CN205609482U - Etching is sprayed module and is used this etching to spray wet -type etching device of module - Google Patents
Etching is sprayed module and is used this etching to spray wet -type etching device of module Download PDFInfo
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- CN205609482U CN205609482U CN201620249189.2U CN201620249189U CN205609482U CN 205609482 U CN205609482 U CN 205609482U CN 201620249189 U CN201620249189 U CN 201620249189U CN 205609482 U CN205609482 U CN 205609482U
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- etching
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- wet
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Abstract
The utility model relates to a wet -type processing procedure field especially relates to an etching is sprayed module and is used this etching to spray wet -type etching device of module, and this wet -type etching device includes that a cavity and this etching spray the module. This cavity includes an air inlet, a gas outlet and etching solution entry. Module setting is sprayed in order to carry out the etching to a base plate in this cavity to this etching. This etching is sprayed the module and is included a body and a plurality of nozzle. Each nozzle includes a first entry, a the second entrance and a jet exit. One of this jet exit bore is less than one of this first entry bore and is less than one of this the second entrance bore. This wet -type etching device and this etching are sprayed the module and can be sprayed the etching solution on the base plate uniformly.
Description
Technical field
This utility model relates to wet process field, particularly relates to a kind of etching sprinkling module and uses the Wet-type etching device of this etching sprinkling module.
Background technology
In panel industry, the development of wet process is the most ripe.But in existing wet process board, use have maintenance difficult, consumption liquid measure is big, uniformity is the best, in the dead of night and dirty etc. the problem in the back side, the problems referred to above are especially severe in the case of fine rule width (fine pitch).
Etching sprinkling module in existing wet process board includes several nozzles, etching solution directly by nozzles spray on a substrate so that this substrate is etched, but the caliber size of no matter nozzle, owing to etching solution not being carried out any process, therefore when etching solution is sprayed on substrate, the problem that uniformity is the best can occur, and then affect etch effect.
It is thus desirable to propose a solution for the problem that uniformity when etching solution is sprayed on substrate in above-mentioned prior art is the best.
Utility model content
The purpose of this utility model is to provide a kind of etching sprinkling module and uses the Wet-type etching device of this etching sprinkling module, the problem that when it can solve that in prior art, etching solution is sprayed on substrate, uniformity is the best.
The Wet-type etching device of this utility model includes a cavity and an etching sprinkling module.This cavity includes an air inlet, a gas outlet and an etching solution entrance.This air inlet is for importing an etching desired gas.This gas outlet is used for deriving this etching desired gas.This etching solution entrance is for importing an etching solution.This etching sprinkling module is arranged in this cavity to be etched a substrate.This etching sprinkling module includes a body and several nozzles.This body is connected to this air inlet and this etching solution entrance.These nozzles are arranged at this body towards on one of this substrate surface.Each nozzle is a shape wide at the top and narrow at the bottom and includes one first entrance, one second entrance and a jet expansion.This first entrance is for importing this etching solution via this body.This second entrance is for importing this etching desired gas via this body.One of this jet expansion bore is less than one of this first entrance bore and less than one of this second entrance bore.
In a preferred embodiment, this Wet-type etching device farther includes an additional circuit boards.This additional circuit boards is arranged in this cavity and for carrying this substrate.
In a preferred embodiment, this Wet-type etching device farther includes a convulsion module.This convulsion module is connected to this gas outlet and for being extracted out from this gas outlet by the etching desired gas of this inside cavity.
In a preferred embodiment, this bore of this first entrance is 10 millimeters to 55 millimeters.
In a preferred embodiment, this bore of this second entrance is 10 millimeters to 55 millimeters.
In a preferred embodiment, this bore of this jet expansion is 0.5 millimeter to 2 millimeters.
In a preferred embodiment, the distance between this etching sprinkling module and this substrate is 10 centimetres to 25 centimetres.
The sprinkling module at quarter of this utility model is used for a Wet-type etching device, and this etching sprinkling module includes a body and several nozzles.These nozzles are arranged at this body towards on one of this substrate surface.Each nozzle is a shape wide at the top and narrow at the bottom and includes one first entrance, one second entrance and a jet expansion.This first entrance is for importing an etching solution.This second entrance is for importing an etching desired gas.One of this jet expansion bore is less than one of this first entrance bore and less than one of this second entrance bore.
In a preferred embodiment, this bore of this first entrance is 10 millimeters to 55 millimeters.
In a preferred embodiment, this bore of this second entrance is 10 millimeters to 55 millimeters.
In a preferred embodiment, this bore of this jet expansion is 0.5 millimeter to 2 millimeters.
Etching solution can be sprayed on substrate by Wet-type etching device and the etching sprinkling module of this utility model equably.Furthermore, etching desired gas can regenerate use, the function pressurizeing etching solution after extracting out via convulsion module further, therefore can save gas usage amount.
For foregoing of the present utility model can be become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, it is described in detail below:
Accompanying drawing explanation
Fig. 1 shows the schematic diagram of the Wet-type etching device according to this utility model one embodiment.
Fig. 2 shows the schematic diagram of the nozzle according to this utility model one embodiment.
Detailed description of the invention
Referring to Fig. 1 to Fig. 2, Fig. 1 and show the schematic diagram of the Wet-type etching device 1 according to this utility model one embodiment, Fig. 2 shows the schematic diagram of the nozzle 102 according to this utility model one embodiment.
As it is shown in figure 1, the Wet-type etching device 1 of this utility model includes etching sprinkling module 10, cavity 20, additional circuit boards 40 and a convulsion module 50.
This etching sprinkling module 10 for this Wet-type etching device 1 and is arranged in this cavity 20 to be etched a substrate 30, and this substrate 30 can be the substrate needing in current wet process to be etched, and is for example and without limitation to a glass substrate.This additional circuit boards 40 is arranged in this cavity 20 and for carrying this substrate 30.
This cavity 20 mainly includes air inlet 200, gas outlet 202 and an etching solution entrance 204.In the present embodiment, this air inlet 200 and this gas outlet 202 are respectively arranged on two relative sidewalls of this cavity 20, but this utility model is not limited to this, and this air inlet 200 and this gas outlet 202 may be disposed on the identical or different sidewall of this cavity 20.
This air inlet 200 is for importing an etching desired gas, this convulsion module 50 is connected to this gas outlet 202, this convulsion module 50 is for extracting out the etching desired gas of this cavity 20 inside from this gas outlet 202, the etching desired gas of extraction can import through this air inlet 200 again, reach the purpose that regeneration uses, save the usage amount of etching desired gas.
Being noted that etching desired gas is well known for ordinary skill in the art, this does not adds to repeat.
This etching solution entrance 204 is for importing an etching solution, and this etching solution entrance 204 may be disposed on arbitrary sidewall of this cavity 20.
This etching sprinkling module 10 is arranged in this cavity 20 corresponding on this substrate 30, and this etching sprinkling module 10 includes a body 100 and several nozzles 102, and these nozzles 102 are arranged at this body 100 towards on one of this substrate 30 surface.This body 100 is connected to this air inlet 200 and this etching solution entrance 204, and etching solution imports this body 100 via this etching solution entrance 204, then is sprayed on this substrate 30 to be etched this substrate 30 via these nozzles 102.
In a preferred embodiment, the distance between this etching sprinkling module 10 and this substrate 30 is 10 centimetres to 25 centimetres.
Fig. 2 show the enlarged diagram of one of them nozzle 102 of Fig. 1, and this nozzle 102 includes one first entrance 1020,1 second entrance 1022 and a jet expansion 1024.This nozzle 102 is substantially in a shape wide at the top and narrow at the bottom, and this first entrance 1020 and this second entrance 1022 are arranged at the wider first half, and this jet expansion 1024 is arranged at narrower lower half.This first entrance 1020 is for importing the etching solution via this body 100.This second entrance 1022 is for importing the etching desired gas via this body 100.One of this jet expansion 1024 bore is less than one of this first entrance 1020 one of bore and this second entrance 1022 bore.
In a preferred embodiment, the bore of this first entrance 1020 is 10 millimeters of (millimeter;Mm) to 55 millimeters, the bore of this second entrance 1022 is 10 millimeters to 55 millimeters, and the bore of this jet expansion is 0.5 millimeter to 2 millimeters.
It is noted that the bore of the bore of this first entrance 1020, the bore of this second entrance 1022 and this jet expansion in the range of particular design, is the most only that those of ordinary skill in the art can the scope of apparent.
One of this utility model feature is the particular design of nozzle 102; more particularly; after the etching solution that the etching desired gas that this second entrance 1022 is imported is imported with this first entrance 1020 after pressurization mixes, jet expansion 1024 less via bore again is sprayed on this substrate 30 to be etched this substrate 30; the etching solution sprayed can form the micronized liquid of high pressure; therefore can be sprayed on uniformly on this substrate 30, the scope that etching solution is sprayed is shown in dotted line.
In a preferred embodiment, this etching desired gas is pressurizeed in the range of 1 to 7 kg/cm.
Additionally, the body 100 of Fig. 1 also includes the hole (not shown) corresponding to this first entrance 1020 and this second entrance 1022.
In sum, etching solution can be sprayed on substrate by Wet-type etching device and the etching sprinkling module of this utility model equably.Furthermore, etching desired gas can regenerate use, the function pressurizeing etching solution after extracting out via convulsion module further, therefore can save gas usage amount.
To skilled person, though this utility model illustrates as above with preferred embodiments, so it is not limited to spirit of the present utility model.Amendment and the similar configuration made in without departing from spirit and scope of the present utility model, should be included in claim, and this scope should cover all similar amendments and similar structures, and should do the broadest annotation.
Claims (11)
1. a Wet-type etching device, it is characterised in that including:
One cavity, including:
One air inlet, for importing an etching desired gas;
One gas outlet, is used for deriving this etching desired gas;And
One etching solution entrance, for importing an etching solution;And
One etching sprinkling module, is arranged in this cavity to be etched a substrate, and this etching sprinkling module includes:
One body, is connected to this air inlet and this etching solution entrance;And
Several nozzles, are arranged at this body towards on one of this substrate surface, and each nozzle is a shape wide at the top and narrow at the bottom and includes:
One first entrance, for importing this etching solution via this body;
One second entrance, for importing this etching desired gas via this body;And
One jet expansion, one of this jet expansion bore is less than one of this first entrance bore and less than one of this second entrance bore.
Wet-type etching device the most according to claim 1, it is characterised in that farther include:
One additional circuit boards, is arranged in this cavity and for carrying this substrate.
Wet-type etching device the most according to claim 1, it is characterised in that farther include:
One convulsion module, is connected to this gas outlet and for being extracted out from this gas outlet by the etching desired gas of this inside cavity.
Wet-type etching device the most according to claim 1, it is characterised in that this bore of this first entrance is 10 millimeters to 55 millimeters.
Wet-type etching device the most according to claim 1, it is characterised in that this bore of this second entrance is 10 millimeters to 55 millimeters.
Wet-type etching device the most according to claim 1, it is characterised in that this bore of this jet expansion is 0.5 millimeter to 2 millimeters.
Wet-type etching device the most according to claim 1, it is characterised in that the distance between this etching sprinkling module and this substrate is 10 centimetres to 25 centimetres.
8. an etching sprinkling module, for a Wet-type etching device, it is characterised in that including:
One body;And
Several nozzles, are arranged on one of this body surface, and each nozzle is a shape wide at the top and narrow at the bottom and includes:
One first entrance, for importing an etching solution;
One second entrance, for importing an etching desired gas;And
One jet expansion, one of this jet expansion bore is less than one of this first entrance bore and less than one of this second entrance bore.
Etching sprinkling module the most according to claim 8, it is characterised in that this bore of this first entrance is 10 millimeters to 55 millimeters.
Etching sprinkling module the most according to claim 8, it is characterised in that this bore of this second entrance is 10 millimeters to 55 millimeters.
11. etching sprinkling modules according to claim 8, it is characterised in that this bore of this jet expansion is 0.5 millimeter to 2 millimeters.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620249189.2U CN205609482U (en) | 2016-03-29 | 2016-03-29 | Etching is sprayed module and is used this etching to spray wet -type etching device of module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620249189.2U CN205609482U (en) | 2016-03-29 | 2016-03-29 | Etching is sprayed module and is used this etching to spray wet -type etching device of module |
Publications (1)
Publication Number | Publication Date |
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CN205609482U true CN205609482U (en) | 2016-09-28 |
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Application Number | Title | Priority Date | Filing Date |
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CN201620249189.2U Expired - Fee Related CN205609482U (en) | 2016-03-29 | 2016-03-29 | Etching is sprayed module and is used this etching to spray wet -type etching device of module |
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CN (1) | CN205609482U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107240561A (en) * | 2016-03-29 | 2017-10-10 | 盟立自动化股份有限公司 | Etch sprinkling module and the Wet-type etching device using the etching sprinkling module |
CN112687590A (en) * | 2021-01-08 | 2021-04-20 | 开化晶芯电子有限公司 | Etching device for processing semiconductor silicon wafer |
-
2016
- 2016-03-29 CN CN201620249189.2U patent/CN205609482U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107240561A (en) * | 2016-03-29 | 2017-10-10 | 盟立自动化股份有限公司 | Etch sprinkling module and the Wet-type etching device using the etching sprinkling module |
CN112687590A (en) * | 2021-01-08 | 2021-04-20 | 开化晶芯电子有限公司 | Etching device for processing semiconductor silicon wafer |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20200329 |
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CF01 | Termination of patent right due to non-payment of annual fee |