CN202558952U - Shield for printed circuit board or wafer electroplating device - Google Patents
Shield for printed circuit board or wafer electroplating device Download PDFInfo
- Publication number
- CN202558952U CN202558952U CN201220207139XU CN201220207139U CN202558952U CN 202558952 U CN202558952 U CN 202558952U CN 201220207139X U CN201220207139X U CN 201220207139XU CN 201220207139 U CN201220207139 U CN 201220207139U CN 202558952 U CN202558952 U CN 202558952U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- wafer
- shield
- masking shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a shield for a printed circuit board or a wafer electroplating device. The shield is arranged in an electroplating bath and positioned between an anode and the printed circuit board or wafer, and the anode, the shield, the printed circuit board or wafer are arranged in parallel; the size of the shield is matched with that of the printed circuit board or wafer; a plurality of through holes are formed on the shield in round, conical or rhombic type; diameters are gradually reduced from the through holes positioned in the middle of the shield to the through holes on the edge of the shield; and the through holes on the shield are arranged in a rectangular mode. According to the shield, the evenness of thickness of the electroplating coating of the printed circuit board or wafer can be effectively improved in the electroplating process, the risk of circuit short or open caused by uneven thickness of the electroplating coating can be reduced, the production yield of the printed circuit board or wafer can be promoted, and the manufacture cost can be reduced.
Description
Technical field
The utility model relates to electroplanting device, and particularly a kind of printed circuit board or wafer electroplanting device are used masking shield.
Background technology
Generally at ± 10-30%, promptly when the electrolytic coating mean thickness of a printed circuit board was 20um, the maximum ga(u)ge at its some position was 22-26um to the electrolytic coating thickness deviation of printed circuit board electroplanting device in the market, and minimum thickness is 18-14um.The thickness of plating layer deviation is big more, and it gives pressure of back-end process (developments-etching-one-tenths circuit) also just big more, the circuit etching short circuit that causes owing to electrolytic coating uneven thickness one and to open circuit bad be the major technique bottleneck of present each circuit board plant.
The masking technique of existing printed circuit board electroplanting device; The modes that adopt the part to cover more; The marginal edge angle part that promptly existing masking shield only merely covers printed circuit board; This mode of covering can't be carried out all covering of position to whole printed circuit board (particularly region intermediate), and this is one of reason of printed circuit board electrolytic coating uneven thickness one.
Secondly, the liquid medicine of existing printed circuit board electroplanting device stirs the technology that adopt pneumatic blending or nozzle ejection to stir more, and these methods are easy to generate the phenomenon that the printed circuit board surface local stirs, and this is former therefore two of a printed circuit board electrolytic coating uneven thickness one.
Summary of the invention
The purpose of the utility model is to design a kind of printed circuit board or the wafer electroplanting device is used masking shield; In electroplating process, can improve printed circuit board or wafer thickness of plating layer homogeneity effectively; Reduce the circuit etching that causes because of electrolytic coating uneven thickness one in printed circuit board or the wafer back-end process bad (short circuit with open circuit), finally reach the purpose of reduction printed circuit board or wafer manufacturing cost.
For achieving the above object, the technical scheme of the utility model is:
Printed circuit board or wafer electroplanting device are used masking shield, it is characterized in that, this masking shield is arranged in the plating tank, and between anode and printed circuit board or wafer, and anode, masking shield, printed circuit board or wafer three laterally arrange; Described masking shield size and printed circuit board or wafer coupling; Offer some through holes on the described masking shield, pass is circular hole, taper hole or diamond hole; The through-hole aperture that is positioned at the masking shield middle part diminishes to being positioned at the through-hole aperture that covers edges of boards portion gradually.
Further, the through hole on the described masking shield is the matrix-style arrangement.
During plating; Stirring parts is directly faced the plating face of printed circuit board or wafer; Through its tilting mechanism stirring parts is swung back and forth along the plating face of printed circuit board or wafer, make electroplate liquid play uniform stirring action the surface (through hole, blind hole, figure) of printed circuit board or wafer.
Stirring parts and printed circuit board or the crystal column surface keeping parallelism is contactless oscillates; Simultaneously; Most through holes of offering with whole matrix-style on the described masking shield, the size through the adjustment aperture improves the homogeneity of printed circuit board or wafer electrolytic coating thickness.
Like product is compared in the utility model and the prior art, and difference has 2 points:
Prior art is covered mode for local (only to the wiring board edge), can't effectively cover the middle part of printed circuit board or wafer.
Whole face is offered the matrix form through hole on the masking shield of the utility model; Printed circuit board or whole formula of wafer enforcement are covered; Again plan through the size in each hole, position on the adjustment masking shield and the height distribution of current of whole wiring board or wafer finally to play bridging effect.
Newly design through masking shield; Enforcement is carried out all measures of covering of position to whole printed circuit board or wafer (particularly region intermediate); Improved printed circuit board or wafer electrolytic coating uniform in thickness property, reduced the thickness of plating layer deviation, reduced the short circuit and the problem that opens circuit in the back segment circuit etching processing procedure that brings out because of electrolytic coating uneven thickness one to ± 5-10%; Improve printed circuit board or wafer production yield, finally reduce manufacturing cost.
Description of drawings
Fig. 1 is the synoptic diagram of the utility model embodiment one.
Fig. 2 is the synoptic diagram of the utility model embodiment two.
Fig. 3 is the utility model working state schematic representation.
Embodiment
Referring to Fig. 1 ~ Fig. 3; Printed circuit board of the utility model or wafer electroplanting device are with masking shield 1, and it is arranged in the plating tank 10, between anode 20 and printed circuit board or wafer 30; And anode 20, masking shield 1, printed circuit board or wafer 30 threes laterally arrange; Described masking shield 1 size and printed circuit board or wafer 30 couplings; Offer some through holes 11,12 on the described masking shield 1, pass is circular hole, taper hole or diamond hole; Through hole 11 apertures that are positioned at masking shield 1 middle part diminish to being positioned at through hole 12 apertures of covering edges of boards portion gradually; Stirring parts 40 is arranged at workplace one side of printed circuit board or wafer 30.
Through hole 11,12 on the described masking shield 1 is matrix-style and arranges.
During plating, stirring parts teeters under tilting mechanism drives, and through masking shield the height distribution of current of printed circuit board is played bridging effect.
In sum; The utility model is compared with class methods with of the prior art; Because the utility model has used whole formula masking shield for the first time in common printed circuit board or wafer electroplating device; Solved the problem that existing masking shield can't effectively cover printed circuit board or wafer region intermediate; Improved the homogeneity of printed circuit board or wafer electrolytic coating thickness widely, thereby the fraction defective that reduces the circuit etching short circuit and open circuit has finally reduced the manufacturing cost of printed circuit board or wafer.
Claims (2)
1. printed circuit board or wafer electroplanting device are used masking shield, it is characterized in that, this masking shield is arranged in the plating tank, and between anode and printed circuit board or wafer, and anode, masking shield, printed circuit board or wafer three laterally arrange; Described masking shield size and printed circuit board or wafer coupling; Offer some through holes on the described masking shield, pass is circular hole, taper hole or diamond hole; The through-hole aperture that is positioned at the masking shield middle part diminishes to being positioned at the through-hole aperture that covers edges of boards portion gradually.
2. printed circuit board as claimed in claim 1 or wafer electroplanting device are used masking shield, it is characterized in that, the through hole on the described masking shield is matrix-style and arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220207139XU CN202558952U (en) | 2012-05-10 | 2012-05-10 | Shield for printed circuit board or wafer electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220207139XU CN202558952U (en) | 2012-05-10 | 2012-05-10 | Shield for printed circuit board or wafer electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202558952U true CN202558952U (en) | 2012-11-28 |
Family
ID=47208628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220207139XU Expired - Lifetime CN202558952U (en) | 2012-05-10 | 2012-05-10 | Shield for printed circuit board or wafer electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202558952U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938256A (en) * | 2014-04-23 | 2014-07-23 | 昆山凯盈机械科技有限公司 | Guide plate for PCB (Printed Circuit Board) |
| CN108396347A (en) * | 2018-05-04 | 2018-08-14 | 蔡宜工 | Block piece and preparation method thereof and graphic plating method is electroplated |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN109518244A (en) * | 2018-12-27 | 2019-03-26 | 中国电子科技集团公司第二研究所 | The wafer copper-plating technique of coating edge effect can be weakened |
| CN112410850A (en) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | Plating solution diffusion baffle of electroplating cavity |
| CN113718308A (en) * | 2021-08-31 | 2021-11-30 | 浙江同芯祺科技有限公司 | Wafer double-side electroplating device and process |
| CN114262927A (en) * | 2021-11-25 | 2022-04-01 | 绍兴同芯成集成电路有限公司 | Electroplating device and electroplating method for substrate |
| CN114855251A (en) * | 2022-05-24 | 2022-08-05 | 东莞市晟悦半导体设备有限公司 | Dynamic anode shielding structure |
-
2012
- 2012-05-10 CN CN201220207139XU patent/CN202558952U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103938256A (en) * | 2014-04-23 | 2014-07-23 | 昆山凯盈机械科技有限公司 | Guide plate for PCB (Printed Circuit Board) |
| CN103938256B (en) * | 2014-04-23 | 2016-03-30 | 昆山凯盈机械科技有限公司 | A kind of guide plate of pcb board |
| CN108396347A (en) * | 2018-05-04 | 2018-08-14 | 蔡宜工 | Block piece and preparation method thereof and graphic plating method is electroplated |
| CN109402713A (en) * | 2018-12-19 | 2019-03-01 | 汕头凯星印制板有限公司 | Gantry upright plating line plates cylinder |
| CN109518244A (en) * | 2018-12-27 | 2019-03-26 | 中国电子科技集团公司第二研究所 | The wafer copper-plating technique of coating edge effect can be weakened |
| CN112410850A (en) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | Plating solution diffusion baffle of electroplating cavity |
| CN113718308A (en) * | 2021-08-31 | 2021-11-30 | 浙江同芯祺科技有限公司 | Wafer double-side electroplating device and process |
| CN114262927A (en) * | 2021-11-25 | 2022-04-01 | 绍兴同芯成集成电路有限公司 | Electroplating device and electroplating method for substrate |
| CN114855251A (en) * | 2022-05-24 | 2022-08-05 | 东莞市晟悦半导体设备有限公司 | Dynamic anode shielding structure |
| CN114855251B (en) * | 2022-05-24 | 2024-04-16 | 东莞市晟悦半导体设备有限公司 | Dynamic anode shielding structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170823 Address after: Cheng Hu road Kunshan Development Zone 215334 Jiangsu city of Kunshan province No. 248 room 3 Patentee after: Kunshan success Environmental Protection Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215011 Suzhou District No. 1088 Binhe Road, Jinhe Nga Court 1-608 Patentee before: Wu Yan |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121128 |