CN107278049A - A kind of design method of PCBA heat dissipation bonding pads steel mesh - Google Patents
A kind of design method of PCBA heat dissipation bonding pads steel mesh Download PDFInfo
- Publication number
- CN107278049A CN107278049A CN201710629236.5A CN201710629236A CN107278049A CN 107278049 A CN107278049 A CN 107278049A CN 201710629236 A CN201710629236 A CN 201710629236A CN 107278049 A CN107278049 A CN 107278049A
- Authority
- CN
- China
- Prior art keywords
- steel mesh
- heat dissipation
- bonding pads
- pcba
- dissipation bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of design method of PCBA heat dissipation bonding pads steel mesh, is related to circuit board processing field, and PCBA Gerber file heat dissipation bonding pads conducting hole location is provided with gas outlet channels.The beneficial effects of the invention are as follows：It is bad that the present invention can effectively solve bubble, fried tin quality using the design of gas outlet channels, increase substantially the yield of production circuit board, reduce production cost, improve circuit board competitiveness.
Description
Technical field
Field, specifically a kind of design side of PCBA heat dissipation bonding pads steel mesh are processed the present invention relates to circuit board
Method.
Background technology
PCBA is printing populated circuit board, and in the high speed development of current electronics industry, almost all of electronic equipment is all
Need PCBA support.And PCBA is fast-developing towards Highgrade integration, miniaturization, PCB layout highly dense is caused, pad
It is unavoidable to there is via hole, also referred to as Via Hole.Tin cream, Via Hole gas in heat dissipation bonding pad (having Via Hole) printing
Body can not be discharged, and the qualities such as bubble, fried tin can be formed after welding bad.
Circuit board is working long hours, and heat dissipation bonding pad produces substantial amounts of heat.Due to the generation of bubble, cause the heat produced
It timely and effective can not radiate, cause working electronic component temperature persistently to raise, more than temperature extremes, electronic component electrical characteristic meets with
To destruction.And fried tin formation tin sweat(ing) splashes, electronic component short circuit is caused.Chinese patent CN106954353A discloses a kind of solution
The steel mesh design method of electric capacity missing solder, this method increases by a window in steel mesh bottom, so as to increase tin amount, improves the upper tin of tin material
Property, and any solution is not obtained to via hole gas and fried tin problem.
The content of the invention
The phenomenon that there is bubble at via hole in the prior art, fried tin occur is directed to, the present invention proposes a kind of PCBA
The design method of heat dissipation bonding pad steel mesh, by designing steel mesh boring method, the bubble formed after solution welding, fried tin quality are not
It is good, increase substantially PCBA yields.
The technical scheme adopted by the invention to solve the technical problem is that：
A kind of design method of PCBA heat dissipation bonding pads steel mesh, hole site is turned in PCBA Gerber file heat dissipation bonding pads
Place is provided with gas outlet channels.By the design of gas outlet channels, air bubble problem of the prior art is solved, so as to also can
Solve the problems, such as fried tin.
Further, the gas outlet channels shape more extends toward edge, and gas outlet channels are wider.Passage is got over
Width, the risk that via hole is blocked by tin is lower.Via hole, which is blocked, easily forms bubble.
Further, steel mesh Edge Distance conducting bore edges are more than 0.2mm.Less than this distance, it is possible to which tin cream melts
After flow to via hole, via hole is covered to form bubble by tin.
Further, steel mesh thickness is 0.08mm-0.15mm.
Further, cutting accuracy is 0.01mm, and is processed by shot blasting after cutting, after steel mesh print solder paste, beneficial to de-
Mould.
The beneficial effects of the invention are as follows：The present invention can effectively solve bubble, fried tin product using the design of gas outlet channels
Matter is bad, increases substantially the yield of production circuit board, reduces production cost, improves circuit board competitiveness.
Brief description of the drawings
Fig. 1 is the structural representation that PCBA prints populated circuit board；
Fig. 2 prints the structural representation of populated circuit board for the PCBA covered with steel disc and steel mesh opening area；
Fig. 3 is the structural representation of PCBA printing populated circuit boards when being printed with tin cream；
In figure：1PCBA prints populated circuit board, 21 steel mesh opening areas, 22 steel discs, 23 tin creams, 3 via holes, 4 gases row
Go out passage.
Embodiment
Clearly to illustrate a kind of design method for PCBA heat dissipation bonding pads steel mesh that the application is proposed, according to PCBA's
Gerber file heat dissipation bonding pads turn on hole site, design suitable steel mesh, solve bubble, fried tin quality bad.Below will knot
Accompanying drawing is closed to illustrate specific implementation step.It is specific as follows：
The structural representation of populated circuit board 1 is printed for PCBA as shown in Figure 1.Choose steel mesh sheet material.According to Gerber
File element minimum spacings, choose the stainless steel of suitable thickness, the steel mesh thickness general range：0.08mm-0.15mm.
According to the particular location of Gerber file heat dissipation bonding pads via hole 3, steel mesh scheme is designed.As shown in Fig. 2 conducting
Covered with steel disc 22 at hole, remaining region is steel mesh opening area 21.
Steel mesh Edge Distance conducting bore edges H at least 0.2mm.As shown in figure 3, tin cream is not smeared in steel disc overlay area, and
Steel mesh opening area smears tin cream 23.Steel mesh is provided with gas outlet channels 4 at via hole, and gas outlet channels shape should expire
More outward, passage is wider for foot.
Steel mesh scheme according to design is programmed cutting.Cutting accuracy requirement is in 0.01mm.To be polished after cutting
Processing.
It is the known technology of those skilled in the art in addition to the technical characteristic described in specification.
Claims (5)
1. a kind of design method of PCBA heat dissipation bonding pads steel mesh, it is characterized in that, turned in PCBA Gerber file heat dissipation bonding pads
Hole location is provided with gas outlet channels.
2. a kind of design method of PCBA heat dissipation bonding pads steel mesh according to claim 1, it is characterized in that, the gas discharge
Channel shape more extends toward edge, and gas outlet channels are wider.
3. a kind of design method of PCBA heat dissipation bonding pads steel mesh according to claim 2, it is characterized in that, steel mesh Edge Distance
Turn on bore edges and be more than 0.2mm.
4. a kind of design method of PCBA heat dissipation bonding pads steel mesh according to claim 3, it is characterized in that, steel mesh thickness is
0.08mm-0.15mm。
5. a kind of design method of PCBA heat dissipation bonding pads steel mesh according to claim 4, it is characterized in that, cutting accuracy is
It is processed by shot blasting after 0.01mm, and cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710629236.5A CN107278049A (en) | 2017-07-28 | 2017-07-28 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710629236.5A CN107278049A (en) | 2017-07-28 | 2017-07-28 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107278049A true CN107278049A (en) | 2017-10-20 |
Family
ID=60074832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710629236.5A Pending CN107278049A (en) | 2017-07-28 | 2017-07-28 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107278049A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990312A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | It is a kind of for welding the steel mesh of QFN |
| CN110198594A (en) * | 2019-06-27 | 2019-09-03 | 浪潮商用机器有限公司 | A kind of heat dissipation bonding pad paste solder printing technique and system of the PCBA with the hole via |
| CN110572956A (en) * | 2019-08-08 | 2019-12-13 | 武汉光迅科技股份有限公司 | Adjustable blow welding protection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201655769U (en) * | 2010-03-01 | 2010-11-24 | 华为终端有限公司 | Circuit board packaging device and steel mesh thereof |
| CN106231813A (en) * | 2016-09-28 | 2016-12-14 | 伟创力电子技术(苏州)有限公司 | A kind of one side the most empty method of backflow of dual platen |
| CN106847705A (en) * | 2016-09-21 | 2017-06-13 | 新华三技术有限公司 | By the method and chip-packaging structure of chip package PCB |
| CN206302652U (en) * | 2016-12-22 | 2017-07-04 | 常州市双进电子有限公司 | The silver paste hole filled template of circuit board |
-
2017
- 2017-07-28 CN CN201710629236.5A patent/CN107278049A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201655769U (en) * | 2010-03-01 | 2010-11-24 | 华为终端有限公司 | Circuit board packaging device and steel mesh thereof |
| CN106847705A (en) * | 2016-09-21 | 2017-06-13 | 新华三技术有限公司 | By the method and chip-packaging structure of chip package PCB |
| CN106231813A (en) * | 2016-09-28 | 2016-12-14 | 伟创力电子技术(苏州)有限公司 | A kind of one side the most empty method of backflow of dual platen |
| CN206302652U (en) * | 2016-12-22 | 2017-07-04 | 常州市双进电子有限公司 | The silver paste hole filled template of circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990312A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | It is a kind of for welding the steel mesh of QFN |
| CN110198594A (en) * | 2019-06-27 | 2019-09-03 | 浪潮商用机器有限公司 | A kind of heat dissipation bonding pad paste solder printing technique and system of the PCBA with the hole via |
| CN110572956A (en) * | 2019-08-08 | 2019-12-13 | 武汉光迅科技股份有限公司 | Adjustable blow welding protection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171020 |
|
| RJ01 | Rejection of invention patent application after publication |