KR20100066988A - Uniform pating method for pcb - Google Patents
Uniform pating method for pcb Download PDFInfo
- Publication number
- KR20100066988A KR20100066988A KR1020080125542A KR20080125542A KR20100066988A KR 20100066988 A KR20100066988 A KR 20100066988A KR 1020080125542 A KR1020080125542 A KR 1020080125542A KR 20080125542 A KR20080125542 A KR 20080125542A KR 20100066988 A KR20100066988 A KR 20100066988A
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- circuit board
- electronic circuit
- current
- cathode
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
The present invention relates to a uniform plating method of an electronic circuit board, and more particularly, immersing an electrode and a lead frame in a plating region including an electrolyte, and a plurality of electrodes between a cathode (electrolyte bath cathode) and an anode (electrolyte bath anode) during electroplating. The present invention relates to a plating method capable of increasing the amount of charge on the surface of a plated surface and increasing the plating speed by placing a window shield frame, which is a structure having a channel structure, and applying a current to each frame to generate a magnetic field.
1 to 4 illustrate an electronic circuit board plating method according to the prior art. Hereinafter, a description will be given of the technology and the problems that are specifically applied.
First, as shown in FIG. 1, in the conventional plating apparatus, a negative potential is applied from the
2 relates to a plating technique in which a
3 illustrates a magnetic field generated by an
4 is a method of electroplating a printed circuit board using a magnetic field having a periodic directionality, and generates a magnetic field through the
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. In the process of forming a plating layer on an electronic circuit board, the present invention provides a plating method that suppresses an electric current pulling phenomenon and makes the layer thickness uniformly plated on the electrification layer. The main purpose is to improve the quality and improve the defect rate of the semiconductor package.
In addition, it is possible to apply to the plating process in the manufacturing process, such as a printed wiring board, in particular, there is another object to provide a plating method that can be easily applied even in the continuous plating process of the flexible substrate of the substrate in the form of tape.
Plating method according to the present invention for solving the above-mentioned conventional problems, the electrode and the electronic circuit board is immersed in the plating region containing the electrolyte, and during electroplating current and between the Cathode (electrolytic bath cathode) and Anode (electrolytic bath anode) In the electroplating method of inducing a magnetic field change, the window shielding frame is positioned between the electrolyzer cathode and the electrolyzer anode by varying the induced current of the applied magnetic field.
Here, the electrolytic cell cathode is characterized in that the electronic circuit board to be plated in the inward direction so as to face the electrolytic cell anode.
On the other hand, the window shield frame is characterized by consisting of at least one channel.
In addition, the amount of current applied to the window shielding frame and the current intensity is greater than both ends as a central portion is characterized in that to form a uniform thickness of the plating layer plated on the surface of the electronic circuit board.
In addition, by forming a magnetic field by the Lorentz force in accordance with the current direction applied to the window shielding frame, it is possible to increase the amount of charge on the surface of the plating layer to improve the plating speed.
In the case of the plating method according to the above-described problem solving means, in the process of forming the plating layer on the electronic circuit board, by providing a plating method of suppressing the phenomenon of the current to uniform the layer thickness to be plated on the electrification layer, It has the effect of improving the quality and improving the defect rate of the semiconductor package.
In particular, it can be easily applied in the continuous plating process of the flexible substrate, which is a tape substrate.
Hereinafter, a plating method according to the present invention will be described in detail with reference to the accompanying drawings.
First, the electromagnetic induction in the magnetic field in which the Lorentz force is generated is briefly described as follows. The phenomenon of electromagnetic induction in the changing magnetic field occurs when the magnetic field at a point in space changes, the electric field is induced at that point, and if there is a conductor circuit, the charge in the conductor is moved by the action of the electric field. It's a starting phenomenon. Therefore, it is not a circuit that exists in the changing magnetic field, and even when charged particles, the force by the electric field acts and the particles start to move. In this case, the edge portion of the electronic circuit board is the place where electricity is collected the most and the center portion is low in electrical density. Therefore, in order to compensate for this and to evenly plate the plating layer on the electronic circuit board, it is necessary to have a shielding film between the electronic circuit board and the anode to interrupt the flow of electricity so that the distribution of electricity (high current site side) can be uniformly obtained. have. Here, the shielding film refers to a structure that evenly distributes a current distribution by artificially interfering a large amount of current with a high current as a non-conductive material between the anode and the cathode (electronic circuit board). In this case, the shielding film may be configured differently according to the shape of the plating bath and the shape of the product. The shielding film structure according to the present invention will be described later.
In addition, electroplating, as is well known, refers to the deposition of metal ions by supplying electrons to metal ions (
In addition, in the case of electroplating, the problem of hydrogen embrittlement is that if an electron is applied to the electrode where plating occurs, all materials capable of reducing may naturally be reduced. And, if the material is the most reducing in water, of course, the water is decomposed to generate hydrogen reaction, especially when plating an active metal (zinc, aluminum, etc.) hydrogen generation is particularly enormous.
In this case, once hydrogen is generated, a problem occurs in plating efficiency. In other words, I tried to plate 100 zinc, but about 50 are consumed by hydrogen generation and the other 500,000 are consumed by zinc plating. Therefore, power should be supplied at least twice as much. Naturally, hydrogen will be generated more than twice in this process, and eventually the excessively generated hydrogen atoms should normally be combined with each other to occur on the metal surface in the form of molecules (ie hydrogen bubbles), but supply more power to supply excessive amounts of hydrogen. Is likely to fail to bind into the molecule at a rate.
As a result, some of the metals penetrate into the metal, thereby causing a problem of reducing the ductility of the metal. Of course, the degree of embrittlement will depend on the environment, metal, plating conditions and the like.
That is, a problem arises that the workability of the metal base material or the plating layer is deteriorated and the scope of application thereof is limited, and in order to prevent such brittleness from occurring, hydrogen generation is minimized once and the desired metal is well deposited. There must be a way to improve the plating efficiency.
As a method for this, appropriate additives may be added to the plating solution, and if possible, plating with minimal power, or plating on a metal surface which is difficult to generate hydrogen.
Hereinafter, the uniform plating method of the electronic circuit board according to the present invention will be described in detail with reference to the accompanying drawings based on the above-described electromagnetic induction and electroplating process. 5 is a block diagram showing a plating apparatus according to the present invention, Figure 6 is a cross-sectional view showing a window shield frame structure according to the present invention.
First, as shown in FIG. 5, the basic structure of the electroplating apparatus according to the present invention will be described with the
The interior of the electrolytic cell 100 is composed of two electrodes, the
On the other hand, after dipping the
Then, a predetermined power is applied to the
In this case, ultrasonic agitation may be used. In this case, the ion transport in the plating bath 100 may be greatly activated to remove hydrogen adsorption during plating, to refine the plating layer structure, and to improve current efficiency. Can improve the adhesion and finally the corrosion resistance can be greatly improved.
In this case, the
This configuration and magnetic field and induced current generation is to prevent the plating layer from being uneven because the current is concentrated toward the outer side in the plating region of the
That is, in the electroplating, the thickness of the plating layer is proportional to the current applied to the unit area, and the current strength supplied from the power source is concentrated on the edge portion of the
As such, the metal plating layer formed on the surface of the
In addition, the general part of the plating apparatus configuration for the electroplating is the same as the existing plating apparatus configuration and can be selectively applied, the detailed description thereof will be omitted.
As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.
That is, in the embodiment of the present invention, the window shielding frame has a rectangular shape having a plurality of channels, but the present invention is not limited thereto and may be disposed in the electrolytic cell in various structures and shapes.
1 to 4 is a block diagram showing a plating apparatus according to the prior art
5 is a block diagram showing a plating apparatus according to the present invention.
Figure 6 is a cross-sectional view showing a window shield frame structure according to the present invention.
<Description of the symbols for the main parts of the drawings>
100: plating bath 120: electrolytic cathode (Cathode)
130: electrolytic anode 140: electronic circuit board
150:
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080125542A KR20100066988A (en) | 2008-12-10 | 2008-12-10 | Uniform pating method for pcb |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080125542A KR20100066988A (en) | 2008-12-10 | 2008-12-10 | Uniform pating method for pcb |
Publications (1)
Publication Number | Publication Date |
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KR20100066988A true KR20100066988A (en) | 2010-06-18 |
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Family Applications (1)
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KR1020080125542A KR20100066988A (en) | 2008-12-10 | 2008-12-10 | Uniform pating method for pcb |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140135108A (en) * | 2013-05-14 | 2014-11-25 | 신꼬오덴기 고교 가부시키가이샤 | Method of manufacturing plating films |
CN115058760A (en) * | 2022-07-04 | 2022-09-16 | 厦门海辰新材料科技有限公司 | Electroplating equipment and coating machine |
-
2008
- 2008-12-10 KR KR1020080125542A patent/KR20100066988A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140135108A (en) * | 2013-05-14 | 2014-11-25 | 신꼬오덴기 고교 가부시키가이샤 | Method of manufacturing plating films |
CN115058760A (en) * | 2022-07-04 | 2022-09-16 | 厦门海辰新材料科技有限公司 | Electroplating equipment and coating machine |
CN115058760B (en) * | 2022-07-04 | 2024-05-24 | 厦门海辰新材料科技有限公司 | Electroplating equipment and film plating machine |
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