CN103152991B - A kind of layout method of printed circuit board (PCB) - Google Patents
A kind of layout method of printed circuit board (PCB) Download PDFInfo
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- CN103152991B CN103152991B CN201310105394.2A CN201310105394A CN103152991B CN 103152991 B CN103152991 B CN 103152991B CN 201310105394 A CN201310105394 A CN 201310105394A CN 103152991 B CN103152991 B CN 103152991B
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Abstract
The embodiment of the invention discloses a kind of layout method of printed circuit board (PCB), comprising: the position determining each pad and crest tool on a printed circuit, crest tool comprises vertical portion, rake and horizontal part; According to the extended line of crest tool rake and the point of interface of the point of interface of printed circuit board (PCB), the peripheral devices corresponding with pad and printed circuit board (PCB), and the point of interface 3 of crest tool horizontal part and rake determines right-angled triangle; According to constructed right-angled triangle, utilize trigonometric function to calculate, determine the Jin Bu district around each pad; According to described Jin Bu district, the layout of each peripheral devices on design printed circuit board (PCB), during to solve wave soldering, while there is missing solder and the bad problem of upper tin, realizes the Appropriate application of printed circuit board space, avoids the waste of printed circuit board space.
Description
Technical field
The present invention relates to ic manufacturing technology field, particularly relate to a kind of layout method of printed circuit board (PCB).
Background technology
Along with integrated circuit is more and more intensive, the requirement of printed circuit board (PCB) (Printedcircuitboard, be called for short PCB) cloth member is more and more higher, small and exquisite intensive and the circuit layout that reliability is high can bring more and more higher value to enterprise.Current most of electronic product still needs to use various connector, and wave soldering is the use of the electronic assemblies technique of decades, and therefore, in electronic product is produced, wave-soldering still occupies critical role.
Plug-in unit welding needs pad and Wave soldering fixture, and wherein, described pad is used for fixing described plug-in unit, and described crest tool is used for when wave soldering, and the device of protection solder side, prevents shorted devices, open circuit or destruction.The perfect condition of wave soldering is: the speed of speed and the movement of crest tool of the flowing of liquid tin is equal, and when wave soldering, crest tool and tin ripple geo-stationary, liquid tin vertically goes up tin due to the capillary action of leg.But in prior art when wave soldering, unreasonable owing to designing, after causing printed circuit board layout to complete, or space waste is comparatively large, or easily there is missing solder and the bad problem of upper tin.
Summary of the invention
For solving the problems of the technologies described above, embodiments provide a kind of layout method of printed circuit board (PCB), during to solve wave soldering, while there is missing solder and the bad problem of upper tin, realize the Appropriate application of printed circuit board space, avoid the waste of printed circuit board space.
For solving the problem, embodiments provide following technical scheme:
A layout method for printed circuit board (PCB), comprising:
Determine the position of each pad and crest tool on the printed circuit board, described crest tool comprises vertical portion, rake and horizontal part;
According to the extended line of described crest tool rake and the point of interface of the point of interface of described printed circuit board (PCB), the peripheral devices corresponding with described pad and printed circuit board (PCB), and the point of interface 3 of described crest tool horizontal part and rake determines right-angled triangle, wherein, point of interface 2 line segments formed of the described extended line of crest tool rake and the point of interface of described printed circuit board (PCB) and described crest tool horizontal part and rake are the hypotenuse of described right-angled triangle;
According to constructed right-angled triangle, utilize trigonometric function to calculate, determine the Jin Bu district around each pad;
According to described Jin Bu district, the layout of each peripheral devices on design printed circuit board (PCB).
Preferably, according to described right-angled triangle, utilize trigonometric function to calculate, determine that the Jin Bu district around each pad comprises:
Calculate described right-angled triangle perpendicular to sharp angle formed by the hypotenuse of the right-angle side length of described printed circuit board (PCB), the described right-angled triangle right-angle side in described printed circuit board plane in parallel;
Utilize cotangent trigonometric function, determine the distance between each plug-in unit pad and its peripheral devices, obtain prohibiting cloth distance;
Centered by plug-in unit pad, described taboo cloth distance is radius, determines the Jin Bu district around each pad.
Preferably, described right-angled triangle comprises perpendicular to the calculating of the right-angle side length of described printed circuit board (PCB):
The thickness of the height of the peripheral devices that place known and to be welded pad is corresponding, the preset clearance between described peripheral devices and the horizontal part of crest tool, described crest tool and make tolerance;
To the thickness of the height of the peripheral devices corresponding with place to be welded pad, the preset clearance between described peripheral devices and the horizontal part of crest tool and described crest tool and make tolerance and sue for peace, calculate the right-angle side length of described right-angled triangle perpendicular to described printed circuit board (PCB).
Preferably, utilize cotangent trigonometric function, determine the distance between each plug-in unit pad and its peripheral devices, obtain prohibiting cloth distance and comprise:
According to formula L=Cot θ. (H+a+b+t), determine the distance between each plug-in unit pad and its peripheral devices, obtain prohibiting cloth distance;
Wherein, L represents taboo cloth distance; H represents the height of the peripheral devices corresponding with place to be welded pad; A represents the preset clearance between described peripheral devices and crest tool horizontal part; B represents the thickness of described crest tool; T represents the making tolerance of described crest tool; The hypotenuse that θ represents described right-angled triangle and be parallel to described printed circuit board plane right-angle side formed by sharp angle.
Preferably, the span of the preset clearance a between described peripheral devices and crest tool horizontal part is: 0.1mm-1.0mm, comprises endpoint value.
Preferably, formed by the hypotenuse of the described right-angled triangle right-angle side in described printed circuit board plane in parallel, the span of sharp angle θ is 0 °-90 °, does not comprise endpoint value.
Compared with prior art, technique scheme has the following advantages:
Due to the described extended line of crest tool rake and the point of interface of printed circuit board (PCB), be positioned at the outward flange position with described pad, namely described pad is away from the side of welding hole, and, when wave soldering, the horizontal part of described crest tool is parallel to printed circuit board (PCB), rake is parallel to the direction of liquid tin flowing, so sharp angle equals sharp angle formed by liquid tin flow direction and described crest tool horizontal part formed by the hypotenuse of the described right-angled triangle right-angle side in described printed circuit board plane in parallel.Therefore, in the technical scheme that the embodiment of the present invention provides, utilize according to the described extended line of crest tool rake and the point of interface of described printed circuit board (PCB), the peripheral devices corresponding with described pad and the point of interface of printed circuit board (PCB), and point of interface 3 right-angled triangles determined of described crest tool horizontal part and rake, determine the Jin Bu district of described pad, when can avoid wave soldering, crest tool blocks the possibility of leg, and for preventing from occurring during wave soldering the minimum Jin Bu district of missing solder and the bad problem of upper tin, so, utilize the Jin Bu district according to described pad provided by the present invention, carry out the method for the layout of this printed circuit board (PCB), can when solving wave soldering, while there is missing solder and the bad problem of upper tin, realize the Appropriate application of printed circuit board space, avoid the waste of printed circuit board space.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The schematic flow sheet of the layout method of the printed circuit board (PCB) that Fig. 1 provides for the embodiment of the present invention;
In the layout method of the printed circuit board (PCB) that Fig. 2 provides for the embodiment of the present invention, structural representation during wave soldering;
In the layout method of the printed circuit board (PCB) that Fig. 3 provides for the embodiment of the present invention, the schematic flow sheet of step 3.
Embodiment
Just as described in the background section, in prior art when wave soldering, unreasonable owing to designing, after causing printed circuit board layout to complete, or space waste is comparatively large, or easily occurs missing solder and the bad problem of upper tin.
Inventor studies discovery, and when wave soldering, wave-soldering junction needs to consider the distance between plug-in unit pad (i.e. pad) and peripheral devices usually, both distances are too near, wave soldering can be caused bad, apart from too far away, can the irrational problems of PCB layout such as space waste be caused.And when PCB layout is carried out in industry inherence at present, unified a kind of computational methods are not had to go to calculate the distance in wave-soldering junction between pad and peripheral devices, whether PCB design layout is reasonable, can only be judged by the process experiences of designer or design experiences, there is no rational theories integration, precision is lower, easily occurs missing solder or failure welding, or the problem that space waste is larger.
Inventor studies discovery further, and when carrying out wave soldering, the thickness of crest tool needs to design according to the height of device on solder side, and the height of device is higher, and the projection of crest tool is higher.When the projection of crest tool is higher, if the distance of pad and peripheral devices is too near, crest tool may block leg, and Xi Bo cannot be contacted with leg, cause missing solder or upper tin bad, i.e. generation " shadow effect "; If pad and peripheral devices apart from too far away, the irrational problem of the layouts such as space waste is larger can be caused.
In view of this, embodiments provide a kind of layout method of printed circuit board (PCB), comprising: the position determining each pad and crest tool on the printed circuit board, described crest tool comprises vertical portion, rake and horizontal part; According to the extended line of described crest tool rake and the point of interface of the point of interface of described printed circuit board (PCB), the peripheral devices corresponding with described pad and printed circuit board (PCB), and the point of interface 3 of described crest tool horizontal part and rake determines right-angled triangle, wherein, point of interface 2 line segments formed of the described extended line of crest tool rake and the point of interface of described printed circuit board (PCB) and described crest tool horizontal part and rake are the hypotenuse of described right-angled triangle; According to constructed right-angled triangle, utilize trigonometric function to calculate, determine the Jin Bu district around each pad; According to described Jin Bu district, the layout of each peripheral devices on design printed circuit board (PCB).
The layout method of printed circuit board (PCB) provided by the present invention, rational deployment between pad and peripheral devices can be realized, make pad and peripheral devices both can not because of distance too near, produce " shadow effect ", cause missing solder or upper tin bad, also because of apart from too far away, the irrational problems of PCB layout such as space waste can not be caused.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail tool execution mode of the present invention below in conjunction with accompanying drawing.
Set forth detail in the following description so that fully understand the present invention.But the present invention can be different from alternate manner described here to implement with multiple, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention.Therefore the present invention is not by the restriction of following public concrete enforcement.
Embodiment one:
Shown in composition graphs 1 and Fig. 2, embodiments provide a kind of layout method of printed circuit board (PCB), comprising:
Step S1: the position determining each pad 2 and crest tool 3 on described printed circuit board (PCB) 1, described crest tool 3 comprises vertical portion 31, rake 32 and horizontal part 33.Wherein, the position of described pad 2 and crest tool 3, needs according to circuit layout specifically to be produced on this printed circuit board (PCB) 1 and determines.
Step S2: according to the extended line of described crest tool 3 rake 32 and the point of interface B of the point of interface A of described printed circuit board (PCB) 1, the peripheral devices 4 corresponding with described pad 2 and printed circuit board (PCB) 1, and the point of interface C 3 of described crest tool 3 horizontal part 33 and rake 32 determines right-angled triangle ABC, wherein, the line segment AC that the point of interface C 2 of the described extended line of crest tool 3 rake 33 and the point of interface A of described printed circuit board (PCB) 1 and described crest tool 3 horizontal part 33 and rake 32 is formed is the hypotenuse of described right-angled triangle ABC.
As shown in Figure 2, described pad 2 center has through hole, the welding hole on corresponding described printed circuit board (PCB), for placing plug-in unit 5 to be welded.The extended line of described crest tool 3 rake 33, through the outward flange of described pad, namely described pad 2 is away from the marginal position of welding hole side, therefore, the A point of described right-angled triangle ABC, the i.e. described extended line of crest tool 3 rake 32 and the point of interface of described printed circuit board (PCB) 1 is the described extended line of crest tool 3 rake 32 and the point of interface of pad 2;
The peripheral devices 4 corresponding with described pad 2 is vertically set on the side of described printed circuit board (PCB) 1 towards described crest tool 3, and described peripheral devices 4 has certain length being parallel on described printed circuit board (PCB) 1 direction, preferably, in embodiments of the present invention, the B point of described right-angled triangle ABC refers to the point of interface near welding hole side in each point of interface of the peripheral devices 4 corresponding with described pad 2 and printed circuit board (PCB) 1; Described crest tool 3 has certain thickness, and preferably, in embodiments of the present invention, the C point of described right-angled triangle ABC refers to the point of interface away from described printed circuit board (PCB) 1 side in the horizontal part 33 of described crest tool 3 and the point of interface of rake 32.
It should be noted that, during due to wave soldering, described peripheral devices 4 is vertically installed in the side of described printed circuit board (PCB) 1 towards described crest tool 3, and the boundary line of the horizontal part 33 of described crest tool 3 and rake 32 and the sidewall of described peripheral devices 4 near welding hole side are in same perpendicular, so, the triangle that three summit ABC determine is right-angled triangle, and the line segment AC that the point of interface C 2 of the described extended line of crest tool 3 rake 33 and the point of interface A of described printed circuit board (PCB) 1 and described crest tool 3 horizontal part 33 and rake 32 is formed is the hypotenuse of described right-angled triangle ABC, the described extended line of crest tool 3 rake 32 and the point of interface A of described printed circuit board (PCB) 1, and the line segment AB that forms of the point of interface B 2 of the peripheral devices 4 corresponding with described pad 2 and printed circuit board (PCB) 1 is a right-angle side of described right-angled triangle, also be in wave soldering process, when can avoid missing solder or failure welding, described pad 2 surrounding forbids the least radius in peripheral devices region described in layout.
Step S3: according to constructed right-angled triangle ABC, utilize trigonometric function to calculate, determines the Jin Bu district around each pad.
After determining that described pad 2 surrounding forbids the least radius in peripheral devices region described in layout, according to described right-angled triangle ABC, trigonometric function theorem can be utilized, calculate the concrete numerical value of described least radius, thus determine the Jin Bu district around each pad.
Concrete, as shown in Figure 3, in one embodiment of the invention, step S3 comprises:
Step S301: calculate described right-angled triangle ABC perpendicular to sharp angle θ formed by the right-angle side BC length of described printed circuit board (PCB) 1 and the hypotenuse AC of the described right-angled triangle ABC right-angle side AB in described printed circuit board (PCB) 1 plane in parallel.
As can be known from Fig. 2, the hypotenuse of described right-angled triangle ABC, for point of interface C 2 line segments formed of the described extended line of crest tool 3 rake 33 and the point of interface A of described printed circuit board (PCB) 1 and described crest tool 3 horizontal part 33 and rake 32, its concrete length is not easily measured or calculates, therefore, in the layout method of the printed circuit board (PCB) 1 that the embodiment of the present invention provides, preferred measurement or calculate the right-angle side BC length of described right-angled triangle ABC perpendicular to described printed circuit board (PCB) 1, namely in the horizontal part 33 of described crest tool 3 and the point of interface of rake 32 away from the distance of point of interface to described printed circuit board (PCB) 1 towards described crest tool 3 one side plane of described printed circuit board (PCB) 1 side.
In one embodiment of the invention, the calculating of the right-angle side BC length of described right-angled triangle ABC comprises:
The thickness b of the height H of the peripheral devices 4 that place known and to be welded pad 2 is corresponding, the preset clearance a between described peripheral devices 4 and the horizontal part 33 of crest tool 3, described crest tool 3 and make tolerance t;
To the thickness b of the height H of the peripheral devices 4 corresponding with place to be welded pad 2, the preset clearance a between described peripheral devices 4 and the horizontal part 33 of crest tool 3 and described crest tool 3 and make tolerance t and sue for peace, calculate the length of described right-angled triangle ABC perpendicular to the right-angle side BC of described printed circuit board (PCB) 1.
Step S302: utilize cotangent trigonometric function, determines the distance between each plug-in unit pad 2 and its peripheral devices 4, obtains prohibiting cloth distance L;
After obtaining the length of described right-angled triangle perpendicular to the right-angle side BC of described printed circuit board (PCB) 1, according to trigonometric function theorem, the length that described right-angled triangle is parallel to the right-angle side AB of described printed circuit board (PCB) 1 can be obtained.
In one particular embodiment of the present invention, describedly utilize cotangent trigonometric function, determine the distance between each plug-in unit pad 2 and its peripheral devices 4, obtain prohibiting cloth distance L to comprise: according to formula L=Cot θ. (H+a+b+t), determine the distance L between each plug-in unit pad 2 and its peripheral devices 4, obtain prohibiting cloth distance.Wherein, L represents taboo cloth distance; H represents the height of the peripheral devices 4 corresponding with place to be welded pad 2; A represents the preset clearance between described peripheral devices 4 and crest tool 3 horizontal part 33, and preferably, the span of the preset clearance a between described peripheral devices and crest tool horizontal part is: 0.1mm-1.0mm, comprises endpoint value; B represents the thickness of described crest tool 3; T represents the making tolerance of described crest tool 3; θ represents sharp angle formed by the hypotenuse AC of the described right-angled triangle right-angle side AB in described printed circuit board (PCB) 1 plane in parallel.
Due to the described extended line of crest tool 3 rake 32 and the point of interface of printed circuit board (PCB) 1, be positioned at the outward flange position with described pad 2, namely described pad 2 is away from the side of welding hole, and, when wave soldering, the horizontal part 33 of described crest tool 3 is parallel to printed circuit board (PCB), rake is parallel to the direction of liquid tin flowing, so sharp angle equals sharp angle formed by liquid tin flow direction and described crest tool 3 horizontal part 33 formed by the hypotenuse of the described right-angled triangle right-angle side AB in described printed circuit board (PCB) 1 plane in parallel.Preferably, formed by the hypotenuse of the described right-angled triangle right-angle side in described printed circuit board plane in parallel, the span of sharp angle θ is 0 °-90 °, does not comprise endpoint value.
According to above-mentioned formula, if the working process parameter of crest tool 3 is certain, liquid tin flowing velocity is certain, and namely θ is certain, then prohibit cloth distance L and increase along with the increase of described peripheral devices height H.Therefore, when carrying out printed circuit board layout design, designer can utilize above-mentioned formula, according to the concrete height of described peripheral devices, carries out PCB rational deployment.
Step S303: centered by described plug-in unit pad 2, described taboo cloth distance L is radius, determines the Jin Bu district around each pad.
After obtaining the taboo cloth distance L around each pad, centered by described plug-in unit pad 2, preferably, centered by the point of interface A of described crest tool rake extended line and described printed circuit board (PCB), described taboo cloth distance L is in the scope of radius, be all the Jin Bu district of described pad, namely forbid the region of peripheral devices described in layout.
Step S4: according to described Jin Bu district, the layout of each peripheral devices on design printed circuit board (PCB).
In the layout method of the printed circuit board (PCB) that the embodiment of the present invention provides, utilize according to the described extended line of crest tool rake and the point of interface of described printed circuit board (PCB), the peripheral devices corresponding with described pad and the point of interface of printed circuit board (PCB), and point of interface 3 right-angled triangles determined of described crest tool horizontal part and rake, determine the Jin Bu district of described pad, when can avoid wave soldering, crest tool blocks the possibility of leg, and during for preventing wave soldering, there is the minimum Jin Bu district of missing solder and the bad problem of upper tin, so, utilize the Jin Bu district according to described pad provided by the present invention, carry out the method for the layout of this printed circuit board (PCB), can when solving wave soldering, while there is missing solder and the bad problem of upper tin, realize the Appropriate application of printed circuit board space, avoid the waste of printed circuit board space.
In this specification, various piece adopts the mode of going forward one by one to describe, and what each some importance illustrated is the difference with other parts, between various piece identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a layout method for printed circuit board (PCB), is characterized in that, comprising:
Determine the position of each pad and crest tool on a printed circuit, described crest tool comprises vertical portion, rake and horizontal part;
According to the extended line of described crest tool rake and the point of interface of the point of interface of described printed circuit board (PCB), the peripheral devices corresponding with described pad and printed circuit board (PCB), and the point of interface 3 of described crest tool horizontal part and rake determines right-angled triangle, wherein, point of interface 2 line segments formed of the described extended line of crest tool rake and the point of interface of described printed circuit board (PCB) and described crest tool horizontal part and rake are the hypotenuse of described right-angled triangle;
According to constructed right-angled triangle, utilize trigonometric function to calculate, determine the Jin Bu district around each pad;
According to described Jin Bu district, the layout of each peripheral devices on design printed circuit board (PCB).
2. layout method according to claim 1, is characterized in that, according to described right-angled triangle, utilizes trigonometric function to calculate, and determines that the Jin Bu district around each pad comprises:
Calculate described right-angled triangle perpendicular to sharp angle formed by the hypotenuse of the right-angle side length of described printed circuit board (PCB), the described right-angled triangle right-angle side in described printed circuit board plane in parallel;
Utilize cotangent trigonometric function, determine the distance between each pad and its peripheral devices, obtain prohibiting cloth distance, wherein, the extended line of described crest tool rake is through the outward flange of described pad;
Centered by pad, described taboo cloth distance is radius, determines the Jin Bu district around each pad.
3. layout method according to claim 2, is characterized in that, described right-angled triangle comprises perpendicular to the calculating of the right-angle side length of described printed circuit board (PCB):
The thickness of the height of the peripheral devices that place known and to be welded pad is corresponding, the preset clearance between described peripheral devices and the horizontal part of crest tool, described crest tool and make tolerance;
To the thickness of the height of the peripheral devices corresponding with place to be welded pad, the preset clearance between described peripheral devices and the horizontal part of crest tool and described crest tool and make tolerance and sue for peace, calculate the right-angle side length of described right-angled triangle perpendicular to described printed circuit board (PCB).
4. layout method according to claim 3, is characterized in that, utilizes cotangent trigonometric function, determines the distance between each pad and its peripheral devices, obtains prohibiting cloth distance and comprises:
According to formula L=Cot θ × (H+a+b+t), determine the distance between each pad and its peripheral devices, obtain prohibiting cloth distance;
Wherein, L represents taboo cloth distance; H represents the height of the peripheral devices corresponding with place to be welded pad; A represents the preset clearance between described peripheral devices and crest tool horizontal part; B represents the thickness of described crest tool; T represents the making tolerance of described crest tool; The hypotenuse that θ represents described right-angled triangle and be parallel to described printed circuit board plane right-angle side formed by sharp angle.
5. layout method according to claim 4, is characterized in that, the span of the preset clearance a between described peripheral devices and crest tool horizontal part is: 0.1mm-1.0mm, comprises endpoint value.
6. the layout method according to any one of claim 1-5, is characterized in that, formed by the hypotenuse of the described right-angled triangle right-angle side in described printed circuit board plane in parallel, the span of sharp angle θ is 0 °-90 °, does not comprise endpoint value.
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| CN103648232A (en) * | 2013-12-27 | 2014-03-19 | 广东威创视讯科技股份有限公司 | Method for solving short circuit of signal through hole and packaging bonding pad |
| CN105157651B (en) * | 2015-08-25 | 2017-10-24 | 北京经纬恒润科技有限公司 | A kind of measuring method of deposited type coating film thickness, apparatus and system |
| CN108098096B (en) * | 2016-11-25 | 2020-02-25 | 联创汽车电子有限公司 | Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof |
| CN108966494A (en) * | 2018-07-12 | 2018-12-07 | 郑州云海信息技术有限公司 | Packaging method, device, equipment and the storage medium of PTH foot for PIH technique |
| CN110606275B (en) * | 2019-08-27 | 2021-04-27 | 烽火通信科技股份有限公司 | Protection layout method and structure for welding surface of machine disc |
| CN111642084B (en) * | 2020-06-29 | 2021-08-31 | 苏州浪潮智能科技有限公司 | Golden finger chamfering determination method, golden finger chamfering determination device, golden finger chamfering determination equipment and storage medium |
| CN114051374B (en) * | 2021-10-29 | 2023-07-25 | 株洲麦格米特电气有限责任公司 | Avoidance method, avoidance inspection method, package inspection unit, and structure inspection tool |
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| CN103152991A (en) | 2013-06-12 |
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Address after: 4 / F, building 1, No.14 Jiuxianqiao Road, Chaoyang District, Beijing 100020 Patentee after: Beijing Jingwei Hengrun Technology Co., Ltd Address before: 100101 Beijing city Chaoyang District Anxiang Beili 11 B block 8 layer Patentee before: Beijing Jingwei HiRain Technologies Co.,Ltd. |
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