CN205811881U - A kind of soft initiator of Based PC B baseplate heat sink - Google Patents

A kind of soft initiator of Based PC B baseplate heat sink Download PDF

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Publication number
CN205811881U
CN205811881U CN201620577002.1U CN201620577002U CN205811881U CN 205811881 U CN205811881 U CN 205811881U CN 201620577002 U CN201620577002 U CN 201620577002U CN 205811881 U CN205811881 U CN 205811881U
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CN
China
Prior art keywords
pcb board
pad
circle
increasing
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620577002.1U
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Chinese (zh)
Inventor
刘国鹰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Wonder Electric Polytron Technologies Inc
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Shanghai Wonder Electric Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201620577002.1U priority Critical patent/CN205811881U/en
Application granted granted Critical
Publication of CN205811881U publication Critical patent/CN205811881U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

This utility model relates to the soft initiator of a kind of Based PC B baseplate heat sink, including housing, numerous (PCC) power it is provided with in described housing, described (PCC) power is arranged on pcb board, wherein, described pcb board includes substrate and sets fairlead on the substrate, and at the middle part of described pcb board, pressure sets at least two-layer Copper Foil, in order to heat radiation;The two sides of described fairlead are respectively equipped with pad, and the periphery at described pad outwards expands and forms a circle increasing weldering circle, and the material that described increasing weldering is enclosed is identical with the material of pad.Provide the benefit that: the increasing weldering circle of Copper Foil and increase by increasing more than two-layer at pcb board, area of dissipation, beneficially thermal diffusion can be expanded;The increasing weldering circle of substrate both sides is connected by via, increases the conduction of heat strengthening substrate both sides, reduces the temperature difference of both sides pad, be more beneficial for the thermal diffusion of pcb board.

Description

A kind of soft initiator of Based PC B baseplate heat sink
Technical field
This utility model relates to soft initiator technical field, especially relates to soft the opening of a kind of Based PC B baseplate heat sink Dynamic device.
Background technology
Soft initiator is that a kind of motor integrating soft start, soft stop, light-load energy saving and multifunction protection controls dress Standby.Realize startup motor smooth without impact in whole start-up course, and can adjust according to the characteristic of motor load Various parameters in joint start-up course, such as cut-off current, startup time etc..
Pcb board in soft initiator, has substantial amounts of components and parts on pcb board, and in work process, components and parts can produce greatly The heat energy of amount, crosses conference such as heat and overall circuit function is produced strong influence, the when of typically encountering this problem, if Meter personnel can be combined this device and a radiator panel, and heat can be made to distribute sooner, but this situation Large circuit board cost can be added, in the case of circuit board size requires, the typesetting cabling of circuit can be produced certain impact, Such as device bigger for temperature influence can not be placed in together etc. with it, also some spraying coating process can be had necessarily Restriction.
Therefore, the appearance of a kind of direct soft initiator with pcb board as radiator is necessary.
Utility model content
This utility model provides the soft initiator of a kind of Based PC B baseplate heat sink, to solve circuit of the prior art Plate cost is high, the problem of radiating effect difference.
This utility model is solved the technical problem that and is realized by the following technical solutions:
The soft initiator of a kind of Based PC B baseplate heat sink, including housing, is provided with numerous power packages in described housing Part, described (PCC) power is arranged on pcb board, and wherein, described pcb board includes substrate and sets lead-in wire on the substrate Hole, at the middle part of described pcb board, pressure sets at least two-layer Copper Foil, in order to heat radiation;
The two sides of described fairlead are respectively equipped with pad, and the periphery at described pad outwards expands formation one circle and increases weldering Circle, and the material of described increasing weldering circle is identical with the material of pad.
As preferred technical scheme, described increasing weldering circle is provided with at least one via, and the increasing weldering circle of described substrate both sides is logical Cross described via to be connected.
As preferred technical scheme, described via is 4, and is located on the surrounding of described fairlead uniformly.
Copper Foil material is all used as preferred technical scheme, described pad and increasing weldering circle.
As preferred technical scheme, described in two-layer, between Copper Foil, there is certain distance.
This utility model has the advantages that the increasing of Copper Foil and increase by increasing more than two-layer at pcb board is welded Circle, can expand area of dissipation, beneficially thermal diffusion;The increasing weldering circle of substrate both sides is connected by via, increases and strengthens substrate The conduction of heat of both sides, reduces the temperature difference of both sides pad, is more beneficial for the thermal diffusion of pcb board.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention or technical scheme of the prior art, below will be to embodiment Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only It is some embodiments of the present invention, for those of ordinary skill in the art, in the premise not paying creative work Under, it is also possible to other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is this utility model: the structural representation of the soft initiator of a kind of Based PC B baseplate heat sink;
Fig. 2 is this utility model: the structural representation of the pcb board of the soft initiator of a kind of Based PC B baseplate heat sink.
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and be easy to understand with effect, under Face combines and is specifically illustrating, and this utility model is expanded on further.
With reference to shown in Fig. 1-2, the soft initiator of a kind of Based PC B baseplate heat sink, including housing 1, in described housing 1 Being provided with numerous (PCC) power, described (PCC) power is arranged on pcb board 2, and wherein, described pcb board 2 includes substrate 21, Yi Jishe Fairlead 22 on described substrate 21, at the middle part of described pcb board 2, pressure sets the Copper Foil 23 that at least two-layer does not contacts with each other, with It is easy to heat radiation;
The two sides of described fairlead 22 are respectively equipped with pad 24, and the periphery at described pad 24 outwards expands formation one circle Increase and weld circle 25, and the material of described increasing weldering circle 25 is identical with the material of pad 24, it is preferred that it is equal that circle 25 is welded in described pad 24 and increasing Use Copper Foil material.
The described weldering circle 25 that increases of the present utility model is provided with at least one via 26, and the increasing weldering circle 25 of described substrate 21 both sides leads to Cross described via 26 to be connected.
Described via of the present utility model is 4, and is located on the surrounding of described fairlead 22 uniformly.
The increasing weldering circle of this utility model Copper Foil and increase by increasing more than two-layer at pcb board, can expand heat radiation Area, beneficially thermal diffusion;The increasing weldering circle of substrate 21 both sides is connected by via, increases the heat biography strengthening substrate 21 both sides Lead, reduce the temperature difference of both sides pad, be more beneficial for the thermal diffusion of pcb board.
Of the present utility model ultimate principle and principal character and of the present utility model advantage have more than been shown and described.One's own profession Skilled person will appreciate that of industry, this utility model is not restricted to the described embodiments, described in above-described embodiment and description Principle of the present utility model is simply described, on the premise of without departing from this utility model spirit and scope, this utility model is also Have various changes and modifications, in the range of these changes and improvements both fall within claimed this utility model.This utility model Claimed scope is defined by appending claims and equivalent thereof.

Claims (5)

1. a soft initiator for Based PC B baseplate heat sink, including housing, is provided with numerous (PCC) power in described housing, Described (PCC) power is arranged on pcb board, and wherein, described pcb board includes substrate and sets fairlead on the substrate, At the middle part of described pcb board, pressure sets at least two-layer Copper Foil;
The two sides of described fairlead are respectively equipped with pad, and the periphery at described pad outwards expands formation one circle and increases weldering circle, and The material of described increasing weldering circle is identical with the material of pad.
The soft initiator of a kind of Based PC B baseplate heat sink the most according to claim 1, it is characterised in that described increasing is welded Circle is provided with at least one via, and the increasing weldering circle of described substrate both sides is connected by described via.
The soft initiator of a kind of Based PC B baseplate heat sink the most according to claim 2, it is characterised in that described via It is 4, and is located on the surrounding of described fairlead uniformly.
The soft initiator of a kind of Based PC B baseplate heat sink the most according to claim 1, it is characterised in that described pad Copper Foil material is all used with increasing weldering circle.
The soft initiator of a kind of Based PC B baseplate heat sink the most according to claim 1, it is characterised in that described in two-layer There is between Copper Foil certain distance.
CN201620577002.1U 2016-06-13 2016-06-13 A kind of soft initiator of Based PC B baseplate heat sink Expired - Fee Related CN205811881U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620577002.1U CN205811881U (en) 2016-06-13 2016-06-13 A kind of soft initiator of Based PC B baseplate heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620577002.1U CN205811881U (en) 2016-06-13 2016-06-13 A kind of soft initiator of Based PC B baseplate heat sink

Publications (1)

Publication Number Publication Date
CN205811881U true CN205811881U (en) 2016-12-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620577002.1U Expired - Fee Related CN205811881U (en) 2016-06-13 2016-06-13 A kind of soft initiator of Based PC B baseplate heat sink

Country Status (1)

Country Link
CN (1) CN205811881U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110366355A (en) * 2019-07-12 2019-10-22 周洋洋 A kind of flexible printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110366355A (en) * 2019-07-12 2019-10-22 周洋洋 A kind of flexible printed board

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161214

Termination date: 20190613