CN109402713A - Gantry upright plating line plates cylinder - Google Patents
Gantry upright plating line plates cylinder Download PDFInfo
- Publication number
- CN109402713A CN109402713A CN201811554980.4A CN201811554980A CN109402713A CN 109402713 A CN109402713 A CN 109402713A CN 201811554980 A CN201811554980 A CN 201811554980A CN 109402713 A CN109402713 A CN 109402713A
- Authority
- CN
- China
- Prior art keywords
- plating line
- baffle
- anode
- scaffold
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to electronic technology fields, it is related to gantry upright plating line plating cylinder, several scaffolds of plating cylinder base lateral arrangement, several groups electroplating clamp is installed on conductive plate component and is located above scaffold, it plates cylinder body and is equipped with plating line fixed link, several plating line vessel are equidistantly hung in plating line fixed link, and baffle fixing card is arranged in plating line fixed link, anode baffle assigns into baffle fixing card, and anode baffle is located in front of plating line vessel.Compared with prior art, beneficial effect is: the application is by analyzing device structure and designing increase anode baffle, under the arrangement effect of anode baffle and adjustment plating line vessel, anode baffle and scaffold transformation are installed additional, online quality routine monitoring copper facing uniformity data is shown after the completion, production plate copper facing has good uniformity, COV:5.21%, whole very poor 8.16um, is obviously improved compared with than traditional equipment ability, scaffold transformation and anode titanium basket, which are arranged, debugs adjustment, and equipment complex production capacity can arrive promotion.
Description
Technical field
The present invention relates to electronic technology fields, plate cylinder more particularly, to gantry upright plating line.
Background technique
Gantry upright plating line copper-plated cylinder is because there are the phenomenon of copper facing unevenness, plate platings caused by trough body structure and subsidiary conditions
Material, which is lost, in copper unevenness influences cost, directly contributes rear processing procedure manufacture difficulty height, influences comprehensive production technology ability, optimize copper facing
Evenness reduces production cost and promotes the market competitiveness beneficial to our company comprehensive production technology ability is promoted.
The applicant has the deficiency for seeing above-mentioned known existing plating line plating cylinder, adheres to research and innovation, excelsior essence
Mind proposes a practical solution using the method for professional science in conjunction with production practices, therefore proposes this case application.
Summary of the invention
The present invention in order to overcome at least one of the drawbacks of the prior art described above, proposes that gantry upright plating line plates cylinder, needle
To existing equipment tank structure and plating present situation statistical analysis is combined, design mould baffle changes by debugging suitable design combination scaffold
Guidance plating solution electric force lines distribution is made, promotion is plated, and realizes the promotion of capacity of equipment
In order to solve the above technical problems, present invention employs following technical solutions: gantry upright plating line plates cylinder, specifically includes that
Plate cylinder body, anode baffle, baffle fixing card, scaffold, conductive plate component, electroplating clamp and plating line vessel, the plating cylinder body
Lateral arrangement several scaffolds in bottom are installed several groups electroplating clamp on conductive plate component and are located above scaffold, plate and set on cylinder body
There is plating line fixed link, several plating line vessel are equidistantly hung in plating line fixed link, and the setting of baffle fixing card is being electroplated
Line fixed link, anode baffle assign into baffle fixing card, and anode baffle is located in front of plating line vessel.
Specifically, the anode baffle is equipped with several U-shaped grooves and anode circular hole, U-shaped groove is agreed with solid in baffle
Surely in the slot position blocked and the two corresponds to each other, and anode circular hole is in lateral disposed at equal distance, upper and lower two rows anode circular hole location dislocation
Arrangement, the line-spacing of anode circular hole are from top to bottom reduced.
Specifically, the baffle fixing card be it is ladder-like, baffle fixing card one end is equipped with slot position, and baffle fixing card is another
End is equipped with the fixed link slot position of U-shaped, and plating line fixed link is agreed in fixed link slot position.
Specifically, the conductive plate component is mainly made of fixed bracket and conductive plate, fixing seat, fixed bracket two sides
It is clamped on conductive plate, conductive board ends mounting and fixing bracket, electroplating clamp one end is mounted on conductive plate by upper and lower two bolt
On, the electroplating clamp other end clamps electroplate, and electroplate bottom assigns on scaffold.
Specifically, being equipped with triangular prism on the outside of the conductive plate two, fixing seat is equipped with V-shaped groove position, and triangular prism agrees with
On V-shaped groove position.
Specifically, the U-shaped groove strip of the scaffold, the scaffold left and right sides is equipped with an entire row circular hole, several snap-gauges
Part is fixed on inside scaffold, and the V-shaped slot of snap-gauge part and longitudinal disposed at equal distance, snap-gauge part central bottom are equipped with and assign for electroplate
Fixed strip, an entire row circular hole can baffle use.
Compared with prior art, beneficial effect is: the application by analyzing device structure and designing increase anode baffle,
Under the arrangement effect of anode baffle and adjustment plating line vessel, anode baffle and scaffold transformation are installed additional, after the completion online quality
Routine monitoring copper facing uniformity data shows that production plate copper facing has good uniformity, COV:5.21%, and whole very poor 8.16um is reduced
Copper ball loss, and rear processing procedure manufacture difficulty is reduced；It is obviously improved compared to traditional equipment ability, scaffold transformation and anode titanium basket row
Cloth debugging adjustment, equipment complex production capacity can arrive promotion, and anode baffle promotes plate face copper facing evenness, that is, reduce loss, and drop
Processing procedure manufacture difficulty, improves comprehensive production technology ability after low.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the structural schematic diagram of anode baffle of the present invention；
Fig. 3 is the structural schematic diagram of baffle fixing card of the present invention.
Specific embodiment
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent；In order to better illustrate this embodiment, attached
Scheme certain components to have omission, zoom in or out, does not represent the size of actual product；To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable.Being given for example only property of positional relationship is described in attached drawing
Illustrate, should not be understood as the limitation to this patent.
As shown in Figures 1 to 3, gantry upright plating line plates cylinder, specifically includes that plating cylinder body 1, anode baffle 2, baffle fixing card
3, scaffold 5, conductive plate component 6, electroplating clamp 7 and plating line vessel 8,1 several scaffolds of bottom lateral arrangement of plating cylinder body
5, several groups electroplating clamp 7 to be installed on conductive plate component 6 and is located at 5 top of scaffold, plating cylinder body 1 is equipped with plating line fixed link 9,
Several plating line vessel 8 are equidistantly hung in plating line fixed link 9, and the setting of baffle fixing card 3 is in plating line fixed link 9, sun
Pole baffle 2 assigns into baffle fixing card 3, and anode baffle 2 is located at 8 front of plating line vessel.
Above scheme, the anode baffle 2 are equipped with several U-shaped grooves 21 and anode circular hole 22, and U-shaped groove 21 is agreed with
In the slot position 31 of baffle fixing card 3 and the two corresponds to each other, and anode circular hole 22 is in lateral disposed at equal distance, upper and lower two rows anode
22 location dislocation of circular hole arrangement, the line-spacing of anode circular hole 22 are from top to bottom reduced.The baffle fixing card 3 is ladder-like, gear
3 one end of plate fixing card is equipped with slot position 31, and 3 other end of baffle fixing card is equipped with the fixed link slot position 32 of U-shaped, plating line fixed link 9
Agree in fixed link slot position 32.
Above scheme, the conductive plate component 6 are mainly made of fixed bracket 61 and conductive plate 62, fixing seat 63, Gu
61 sandwich of fixed rack is on conductive plate 62,62 both ends mounting and fixing bracket 61 of conductive plate, and 7 one end of electroplating clamp passes through up and down
Two bolts 71 are mounted on conductive plate 62, and 7 other end of electroplating clamp clamps electroplate 4, and 4 bottom of electroplate assigns on scaffold 5.
Above scheme, described 62 liang of outsides of conductive plate are equipped with triangular prism 621, and fixing seat 63 is equipped with V-shaped groove position
631, triangular prism 621 agrees on V-shaped groove position 631.The U-shaped groove strip of scaffold 5 is equipped at left and right sides of scaffold 5
One entire row circular hole 53, several snap-gauge parts 51 are fixed on inside scaffold 5, the V-shaped slot of snap-gauge part 51 and longitudinal disposed at equal distance, snap-gauge
51 central bottom of part is equipped with the fixed strip 52 assigned for electroplate 4.
When anode and cathode parallel, when electrode cuts plating solution completely, power line just equality and vertical electrode surface mutually, when
Preceding copper-plated anode and cathode design are relatively parallel, the variability of actual production process cathode size, in addition its surface of anodic solution
Long-pending variation is not parallel state, and design adjusts anode and cathode using PP plate " anode baffle " and transformation floating system thus
Distribution, guidance Sectional Electrophoretic change to form upper and lower relatively uniform equivalent electric force lines distribution；Anode arrangement area amount difference, flies
Target both ends anode have more than needed work when power line it is thick poor to the copper for concentrating " edge effect " to left and right end at cathode plate edge, tip
It is different.
Staff will be placed in the clamping of electroplating clamp 7 on electroplate 4 after, overhead traveling crane hangs electroplating clamp 7 according to setting program
Enter in corresponding liquid medicine tank, then as in figure in plating cylinder, electroplate 4 is located at scaffold Building V center top, and is fixed.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (6)
1. gantry upright plating line plates cylinder, plating cylinder body (1), anode baffle (2), baffle fixing card (3), scaffold are specifically included that
(5), conductive plate component (6), electroplating clamp (7) and plating line vessel (8), it is characterised in that: described plating cylinder body (1) bottom transverse
To arranging several scaffolds (5), several groups electroplating clamp (7) are installed on conductive plate component (6) and being located above scaffold (5), cylinder is plated
Body (1) is equipped with plating line fixed link (9), and several plating line vessel (8) equidistantly hang on plating line fixed link (9), keeps off
Plate fixing card (3) is arranged in plating line fixed link (9), and anode baffle (2) assigns into baffle fixing card (3), anode baffle (2) position
In front of plating line vessel (8).
2. gantry upright plating line according to claim 1 plates cylinder, it is characterised in that: set in the anode baffle (2)
Have a several U-shaped grooves (21) and anode circular hole (22), U-shaped groove (21) agree in the slot position (31) of baffle fixing card (3) and
The two corresponds to each other, and anode circular hole (22) is in lateral disposed at equal distance, upper and lower two rows anode circular hole (22) location dislocation arrangement, sun
The line-spacing in polar circle hole (22) is from top to bottom reduced.
3. gantry upright plating line according to claim 2 plates cylinder, it is characterised in that: the baffle fixing card (3) is
Ladder-like, baffle fixing card (3) one end is equipped with slot position (31), and baffle fixing card (3) other end is equipped with the fixed link slot position of U-shaped
(32), plating line fixed link (9) is agreed in fixed link slot position (32).
4. gantry upright plating line according to claim 3 plates cylinder, it is characterised in that: the conductive plate component (6) is main
It to be made of fixed bracket (61) and conductive plate (62), fixing seat (63), fixed bracket (61) sandwich is in conductive plate (62)
On, conductive plate (62) both ends mounting and fixing bracket (61), electroplating clamp (7) one end is mounted on conduction by upper and lower two bolt (71)
On plate (62), electroplating clamp (7) other end clamps electroplate (4), and electroplate (4) bottom assigns on scaffold (5).
5. gantry upright plating line according to claim 4 plates cylinder, it is characterised in that: (62) two outside of conductive plate
It is equipped with triangular prism (621), fixing seat (63) is equipped with V-shaped groove position (631), and triangular prism (621) agrees in V-shaped groove position (631)
On.
6. gantry upright plating line according to claim 5 plates cylinder, it is characterised in that: described scaffold (5) the U-shaped groove
Strip, scaffold (5) left and right sides are equipped with an entire row circular hole (53), and several snap-gauge parts (51) are fixed on scaffold (5) inside, snap-gauge
The V-shaped slot of part (51) and longitudinal disposed at equal distance, snap-gauge part (51) central bottom is equipped with the fixed strip assigned for electroplate (4)
(52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554980.4A CN109402713A (en) | 2018-12-19 | 2018-12-19 | Gantry upright plating line plates cylinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554980.4A CN109402713A (en) | 2018-12-19 | 2018-12-19 | Gantry upright plating line plates cylinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109402713A true CN109402713A (en) | 2019-03-01 |
Family
ID=65460117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811554980.4A Pending CN109402713A (en) | 2018-12-19 | 2018-12-19 | Gantry upright plating line plates cylinder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109402713A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201424517Y (en) * | 2009-03-10 | 2010-03-17 | 深圳大学反光材料厂 | Improved electroplating device |
| CN202558952U (en) * | 2012-05-10 | 2012-11-28 | 吴燕 | Shield for printed circuit board or wafer electroplating device |
| CN203728948U (en) * | 2014-03-19 | 2014-07-23 | 无锡金信表面处理有限公司 | Electroplating bath with uniformly distributed current |
| CN206553644U (en) * | 2017-02-23 | 2017-10-13 | 深圳崇达多层线路板有限公司 | A kind of hanger of improvement VCP electroplating evenness |
| CN206624935U (en) * | 2017-03-24 | 2017-11-10 | 莆田市涵江区依吨多层电路有限公司 | A kind of board substrate electroplanting device |
| CN208071833U (en) * | 2017-12-05 | 2018-11-09 | 迈瑞凯电子科技（天津）有限公司 | A kind of Novel electric copper plating groove pontoon bridge |
-
2018
- 2018-12-19 CN CN201811554980.4A patent/CN109402713A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201424517Y (en) * | 2009-03-10 | 2010-03-17 | 深圳大学反光材料厂 | Improved electroplating device |
| CN202558952U (en) * | 2012-05-10 | 2012-11-28 | 吴燕 | Shield for printed circuit board or wafer electroplating device |
| CN203728948U (en) * | 2014-03-19 | 2014-07-23 | 无锡金信表面处理有限公司 | Electroplating bath with uniformly distributed current |
| CN206553644U (en) * | 2017-02-23 | 2017-10-13 | 深圳崇达多层线路板有限公司 | A kind of hanger of improvement VCP electroplating evenness |
| CN206624935U (en) * | 2017-03-24 | 2017-11-10 | 莆田市涵江区依吨多层电路有限公司 | A kind of board substrate electroplanting device |
| CN208071833U (en) * | 2017-12-05 | 2018-11-09 | 迈瑞凯电子科技（天津）有限公司 | A kind of Novel electric copper plating groove pontoon bridge |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113564672A (en) * | 2021-07-30 | 2021-10-29 | 苏州浪潮智能科技有限公司 | Promote PCB board electroplating uniformity's tool and plating bath of sheltering from |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190301 |