conductive pattern 22A, and two or more first transparent conductive patterns are formed. 22A is arranged in the y direction (second direction) orthogonal to the x direction, and a first insulating portion 24A that is electrically insulated is disposed between adjacent first transparent conductive patterns 22A.

より具体的には、第１大格子１４Ａの４つの辺部のうち、隣接する第１大格子１４Ａと接続していない一方の頂点部分２６ａに隣接する第１辺部２８ａ及び第２辺部２８ｂについては、それぞれ第１辺部２８ａ及び第２辺部２８ｂに沿って連続する直線部３０から多数の針状の線３２（小格子１８の辺）がくし歯状に張り出した形態とされている。一方、隣接する第１大格子１４Ａと接続していない他方の頂点部分２６ｂに隣接する第３辺部２８ｃ及び第４辺部２８ｄについては、それぞれ第３辺部２８ｃ及び第４辺部２８ｄに沿って連続する直線部３０が形成された形態とされ、さらに、他方の頂点部分２６ｂに対応する１つの小格子１８（正確には隣接する２つの辺）を取り外したような形態となっている。   More specifically, of the four side portions of the first large lattice 14A, the first side portion 28a and the second side portion 28b that are adjacent to one apex portion 26a that is not connected to the adjacent first large lattice 14A. Is a configuration in which a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the straight line portion 30 continuous along the first side portion 28a and the second side portion 28b. On the other hand, the third side portion 28c and the fourth side portion 28d adjacent to the other vertex portion 26b not connected to the adjacent first large lattice 14A are along the third side portion 28c and the fourth side portion 28d, respectively. Thus, the linear portion 30 is formed continuously, and one small lattice 18 (exactly two adjacent sides) corresponding to the other apex portion 26b is removed.

第１接続部１６Ａは、４つ分の小格子１８を含む大きさを有する中格子２０が４つ（第１中格子２０ａ〜第４中格子２０ｄ）、ジグザグ状に配列された形状を有する。すなわち、第１中格子２０ａは、第２辺部２８ｂの直線部３０と第４辺部２８ｄの直線部３０との境界部分に存在し、１つの小格子１８とＬ字状の空間が形成された形状を有する。第２中格子２０ｂは、第１中格子２０ａの１つ辺（第２辺部２８ｂの直線部３０）に隣接し、正方形状の空間が形成された形状、すなわち、４つ分の小格子１８をマトリクス状に配列し、中央の十字を取り外したような形状を有する。第３中格子２０ｃは、第１中格子２０ａに隣接すると共に、第２中格子２０ｂに隣接して配され、第２中格子２０ｂと同様の形状を有する。第４中格子２０ｄは、第３辺部２８ｃの第２番目の直線部３０（一番外側から第１大格子１４Ａの内方に向かって２番目の直線部３０）と第１辺部２８ａとの境界部分に存在し、第２中格子２０ｂに隣接すると共に、第３中格子２０ｃに隣接して配され、第１中格子２０ａと同様に、１つの小格子１８とＬ字状の空間が形成された形状を有する。第４中格子２０ｄの１つの辺は第１大格子１４Ａにおける第４辺部２８ｄの直線部３０の延長上に存在する。そして、小格子１８の配列ピッチをＰｓとしたとき、中格子２０の配列ピッチＰｍは２×Ｐｓの関係を有している。   The first connecting portion 16A has a shape in which four medium lattices 20 having a size including four small lattices 18 (first medium lattice 20a to fourth medium lattice 20d) are arranged in a zigzag shape. That is, the first middle lattice 20a exists at the boundary portion between the straight portion 30 of the second side portion 28b and the straight portion 30 of the fourth side portion 28d, and one small lattice 18 and an L-shaped space are formed. Have a different shape. The second intermediate lattice 20b is adjacent to one side of the first intermediate lattice 20a (the straight portion 30 of the second side portion 28b) and has a shape in which a square space is formed, that is, four small lattices 18. Are arranged in a matrix and have a shape with the central cross removed. The third intermediate lattice 20c is adjacent to the first intermediate lattice 20a and adjacent to the second intermediate lattice 20b, and has the same shape as the second intermediate lattice 20b. The fourth middle lattice 20d includes a second straight portion 30 (second straight portion 30 from the outermost side toward the inside of the first large lattice 14A) of the third side portion 28c, and the first side portion 28a. And adjacent to the second intermediate lattice 20b and adjacent to the third intermediate lattice 20c, and similarly to the first intermediate lattice 20a, one small lattice 18 and an L-shaped space are provided. It has a formed shape. One side of the fourth middle lattice 20d exists on the extension of the straight portion 30 of the fourth side portion 28d in the first large lattice 14A. When the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.

このように、第１導電シート１０Ａにおいては、１つの第１透明導電パターン２２Ａを、２以上の第１大格子１４Ａを第１接続部１６Ａを介してｘ方向に配列して構成し、各第１大格子１４Ａを、それぞれ２以上の小格子１８を組み合わせて構成し、第１接続部１６Ａを、小格子１８の２倍のピッチを有する４つの中格子２０を配置して構成したので、１つの電極を１つのＩＴＯ膜にて形成する構成よりも大幅に電気抵抗を低減することが可能となる。従って、この第１導電シート１０Ａを用いて例えば投影型静電容量方式のタッチパネルに適用した場合に、応答速度を速めることができ、タッチパネルの大サイズ化を促進させることができる。   As described above, in the first conductive sheet 10A, one first transparent conductive pattern 22A is configured by arranging two or more first large lattices 14A in the x direction via the first connection portions 16A. Since one large lattice 14A is configured by combining two or more small lattices 18, and the first connection portion 16A is configured by arranging four medium lattices 20 having a pitch twice that of the small lattice 18, 1 The electrical resistance can be greatly reduced as compared with the configuration in which one electrode is formed by one ITO film. Accordingly, when the first conductive sheet 10A is used for a projection capacitive touch panel, for example, the response speed can be increased, and the touch panel can be increased in size.

次に、上述の第１導電シート１０Ａを用いたタッチパネル用の１組の導電シート、すなわち、第１の実施の形態に係るタッチパネル用導電シート（以下、第１タッチパネル用導電シート５０Ａと記す）について図３〜図６を参照しながら説明する。
この第１タッチパネル用導電シート５０Ａは、図３及び図４Ａに示すように、上述した第１導電シート１０Ａと後述する第２導電シート１０Ｂとが積層されて構成されている。 Next, a set of conductive sheets for a touch panel using the first conductive sheet 10A described above, that is, a conductive sheet for a touch panel according to the first embodiment (hereinafter referred to as a first conductive sheet for a touch panel 50A). This will be described with reference to FIGS.
As shown in FIGS. 3 and 4A, the first touch panel conductive sheet 50A is configured by laminating the above-described first conductive sheet 10A and a second conductive sheet 10B described later.

第１導電シート１０Ａは、上述したので、ここではその重複説明を省略するが、図３に示すように、各第１透明導電パターン２２Ａの一方の端部側に存在する第１大格子１４Ａの開放端は、第１接続部１６Ａが存在しない形状となっている。各第１透明導電パターン２２Ａの他方の端部側に存在する第１大格子１４Ａの端部は、第１外部配線４０Ａに電気的に接続されている。   Since the first conductive sheet 10A has been described above, an overlapping description thereof will be omitted here, but as shown in FIG. 3, the first large lattice 14A existing on one end side of each first transparent conductive pattern 22A. The open end has a shape in which the first connecting portion 16A does not exist. An end portion of the first large lattice 14A existing on the other end side of each first transparent conductive pattern 22A is electrically connected to the first external wiring 40A.

一方、第２導電シート１０Ｂは、図３及び図４Ａに示すように、第２透明基体１２Ｂの一主面上に、２以上の導電性の第２大格子１４Ｂと、隣接する第２大格子１４Ｂ間を電気的に接続する第２接続部１６Ｂとが形成され、各第２大格子１４Ｂは、図５に示すように、それぞれ２以上の小格子１８が組み合わされて構成され、第２接続部１６Ｂは、小格子１８のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子２０が配置されて構成されている。   On the other hand, as shown in FIGS. 3 and 4A, the second conductive sheet 10B includes two or more conductive second large lattices 14B and adjacent second large lattices on one main surface of the second transparent base 12B. 14B is formed, and each second large lattice 14B is formed by combining two or more small lattices 18 as shown in FIG. The part 16B is configured by arranging one or more medium lattices 20 having a pitch n times (n is a real number larger than 1) the small lattice 18.

さらに、２以上の第２大格子１４Ｂが第２接続部１６Ｂを介してｙ方向（第２方向）に配列されて１つの第２透明導電パターン２２Ｂが構成され、２以上の第２透明導電パターン２２Ｂがｙ方向と直交するｘ方向（第１方向）に配列され、隣接する第２透明導電パターン２２Ｂ間は電気的に絶縁された第２絶縁部２４Ｂが配されている。   Further, two or more second large lattices 14B are arranged in the y direction (second direction) via the second connection portion 16B to constitute one second transparent conductive pattern 22B, and two or more second transparent conductive patterns are formed. 22B is arranged in the x direction (first direction) orthogonal to the y direction, and a second insulating portion 24B that is electrically insulated is disposed between the adjacent second transparent conductive patterns 22B.

より具体的には、第２大格子１４Ｂの４つの辺部のうち、隣接する第２大格子１４Ｂと接続していない一方の頂点部分２６ａに隣接する第５辺部２８ｅ及び第６辺部２８ｆについてみると、第５辺部２８ｅについては、第１導電シート１０Ａにおける第１大格子１４Ａの第１辺部２８ａと同様に、第５辺部２８ｅに沿って連続する直線部３０から多数の針状の線３２（小格子１８の辺）がくし歯状に張り出した形態とされている。第６辺部２８ｆについては、第１導電シート１０Ａにおける第１大格子１４Ａの第３辺部２８ｃと同様に、第６辺部２８ｆに沿って連続する直線部３０が形成された形態とされている。隣接する第２大格子１４Ｂと接続していない他方の頂点部分２６ｂに隣接する第７辺部２８ｇ及び第８辺部２８ｈについてみると、第７辺部２６ｇについては、第５辺部２８ｅと同様に、第７辺部２８ｇに沿って連続する直線部３０から多数の針状の線３２（小格子１８の辺）がくし歯状に張り出した形態とされ、第８辺部２８ｈについては、第６辺部２８ｆと同様に、第８辺部２８ｈに沿って連続する直線部３０が形成された形態とされている。   More specifically, among the four sides of the second large lattice 14B, the fifth side portion 28e and the sixth side portion 28f adjacent to one vertex portion 26a not connected to the adjacent second large lattice 14B. With regard to the fifth side portion 28e, a number of needles are formed from the straight portion 30 continuous along the fifth side portion 28e in the same manner as the first side portion 28a of the first large lattice 14A in the first conductive sheet 10A. A line 32 (side of the small lattice 18) is formed in a comb-like shape. About the 6th side part 28f, it is set as the form by which the linear part 30 continuous along the 6th side part 28f was formed similarly to the 3rd side part 28c of 14 A of 1st large lattices in the 1st conductive sheet 10A. Yes. Looking at the seventh side portion 28g and the eighth side portion 28h adjacent to the other vertex portion 26b not connected to the adjacent second large lattice 14B, the seventh side portion 26g is the same as the fifth side portion 28e. In addition, a large number of needle-like lines 32 (sides of the small lattice 18) project in a comb-tooth shape from the straight portion 30 continuous along the seventh side portion 28g. Similar to the side portion 28f, a linear portion 30 that is continuous along the eighth side portion 28h is formed.

また、第２接続部１６Ｂは、４つ分の小格子１８を含む大きさを有する中格子２０が４つ（第５中格子２０ｅ〜第８中格子２０ｈ）、ジグザグ状に配列された形状を有する。すなわち、第５中格子２０ｅは、第６辺部２８ｆの第２番目の直線部３０（一番外側から第２大格子１４Ｂの内方に向かって２番目の直線部）と第８辺部２８ｈの直線部３０との境界部分に存在し、１つの小格子１８とＬ字状の空間が形成された形状を有する。第６中格子２０ｆは、第５中格子２０ｅの１つの辺（第６辺部２８ｆの第２番目の直線部３０）に隣接し、正方形状の空間が形成された形状、すなわち、４つ分の小格子１８をマトリクス状に配列し、中央の十字を取り外したような形状を有する。第７中格子２０ｇは、第５中格子２０ｅに隣接すると共に、第６中格子２０ｆに隣接して配され、第６中格子２０ｆと同様の形状を有する。第８中格子２０ｈは、第７辺部２８ｇの直線部３０と第５辺部２８ｅとの境界部分に存在し、第６中格子２０ｆに隣接すると共に、第７中格子２０ｇに隣接して配され、第５中格子２０ｅと同様に、１つの小格子１８とＬ字状の空間が形成された形状を有する。第８中格子２０ｈの１つの辺は第５中格子２０ｅにおける第８辺部２８ｈの直線部３０の延長上に存在する。この第２導電シート１０Ｂにおいても、小格子１８の配列ピッチをＰｓとしたとき、中格子２０の配列ピッチＰｍは２×Ｐｓの関係を有している。   The second connecting portion 16B has a shape in which four medium lattices 20 having a size including four small lattices 18 (fifth medium lattice 20e to eighth medium lattice 20h) are arranged in a zigzag shape. Have. That is, the fifth middle lattice 20e includes the second straight portion 30 (second straight portion from the outermost side toward the inside of the second large lattice 14B) and the eighth side portion 28h of the sixth side portion 28f. And has a shape in which one small lattice 18 and an L-shaped space are formed. The sixth intermediate lattice 20f is adjacent to one side of the fifth intermediate lattice 20e (the second straight portion 30 of the sixth side portion 28f), and has a shape in which a square space is formed, that is, four portions. The small lattices 18 are arranged in a matrix, and the cross is removed from the center. The seventh intermediate lattice 20g is adjacent to the fifth intermediate lattice 20e and is adjacent to the sixth intermediate lattice 20f, and has the same shape as the sixth intermediate lattice 20f. The eighth middle lattice 20h exists at the boundary between the straight portion 30 of the seventh side 28g and the fifth side 28e, is adjacent to the sixth middle lattice 20f, and is adjacent to the seventh middle lattice 20g. Similarly to the fifth middle lattice 20e, it has a shape in which one small lattice 18 and an L-shaped space are formed. One side of the eighth middle lattice 20h exists on the extension of the straight portion 30 of the eighth side 28h in the fifth middle lattice 20e. Also in the second conductive sheet 10B, when the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the medium lattice 20 has a relationship of 2 × Ps.

図３に示すように、各第２透明導電パターン２２Ｂの一方の端部側に存在する第２大格子１４Ｂの開放端は、第２接続部１６Ｂが存在しない形状となっている。各第２透明導電パターン２２Ｂの他方の端部側に存在する第２大格子１４Ｂの端部は、第２外部配線４０Ｂに電気的に接続されている。   As shown in FIG. 3, the open end of the second large lattice 14B present on one end side of each second transparent conductive pattern 22B has a shape in which the second connection portion 16B does not exist. An end portion of the second large lattice 14B existing on the other end side of each second transparent conductive pattern 22B is electrically connected to the second external wiring 40B.

そして、例えば第２導電シート１０Ｂ上に第１導電シート１０Ａを積層して第１タッチパネル用導電シート５０Ａとしたとき、図６に示すように、第１透明導電パターン２２Ａの第１接続部１６Ａと第２透明導電パターン２２Ｂの第２接続部１６Ｂとが第１透明基体１２Ａ（図４Ａ参照）を間に挟んで対向し、第１透明導電パターン２２Ａの第１絶縁部２４Ａと第２透明導電パターン２２Ｂの第２絶縁部２４Ｂとが同じく第１透明基体１２Ａを間に挟んで対向した形態となる。なお、第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂの各線幅は同じであるが、図６においては、第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂの位置がわかるように、第１透明導電パターン２２Ａの線幅を太く、第２透明導電パターン２２Ｂの線幅を細くして誇張して図示してある。   For example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the first touch panel conductive sheet 50A, as shown in FIG. 6, the first connection portion 16A of the first transparent conductive pattern 22A and The second connecting portion 16B of the second transparent conductive pattern 22B is opposed to the first transparent base 12A (see FIG. 4A), and the first insulating portion 24A of the first transparent conductive pattern 22A and the second transparent conductive pattern are opposed to each other. Similarly, the second insulating portion 22B of 22B is opposed to the first transparent base 12A. The line widths of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are the same, but in FIG. 6, the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are shown so that the positions of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B can be seen. The line width of the first transparent conductive pattern 22A is widened and the line width of the second transparent conductive pattern 22B is narrowed and exaggerated.

積層した第１導電シート１０Ａ及び第２導電シート１０Ｂを上面から見たとき、第１導電シート１０Ａに形成された第１大格子１４Ａの隙間を埋めるように、第２導電シート１０Ｂの第２大格子１４Ｂが配列された形態となる。つまり、大格子が敷き詰められた形態となる。このとき、第１大格子１４Ａの第１辺部２８ａ及び第２辺部２８ｂにおけるくし歯３２の各先端が第２大格子１４Ｂの第６辺部２８ｆ及び第８辺部２８ｈの各直線部３０にて接続されたような形状となって、結果的に小格子１８が配列された形態となり、同様に、第２大格子１４Ｂの第５辺部２８ｅ及び第７辺部２８ｇにおけるくし歯３２の各先端が第１大格子１４Ａの第３辺部２８ｃ及び第４辺部２８ｄの各直線部３０にて接続されたような形状となって、結果的に小格子１８が配列された形態となり、第１大格子１４Ａと第２大格子１４Ｂとの境界をほとんど見分けることができない状態となる。   When the stacked first conductive sheet 10A and second conductive sheet 10B are viewed from above, the second large size of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 14A formed in the first conductive sheet 10A. The lattice 14B is arranged. In other words, a large lattice is spread. At this time, the tips of the comb teeth 32 in the first side portion 28a and the second side portion 28b of the first large lattice 14A are the straight portions 30 of the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. As a result, the small lattices 18 are arranged, and similarly, the comb teeth 32 on the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are formed. Each tip has a shape connected to each of the straight portions 30 of the third side portion 28c and the fourth side portion 28d of the first large lattice 14A. As a result, the small lattices 18 are arranged, The boundary between the first large lattice 14A and the second large lattice 14B is almost indistinguishable.

ここで、例えば第１大格子１４Ａ及び第２大格子１４Ｂの辺部を全て直線部３０として形成した場合、重ね合わせの位置精度の僅かなズレにより、直線部３０同士の重なり部分の幅が大きくなり（線太り）、これにより、第１大格子１４Ａと第２大格子１４Ｂとの境界が目立ってしまい、視認性が劣化するという問題が生じるが、本実施の形態では、上述したように、くし歯３２の先端と直線部３０との重なりにより、第１大格子１４Ａと第２大格子１４Ｂとの境界が目立たなくなり、視認性が向上する。なお、第１絶縁部２４Ａと第２絶縁部２４Ｂとが対向する部分は、中格子１つ分の開口が形成されることになるが、上述した線太りと異なり、光を遮るということがないため、外部に目立つということがほとんどない。特に、中格子１つ分の開口であれば、周りの小格子１８と比してサイズ的にもほとんど同じであるため、さらに目立たなくなる。   Here, for example, when the side portions of the first large lattice 14A and the second large lattice 14B are all formed as the straight portions 30, the width of the overlapping portion between the straight portions 30 is large due to a slight deviation in the overlay position accuracy. As a result, the boundary between the first large lattice 14A and the second large lattice 14B becomes conspicuous and the visibility deteriorates, but in this embodiment, as described above, Due to the overlap between the tips of the comb teeth 32 and the straight portion 30, the boundary between the first large lattice 14A and the second large lattice 14B becomes inconspicuous, and the visibility is improved. Note that an opening corresponding to one medium lattice is formed at a portion where the first insulating portion 24A and the second insulating portion 24B face each other. However, unlike the above-described line thickening, light is not blocked. Therefore, it is hardly noticeable outside. In particular, an opening corresponding to one medium lattice is almost the same in terms of size as compared with the surrounding small lattice 18, and therefore becomes less conspicuous.

また、第１接続部１６Ａと第２接続部１６Ｂとが対向した部分を上面から見たとき、第２接続部１６Ｂの第５中格子２０ｅと第７中格子２０ｇとの交点が第１大格子１４Ａの第２中格子２０ｂのほぼ中心に位置し、第２接続部１６Ｂの第６中格子２０ｆと第８中格子２０ｈとの交点が第１大格子１４Ａの第３中格子２０ｃのほぼ中心に位置することとなり、これら第１中格子２０ａ〜第８中格子２０ｈの組み合わせによって、複数の小格子１８が形成された形態となる。すなわち、第１接続部１６Ａと第２接続部１６Ｂとが対向した部分に、第１接続部１６Ａと第２接続部１６Ｂの組み合わせによって、複数の小格子１８が配列された形態となり、周りの第１大格子１４Ａを構成する小格子１８や第２大格子１４Ｂを構成する小格子１８と見分けがつかなくなり、視認性が向上する。   Further, when the portion where the first connection portion 16A and the second connection portion 16B are opposed to each other is viewed from above, the intersection of the fifth middle lattice 20e and the seventh middle lattice 20g of the second connection portion 16B is the first large lattice. 14A is located substantially at the center of the second middle grating 20b, and the intersection of the sixth middle grating 20f and the eighth middle grating 20h of the second connecting portion 16B is at the middle of the third middle grating 20c of the first large grating 14A. A plurality of small lattices 18 are formed by a combination of the first medium lattice 20a to the eighth medium lattice 20h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 16A and the second connection portion 16B face each other by a combination of the first connection portion 16A and the second connection portion 16B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 14A and the small lattice 18 constituting the second large lattice 14B, and visibility is improved.

そして、この第１タッチパネル用導電シート５０Ａをタッチパネルとして使用する場合は、第１導電シート１０Ａ上に保護層を形成し、第１導電シート１０Ａの多数の第１透明導電パターン２２Ａから導出された第１外部配線４０Ａと、第２導電シート１０Ｂの多数の第２透明導電パターン２２Ｂから導出された第２外部配線４０Ｂとを、例えば位置演算を行うＩＣ回路に接続する。   When this first touch panel conductive sheet 50A is used as a touch panel, a protective layer is formed on the first conductive sheet 10A, and the first conductive sheet 10A is derived from a large number of first transparent conductive patterns 22A. The first external wiring 40A and the second external wiring 40B derived from the multiple second transparent conductive patterns 22B of the second conductive sheet 10B are connected to, for example, an IC circuit that performs position calculation.

指先を保護層上に接触させることで、指先に対向する第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂからの信号がＩＣ回路に伝達される。ＩＣ回路では、供給された信号に基づいて指先の位置を演算する。従って、同時に２つの指先を接触させても、各指先の位置を検出することが可能となる。   By bringing the fingertip into contact with the protective layer, signals from the first transparent conductive pattern 22A and the second transparent conductive pattern 22B facing the fingertip are transmitted to the IC circuit. The IC circuit calculates the position of the fingertip based on the supplied signal. Therefore, even if two fingertips are brought into contact at the same time, the position of each fingertip can be detected.

このように、第１タッチパネル用導電シート５０Ａにおいては、該第１タッチパネル用導電シート５０Ａを用いて例えば投影型静電容量方式のタッチパネルに適用した場合に、応答速度を速めることができ、タッチパネルの大サイズ化を促進させることができる。しかも、第１導電シート１０Ａの第１大格子１４Ａと第２導電シート１０Ｂの第２大格子１４Ｂとの境界が目立たなくなり、また、第１接続部１６Ａと第２接続部１６Ｂとの組み合わせによって複数の小格子１８が形づくられることから、局部的に線太りが生じる等の不都合がなくなり、全体として、視認性が良好となる。   As described above, in the first touch panel conductive sheet 50A, when the first touch panel conductive sheet 50A is applied to, for example, a projected capacitive touch panel, the response speed can be increased. Increase in size can be promoted. Moreover, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B becomes inconspicuous, and there are a plurality of combinations depending on the combination of the first connection portion 16A and the second connection portion 16B. Since the small lattice 18 is formed, there is no inconvenience such as local thickening of the line, and the visibility is improved as a whole.

上述の第１タッチパネル用導電シート５０Ａでは、図３及び図４Ａに示すように、第１透明基体１２Ａの一主面に第１透明導電パターン２２Ａを形成し、第２透明基体１２Ｂの一主面に第２透明導電パターン２２Ｂを形成するようにしたが、その他、図４Ｂに示すように、第１透明基体１２Ａの一主面に第１透明導電パターン２２Ａを形成し、第１透明基体１２Ａの他主面に第２透明導電パターン２２Ｂを形成するようにしてもよい。また、第１導電シート１０Ａと第２導電シート１０Ｂとはその間に他の層が存在してもよく、第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂとが絶縁状態であれば、それらが対向して配置されてもよい。   In the first touch panel conductive sheet 50A described above, as shown in FIGS. 3 and 4A, the first transparent conductive pattern 22A is formed on one main surface of the first transparent substrate 12A, and the one main surface of the second transparent substrate 12B. The second transparent conductive pattern 22B is formed on the first transparent substrate 12A, but as shown in FIG. 4B, the first transparent conductive pattern 22A is formed on one main surface of the first transparent substrate 12A. The second transparent conductive pattern 22B may be formed on the other main surface. In addition, there may be another layer between the first conductive sheet 10A and the second conductive sheet 10B, and if the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are in an insulating state, they are You may arrange | position facing.

次に、第２の実施の形態に係るタッチパネル用導電シート（以下、第２タッチパネル用導電シート５０Ｂと記す）について図７〜図１０を参照しながら説明する。
この第２タッチパネル用導電シート５０Ｂは、図７に示すように、上述した第１タッチパネル用導電シート５０Ａとほぼ同様の構成を有するが、図８に示すように、第１大格子１４Ａの第１辺部２８ａ〜第４辺部２８ｄがそれぞれ２以上の矩形形状が配列された矩形波形状を有し、図９に示すように、第２大格子１４Ｂの第５辺部２８ｅ〜第８辺部２８ｈがそれぞれ２以上の矩形形状が配列された矩形波形状を有する点で異なる。 Next, a touch panel conductive sheet (hereinafter referred to as a second touch panel conductive sheet 50B) according to a second embodiment will be described with reference to FIGS.
The second touch panel conductive sheet 50B has substantially the same configuration as the first touch panel conductive sheet 50A described above, as shown in FIG. 7, but as shown in FIG. Each of the side portions 28a to 28d has a rectangular wave shape in which two or more rectangular shapes are arranged. As shown in FIG. 9, the fifth side portion 28e to the eighth side portion of the second large lattice 14B. 28h is different in that each has a rectangular wave shape in which two or more rectangular shapes are arranged.

具体的には、第１大格子１４Ａについては、図１に示す第１導電シート１０Ａの第１大格子１４Ａの第１辺部２８ａ及び第２辺部２８ｂの各くし歯３２をそれぞれ１つ置きに繋いで、小格子１８を１つ置きに配列させた形態にし、第３辺部２８ｃ及び第４辺部２８ｄの各直線部３０をそれぞれ１つ置きに分離して、小格子１８を１つ置きに配列させた形態にすることで、図８に示すように、第２タッチパネル用導電シート５０Ｂの第１大格子１４Ａの第１辺部２８ａ〜第４辺部２８ｄを、それぞれ２以上の矩形形状が配列された矩形波形状を有するようにし、特に、第１大格子１４Ａの第１辺部２８ａと該第１辺部２８ａと対向する第４辺部２８ｄの各矩形波形状が互い違いとなり、第１大格子１４Ａの第２辺部２８ｂと該第２辺部２８ｂと対向する第３辺部２８ｃの各矩形波形状が互い違いとなるようにしている。   Specifically, for the first large lattice 14A, one comb tooth 32 on each of the first side portion 28a and the second side portion 28b of the first large lattice 14A of the first conductive sheet 10A shown in FIG. Are connected to each other, so that every other small lattice 18 is arranged, and each straight portion 30 of the third side portion 28c and the fourth side portion 28d is separated every other portion, so that one small lattice 18 is provided. As shown in FIG. 8, the first side portion 28a to the fourth side portion 28d of the first large lattice 14A of the second touch panel conductive sheet 50B are each made up of two or more rectangular shapes by arranging them in a separate arrangement. In particular, the rectangular wave shapes of the first side lattice 28a of the first large lattice 14A and the fourth side portion 28d facing the first side portion 28a are staggered so that the shapes are arranged, The second side portion 28b and the second side portion 28b of the first large lattice 14A Each rectangular wave shape of the third side portion 28c which direction is set to be staggered.

同様に、第２大格子１４Ｂについて、図５に示す第２導電シート１０Ｂ（第１タッチパネル用導電シート５０Ａ）の第２大格子１４Ｂの第５辺部２８ｅ及び第７辺部２８ｇの各くし歯３２をそれぞれ１つ置きに繋いで、小格子１８を１つ置きに配列させた形態にし、第６辺部２６ｆ及び第８辺部２８ｈの各直線部３０をそれぞれ１つ置きに分離して、小格子１８を１つ置きに配列させた形態にすることで、第２タッチパネル用導電シート５０Ｂの第２大格子１４Ｂの第５辺部２８ｅ〜第８辺部２８ｈを、それぞれ２以上の矩形形状が配列された矩形波形状を有するようにし、特に、第２大格子１４Ｂの第５辺部２８ｅと該
第５辺部２８ｅと対向する第８辺部２８ｈの各矩形波形状が互い違いとなり、第２大格子１４Ｂの第６辺部２８ｆと該第６辺部２８ｆと対向する第７辺部２８ｇの各矩形波形状が互い違いとなるようにしている。 Similarly, for the second large lattice 14B, the comb teeth of the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B of the second conductive sheet 10B (first touch panel conductive sheet 50A) shown in FIG. 32 is connected to every other one, and the small lattices 18 are arranged every other one, and each straight line part 30 of the sixth side part 26f and the eighth side part 28h is separated into every other part, By arranging every other small lattice 18 in an array, the fifth side portion 28e to the eighth side portion 28h of the second large lattice 14B of the conductive sheet 50B for the second touch panel have two or more rectangular shapes, respectively. In particular, the rectangular wave shapes of the fifth side portion 28e of the second large lattice 14B and the eighth side portion 28h opposed to the fifth side portion 28e are staggered, The sixth side portion 28f of the two large lattices 14B and the Each rectangular wave shape of the seventh side portion 28g which faces the side portion 28f is set to be staggered.

そして、例えば第２導電シート１０Ｂ上に第１導電シート１０Ａを積層して第２タッチパネル用導電シート５０Ｂとしたとき、図１０に示すように、第１タッチパネル用導電シート５０Ａ（図６参照）の場合と同様に、第１透明導電パターン２２Ａの第１接続部１６Ａと第２透明導電パターン２２Ｂの第２接続部１６Ｂとが第１透明基体１２Ａ（図４Ａ参照）を間に挟んで対向し、第１透明導電パターン２２Ａの第１絶縁部２４Ａと第２透明導電パターン２２Ｂの第２絶縁部２４Ｂとが第１透明基体１２Ａを間に挟んで対向した形態となる。なお、第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂの各線幅は同じであるが、図１０においても図６と同様に、第１透明導電パターン２２Ａと第２透明導電パターン２２Ｂの位置がわかるように、第１透明導電パターン２２Ａの線幅を太く、第２透明導電パターン２２Ｂの線幅を細くして誇張して図示してある。   For example, when the first conductive sheet 10A is stacked on the second conductive sheet 10B to form the second touch panel conductive sheet 50B, as shown in FIG. 10, the first touch panel conductive sheet 50A (see FIG. 6) Similarly to the case, the first connection portion 16A of the first transparent conductive pattern 22A and the second connection portion 16B of the second transparent conductive pattern 22B are opposed to each other with the first transparent base 12A (see FIG. 4A) interposed therebetween, The first insulating portion 24A of the first transparent conductive pattern 22A and the second insulating portion 24B of the second transparent conductive pattern 22B are opposed to each other with the first transparent base 12A interposed therebetween. Although the line widths of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are the same, the positions of the first transparent conductive pattern 22A and the second transparent conductive pattern 22B in FIG. 10 are the same as in FIG. As can be seen, the line width of the first transparent conductive pattern 22A is widened and the line width of the second transparent conductive pattern 22B is thinned and exaggerated.

積層した第１導電シート１０Ａ及び第２導電シート１０Ｂを上面から見たとき、第１導電シート１０Ａに形成された第１大格子１４Ａの隙間を埋めるように、第２導電シート１０Ｂの第２大格子１４Ｂが配列された形態となる。このとき、第１大格子１４Ａの第１辺部２８ａ及び第２辺部２８ｂにおける各矩形波形状の凹部４２ａの開口部分が第２大格子１４Ｂの第６辺部２８ｆ及び第８辺部２８ｈの各矩形波形状の凸部１８ｂの先端部分にて接続されたような形状となって、結果的に小格子１８が連続して配列された形態となり、同様に、第１大格子１４Ａの第３辺部２８ｃ及び第４辺部２８ｄにおける各矩形波形状の凹部４２ａの開口部分が第２大格子１４Ｂの第５辺部２８ｅ及び第７辺部２８ｇの各矩形波形状の凸部４２ｂの先端部分にて接続されたような形状となって、結果的に小格子が連続して配列された形態となり、第１大格子１４Ａと第２大格子１４Ｂとの境界をほとんど見分けることができない状態となる。つまり、矩形波形状の凹部４２ａの開口部分と凸部４２ｂの先端部分との重なりにより、第１大格子１４Ａと第２大格子１４Ｂとの境界が目立たなくなり、視認性が向上する。なお、第１絶縁部２４Ａと第２絶縁部２４Ｂとが対向する部分は、十字形状の開口が形成されることになるが、上述した線太りと異なり、光を遮るということがないため、外部に目立つということがほとんどない。   When the stacked first conductive sheet 10A and second conductive sheet 10B are viewed from above, the second large size of the second conductive sheet 10B is filled so as to fill the gaps of the first large lattice 14A formed in the first conductive sheet 10A. The lattice 14B is arranged. At this time, the opening portions of the rectangular wave-shaped concave portions 42a in the first side portion 28a and the second side portion 28b of the first large lattice 14A correspond to the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. It becomes a shape that is connected at the tip of each rectangular wave-shaped convex portion 18b, resulting in a form in which the small lattices 18 are continuously arranged. Similarly, the third large lattice 14A has a third shape. The opening portions of the rectangular wave-shaped concave portions 42a in the side portion 28c and the fourth side portion 28d are the tip portions of the rectangular wave-shaped convex portions 42b of the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B. As a result, the small lattices are continuously arranged, and the boundary between the first large lattice 14A and the second large lattice 14B is almost indistinguishable. . That is, the overlap between the opening portion of the rectangular wave-shaped concave portion 42a and the tip portion of the convex portion 42b makes the boundary between the first large lattice 14A and the second large lattice 14B inconspicuous, and visibility is improved. Note that a cross-shaped opening is formed at the portion where the first insulating portion 24A and the second insulating portion 24B face each other. However, unlike the above-described line weighting, the portion does not block light. There is almost no noticeable.

第１接続部１６Ａと第２接続部１６Ｂとが対向した部分についても、第１タッチパネル用導電シート５０Ａと同様に、第２接続部１６Ｂの第５中格子２０ｅと第７中格子２０ｇとの交点が第１接続部１６Ａの第２中格子２０ｂのほぼ中心に位置し、第２接続部１６Ｂの第６中格子２０ｆと第８中格子２０ｈとの交点が第１接続部１６Ａの第３中格子２０ｃのほぼ中心に位置することとなり、これら第１中格子２０ａ〜第８中格子２０ｈの組み合わせによって、複数の小格子１８が形成された形態となる。すなわち、第１接続部１６Ａと第２接続部１６Ｂとが対向した部分に、第１接続部１６Ａと第２接続部１６Ｂの組み合わせによって、複数の小格子１８が配列された形態となり、周りの第１大格子１４Ａを構成する小格子１８や第２大格子１４Ｂを構成する小格子１８と見分けがつかなくなり、視認性が向上する。   Also about the part where 16 A of 1st connection parts and the 2nd connection part 16B faced, the intersection of the 5th middle grating | lattice 20e of the 2nd connection part 16B and the 7th middle grating | lattice 20g similarly to the conductive sheet 50A for 1st touch panels. Is located approximately at the center of the second intermediate lattice 20b of the first connection portion 16A, and the intersection of the sixth intermediate lattice 20f and the eighth intermediate lattice 20h of the second connection portion 16B is the third intermediate lattice of the first connection portion 16A. The plurality of small lattices 18 are formed by a combination of the first intermediate lattice 20a to the eighth intermediate lattice 20h. That is, a plurality of small lattices 18 are arranged in a portion where the first connection portion 16A and the second connection portion 16B face each other by a combination of the first connection portion 16A and the second connection portion 16B. It becomes indistinguishable from the small lattice 18 constituting the first large lattice 14A and the small lattice 18 constituting the second large lattice 14B, and visibility is improved.

このように、第２タッチパネル用導電シート５０Ｂにおいても、該第２タッチパネル用導電シート５０Ｂを用いて例えば投影型静電容量方式のタッチパネルに適用した場合に、応答速度を速めることができ、タッチパネルの大サイズ化を促進させることができる。しかも、第１導電シート１０Ａの第１大格子１４Ａと第２導電シート１０Ｂの第２大格子１４Ｂとの境界が目立たなくなり、また、第１接続部１６Ａと第２接続部１６Ｂとの組み合わせによって複数の小格子１８が形づくられることから、局部的に線太りが生じる等の不都合がなくなり、全体として、視認性が良好となる。   As described above, in the second touch panel conductive sheet 50B, when the second touch panel conductive sheet 50B is applied to, for example, a projected capacitive touch panel, the response speed can be increased. Increase in size can be promoted. Moreover, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B becomes inconspicuous, and there are a plurality of combinations depending on the combination of the first connection portion 16A and the second connection portion 16B. Since the small lattice 18 is formed, there is no inconvenience such as local thickening of the line, and the visibility is improved as a whole.

特に、この第２タッチパネル用導電シート５０Ｂにおいては、第１大格子１４Ａの４つの辺（第１辺部２８ａ〜第４辺部２８ｄ）並びに第２大格子１４Ｂの４つの辺（第５辺部２８ｅ〜第８辺部２８ｈ）の形状がいずれも矩形波形状であって、各辺の形状が等価的に同一となっていることから、第１大格子１４Ａや第２大格子１４Ｂの端部での電荷の局在化が抑制され、指先位置の誤検出を防ぐことができる。   In particular, in this second touch panel conductive sheet 50B, four sides (first side portion 28a to fourth side portion 28d) of the first large lattice 14A and four sides (fifth side portion) of the second large lattice 14B. 28e to 8th side portion 28h) are all rectangular wave shapes, and the shape of each side is equivalently the same, so the end portions of the first large lattice 14A and the second large lattice 14B In this case, the localization of electric charges at the fingertips is suppressed, and erroneous detection of the fingertip position can be prevented.

上述した第１導電シート１０Ａ及び第２導電シート１０Ｂにおいては、第１接続部１６Ａ及び第２接続部１６Ｂを構成する中格子２０の配列ピッチＰｍを小格子１８の配列ピッチＰｓの２倍に設定したが、その他、１．５倍、３倍等、中格子の数に応じて任意に設定することができる。中格子２０の配列ピッチＰｍは、その間隔が狭すぎたり、大きすぎたりすると、大格子１４の配置が難しくなり、見栄えが悪くなることがあることから、小格子１８の配列ピッチＰｓの１〜１０倍が好ましく、１〜５倍がより好ましい。   In the first conductive sheet 10A and the second conductive sheet 10B described above, the arrangement pitch Pm of the intermediate lattice 20 constituting the first connection portion 16A and the second connection portion 16B is set to twice the arrangement pitch Ps of the small lattice 18. However, it can be arbitrarily set according to the number of medium lattices, such as 1.5 times or 3 times. Since the arrangement pitch Pm of the medium lattice 20 is too narrow or too large, the arrangement of the large lattice 14 becomes difficult and the appearance may be deteriorated. 10 times is preferable and 1 to 5 times is more preferable.

また、小格子１８のサイズ（１辺の長さや対角線の長さ等）や、第１大格子１４Ａを構成する小格子１８の個数、第２大格子１４Ｂを構成する小格子１８の個数も、適用されるタッチパネルのサイズや分解能（配線数）に応じて適宜設定することができる。   Further, the size of the small lattice 18 (the length of one side, the length of the diagonal line, etc.), the number of small lattices 18 constituting the first large lattice 14A, and the number of small lattices 18 constituting the second large lattice 14B, It can be set as appropriate according to the size and resolution (number of wires) of the applied touch panel.

次に、第１導電シート１０Ａや第２導電シート１０Ｂを製造する方法としては、例えば第１透明基体１２Ａ上及び第２透明基体１２Ｂ上に感光性ハロゲン化銀塩を含有する乳剤層を有する感光材料を露光し、現像処理を施すことによって、露光部及び未露光部にそれぞれ金属銀部及び光透過性部を形成して第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂを形成するようにしてもよい。なお、さらに金属銀部に物理現像及び／又はめっき処理を施すことによって金属銀部に導電性金属を担持させるようにしてもよい。   Next, as a method for producing the first conductive sheet 10A and the second conductive sheet 10B, for example, a photosensitive having an emulsion layer containing a photosensitive silver halide salt on the first transparent substrate 12A and the second transparent substrate 12B. The material is exposed and developed to form the first transparent conductive pattern 22A and the second transparent conductive pattern 22B by forming a metallic silver portion and a light transmissive portion in the exposed portion and the unexposed portion, respectively. May be. In addition, you may make it carry | support a conductive metal to a metal silver part by giving a physical development and / or a plating process to a metal silver part further.

あるいは、第１透明基体１２Ａ及び第２透明基体１２Ｂ上に形成された銅箔上のフォトレジスト膜を露光、現像処理してレジストパターンを形成し、レジストパターンから露出する銅箔をエッチングすることによって、第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂを形成するようにしてもよい。   Alternatively, the photoresist film on the copper foil formed on the first transparent substrate 12A and the second transparent substrate 12B is exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern is etched. The first transparent conductive pattern 22A and the second transparent conductive pattern 22B may be formed.

あるいは、第１透明基体１２Ａ及び第２透明基体１２Ｂ上に金属微粒子を含むペーストを印刷し、ペーストに金属めっきを行うことによって、第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂを形成するようにしてもよい。   Alternatively, the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are formed by printing a paste containing metal fine particles on the first transparent substrate 12A and the second transparent substrate 12B and performing metal plating on the paste. It may be.

第１透明基体１２Ａ及び第２透明基体１２Ｂ上に、第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂをスクリーン印刷版又はグラビア印刷版によって印刷形成するようにしてもよい。   The first transparent conductive pattern 22A and the second transparent conductive pattern 22B may be printed and formed on the first transparent substrate 12A and the second transparent substrate 12B by a screen printing plate or a gravure printing plate.

次に、本実施の形態に係る第１導電シート１０Ａ及び第２導電シート１０Ｂにおいて、特に好ましい態様であるハロゲン化銀写真感光材料を用いる方法を中心にして述べる。
本実施の形態に係る第１導電シート１０Ａ及び第２導電シート１０Ｂの製造方法は、感光材料と現像処理の形態によって、次の３通りの形態が含まれる。
（１） 物理現像核を含まない感光性ハロゲン化銀黒白感光材料を化学現像又は熱現像して金属銀部を該感光材料上に形成させる態様。
（２） 物理現像核をハロゲン化銀乳剤層中に含む感光性ハロゲン化銀黒白感光材料を溶解物理現像して金属銀部を該感光材料上に形成させる態様。
（３） 物理現像核を含まない感光性ハロゲン化銀黒白感光材料と、物理現像核を含む非感光性層を有する受像シートを重ね合わせて拡散転写現像して金属銀部を非感光性受像シート上に形成させる態様。 Next, in the first conductive sheet 10A and the second conductive sheet 10B according to this embodiment, a method using a silver halide photographic light-sensitive material that is a particularly preferable aspect will be mainly described.
The manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment includes the following three modes depending on the mode of the photosensitive material and the development process.
(1) A mode in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material.
(2) An embodiment in which a photosensitive silver halide black-and-white photosensitive material containing physical development nuclei in a silver halide emulsion layer is dissolved and physically developed to form a metallic silver portion on the photosensitive material.
(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei and an image receiving sheet having a non-photosensitive layer containing physical development nuclei are overlapped and developed by diffusion transfer, and the metallic silver portion is non-photosensitive image-receiving sheet. Form formed on top.

上記（１）の態様は、一体型黒白現像タイプであり、感光材料上に光透過性導電膜等の透光性導電性膜が形成される。得られる現像銀は化学現像銀又は熱現像銀であり、高比表面のフィラメントである点で後続するめっき又は物理現像過程で活性が高い。
上記（２）の態様は、露光部では、物理現像核近縁のハロゲン化銀粒子が溶解されて現像核上に沈積することによって感光材料上に光透過性導電性膜等の透光性導電性膜が形成される。これも一体型黒白現像タイプである。現像作用が、物理現像核上への析出であるので高活性であるが、現像銀は比表面の小さい球形である。
上記（３）の態様は、未露光部においてハロゲン化銀粒子が溶解されて拡散して受像シート上の現像核上に沈積することによって受像シート上に光透過性導電性膜等の透光性導電性膜が形成される。いわゆるセパレートタイプであって、受像シートを感光材料から剥離して用いる態様である。 The aspect (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the above aspect (2), the light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material by dissolving silver halide grains close to the physical development nucleus and depositing on the development nucleus in the exposed portion. A characteristic film is formed. This is also an integrated black-and-white development type. Although the development action is precipitation on the physical development nuclei, it is highly active, but developed silver is a sphere with a small specific surface.
In the above aspect (3), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby a light transmitting conductive film or the like is formed on the image receiving sheet. A conductive film is formed. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.

いずれの態様もネガ型現像処理及び反転現像処理のいずれの現像を選択することもできる（拡散転写方式の場合は、感光材料としてオートポジ型感光材料を用いることによってネガ型現像処理が可能となる）。   In either embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer method, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .

ここでいう化学現像、熱現像、溶解物理現像、拡散転写現像は、当業界で通常用いられている用語どおりの意味であり、写真化学の一般教科書、例えば菊地真一著「写真化学」（共立出版社、１９５５年刊行）、Ｃ．Ｅ．Ｋ．Ｍｅｅｓ編「Ｔｈｅ Ｔｈｅｏｒｙ ｏｆ Ｐｈｏｔｏｇｒａｐｈｉｃ Ｐｒｏｃｅｓｓｅｓ， ４ｔｈ ｅｄ．」（Ｍｃｍｉｌｌａｎ社、１９７７年刊行）に解説されている。本件は液処理に係る発明であるが、その他の現像方式として熱現像方式を適用する技術も参考にすることができる。例えば、特開２００４−１８４６９３号、同２００４−３３４０７７号、同２００５−０１０７５２号の各公報、特願２００４−２４４０８０号、同２００４−０８５６５５号の各明細書に記載された技術を適用することができる。   The chemical development, thermal development, dissolution physical development, and diffusion transfer development mentioned here have the same meanings as are commonly used in the industry, and are general textbooks of photographic chemistry such as Shinichi Kikuchi, “Photochemistry” (Kyoritsu Publishing) (Published in 1955), C.I. E. K. It is described in "The Theory of Photographic Processes, 4th ed." Edited by Mees (Mcmillan, 1977). Although this case is an invention related to liquid processing, a technique of applying a thermal development system as another development system can also be referred to. For example, the techniques described in Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, and 2005-010752, and Japanese Patent Application Nos. 2004-244080 and 2004-085655 can be applied. it can.

ここで、本実施の形態に係る第１導電シート１０Ａ及び第２導電シート１０Ｂの各層の構成について、以下に詳細に説明する。   Here, the configuration of each layer of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment will be described in detail below.

［第１透明基体１２Ａ、第２透明基体１２Ｂ］
第１透明基体１２Ａ及び第２透明基体１２Ｂとしては、プラスチックフイルム、プラスチック板、ガラス板等を挙げることができる。 [First Transparent Base 12A, Second Transparent Base 12B]
Examples of the first transparent substrate 12A and the second transparent substrate 12B include a plastic film, a plastic plate, and a glass plate.

上記プラスチックフイルム及びプラスチック板の原料としては、例えば、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）等のポリエステル類；ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、ポリスチレン、ＥＶＡ等のポリオレフィン類；ビニル系樹脂；その他、ポリカーボネート（ＰＣ）、ポリアミド、ポリイミド、アクリル樹脂、トリアセチルセルロース（ＴＡＣ）等を用いることができる。   Examples of the raw material for the plastic film and the plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; Resin; In addition, polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) and the like can be used.

第１透明基体１２Ａ及び第２透明基体１２Ｂとしては、ＰＥＴ（融点：２５８℃）、ＰＥＮ（融点：２６９℃）、ＰＥ（融点：１３５℃）、ＰＰ（融点：１６３℃）、ポリスチレン（融点：２３０℃）、ポリ塩化ビニル（融点：１８０℃）、ポリ塩化ビニリデン（融点：２１２℃）やＴＡＣ（融点：２９０℃）等の融点が約２９０℃以下であるプラスチックフィルム、又はプラスチック板が好ましく、特に、光透過性や加工性等の観点から、ＰＥＴが好ましい。第１タッチパネル用導電シート５０Ａや第２タッチパネル用導電シート５０Ｂに使用される第１導電シート１０Ａ及び第２導電シート１０Ｂのような透明導電性フイルムは透明性が要求されるため、第１透明基体１２Ａ及び第２透明基体１２Ｂの透明度は高いことが好ましい。   As the first transparent substrate 12A and the second transparent substrate 12B, PET (melting point: 258 ° C.), PEN (melting point: 269 ° C.), PE (melting point: 135 ° C.), PP (melting point: 163 ° C.), polystyrene (melting point: 230 ° C.), polyvinyl chloride (melting point: 180 ° C.), polyvinylidene chloride (melting point: 212 ° C.), TAC (melting point: 290 ° C.) or the like, preferably a plastic film or plastic plate having a melting point of about 290 ° C. or less, In particular, PET is preferable from the viewpoints of light transmittance and processability. Since the transparent conductive films such as the first conductive sheet 10A and the second conductive sheet 10B used for the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B are required to be transparent, the first transparent substrate is used. The transparency of 12A and the second transparent substrate 12B is preferably high.

［銀塩乳剤層］
第１導電シート１０Ａ及び第２導電シート１０Ｂの導電層（第１大格子１４Ａ、第１接続部１６Ａ、第２大格子１４Ｂ、第２接続部１６Ｂ、小格子１８等の導電部）となる銀塩乳剤層は、銀塩とバインダーの他、溶媒や染料等の添加剤を含有する。 [Silver salt emulsion layer]
Silver used as conductive layers (conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18) of the first conductive sheet 10A and the second conductive sheet 10B. The salt emulsion layer contains additives such as a solvent and a dye in addition to the silver salt and the binder.

本実施の形態に用いられる銀塩としては、ハロゲン化銀等の無機銀塩及び酢酸銀等の有機銀塩が挙げられる。本実施の形態においては、光センサーとしての特性に優れるハロゲン化銀を用いることが好ましい。   Examples of the silver salt used in the present embodiment include inorganic silver salts such as silver halide and organic silver salts such as silver acetate. In the present embodiment, it is preferable to use silver halide having excellent characteristics as an optical sensor.

銀塩乳剤層の塗布銀量（銀塩の塗布量）は、銀に換算して１〜３０ｇ／ｍ２が好ましく、１〜２５ｇ／ｍ２がより好ましく、５〜２０ｇ／ｍ２がさらに好ましい。この塗布銀量を上記範囲とすることで、第１タッチパネル用導電シート５０Ａや第２タッチパネル用導電シート５０Ｂとした場合に所望の表面抵抗を得ることができる。 Silver coating amount of silver salt emulsion layer (coating amount of silver salt) is preferably from 1 to 30 g / m 2 in terms of silver, more preferably 1 to 25 g / m 2, more preferably 5 to 20 g / m 2 . By setting the coated silver amount within the above range, a desired surface resistance can be obtained when the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B are used.

本実施の形態に用いられるバインダーとしては、例えば、ゼラチン、ポリビニルアルコール（ＰＶＡ）、ポリビニルピロリドン（ＰＶＰ）、澱粉等の多糖類、セルロース及びその誘導体、ポリエチレンオキサイド、ポリビニルアミン、キトサン、ポリリジン、ポリアクリル酸、ポリアルギン酸、ポリヒアルロン酸、カルボキシセルロース等が挙げられる。これらは、官能基のイオン性によって中性、陰イオン性、陽イオン性の性質を有する。   Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch and other polysaccharides, cellulose and derivatives thereof, polyethylene oxide, polyvinyl amine, chitosan, polylysine, and polyacryl. Examples include acid, polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

本実施の形態の銀塩乳剤層１６中に含有されるバインダーの含有量は、特に限定されず、分散性と密着性を発揮し得る範囲で適宜決定することができる。銀塩乳剤層１６中のバインダーの含有量は、銀／バインダー体積比で１／４以上が好ましく、１／２以上がより好ましい。銀／バインダー体積比は、１００／１以下が好ましく、５０／１以下がより好ましい。また、銀／バインダー体積比は１／１〜４／１であることがさらに好ましい。１／１〜３／１であることが最も好ましい。銀塩乳剤層中の銀／バインダー体積比をこの範囲にすることで、塗布銀量を調整した場合でも抵抗値のばらつきを抑制し、均一な表面抵抗を有する第１タッチパネル用導電シート５０Ａや第２タッチパネル用導電シート５０Ｂを得ることができる。なお、銀／バインダー体積比は、原料のハロゲン化銀量／バインダー量（重量比）を銀量／バインダー量（重量比）に変換し、さらに、銀量／バインダー量（重量比）を銀量／バインダー量（体積比）に変換することで求めることができる。   The content of the binder contained in the silver salt emulsion layer 16 of the present embodiment is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer 16 is preferably 1/4 or more, and more preferably 1/2 or more in terms of a silver / binder volume ratio. The silver / binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. The silver / binder volume ratio is more preferably 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver / binder volume ratio in the silver salt emulsion layer within this range, even when the amount of coated silver is adjusted, variation in resistance value is suppressed, and the first touch panel conductive sheet 50A having a uniform surface resistance, A conductive sheet 50B for two touch panels can be obtained. The silver / binder volume ratio is converted from the amount of silver halide / binder amount (weight ratio) of the raw material to the amount of silver / binder amount (weight ratio), and the amount of silver / binder amount (weight ratio) is further converted to the silver amount. / It can obtain | require by converting into binder amount (volume ratio).

＜溶媒＞
銀塩乳剤層の形成に用いられる溶媒は、特に限定されるものではないが、例えば、水、有機溶媒（例えば、メタノール等のアルコール類、アセトン等のケトン類、ホルムアミド等のアミド類、ジメチルスルホキシド等のスルホキシド類、酢酸エチル等のエステル類、エーテル類等）、イオン性液体、及びこれらの混合溶媒を挙げることができる。
本実施の形態の銀塩乳剤層に用いられる溶媒の含有量は、銀塩乳剤層に含まれる銀塩、バインダー等の合計の質量に対して３０〜９０質量％の範囲であり、５０〜８０質量％の範囲であることが好ましい。
＜その他の添加剤＞
本実施の形態に用いられる各種添加剤に関しては、特に制限は無く、公知のものを好ましく用いることができる。 <Solvent>
The solvent used for forming the silver salt emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl sulfoxide, etc. Sulphoxides such as, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the silver salt emulsion layer of the present embodiment is in the range of 30 to 90% by mass with respect to the total mass of the silver salt and binder contained in the silver salt emulsion layer, and 50 to 80 It is preferably in the range of mass%.
<Other additives>
There are no particular restrictions on the various additives used in the present embodiment, and known ones can be preferably used.

［その他の層構成］
銀塩乳剤層の上に図示しない保護層を設けてもよい。本実施の形態において「保護層」とは、ゼラチンや高分子ポリマーといったバインダーからなる層を意味し、擦り傷防止や力学特性を改良する効果を発現するために感光性を有する銀塩乳剤層上に形成される。その厚みは０．５μｍ以下が好ましい。保護層の塗布方法及び形成方法は特に限定されず、公知の塗布方法及び形成方法を適宜選択することができる。また、銀塩乳剤層１６よりも下に、例えば下塗り層を設けることもできる。 [Other layer structure]
A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the “protective layer” means a layer made of a binder such as gelatin or a high molecular polymer, and is formed on a silver salt emulsion layer having photosensitivity in order to exhibit an effect of preventing scratches and improving mechanical properties. It is formed. The thickness is preferably 0.5 μm or less. The coating method and forming method of the protective layer are not particularly limited, and a known coating method and forming method can be appropriately selected. An undercoat layer, for example, can be provided below the silver salt emulsion layer 16.

次に、第１導電シート１０Ａ及び第２導電シート１０Ｂの作製方法の各工程について説明する。   Next, each step of the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B will be described.

［露光］
本実施の形態では、第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂを印刷方式によって施す場合を含むが、印刷方式以外は、第１透明導電パターン２２Ａ及び第２透明導電パターン２２Ｂを露光と現像等によって形成する。すなわち、第１透明基体１２Ａ及び第２透明基体１２Ｂ上に設けられた銀塩含有層を有する感光材料又はフォトリソグラフィ用フォトポリマーを塗工した感光材料への露光を行う。露光は、電磁波を用いて行うことができる。電磁波としては、例えば、可視光線、紫外線等の光、Ｘ線等の放射線等が挙げられる。さらに露光には波長分布を有する光源を利用してもよく、特定の波長の光源を用いてもよい。 [exposure]
The present embodiment includes the case where the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are applied by a printing method, but the first transparent conductive pattern 22A and the second transparent conductive pattern 22B are exposed by exposure except for the printing method. It is formed by development or the like. That is, exposure is performed on a photosensitive material having a silver salt-containing layer provided on the first transparent substrate 12A and the second transparent substrate 12B or a photosensitive material coated with a photolithography photopolymer. The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

［現像処理］
本実施の形態では、乳剤層を露光した後、さらに現像処理が行われる。現像処理は、銀塩写真フイルムや印画紙、印刷製版用フイルム、フォトマスク用エマルジョンマスク等に用いられる通常の現像処理の技術を用いることができる。現像液については特に限定はしないが、ＰＱ現像液、ＭＱ現像液、ＭＡＡ現像液等を用いることもでき、市販品では、例えば、富士フイルム社処方のＣＮ−１６、ＣＲ−５６、ＣＰ４５Ｘ、ＦＤ−３、パピトール、ＫＯＤＡＫ社処方のＣ−４１、Ｅ−６、ＲＡ−４、Ｄ−１９、Ｄ−７２等の現像液、又はそのキットに含まれる現像液を用いることができる。また、リス現像液を用いることもできる。 [Development processing]
In this embodiment, after the emulsion layer is exposed, development processing is further performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but PQ developer, MQ developer, MAA developer and the like can also be used, and commercially available products include, for example, CN-16, CR-56, CP45X, FD prescribed by Fuji Film -3, Papitol, a developer such as C-41, E-6, RA-4, D-19, D-72, etc. formulated by KODAK, or a developer included in the kit can be used. A lith developer can also be used.

本発明における現像処理は、未露光部分の銀塩を除去して安定化させる目的で行われる定着処理を含むことができる。本発明における定着処理は、銀塩写真フイルムや印画紙、印刷製版用フイルム、フォトマスク用エマルジョンマスク等に用いられる定着処理の技術を用いることができる。   The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

上記定着工程における定着温度は、約２０℃〜約５０℃が好ましく、さらに好ましくは２５〜４５℃である。また、定着時間は５秒〜１分が好ましく、さらに好ましくは７秒〜５０秒である。定着液の補充量は、感光材料の処理量に対して６００ｍｌ／ｍ２以下が好ましく、５００ｍｌ／ｍ２以下がさらに好ましく、３００ｍｌ／ｍ２以下が特に好ましい。 The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / m 2 or less with respect to the processing of the photosensitive material, more preferably 500 ml / m 2 or less, 300 ml / m 2 or less is particularly preferred.

現像、定着処理を施した感光材料は、水洗処理や安定化処理を施されるのが好ましい。上記水洗処理又は安定化処理においては、水洗水量は通常感光材料１ｍ２当り、２０リットル以下で行われ、３リットル以下の補充量（０も含む、すなわちため水水洗）で行うこともできる。 The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the water washing treatment or the stabilization treatment, the washing water amount is usually 20 liters or less per 1 m 2 of the light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water).

現像処理後の露光部に含まれる金属銀の質量は、露光前の露光部に含まれていた銀の質量に対して５０質量％以上の含有率であることが好ましく、８０質量％以上であることがさらに好ましい。露光部に含まれる銀の質量が露光前の露光部に含まれていた銀の質量に対して５０質量％以上であれば、高い導電性を得ることができるため好ましい。   The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

本実施の形態における現像処理後の階調は、特に限定されるものではないが、４．０を超えることが好ましい。現像処理後の階調が４．０を超えると、光透過性部の透光性を高く保ったまま、導電性金属部の導電性を高めることができる。階調を４．０以上にする手段としては、例えば、前述のロジウムイオン、イリジウムイオンのドープが挙げられる。   The gradation after the development processing in the present embodiment is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the light transmissive property of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.

以上の工程を経て導電シートは得られるが、得られた導電シートの表面抵抗は０．１〜１００オーム／ｓｑ．の範囲にあることが好ましく、１〜１０オーム／ｓｑ．の範囲にあることがより好ましい。また、現像処理後の導電シートに対しては、さらにカレンダー処理を行ってもよく、カレンダー処理により所望の表面抵抗に調整することができる。   Although the conductive sheet is obtained through the above steps, the surface resistance of the obtained conductive sheet is 0.1 to 100 ohm / sq. Is preferably in the range of 1 to 10 ohm / sq. It is more preferable that it is in the range. Further, the conductive sheet after the development treatment may be further subjected to a calendar treatment, and can be adjusted to a desired surface resistance by the calendar treatment.

［物理現像及びめっき処理］
本実施の形態では、前記露光及び現像処理により形成された金属銀部の導電性を向上させる目的で、前記金属銀部に導電性金属粒子を担持させるための物理現像及び／又はめっき処理を行ってもよい。本発明では物理現像又はめっき処理のいずれか一方のみで導電性金属粒子を金属性銀部に担持させてもよく、物理現像とめっき処理とを組み合わせて導電性金属粒子を金属銀部に担持させてもよい。なお、金属銀部に物理現像及び／又はめっき処理を施したものを含めて「導電性金属部」と称する。 [Physical development and plating]
In the present embodiment, for the purpose of improving the conductivity of the metallic silver portion formed by the exposure and development processing, physical development and / or plating treatment for supporting the conductive metal particles on the metallic silver portion is performed. May be. In the present invention, the conductive metal particles may be supported on the metallic silver portion by only one of physical development and plating treatment, or the conductive metal particles are supported on the metallic silver portion by combining physical development and plating treatment. May be. In addition, the thing which performed the physical development and / or the plating process to the metal silver part is called "conductive metal part".

本実施の形態における「物理現像」とは、金属や金属化合物の核上に、銀イオン等の金属イオンを還元剤で還元して金属粒子を析出させることをいう。この物理現象は、インスタントＢ＆Ｗフイルム、インスタントスライドフイルムや、印刷版製造等に利用されており、本発明ではその技術を用いることができる。また、物理現像は、露光後の現像処理と同時に行っても、現像処理後に別途行ってもよい。   “Physical development” in the present embodiment means that metal particles such as silver ions are reduced by a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

本実施の形態において、めっき処理は、無電解めっき（化学還元めっきや置換めっき）、電解めっき、又は無電解めっきと電解めっきの両方を用いることができる。本実施の形態における無電解めっきは、公知の無電解めっき技術を用いることができ、例えば、プリント配線板等で用いられている無電解めっき技術を用いることができ、無電解めっきは無電解銅めっきであることが好ましい。   In the present embodiment, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating. For the electroless plating in the present embodiment, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Plating is preferred.

［酸化処理］
本実施の形態では、現像処理後の金属銀部、並びに、物理現像及び／又はめっき処理によって形成された導電性金属部には、酸化処理を施すことが好ましい。酸化処理を行うことにより、例えば、光透過性部に金属が僅かに沈着していた場合に、該金属を除去し、光透過性部の透過性をほぼ１００％にすることができる。 [Oxidation treatment]
In the present embodiment, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

［導電性金属部］
本実施の形態の導電性金属部の線幅は、５μｍ以上２００μｍ（０．２ｍｍ）以下から選択可能であるが、タッチパネルの材料としての用途である場合、５μｍ以上５０μｍ以下が好ましい。さらに好ましくは５μｍ以上３０μｍ以下、最も好ましくは５μｍ以上２０μｍ以下である。線間隔は３０μｍ以上５００μｍ以下であることが好ましく、さらに好ましくは５０μｍ以上４００μｍ以下、最も好ましくは１００μｍ以上３５０μｍ以下である。また、導電性金属部は、アース接続等の目的においては、線幅は２００μｍより広い部分を有していてもよい。 [Conductive metal part]
The line width of the conductive metal portion of the present embodiment can be selected from 5 μm to 200 μm (0.2 mm), but is preferably 5 μm to 50 μm when used as a touch panel material. More preferably, they are 5 micrometers or more and 30 micrometers or less, Most preferably, they are 5 micrometers or more and 20 micrometers or less. The line spacing is preferably 30 μm or more and 500 μm or less, more preferably 50 μm or more and 400 μm or less, and most preferably 100 μm or more and 350 μm or less. The conductive metal portion may have a portion whose line width is wider than 200 μm for the purpose of ground connection or the like.

本実施の形態における導電性金属部は、可視光透過率の点から開口率は８５％以上であることが好ましく、９０％以上であることがさらに好ましく、９５％以上であることが最も好ましい。開口率とは、第１大格子１４Ａ、第１接続部１６Ａ、第２大格子１４Ｂ、第２接続部１６Ｂ、小格子１８等の導電部を除いた透光性部分が全体に占める割合であり、例えば、線幅１５μｍ、ピッチ３００μｍの正方形の格子状の開口率は、９０％である。   The conductive metal portion in the present embodiment preferably has an aperture ratio of 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the light-transmitting portions excluding the conductive portions such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 18 to the whole. For example, the aperture ratio of a square lattice having a line width of 15 μm and a pitch of 300 μm is 90%.

［光透過性部］
本実施の形態における「光透過性部」とは、第１導電シート１０Ａ及び第２導電シート１０Ｂのうち導電性金属部以外の透光性を有する部分を意味する。光透過性部における透過率は、前述のとおり、第１透明基体１２Ａ及び第２透明基体１２Ｂの光吸収及び反射の寄与を除いた３８０〜７８０ｎｍの波長領域における透過率の最小値で示される透過率が９０％以上、好ましくは９５％以上、さらに好ましくは９７％以上であり、さらにより好ましくは９８％以上であり、最も好ましくは９９％以上である。 [Light transmissive part]
The “light transmissive part” in the present embodiment means a part having translucency other than the conductive metal part in the first conductive sheet 10A and the second conductive sheet 10B. As described above, the transmittance in the light transmissive part is the transmission indicated by the minimum value of the transmittance in the wavelength region of 380 to 780 nm excluding the contribution of light absorption and reflection of the first transparent substrate 12A and the second transparent substrate 12B. The rate is 90% or more, preferably 95% or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.

露光方法に関しては、ガラスマスクを介した方法やレーザー描画によるパターン露光方式が好ましい。   Regarding the exposure method, a method through a glass mask or a pattern exposure method by laser drawing is preferable.

［第１導電シート１０Ａ及び第２導電シート１０Ｂ］
本実施の形態に係る第１導電シート１０Ａ及び第２導電シート１０Ｂにおける第１透明基体１２Ａ及び第２透明基体１２Ｂの厚さは、５〜３５０μｍであることが好ましく、３０〜１５０μｍであることがさらに好ましい。５〜３５０μｍの範囲であれば所望の可視光の透過率が得られ、且つ、取り扱いも容易である。 [First conductive sheet 10A and second conductive sheet 10B]
The thickness of the first transparent base 12A and the second transparent base 12B in the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment is preferably 5 to 350 μm, and preferably 30 to 150 μm. Further preferred. If it is the range of 5-350 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

第１透明基体１２Ａ及び第２透明基体１２Ｂ上に設けられる金属銀部の厚さは、第１透明基体１２Ａ及び第２透明基体１２Ｂ上に塗布される銀塩含有層用塗料の塗布厚みに応じて適宜決定することができる。金属銀部の厚さは、０．００１ｍｍ〜０．２ｍｍから選択可能であるが、３０μｍ以下であることが好ましく、２０μｍ以下であることがより好ましく、０．０１〜９μｍであることがさらに好ましく、０．０５〜５μｍであることが最も好ましい。また、金属銀部はパターン状であることが好ましい。金属銀部は１層でもよく、２層以上の重層構成であってもよい。金属銀部がパターン状であり、且つ、２層以上の重層構成である場合、異なる波長に感光できるように、異なる感色性を付与することができる。これにより、露光波長を変えて露光すると、各層において異なるパターンを形成することができる。   The thickness of the metallic silver portion provided on the first transparent substrate 12A and the second transparent substrate 12B depends on the coating thickness of the silver salt-containing layer coating applied on the first transparent substrate 12A and the second transparent substrate 12B. Can be determined as appropriate. The thickness of the metallic silver portion can be selected from 0.001 mm to 0.2 mm, but is preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 to 9 μm. And most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion is patterned and has a multilayer structure of two or more layers, different color sensitivities can be imparted so as to be sensitive to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer.

導電性金属部の厚さは、タッチパネルの用途としては、薄いほど表示パネルの視野角が広がるため好ましく、視認性の向上の点でも薄膜化が要求される。このような観点から、導電性金属部に担持された導電性金属からなる層の厚さは、９μｍ未満であることが好ましく、０．１μｍ以上５μｍ未満であることがより好ましく、０．１μｍ以上３μｍ未満であることがさらに好ましい。   As the thickness of the conductive metal part, the thinner the display panel, the wider the viewing angle of the display panel, and the thinner the display is required for improving the visibility. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.

本実施の形態では、上述した銀塩含有層の塗布厚みをコントロールすることにより所望の厚さの金属銀部を形成し、さらに物理現像及び／又はめっき処理により導電性金属粒子からなる層の厚みを自在にコントロールできるため、５μｍ未満、好ましくは３μｍ未満の厚みを有する第１導電シート１０Ａ及び第２導電シート１０Ｂであっても容易に形成することができる。   In the present embodiment, the thickness of the layer made of conductive metal particles is formed by controlling the coating thickness of the silver salt-containing layer described above to form a metallic silver portion having a desired thickness, and further by physical development and / or plating treatment. Therefore, even the first conductive sheet 10A and the second conductive sheet 10B having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.

なお、本実施の形態に係る第１導電シート１０Ａや第２導電シート１０Ｂの製造方法では、めっき等の工程は必ずしも行う必要はない。本実施の形態に係る第１導電シート１０Ａや第２導電シート１０Ｂの製造方法では銀塩乳剤層の塗布銀量、銀／バインダー体積比を調整することで所望の表面抵抗を得ることができるからである。なお、必要に応じてカレンダー処理等を行ってもよい。   In addition, in the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a process such as plating is not necessarily performed. In the manufacturing method of the first conductive sheet 10A and the second conductive sheet 10B according to the present embodiment, a desired surface resistance can be obtained by adjusting the coating silver amount of the silver salt emulsion layer and the silver / binder volume ratio. It is. In addition, you may perform a calendar process etc. as needed.

（現像処理後の硬膜処理）
銀塩乳剤層に対して現像処理を行った後に、硬膜剤に浸漬して硬膜処理を行うことが好ましい。硬膜剤としては、例えば、グルタルアルデヒド、アジポアルデヒド、２，３−ジヒドロキシ−１，４−ジオキサン等のジアルデヒド類及びほう酸等の特開平２−１４１２７９号に記載のものを挙げることができる。 (Hardening after development)
It is preferable to perform a film hardening process by immersing the film in a hardener after the silver salt emulsion layer is developed. Examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and those described in JP-A-2-141279 such as boric acid. .

なお、本発明は、下記表１及び表２に記載の公開公報及び国際公開パンフレットの技術と適宜組合わせて使用することができる。「特開」、「号公報」、「号パンフレット」等の表記は省略する。   In addition, this invention can be used in combination with the technique of the publication gazette and international publication pamphlet which are described in following Table 1 and Table 2. FIG. Notations such as “JP,” “Gazette” and “No. Pamphlet” are omitted.

Figure 0004820451
Figure 0004820451

Figure 0004820451
Figure 0004820451

以下に、本発明の実施例を挙げて本発明をさらに具体的に説明する。なお、以下の実施例に示される材料、使用量、割合、処理内容、処理手順等は、本発明の趣旨を逸脱しない限り適宜変更することができる。従って、本発明の範囲は以下に示す具体例により限定的に解釈されるべきものではない。   Hereinafter, the present invention will be described more specifically with reference to examples of the present invention. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.

（ハロゲン化銀感光材料）
水媒体中のＡｇ１５０ｇに対してゼラチン１０．０ｇを含む、球相当径平均０．１μｍの沃臭塩化銀粒子（Ｉ＝０．２モル％、Ｂｒ＝４０モル％）を含有する乳剤を調製した。 (Silver halide photosensitive material)
An emulsion containing 10.0 g of gelatin per 150 g of Ag in an aqueous medium and containing silver iodobromochloride grains having an average equivalent sphere diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared. .

また、この乳剤中にはＫ３Ｒｈ２Ｂｒ９及びＫ２ＩｒＣｌ６を濃度が１０−７（モル／モル銀）になるように添加し、臭化銀粒子にＲｈイオンとＩｒイオンをドープした。この乳剤にＮａ２ＰｄＣｌ４を添加し、さらに塩化金酸とチオ硫酸ナトリウムを用いて金硫黄増感を行った後、ゼラチン硬膜剤と共に、銀の塗布量が１０ｇ／ｍ２となるように第１透明基体１２Ａ及び第２透明基体１２Ｂ（ここでは、共にポリエチレンテレフタレート（ＰＥＴ））上に塗布した。この際、Ａｇ／ゼラチン体積比は２／１とした。 In this emulsion, K 3 Rh 2 Br 9 and K 2 IrCl 6 were added so as to have a concentration of 10 −7 (mol / mol silver), and silver bromide grains were doped with Rh ions and Ir ions. . After adding Na 2 PdCl 4 to this emulsion and further performing gold-sulfur sensitization using chloroauric acid and sodium thiosulfate, together with the gelatin hardener, the coating amount of silver was 10 g / m 2. The coating was applied on the first transparent substrate 12A and the second transparent substrate 12B (both here are polyethylene terephthalate (PET)). At this time, the volume ratio of Ag / gelatin was 2/1.

幅３０ｃｍのＰＥＴ支持体に２５ｃｍの幅で２０ｍ分塗布を行ない、塗布の中央部２４ｃｍを残すように両端を３ｃｍずつ切り落としてロール状のハロゲン化銀感光材料を得た。   Coating was performed for 20 m with a width of 25 cm on a PET support having a width of 30 cm, and both ends were cut off by 3 cm so as to leave a central portion of the coating, thereby obtaining a roll-shaped silver halide photosensitive material.

（露光）
露光のパターンは、第１タッチパネル用導電シート５０Ａの第１導電シート１０Ａについては図１及び図３に示すパターンで、第２導電シート１０Ｂについては図３及び図５に示すパターンで、Ａ４サイズ（２１０ｍｍ×２９７ｍｍ）の第１透明基体１２Ａ及び第２透明基体１２Ｂに行った。第２タッチパネル用導電シート５０Ｂの第１導電シート１０Ａについては図７及び図８に示すパターンで、第２導電シート１０Ｂについては図７及び図９に示すパターンで、Ａ４サイズ（２１０ｍｍ×２９７ｍｍ）の第１透明基体１２Ａ及び第２透明基体１２Ｂに行った。小格子１８の配列ピッチＰｓを２００μｍとし、中格子２０の配列ピッチＰｍを２×Ｐｓとした。また、小格子１８の導電部の厚みを２μｍとし、幅を１０μｍとした。露光は上記パターンのフォトマスクを介して高圧水銀ランプを光源とした平行光を用いて露光した。 (exposure)
The pattern of exposure is the pattern shown in FIGS. 1 and 3 for the first conductive sheet 10A of the conductive sheet 50A for the first touch panel, and the pattern shown in FIGS. 3 and 5 for the second conductive sheet 10B. 210 mm × 297 mm) for the first transparent substrate 12A and the second transparent substrate 12B. The first conductive sheet 10A of the second touch panel conductive sheet 50B has the pattern shown in FIGS. 7 and 8, and the second conductive sheet 10B has the pattern shown in FIGS. 7 and 9, and has an A4 size (210 mm × 297 mm). This was performed on the first transparent substrate 12A and the second transparent substrate 12B. The arrangement pitch Ps of the small lattice 18 was 200 μm, and the arrangement pitch Pm of the medium lattice 20 was 2 × Ps. The thickness of the conductive portion of the small lattice 18 was 2 μm, and the width was 10 μm. The exposure was performed using parallel light using a high-pressure mercury lamp as a light source through the photomask having the above pattern.

（現像処理）
・現像液１Ｌ処方
ハイドロキノン ２０ ｇ
亜硫酸ナトリウム ５０ ｇ
炭酸カリウム ４０ ｇ
エチレンジアミン・四酢酸 ２ ｇ
臭化カリウム ３ ｇ
ポリエチレングリコール２０００ １ ｇ
水酸化カリウム ４ ｇ
ｐＨ １０．３に調整
・定着液１Ｌ処方
チオ硫酸アンモニウム液（７５％） ３００ ｍｌ
亜硫酸アンモニウム・１水塩 ２５ ｇ
１，３−ジアミノプロパン・四酢酸 ８ ｇ
酢酸 ５ ｇ
アンモニア水（２７％） １ ｇ
ｐＨ ６．２に調整
上記処理剤を用いて露光済み感材を、富士フイルム社製自動現像機 ＦＧ−７１０ＰＴＳを用いて処理条件：現像３５℃ ３０秒、定着３４℃ ２３秒、水洗 流水（５Ｌ／分）の２０秒処理で行った。 (Development processing)
・ Developer 1L formulation Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjusted to pH 10.3 and formulated 1L fixer ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjusted to pH 6.2 Processed photosensitive material using the above processing agent using Fujifilm's automatic processor FG-710PTS Processing conditions: development 35 ° C. for 30 seconds, fixing 34 ° C. for 23 seconds, washed water (5 L / Min) for 20 seconds.

〔評価〕
（表面抵抗測定）
表面抵抗率の均一性を評価するために、第１導電シート１０Ａ及び第２導電シート１０Ｂの表面抵抗率をダイアインスツルメンツ社製ロレスターＧＰ（型番ＭＣＰ−Ｔ６１０）直列４探針プローブ（ＡＳＰ）にて任意の１０箇所測定した値の平均値である。 [Evaluation]
(Surface resistance measurement)
In order to evaluate the uniformity of the surface resistivity, the surface resistivity of the first conductive sheet 10A and the second conductive sheet 10B is measured with a Learstar GP (model number MCP-T610) in-line four probe probe (ASP) manufactured by Dia Instruments. It is an average value of values measured at arbitrary 10 locations.

（視認性の評価）
第１導電シート１０Ａ及び第２導電シート１０Ｂを貼り合わせて、第１タッチパネル用導電シート５０Ａ及び第２タッチパネル用導電シート５０Ｂを作製し、肉眼で、線太りや黒い斑点がないかどうかを確認した。 (Visibility evaluation)
The first conductive sheet 10A and the second conductive sheet 10B were bonded together to produce the first touch panel conductive sheet 50A and the second touch panel conductive sheet 50B. .

（評価結果）
表面抵抗は、第１導電シート１０Ａ及び第２導電シート１０Ｂ共に、５オーム／ｓｑ．であり、Ａ４サイズの大きさを有する投影型静電容量方式のタッチパネルに十分に適用できることがわかった。また、第１タッチパネル用導電シート５０Ａ及び第２タッチパネル用導電シート５０Ｂ共に、線太りや黒い斑点は確認されず、視認性は良好であった。 (Evaluation results)
The surface resistance is 5 ohm / sq. For both the first conductive sheet 10A and the second conductive sheet 10B. Thus, it was found that the invention can be sufficiently applied to a projected capacitive touch panel having an A4 size. Moreover, neither the thickening of a line nor the black spot was confirmed in the conductive sheet 50A for the first touch panel and the conductive sheet 50B for the second touch panel, and the visibility was good.

なお、本発明に係る導電シート、導電シートの使用方法及びタッチパネルは、上述の実施の形態に限らず、本発明の要旨を逸脱することなく、種々の構成を採り得ることはもちろんである。   Note that the conductive sheet, the method of using the conductive sheet, and the touch panel according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

１０Ａ…第１導電シート １０Ｂ…第２導電シート
１２Ａ…第１透明基体 １２Ｂ…第２透明基体
１４Ａ…第１大格子 １４Ｂ…第２大格子
１６Ａ…第１接続部 １６Ｂ…第２接続部
１８…小格子 ２０…中格子
２０ａ〜２０ｈ…第１中格子〜第８中格子
２２Ａ…第１透明導電パターン ２２Ｂ…第２透明導電パターン
２４Ａ…第１絶縁部 ２４Ｂ…第２絶縁部
２８ａ〜２８ｈ…第１辺部〜第８辺部
５０Ａ…第１タッチパネル用導電シート
５０Ｂ…第２タッチパネル用導電シート DESCRIPTION OF SYMBOLS 10A ... 1st conductive sheet 10B ... 2nd conductive sheet 12A ... 1st transparent base | substrate 12B ... 2nd transparent base | substrate 14A ... 1st large lattice 14B ... 2nd large lattice 16A ... 1st connection part 16B ... 2nd connection part 18 ... Small lattice 20... Medium lattice 20 a to 20 h... First intermediate lattice to eighth intermediate lattice 22 A... First transparent conductive pattern 22 B... Second transparent conductive pattern 24 A. 1st side part-8th side part 50A ... conductive sheet for first touch panel 50B ... conductive sheet for second touch panel

Claims (31)

基体上に、２以上の導電性の大格子と、隣接する前記大格子間を電気的に接続する接続部とが形成され、
各前記大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記接続部は、前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する複数の中格子がジグザグ状に配列された形状を有することを特徴とする導電シート。 On the substrate, two or more conductive large lattices and a connecting portion for electrically connecting the adjacent large lattices are formed,
Each of the large lattices is configured by combining two or more small lattices,
The connecting portion, the conductive sheet having a plurality of in lattice and wherein Rukoto which have a sequence shape in a zigzag shape having a pitch of n times the small lattices (n is a real number larger than 1). 基体上に、２以上の導電性の大格子と、隣接する前記大格子間を電気的に接続する接続部とが形成され、
各前記大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記接続部は、前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する複数の中格子を有し、
１つの前記小格子とＬ字状の空間が形成された第１中格子と、４つ分の前記小格子をマトリクス状に配列し、中央の十字を取り外した形状を有する第２中格子が直列に接続されて構成されていることを特徴とする導電シート。 On the substrate, two or more conductive large lattices and a connecting portion for electrically connecting the adjacent large lattices are formed,
Each of the large lattices is configured by combining two or more small lattices,
The connecting portion includes a plurality of medium lattices having a pitch n times (n is a real number greater than 1) the small lattice,
A first medium lattice in which one small lattice and an L-shaped space are formed, and a second medium lattice having a shape in which the four small lattices are arranged in a matrix and the central cross is removed are connected in series. An electrically conductive sheet characterized by being connected to . 基体上に、２以上の導電性の大格子と、隣接する前記大格子間を電気的に接続する接続部とが形成され、
各前記大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記接続部は、前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、
前記導電性金属部の線間隔が３０μｍ以上５００μｍ以下、
前記導電性金属部の厚さが９μｍ未満、
前記基体の厚さが５〜３５０μｍであることを特徴とする導電シート。 On the substrate, two or more conductive large lattices and a connecting portion for electrically connecting the adjacent large lattices are formed,
Each of the large lattices is configured by combining two or more small lattices,
The connecting portion is configured by arranging one or more medium lattices having a pitch n times (n is a real number larger than 1) the small lattice,
The line width of the conductive metal part constituting the small lattice is 200 μm or less,
The line spacing of the conductive metal part is 30 μm or more and 500 μm or less,
The conductive metal portion has a thickness of less than 9 μm;
Conductive sheet the thickness of the substrate, characterized in 5~350μm der Rukoto. 基体上に、２以上の導電性の大格子と、隣接する前記大格子間を電気的に接続する接続部とが形成され、
各前記大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記接続部は、前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、
前記導電性金属部の厚さが９μｍ未満であることを特徴とする導電シート。 On the substrate, two or more conductive large lattices and a connecting portion for electrically connecting the adjacent large lattices are formed,
Each of the large lattices is configured by combining two or more small lattices,
The connecting portion is configured by arranging one or more medium lattices having a pitch n times (n is a real number larger than 1) the small lattice,
The line width of the conductive metal part constituting the small lattice is 200 μm or less,
Conductive sheet thickness of the conductive metal portion, characterized in der Rukoto less than 9 .mu.m. 請求項２〜４のいずれか１項に記載の導電シートにおいて、
前記接続部は、複数の前記中格子がジグザグ状に配列された形状を有することを特徴とする導電シート。 In the electrically conductive sheet of any one of Claims 2-4 ,
The connecting portion has a shape in which a plurality of the intermediate grids are arranged in a zigzag shape. 請求項３又は４記載の導電シートにおいて、
前記接続部は、１つの前記小格子とＬ字状の空間が形成された第１中格子と、４つ分の前記小格子をマトリクス状に配列し、中央の十字を取り外した形状を有する第２中格子が直列に接続されて構成されていることを特徴とする導電シート。 In the conductive sheet according to claim 3 or 4 ,
The connecting portion has a shape in which one small lattice and a first middle lattice in which an L-shaped space is formed, and the four small lattices are arranged in a matrix, and a central cross is removed. 2. A conductive sheet comprising a grid of 2 connected in series. 請求項１〜６のいずれか１項に記載の導電シートにおいて、
前記接続部は、１つの前記小格子とＬ字状の空間が形成された複数の前記中格子を有することを特徴とする導電シート。 In the conductive sheet according to any one of claims 1 to 6 ,
The connection portion includes a plurality of the intermediate lattices in which one small lattice and an L-shaped space are formed. 請求項１〜７のいずれか１項に記載の導電シートにおいて、
前記中格子の配列ピッチは、前記小格子の配列ピッチの１〜１０倍であることを特徴とする導電シート。 In the conductive sheet according to any one of claims 1 to 7 ,
The conductive sheet is characterized in that the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice. 請求項１〜８のいずれか１項に記載の導電シートにおいて、
前記小格子の配列ピッチをＰｓ、前記中格子の配列ピッチをＰｍとしたとき、
Ｐｍ＝２×Ｐｓ
を満足することを特徴とする導電シート。 In the electrically conductive sheet of any one of Claims 1-8 ,
When the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm,
Pm = 2 × Ps
A conductive sheet characterized by satisfying 請求項１〜９のいずれか１項に記載の導電シートにおいて、
２以上の前記大格子が前記接続部を介して一方向に配列されていることを特徴とする導電シート。 In the electrically conductive sheet of any one of Claims 1-9 ,
A conductive sheet, wherein two or more of the large lattices are arranged in one direction through the connecting portion. 請求項１〜１０のいずれか１項に記載の導電シートにおいて、
２以上の前記大格子が前記接続部を介して第１方向に配列されて１つの透明導電パターンが構成され、
２以上の前記透明導電パターンが前記第１方向と直交する第２方向に配列され、
隣接する前記透明導電パターン間は電気的に絶縁された絶縁部が配されていることを特徴とする導電シート。 In the conductive sheet according to any one of claims 1 to 10 ,
Two or more of the large lattices are arranged in the first direction through the connection portion to constitute one transparent conductive pattern,
Two or more transparent conductive patterns are arranged in a second direction orthogonal to the first direction;
An electrically conductive sheet, wherein an electrically insulated insulating portion is disposed between the adjacent transparent conductive patterns. 基体の一方の主面に、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、
前記基体の他方の主面に、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、
各前記第１大格子及び各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記第１接続部及び前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、
２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、
２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、
２以上の前記第１透明導電パターンが前記第２方向に配列され、
２以上の前記第２透明導電パターンが前記第１方向に配列され、
隣接する前記第１透明導電パターン間は電気的に絶縁された第１絶縁部が配され、
隣接する前記第２透明導電パターン間は電気的に絶縁された第２絶縁部が配され、
前記第１接続部と前記第２接続部とが前記基体を間に挟んで対向し、
前記第１絶縁部と前記第２絶縁部とが前記基体を間に挟んで対向しており、
前記第１絶縁部と前記第２絶縁部とが前記基体を間に挟んで対向する部分は、前記小格子が２以上配列された大きさの開口が形成された形態を有することを特徴とする導電シート。 One main surface of the base is formed with two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices,
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
Each of the first connection part and the second connection part is configured by arranging one or more medium lattices each having a pitch n times (n is a real number larger than 1) the small lattice ,
Two or more of the first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
Two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
Two or more first transparent conductive patterns are arranged in the second direction;
Two or more second transparent conductive patterns are arranged in the first direction;
A first insulating portion that is electrically insulated is disposed between the adjacent first transparent conductive patterns,
A second insulating portion that is electrically insulated is disposed between the adjacent second transparent conductive patterns,
The first connection portion and the second connection portion are opposed to each other with the base interposed therebetween,
The first insulating portion and the second insulating portion are opposed to each other with the base interposed therebetween,
Wherein the first insulating portion of the second insulating portion is opposed to each other between said substrates, characterized Rukoto to have a form in which opening of the small lattices two or more sequences magnitude is formed A conductive sheet. 請求項１２記載の導電シートにおいて、
前記部分は、前記中格子１つ分の大きさの開口が形成された形態を有することを特徴とする導電シート。 The conductive sheet according to claim 12 ,
The conductive sheet is characterized in that the portion has a form in which an opening having a size corresponding to the one of the middle grids is formed. 請求項１２又は１３記載の導電シートにおいて、
前記部分は、複数の前記小格子がほぼ十字形状に配列された大きさの開口が形成された形態を有する導電シート。 The conductive sheet according to claim 12 or 13 ,
The portion is a conductive sheet having a form in which an opening having a size in which a plurality of the small lattices are arranged in a substantially cross shape is formed. 基体の一方の主面に、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、
前記基体の他方の主面に、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、
各前記第１大格子及び各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記第１接続部及び前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、
前記第１大格子のうち、第１の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有し、前記第１の辺と対向する第２の辺は、該第２の辺に沿って連続する直線部が形成された形態を有し、
前記第２大格子のうち、前記基体を介して前記第１大格子の前記第１の辺と対向する第３の辺は、該第３の辺に沿って連続する直線部が形成された形態を有し、前記基体を介して前記第１大格子の前記第２の辺と対向する第４の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有することを特徴とする導電シート。 One main surface of the base is formed with two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices,
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
Each of the first connection part and the second connection part is configured by arranging one or more medium lattices each having a pitch n times (n is a real number larger than 1) the small lattice,
Of the first large lattice, the first side has a form in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side, and the first side and The opposing second side has a form in which a straight line portion continuous along the second side is formed,
Of the second large lattice, a third side facing the first side of the first large lattice through the base is formed with a linear portion continuous along the third side. And the fourth side facing the second side of the first large lattice via the base body has a plurality of needle-like lines combed from a straight line portion continuous along the first side. A conductive sheet characterized by having a shape protruding in a shape. 基体の一方の主面に、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、
前記基体の他方の主面に、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、
各前記第１大格子及び各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、
前記第１接続部及び前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、
前記導電性金属部の線間隔が３０μｍ以上５００μｍ以下、
前記導電性金属部の厚さが９μｍ未満、
前記基体の厚さが５〜３５０μｍであることを特徴とする導電シート。 One main surface of the base is formed with two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices,
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed on the other main surface of the base body,
Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
Each of the first connection part and the second connection part is configured by arranging one or more medium lattices each having a pitch n times (n is a real number larger than 1) the small lattice,
The line width of the conductive metal part constituting the small lattice is 200 μm or less,
The line spacing of the conductive metal part is 30 μm or more and 500 μm or less,
The conductive metal portion has a thickness of less than 9 μm;
A conductive sheet having a thickness of the substrate of 5 to 350 μm . 基体の一方の主面に、２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、One main surface of the base is formed with two or more conductive first large lattices and a first connection portion that electrically connects the adjacent first large lattices,
前記基体の他方の主面に、２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed on the other main surface of the base body,
各前記第１大格子及び各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、Each of the first large lattice and each of the second large lattices is configured by combining two or more small lattices,
前記第１接続部及び前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成され、Each of the first connection part and the second connection part is configured by arranging one or more medium lattices each having a pitch n times (n is a real number larger than 1) the small lattice,
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、The line width of the conductive metal part constituting the small lattice is 200 μm or less,
前記導電性金属部の厚さが９μｍ未満であることを特徴とする導電シート。A conductive sheet, wherein the conductive metal portion has a thickness of less than 9 μm. 請求項１５〜１７のいずれか１項に記載の導電シートにおいて、
２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、
２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、
２以上の前記第１透明導電パターンが前記第２方向に配列され、
２以上の前記第２透明導電パターンが前記第１方向に配列され、
隣接する前記第１透明導電パターン間は電気的に絶縁された第１絶縁部が配され、
隣接する前記第２透明導電パターン間は電気的に絶縁された第２絶縁部が配され、
前記第１接続部と前記第２接続部とが前記基体を間に挟んで対向し、
前記第１絶縁部と前記第２絶縁部とが前記基体を間に挟んで対向していることを特徴とする導電シート。 The conductive sheet according to any one of claims 15 to 17 ,
Two or more of the first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
Two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
Two or more first transparent conductive patterns are arranged in the second direction;
Two or more second transparent conductive patterns are arranged in the first direction;
A first insulating portion that is electrically insulated is disposed between the adjacent first transparent conductive patterns,
A second insulating portion that is electrically insulated is disposed between the adjacent second transparent conductive patterns,
The first connection portion and the second connection portion are opposed to each other with the base interposed therebetween,
The conductive sheet, wherein the first insulating portion and the second insulating portion are opposed to each other with the base interposed therebetween. 請求項１２〜１４、１６、１７のいずれか１項に記載の導電シートにおいて、
前記第１大格子のうち、第１の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有し、前記第１の辺と対向する第２の辺は、該第２の辺に沿って連続する直線部が形成された形態を有し、
前記第２大格子のうち、前記基体を介して前記第１大格子の前記第１の辺と対向する第３の辺は、該第３の辺に沿って連続する直線部が形成された形態を有し、前記基体を介して前記第１大格子の前記第２の辺と対向する第４の辺は、該第１の辺に沿って連続する直線部から多数の針状の線がくし歯状に張り出した形態を有することを特徴とする導電シート。 In the electrically conductive sheet according to any one of claims 12 to 14, 16, and 17 ,
Of the first large lattice, the first side has a form in which a large number of needle-like lines project in a comb-tooth shape from a linear portion continuous along the first side, and the first side and The opposing second side has a form in which a straight line portion continuous along the second side is formed,
Of the second large lattice, a third side facing the first side of the first large lattice through the base is formed with a linear portion continuous along the third side. And the fourth side facing the second side of the first large lattice via the base body has a plurality of needle-like lines combed from a straight line portion continuous along the first side. A conductive sheet characterized by having a shape protruding in a shape. 請求項１２〜１４のいずれか１項に記載の導電シートにおいて、
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、
前記導電性金属部の線間隔が３０μｍ以上５００μｍ以下、
前記導電性金属部の厚さが９μｍ未満、
前記基体の厚さが５〜３５０μｍであることを特徴とする導電シート。 The conductive sheet according to any one of claims 12 to 14 ,
The line width of the conductive metal part constituting the small lattice is 200 μm or less,
The line spacing of the conductive metal part is 30 μm or more and 500 μm or less,
The conductive metal portion has a thickness of less than 9 μm;
A conductive sheet having a thickness of the substrate of 5 to 350 μm. 請求項１２〜２０のいずれか１項に記載の導電シートにおいて、
前記小格子は正方形状であることを特徴とする導電シート。 In the conductive sheet according to any one of claims 12 to 20 ,
The conductive sheet is characterized in that the small lattice has a square shape. 請求項１２〜２１のいずれか１項に記載の導電シートにおいて、In the conductive sheet according to any one of claims 12 to 21,
前記第１接続部及び第２接続部は、複数の前記中格子がジグザグ状に配列された形状を有することを特徴とする導電シート。The conductive sheet, wherein the first connection part and the second connection part have a shape in which a plurality of the intermediate grids are arranged in a zigzag shape. 請求項１２〜２２のいずれか１項に記載の導電シートにおいて、In the conductive sheet according to any one of claims 12 to 22,
前記第１接続部及び前記第２接続部は、１つの前記小格子とＬ字状の空間が形成された複数の前記中格子を有することを特徴とする導電シート。The said 1st connection part and the said 2nd connection part have the said some lattice and the said some grid | lattice in which L-shaped space was formed, The electrically conductive sheet characterized by the above-mentioned. 請求項１２〜２３のいずれか１項に記載の導電シートにおいて、The conductive sheet according to any one of claims 12 to 23,
前記中格子の配列ピッチは、前記小格子の配列ピッチの１〜１０倍であることを特徴とする導電シート。The conductive sheet is characterized in that the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice. 請求項１２〜２４のいずれか１項に記載の導電シートにおいて、The conductive sheet according to any one of claims 12 to 24,
前記小格子の配列ピッチをＰｓ、前記中格子の配列ピッチをＰｍとしたとき、When the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm,
Ｐｍ＝２×ＰｓPm = 2 × Ps
を満足することを特徴とする導電シート。A conductive sheet characterized by satisfying ２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、各前記第１大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第１接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第１導電シートと、
２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第２導電シートとを使用する導電シートの使用方法であって、
前記第１導電シートは、２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、
前記第２導電シートは、２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、
前記導電性金属部の線間隔が３０μｍ以上５００μｍ以下、
前記導電性金属部の厚さが９μｍ未満、
前記基体の厚さが５〜３５０μｍであり、
前記第１導電シートと前記第２導電シートとを組み合わせることで、前記第１導電シートの前記第１接続部と前記第２導電シートの前記第２接続部とが組み合わさって前記小格子の配列を形成するように配置して使用することを特徴とする導電シートの使用方法。 Two or more conductive first large lattices and a first connection portion for electrically connecting the adjacent first large lattices are formed, and each of the first large lattices has two or more small lattices. A first conductive sheet configured by combining one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices.
Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed, and each of the second large lattices has two or more small lattices. A second conductive sheet configured by arranging one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices. A method of using a conductive sheet to be used,
In the first conductive sheet, two or more first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
In the second conductive sheet, two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
The line width of the conductive metal part constituting the small lattice is 200 μm or less,
The line spacing of the conductive metal part is 30 μm or more and 500 μm or less,
The conductive metal portion has a thickness of less than 9 μm;
The substrate has a thickness of 5 to 350 μm;
By combining the first conductive sheet and the second conductive sheet, the first connection portion of the first conductive sheet and the second connection portion of the second conductive sheet are combined to form the arrangement of the small lattices. using conductive sheet, characterized in that arranged and used to form the. ２以上の導電性の第１大格子と、隣接する前記第１大格子間を電気的に接続する第１接続部とが形成され、各前記第１大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第１接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第１導電シートと、Two or more conductive first large lattices and a first connection portion for electrically connecting the adjacent first large lattices are formed, and each of the first large lattices has two or more small lattices. A first conductive sheet configured by combining one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices.
２以上の導電性の第２大格子と、隣接する前記第２大格子間を電気的に接続する第２接続部とが形成され、各前記第２大格子は、それぞれ２以上の小格子が組み合わされて構成され、前記第２接続部は、それぞれ前記小格子のｎ倍（ｎは１より大きい実数）のピッチを有する１以上の中格子が配置されて構成された第２導電シートとを使用する導電シートの使用方法であって、Two or more conductive second large lattices and a second connection portion for electrically connecting the adjacent second large lattices are formed, and each of the second large lattices has two or more small lattices. A second conductive sheet configured by arranging one or more medium lattices each having a pitch of n times (n is a real number larger than 1) each of the small lattices. A method of using a conductive sheet to be used,
前記第１導電シートは、２以上の前記第１大格子が前記第１接続部を介して第１方向に配列されて１つの第１透明導電パターンが構成され、In the first conductive sheet, two or more first large lattices are arranged in the first direction via the first connection portion to constitute one first transparent conductive pattern,
前記第２導電シートは、２以上の前記第２大格子が前記第２接続部を介して前記第１方向と直交する第２方向に配列されて１つの第２透明導電パターンが構成され、In the second conductive sheet, two or more second large lattices are arranged in a second direction orthogonal to the first direction via the second connection portion to constitute one second transparent conductive pattern,
前記小格子を構成する導電性金属部の線幅が２００μｍ以下、The line width of the conductive metal part constituting the small lattice is 200 μm or less,
前記導電性金属部の厚さが９μｍ未満であり、The conductive metal portion has a thickness of less than 9 μm;
前記第１導電シートと前記第２導電シートとを組み合わせることで、前記第１導電シートの前記第１接続部と前記第２導電シートの前記第２接続部とが組み合わさって前記小格子の配列を形成するように配置して使用することを特徴とする導電シートの使用方法。By combining the first conductive sheet and the second conductive sheet, the first connection portion of the first conductive sheet and the second connection portion of the second conductive sheet are combined to form the arrangement of the small lattices. A method of using a conductive sheet, wherein the conductive sheet is used so as to form a film. 請求項２６又は２７記載の導電シートの使用方法において、In the usage method of the electrically conductive sheet of Claim 26 or 27,
前記第１接続部及び第２接続部は、複数の前記中格子がジグザグ状に配列された形状を有することを特徴とする導電シートの使用方法。The method for using a conductive sheet, wherein the first connection portion and the second connection portion have a shape in which a plurality of the intermediate lattices are arranged in a zigzag shape. 請求項２６〜２８のいずれか１項に記載の導電シートの使用方法において、In the usage method of the electrically conductive sheet of any one of Claims 26-28,
前記中格子の配列ピッチは、前記小格子の配列ピッチの１〜１０倍であることを特徴とする導電シートの使用方法。The method for using a conductive sheet, wherein the arrangement pitch of the medium lattice is 1 to 10 times the arrangement pitch of the small lattice. 請求項２６〜２９のいずれか１項に記載の導電シートの使用方法において、In the usage method of the electrically conductive sheet of any one of Claims 26-29,
前記小格子の配列ピッチをＰｓ、前記中格子の配列ピッチをＰｍとしたとき、When the arrangement pitch of the small lattices is Ps and the arrangement pitch of the medium lattices is Pm,
Ｐｍ＝２×ＰｓPm = 2 × Ps
を満足することを特徴とする導電シートの使用方法。A method of using a conductive sheet characterized by satisfying 請求項１２〜２５のいずれか１項に記載の導電シートを有することを特徴とするタッチパネル。 Features and to filter touch panel that has a conductive sheet according to any one of claims 12-25.
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