CN106231813A - A kind of one side the most empty method of backflow of dual platen - Google Patents
A kind of one side the most empty method of backflow of dual platen Download PDFInfo
- Publication number
- CN106231813A CN106231813A CN201610857617.4A CN201610857617A CN106231813A CN 106231813 A CN106231813 A CN 106231813A CN 201610857617 A CN201610857617 A CN 201610857617A CN 106231813 A CN106231813 A CN 106231813A
- Authority
- CN
- China
- Prior art keywords
- backflow
- dual platen
- empty method
- rss
- sided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Abstract
The invention discloses a kind of one side the most empty method of backflow of dual platen, during one side backflow, facing up of PCB dual platen, sphere down, including step in detail below: a, amendment steel mesh perforate design, uses X-shaped steel net perforate；B, fluid welding temperature curve setting, use RTS type or RSS type profile, uses reflow soldering machine, totally 10 warm areas and 2 cooling zones, and speed is 30 39inch/min；C, adjustment soak time, use 75 85 seconds.By the way, the one side the most empty method of backflow of the dual platen of the present invention, two-sided backflow changes one side backflow into, production line becomes 1 from 2, improving production efficiency, meanwhile, to make empty ratio consistent with two-sided reflowing result or close in the case of one side refluxes and meet IPC 610* standard.
Description
Technical field
The present invention relates to the field of pcb board, particularly relate to a kind of one side the most empty method of backflow of dual platen, carry out surface
Component mounter and welding.
Background technology
PCBA board, front is mount components, and reverse side is the ball made with soldering paste, not mount components, similar BGA.
Owing to ball is made by soldering paste, containing liquid in tin cream, the gasification volatilization when backflow, due to time restriction, its
Gas can not vapor away completely, thus causes cavity, and its cavity is inevitable, and the metallic particles of the ball of BGA, no
This problem can be there is.Under normal circumstances, dual platen one side backflow more than its two-sided backflow cavity because now sphere under,
Gas upwards volatilizees, and suffers that PCB stops, causes volatilization not smooth, thus causes cavity.
The two-sided backflow of dual platen in prior art, i.e. reverse side reflux 1 time, reflux 1 time in front.When doing reverse side, print tin cream
Face (i.e. sphere) upward, reflow soldering；When doing front, face up, reflow soldering.But have the drawback that
A. needing 2 lines to produce, 1 produces reverse side, and another 1 produces front, wastes equipment, human resources；
B. production efficiency is low.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of one side the most empty method of backflow of dual platen, by two-sided time
Stream changes one side backflow into, and production line becomes 1 from 2, improving production efficiency, meanwhile, and cavity to be made in the case of one side refluxes
Ratio consistent with two-sided reflowing result or close to and meet IPC 610* standard.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provide the one side of a kind of dual platen
Reflux the most empty method, one side backflow time, facing up of PCB dual platen, sphere down, including step in detail below:
A, amendment steel mesh perforate design, use X-shaped steel net perforate；
B, fluid welding temperature curve setting, use RTS type or RSS type profile, uses reflow soldering machine, totally 10 warm areas and 2
Individual cooling zone, speed is 30-39inch/min；
C, adjustment soak time, use the 75-85 second.
In a preferred embodiment of the present invention, the thickness of described PCB dual platen is 1 ± 0.1mm.
In a preferred embodiment of the present invention, during RTS type profile described in employing, RTS furnace temperature parameter upper and lower
Warm area is consistent, and the temperature of 10 warm areas arranges respectively: 95,125,140,160,190,200,210,230,255 and 250 degree,
Speed is 30inch/min.
In a preferred embodiment of the present invention, during RSS type profile described in employing, RSS furnace temperature parameter upper and lower
Warm area is consistent, and the temperature of 10 warm areas arranges respectively: 130,165,190,180,190,205,240,260,255 and 245 degree,
Speed is 39inch/min.
The invention has the beneficial effects as follows: the one side the most empty method of backflow of a kind of dual platen of the present invention, by two-sided backflow
Changing one side backflow into, production line becomes 1 from 2, improving production efficiency, meanwhile, to make cavity in the case of one side refluxes
Ratio is consistent with two-sided reflowing result or close and meets IPC 610* standard.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described, it should be apparent that, below describe in accompanying drawing be only some embodiments of the present invention, for
From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other according to these accompanying drawings
Accompanying drawing, wherein:
Fig. 1 is the structural representation of X-shaped steel net perforate in the present invention；
Fig. 2 is the display figure of RTS type profile；
Fig. 3 is the display figure of RSS type profile.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
The embodiment of the present invention includes:
A kind of one side the most empty method of backflow of dual platen, during one side backflow, facing up of PCB dual platen, sphere down, wraps
Include step in detail below:
A, amendment steel mesh perforate design, use X-shaped steel net perforate；
B, fluid welding temperature curve setting, use RTS type or RSS type profile, uses reflow soldering machine, totally 10 warm areas and 2
Individual cooling zone, speed is 30-39inch/min；
C, adjustment soak time, use the 75-85 second.
When refluxing due to one side, down, the gas in soldering paste upwards volatilizees sphere, owing to PCB dual platen intercepts, causes and waves
Sending out smooth, need to increase passage to help it volatilize, therefore attempt different steel mesh perforate designs, " X " designs is best, pad
A diameter of 0.72mm, X-shaped steel net perforate is as shown in Figure 1.
In above-mentioned, the thickness of described PCB dual platen is 1 ± 0.1mm.The present embodiment uses RSS type Profile
Good.
As in figure 2 it is shown, when RTS type profile described in using, the warm area up and down of RTS furnace temperature parameter is consistent, 10
The temperature of warm area arranges respectively: 95,125,140,160,190,200,210,230,255 and 250 degree, speed is 30inch/
min。
As it is shown on figure 3, as RSS type profile described in using, the warm area up and down of RSS furnace temperature parameter is consistent, 10
The temperature of warm area arranges respectively: 130,165,190,180,190,205,240,260,255 and 245 degree, speed is 39inch/
min。
The most empty method of one side backflow of dual platen of the present invention compared with prior art has the advantage that
A. 1 production line and related personnel thereof can be reduced；
B. 2 lines become 1 line, do not increase another line personnel amount；
C. improving production efficiency (positive and negative production simultaneously).
In sum, the one side the most empty method of backflow of a kind of dual platen of the present invention, change two-sided backflow into single-side square
Stream, production line becomes 1 from 2, improving production efficiency, meanwhile, to make the ratio in cavity with two-sided in the case of one side refluxes
Reflowing result is consistent or close and meets IPC 610* standard.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every present invention of utilization says
Equivalent structure or equivalence flow process that bright book content is made convert, or are directly or indirectly used in other relevant technical field, all
In like manner it is included in the scope of patent protection of the present invention.
Claims (4)
1. the one side the most empty method of backflow of a dual platen, it is characterised in that during one side backflow, just facing of PCB dual platen
On, sphere down, including step in detail below:
A, amendment steel mesh perforate design, use X-shaped steel net perforate；
B, fluid welding temperature curve setting, use RTS type or RSS type profile, uses reflow soldering machine, totally 10 warm areas and 2
Individual cooling zone, speed is 30-39inch/min；
C, adjustment soak time, use the 75-85 second.
The one side the most empty method of backflow of dual platen the most according to claim 1, it is characterised in that described PCB is two-sided
The thickness of plate is 1 ± 0.1mm.
The one side the most empty method of backflow of dual platen the most according to claim 1, it is characterised in that the RTS described in employing
During type profile, the warm area up and down of RTS furnace temperature parameter is consistent, and the temperature of 10 warm areas arranges respectively: 95,125,140,
160,190,200,210,230,255 and 250 degree, speed is 30inch/min.
The one side the most empty method of backflow of dual platen the most according to claim 1, it is characterised in that the RSS described in employing
During type profile, the warm area up and down of RSS furnace temperature parameter is consistent, and the temperature of 10 warm areas arranges respectively: 130,165,190,
180,190,205,240,260,255 and 245 degree, speed is 39inch/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610857617.4A CN106231813A (en) | 2016-09-28 | 2016-09-28 | A kind of one side the most empty method of backflow of dual platen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610857617.4A CN106231813A (en) | 2016-09-28 | 2016-09-28 | A kind of one side the most empty method of backflow of dual platen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106231813A true CN106231813A (en) | 2016-12-14 |
Family
ID=58076926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610857617.4A Pending CN106231813A (en) | 2016-09-28 | 2016-09-28 | A kind of one side the most empty method of backflow of dual platen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106231813A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278049A (en) * | 2017-07-28 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
| CN108990312A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | It is a kind of for welding the steel mesh of QFN |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252815A (en) * | 2008-03-31 | 2008-08-27 | 广州金升阳科技有限公司 | Solder tray local tin plating method on circuit board |
| CN103037633A (en) * | 2012-12-13 | 2013-04-10 | 无锡江南计算技术研究所 | Welding skewing-proof method for surface mounting device |
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN204669723U (en) * | 2014-10-21 | 2015-09-23 | 珠海迈科智能科技股份有限公司 | A kind of circuit board, printed circuit board and steel mesh |
| CN105007695A (en) * | 2015-07-29 | 2015-10-28 | 无锡市同步电子制造有限公司 | LGA welding process method in printed circuit board processing |
-
2016
- 2016-09-28 CN CN201610857617.4A patent/CN106231813A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101252815A (en) * | 2008-03-31 | 2008-08-27 | 广州金升阳科技有限公司 | Solder tray local tin plating method on circuit board |
| CN103037633A (en) * | 2012-12-13 | 2013-04-10 | 无锡江南计算技术研究所 | Welding skewing-proof method for surface mounting device |
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN204669723U (en) * | 2014-10-21 | 2015-09-23 | 珠海迈科智能科技股份有限公司 | A kind of circuit board, printed circuit board and steel mesh |
| CN105007695A (en) * | 2015-07-29 | 2015-10-28 | 无锡市同步电子制造有限公司 | LGA welding process method in printed circuit board processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107278049A (en) * | 2017-07-28 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of design method of PCBA heat dissipation bonding pads steel mesh |
| CN108990312A (en) * | 2018-08-24 | 2018-12-11 | 郑州云海信息技术有限公司 | It is a kind of for welding the steel mesh of QFN |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102281724B (en) | Method for machining double-sided windowed plug hole | |
| CN106231813A (en) | A kind of one side the most empty method of backflow of dual platen | |
| CN106793572A (en) | Drilling method of the multilayer circuit board laser into blind hole | |
| CN106604526A (en) | Heat-radiation pad, design method thereof and printed circuit board (PCB) | |
| CN202873193U (en) | Technological edge of PCB board and PCB jointed board | |
| CN106102315B (en) | The Wave crest Welding method and printed circuit board of printed circuit board | |
| CN101677492B (en) | Manufacturing technology of printed circuit board (PCB) | |
| CN201491379U (en) | Printed circuit board comprising LCD bonding pads | |
| CN105491805A (en) | Method for fabricating characters on thick copper board of PCB | |
| CN205546222U (en) | Reflow soldering template, Stencil assembly and solder paste printing process device | |
| CN205566802U (en) | Circuit board | |
| CN206200382U (en) | A kind of special tin bar of photovoltaic welding belt | |
| CN206422970U (en) | A kind of ladder printed circuit board (PCB) | |
| CN102348337A (en) | Method for producing circuit board containing stepped blind hole | |
| CN207782070U (en) | A kind of soft copper bar structure | |
| CN204335154U (en) | Metallization via pad and circuit board | |
| CN201328216Y (en) | Circuit board structure | |
| CN203401173U (en) | Device for improving wave crest stability of selective wave-soldering brazing filler metal | |
| CN105491815A (en) | Reflow soldering template, template component, tin paste printing device and reflow soldering method | |
| CN204818358U (en) | Device of simulation backward flow brazier holds container | |
| CN206674324U (en) | A kind of template for pcb board | |
| CN105990296A (en) | Chip connecting structure and manufacturing process | |
| CN205811881U (en) | A kind of soft initiator of Based PC B baseplate heat sink | |
| CN101636045A (en) | Bearing plate for wave-soldering device | |
| CN205584611U (en) | PCB's inner -layer core plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161214 |