CN206302652U - The silver paste hole filled template of circuit board - Google Patents
The silver paste hole filled template of circuit board Download PDFInfo
- Publication number
- CN206302652U CN206302652U CN201621417985.9U CN201621417985U CN206302652U CN 206302652 U CN206302652 U CN 206302652U CN 201621417985 U CN201621417985 U CN 201621417985U CN 206302652 U CN206302652 U CN 206302652U
- Authority
- CN
- China
- Prior art keywords
- silver paste
- plate body
- hole filled
- circuit board
- paste hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model is related to a kind of silver paste hole filled template of circuit board, including plate body, the plate body is provided with silver paste hole filled several perforations for matching with circuit board, and the through slot of several perforations is communicated with the front of plate body, and the perforation of outermost sets the air discharge duct for stretching to plate body side；The air discharge duct is mutually perpendicular to adjacent plate body side；Groove width of the groove width of the air discharge duct less than through slot；The back side of the plate body has peripheral flange.The utility model improves silver paste hole filled efficiency, it is to avoid bubble is produced in perforation.
Description
Technical field
The utility model is related to a kind of auxiliary template, more particularly to a kind of circuit board silver paste hole filled template.
Background technology
Printed wiring board is typically served to as each component provides necessary support in circuit in the electronic device, is easy to each
Individual component inserting, realizes that it is electrically connected.Widely used in an electronic.But the more sensitive unit of electromagnetic induction
Device, can easily receive electromagnetic interference.Electromagnetic interference is generally eliminated by the way of silver paste hole filled.Existing silver paste hole filled method
Being directed at several circuit boards by syringe needle carries out perforation, and such perforation efficiency declines, and bubble is likely to occur in perforation, influences
The quality of wiring board.
The content of the invention
The purpose of this utility model is to provide a kind of raising silver paste hole filled efficiency, it is to avoid the electricity that bubble is produced in perforation
The silver paste hole filled template of road plate.
In order to achieve the above object, the technical solution of the utility model is：A kind of silver paste hole filled template of circuit board, including
Plate body, the plate body is provided with silver paste hole filled several perforations for matching with circuit board, is communicated with the front of plate body
The through slot of several perforations, the perforation of outermost sets the air discharge duct for stretching to plate body side.
The air discharge duct is mutually perpendicular to adjacent plate body side.
Groove width of the groove width of the air discharge duct less than through slot.
The back side of the plate body has peripheral flange.
After said structure, the utility model when silver paste hole filled, by several perforations by plate body cover on circuit boards
The hole of silver paste is poured into the need on alignment circuit plate, is flowed in through slot by silver paste, filled silver paste by several perforations
Enter in the hole of circuit board, realize silver paste hole filled, once complete, improve silver paste hole filled efficiency, reach the two sides conducting of circuit board
Effect.And in order to avoid occurring bubble when silver paste hole filled, silver paste bubble in flow process can be discharged with air discharge duct, carried
Silver paste hole filled quality high.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the rearview of Fig. 1.
Specific embodiment
The utility model is described in further detail below in conjunction with the embodiment that accompanying drawing is given.
Referring to shown in Fig. 1,2, a kind of silver paste hole filled template of circuit board, including plate body 1, the plate body 1 is provided with and electricity
Silver paste hole filled several perforations 2 for matching of road plate, are communicated with the through slot 3 of several perforations 2 on the front of plate body 1,
The perforation 2 of outermost sets the air discharge duct 4 for stretching to the side of plate body 1.
It is shown in Figure 1, in order to shorten bubble discharge distance, improve discharge bubble velocity, the air discharge duct 4 with it is adjacent
The side of plate body 1 be mutually perpendicular to.
It is shown in Figure 1, in order to when silver paste hole filled, silver paste will not be discharged with air discharge duct 4, the groove of the air discharge duct 4
Groove width less than through slot 3 wide.
It is shown in Figure 1, in order to can accurately position so that perforation 2 can pour into silver paste the need for alignment circuit plate
Hole, the back side of the plate body 1 has peripheral flange 5.
It is shown in Figure 1, when the utility model is used, plate body 1 is covered on circuit boards, positioned by peripheral flange 5.Will
Silver paste pours into through slot 3, and silver paste flows into several perforations 2 with through slot 3, as perforation 2 is poured into the hole of circuit board, realizes
It is silver paste hole filled.And bubble can be discharged with air discharge duct 4.
Above-described is only preferred embodiment of the present utility model, it is noted that for the ordinary skill of this area
For personnel, on the premise of the utility model creation design is not departed from, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.
Claims (4)
1. the silver paste hole filled template of a kind of circuit board, it is characterised in that：Including plate body (1), the plate body (1) is provided with and circuit
Silver paste hole filled several perforations (2) for matching of plate, are communicated with the insertion of several perforations (2) on the front of plate body (1)
Groove (3), the perforation (2) of outermost sets the air discharge duct (4) for stretching to plate body (1) side.
2. the silver paste hole filled template of circuit board according to claim 1, it is characterised in that：The air discharge duct (4) with it is adjacent
Plate body (1) side be mutually perpendicular to.
3. the silver paste hole filled template of circuit board according to claim 1, it is characterised in that：The groove width of the air discharge duct (4)
Less than the groove width of through slot (3).
4. the silver paste hole filled template of circuit board according to claim 1, it is characterised in that：The back side tool of the plate body (1)
There is peripheral flange (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621417985.9U CN206302652U (en) | 2016-12-22 | 2016-12-22 | The silver paste hole filled template of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621417985.9U CN206302652U (en) | 2016-12-22 | 2016-12-22 | The silver paste hole filled template of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206302652U true CN206302652U (en) | 2017-07-04 |
Family
ID=59205907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621417985.9U Expired - Fee Related CN206302652U (en) | 2016-12-22 | 2016-12-22 | The silver paste hole filled template of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206302652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278049A (en) * | 2017-07-28 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
-
2016
- 2016-12-22 CN CN201621417985.9U patent/CN206302652U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278049A (en) * | 2017-07-28 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20171222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |