CN206293413U

CN206293413U - Wet-type etching device

Info

Publication number: CN206293413U
Application number: CN201621186842.1U
Authority: CN
Inventors: 黄荣龙; 吕峻杰; 陈滢如
Original assignee: Mirle Automation Corp
Current assignee: Mirle Automation Corp
Priority date: 2016-10-28
Filing date: 2016-10-28
Publication date: 2017-06-30
Anticipated expiration: 2026-10-28

Abstract

It is a kind of Wet-type etching device that the utility model is taken off, and the Wet-type etching device includes a cavity, some carrying platforms of etching nozzle for liquid one and a guiding device.The cavity includes an air inlet and a gas outlet.Some etching nozzle for liquid are arranged in the cavity and are etched with to a substrate.The carrying platform includes a body and some platform nozzles.The body is arranged at the substrate lower section.Some platform nozzles run through the body, and some platform nozzles described in a penetration by liquid provide a liquid buoyancy to carry the substrate.The guiding device moves the substrate including some guide ports, and then solves the mobile problem of the substrate.

Description

Wet-type etching device

Technical field

The utility model is related to one kind on wet process field, especially with respect to a kind of Wet-type etching device.

Background technology

In panel industry, the development of wet process is quite ripe.But in known wet process board, using upper With maintenance difficult, consumption liquid measure is big, uniformity is not good, in the dead of night and back side fouling problems.

The above-mentioned back side most reason of dirty problem is to support a substrate and move caused by the roller of the substrate, For ultra thin substrate, it is often necessary to use thousands of rollers, the huge roller of usage quantity except price it is high it Outward, also it is unfavorable for maintaining, or even roller marks (roller can be formed at the back side (one side for being contacted with roller) of substrate mark).Furthermore, it is existing solid (3D) encapsulation need to carry out two-sided processing procedure, using roller bearing substrate Wet-type etching device without Method is etched processing procedure to the back side of substrate.

In known technology, roller is replaced using liquid buoyancy, but, for the shifting for how solving the substrate Dynamic problem is but without effective solution.

Therefore need to be proposed a solution for the problem of moving substrate in above-mentioned known techniques.

The content of the invention

The utility model provides a kind of Wet-type etching device, and it can solve asking using roller bearing substrate in known techniques Topic.

The Wet-type etching device of the utility model is led including a cavity, some etching nozzle for liquid, a carrying platform and one Leading-in device.The cavity includes an air inlet and a gas outlet.The air inlet is used to import an etching gas.The outlet Mouth is for deriving the etching gas.Some etching nozzle for liquid are arranged in the cavity and are etched with to a substrate. The carrying platform is arranged in the cavity.The carrying platform includes a body and some platform nozzles.The body It is arranged at the substrate lower section.Some platform nozzles run through the body, and some platform nozzles described in a penetration by liquid are carried It is used to offset the downward gravity of the substrate for a upward liquid buoyancy carry the substrate.The guiding device is arranged at The side for multiplying carrying platform.The guiding device includes some guide ports, and the liquid is guided by some guide ports And then move the substrate.

In a preferred embodiment, the Wet-type etching device further includes an exhausting module.The exhausting module connects It is connected to the air inlet and the gas outlet and for gas needed for the etching of the inside cavity to be extracted out from the gas outlet Additional circuit boards.

In a preferred embodiment, liquid liquid for needed for water or processing procedure.

In a preferred embodiment, the guiding device is arranged on the both sides up and down of the substrate.

In a preferred embodiment, some guide ports draw the liquid and then move the substrate.

In a preferred embodiment, some guide ports spray the liquid and then move the substrate.

In a preferred embodiment, described some guide ports of first part spray the institute of the liquid and the second part Some guide ports are stated to suck the liquid and then move the substrate.

In a preferred embodiment, the direction of liquid entrance/ejection some guide ports is moved in the substrate Direction on it is important.

The Wet-type etching device of the utility model can solve the problems, such as moving substrate and can also enter while roller marks are reduced The two-sided processing procedure of row.Furthermore, gas can further be regenerated after being extracted out via exhausting module and use needed for etching, and etching solution is added The function of pressure, therefore gas usage amount can be saved.

Brief description of the drawings

Fig. 1 shows the schematic diagram of the Wet-type etching device of the first embodiment according to the utility model；

Fig. 2A shows the guiding device of the Wet-type etching device according to the utility model first embodiment and the amplification of substrate Schematic diagram；

Fig. 2 B show the front view of the guiding device of Fig. 2A；

Fig. 2 C show the enlarged diagram of the region A according to Fig. 2A；

Fig. 3 A show the guiding device of the Wet-type etching device according to the utility model second embodiment and the amplification of substrate Schematic diagram；

Fig. 3 B show the front view of the guiding device of Fig. 3 A；

Fig. 4 A show the guiding device of the Wet-type etching device according to the utility model 3rd embodiment and the amplification of substrate Schematic diagram；

Fig. 4 B show the first type front view of the guiding device of Fig. 4 A；And

Fig. 4 C show the Second-Type front view of the guiding device of Fig. 4 A.

Specific embodiment

Fig. 1 is referred to, Fig. 1 shows the schematic diagram of the Wet-type etching device 1 according to the first embodiment of the utility model one.

As shown in figure 1, the Wet-type etching device 1 of the utility model includes that some etching nozzle for liquid 10, a cavity 20, hold Carrying platform 40, an exhausting module 50 and a guiding device 60.

Some nozzles 10 are arranged in the cavity 20 and are etched with to a substrate 30, more particularly, described Some etching nozzle for liquid 10 are arranged at the top of the substrate 30.The substrate 30 can be to need to carry out in current wet process The substrate of etching, such as but not limited to a glass substrate.The carrying platform 40 is arranged in the cavity 20 and for non- Contiguously carry the substrate 30.

The cavity 20 mainly includes an air inlet 200 and a gas outlet 202.In the present embodiment, the air inlet 200 and the gas outlet 202 be respectively arranged on two relative side walls of the cavity 20, but the utility model is not limited to This, the air inlet 200 and the gas outlet 202 may be disposed on the identical or different side wall of the cavity 20.

The air inlet 200 is used to import an etching gas, and the exhausting module 50 is connected to the gas outlet 202, institute Exhausting module 50 is stated for the etching gas of the inside of the cavity 20 to be extracted out from the gas outlet 202, the etching gas of extraction Can be imported through the air inlet 200 again, reach the purpose that regeneration is used, save the usage amount of etching gas.

It is noted that gas needed for etching is ripe for the utility model those of ordinary skill in the art Know, this does not add to repeat.

The carrying platform 40 is arranged in the cavity 20.The carrying platform 40 is used to non-contactly carry the base Plate 30, the carrying platform 40 includes a body 400 and some platform nozzles 402, and the body 40 is arranged at the substrate Below 30 and substantially in a tabular.Some platform nozzles 402 run through the body 400, and a liquid is passed through from lower to upper Some platform nozzles 402 provide a upward liquid buoyancy and are used to offset the downward gravity of the substrate 30 described to carry Substrate 30.By the substrate 30 is carried by the liquid buoyancy, therefore can avoid causing the back side of the substrate 30 (i.e. One side of the substrate 30 towards the carrying platform 40) dirty problem and the quantity of roller is greatly decreased, and the substrate 30 will not contact with the carrying platform 40, the back side (the i.e. described substrate of the substrate 30 when will not occur to be carried using roller 30 towards the carrying platform 40 one side) formed roller marks problem.

One of the utility model feature is that the guiding device 60 includes some guide ports 62, by some guidings Mouth 62 moves the substrate 30.In detail, the guiding device 60 is arranged at the side for multiplying carrying platform 40.By practicality After new people tests repeatedly, in the presence of the carrying platform 40, the substrate 30 is substantially presented the state of floating body, only needs Somewhat touching will move along the direction of force, the detailed design on some guide ports 62, will be in other implementations Explanation in example.

The liquid can for needed for water or processing procedure liquid, the liquid for needed for processing procedure during liquid, except liquid can be provided Body buoyancy is outside carrying the substrate 30, further equably spraying liquid needed for processing procedure (such as but not limited to etching solution) At the back side (one side of the i.e. described substrate 30 towards the carrying platform 40) of the substrate 30, therefore can be suitably used for three-dimensional encapsulation Required two-sided processing procedure.

The design of some platform nozzles 402 needs the area of the factor including the substrate 30 for considering, weight, described The material and surface roughness of body 400.

In a preferred embodiment, every square centimeter of the surface of the body 400 includes one to five platform nozzle 402, The fluid pressure of the liquid is every square centimeter less than 2.5 kilograms of (kg/cm²), one of each platform nozzle 402 bore is 0.5 Millimetre (millimeter；Mm) to 1.5 millimeters, the distance between some platform nozzles 402 and described substrate 30 are 1 millimeter To 6 millimeters.

It is noted that the quantity of some platform nozzles 402, the fluid pressure of the liquid, each platform nozzle 402 Bore and the scope of some platform nozzles 402 and the distance between the substrate 30 be particular design, be only not this Utility model those of ordinary skill in the art can apparent scope.

Substantially, in order to design simplicity, the quantity of some guide ports 62, bore and between the substrate 30 Distance may be referred to some platform nozzles 402.Some guide ports 62 and some difference platform nozzles 402 It is：What some platform nozzles 402 were supplied to the substrate 30 is the upward external force for being used to resist gravity, it is impossible to Make the movement of the level of the substrate 30；It is an external force for level that some guide ports 62 are supplied to the substrate 30, therefore The substrate 30 can be made to move in the horizontal direction.It should be noted that because the guiding device 60 is needed only provide for quite Small strength just can move the substrate 30, but in order to not destroy balance of the substrate on the carrying platform 40, Substantially described guiding device 60 is arranged on the both sides up and down of the substrate 30.

With reference to Fig. 2A -2B.Fig. 2A shows the guiding device of the Wet-type etching device 1 according to the utility model first embodiment 60 with the enlarged diagram of substrate 30.Fig. 2 B show the front view of the guiding device 60 of Fig. 2A.Arrow in figure represents liquid Direction.In the preferred embodiment, the liquid is sprayed towards the left side by some guide ports 62, therefore can be driven described Substrate 30 is moved toward the left side.It should be noted that in fig. 2b, described some guide ports 62 of upper row do not spray the liquid Body, its reason is, when the substrate 30 needs to be moved toward the right, to be used to close described some guide ports 62 of lower row, is opened Described some guide ports 62 of the row of opening, certainly, described some guide ports 62 of upper row are directed towards the right and spray the liquid. In other preferred embodiments, it is also possible to change the configuration mode of some guide ports 62, be not limited thereto.

With reference to Fig. 2 C, enlarged diagram of the display according to the region A of Fig. 2A.Some guide ports 62 are specific according to one Opening design, enable the liquid to the left side spray.In detail, liquid entrance/ejection some guide ports 62 Direction it is important on the direction that the substrate 30 is moved, as described above, it is only necessary to there is the atomic small strength just can to order about The substrate 30 is moved.The design of described some guide ports 62 of the present embodiment is only for signal, remaining guide port of different shapes As long as design can reach similar or identical function also in the range of the utility model is intended to protect.

With reference to Fig. 3 A-3B.Fig. 3 A show the guiding device of the Wet-type etching device according to the utility model second embodiment 60 with the enlarged diagram of substrate 30.Fig. 3 B show the front view of the guiding device 60 of Fig. 3 A.This preferred embodiment is excellent with first The difference for selecting embodiment is that some guide ports 62 are from the left suction liquid in the right side, the liquid and then to the base Plate 30 produces a reaction force to the right, makes the substrate 30 toward moving right.In figure 3b, described some guide ports 62 of upper row The reason for not sucking the liquid repeats no more such as first preferred embodiment.In other preferred embodiments, it is also possible to Change the configuration mode of some guide ports 62, be not limited thereto.

With reference to Fig. 4 A, 4B, 4C.Fig. 4 A show the guiding dress of the Wet-type etching device according to the utility model 3rd embodiment Put the enlarged diagram of 60 and substrate 30.Fig. 4 B show the first type front view of the guiding device 60 of Fig. 4 A.Fig. 4 C show Fig. 4 A Guiding device 60 Second-Type front view.This preferred embodiment is with the first two preferred embodiment difference：Originally it is preferable to carry out Described some guide ports 62 of example can be by the way of first part sprays the liquid and the second part sucks the liquid Design, and then move in the horizontal direction the substrate.In figure 4b, the liquid is ejected into adjacent row from row's guide port 62 Guide port 62 is sucked；In figure 4 c, the liquid is ejected into the adjacent guide port 62 of same row and inhales from the guide port 62 of same row Enter.In other preferred embodiments, it is also possible to change the configuration mode of some guide ports 62, be not limited thereto.

Although the utility model has used preferred embodiment disclosed above, so it is not limited to the utility model, this reality It is various when that can make with new those of ordinary skill in the art in the spirit and scope for not departing from the utility model Change and retouching, therefore the utility model protection domain when depending on after the attached claim person of defining be defined.

Claims

1. a kind of Wet-type etching device, it is characterised in that including：

One cavity, including：

One air inlet, for importing an etching gas；And

One gas outlet, for deriving the etching gas；

Some etching nozzle for liquid, are arranged in the cavity, are etched with to a substrate；

One carrying platform is arranged in the cavity, including：

One body, is arranged at the substrate lower section；And

Some platform nozzles, through the body, some platform nozzles described in a penetration by liquid provide a upward liquid buoyancy It is used to offset the downward gravity of the substrate carry the substrate；And

One guiding device is arranged at the side for multiplying carrying platform, including some guide ports, is guided by some guide ports The liquid and then move the substrate.

2. Wet-type etching device as claimed in claim 1, it is characterised in that further include：

One exhausting module, is connected to the air inlet and the gas outlet and for by gas needed for the etching of the inside cavity Extracted out from the gas outlet.

3. Wet-type etching device as claimed in claim 1, it is characterised in that liquid liquid for needed for water or processing procedure.

4. Wet-type etching device as claimed in claim 1, it is characterised in that the guiding device is arranged on the upper of the substrate Lower both sides.

5. Wet-type etching device as claimed in claim 1, it is characterised in that some guide ports draw the liquid and then Move the substrate.

6. Wet-type etching device as claimed in claim 1, wherein some guide ports spray the liquid and then make described Substrate is moved.

7. Wet-type etching device as claimed in claim 1, it is characterised in that described some guide ports of first part spray institute The described some guide ports for stating liquid and the second part suck the liquid and then move the substrate.

8. Wet-type etching device as claimed in claim 1, it is characterised in that liquid entrance/ejection some guidings The direction of mouth is important on the direction that the substrate is moved.