CN108966494A - Packaging method, device, equipment and the storage medium of PTH foot for PIH technique - Google Patents
Packaging method, device, equipment and the storage medium of PTH foot for PIH technique Download PDFInfo
- Publication number
- CN108966494A CN108966494A CN201810763963.5A CN201810763963A CN108966494A CN 108966494 A CN108966494 A CN 108966494A CN 201810763963 A CN201810763963 A CN 201810763963A CN 108966494 A CN108966494 A CN 108966494A
- Authority
- CN
- China
- Prior art keywords
- pth
- foot
- pih
- technique
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Packages (AREA)
Abstract
This application discloses the packaging methods of the PTH foot for PIH technique, since the steel mesh layer to match with its location and shape being arranged on PTH foot, peripheral part of the edge of the steel mesh layer at the edge of the PTH foot, and the difference of the horizontal distance of the two is at least 3mm, therefore can guarantee that steel mesh layer corresponding with PTH foot will not be missed when steel mesh is opened using Gerber file in subsequent factory end, to guarantee that all PTH feet are all correctly welded, but also part is set at least 3mm other than the edge of the PTH foot and forbids placement area, therefore the problem of forming even tin with the PTH foot due to parts error puts the closer region into the PTH foot periphery is avoided that in design, reduce error probability, guarantee that part normally produces, improve production efficiency, the application is also disclosed Packaging system, equipment and the storage medium of PTH foot for PIH technique, can effectively ensure that PTH foot is welded, and reduce error probability, guarantee the normal production of part, improve production efficiency.
Description
Technical field
The invention belongs to store equipment manufacturing technology field, more particularly to the encapsulation side of the PTH foot for PIH technique
Method, device, equipment and storage medium.
Background technique
It is directed in many stored items using part as shown in Figure 1 now, Fig. 1 is to adopt in existing stored items
A kind of schematic diagram of part, there are the pads 102 of the pad 101 of PTH type and SMD type in this part, wherein PTH
Element is exactly Plating Through Hole, this is a kind of direct insertion element of through-hole, and SMD is exactly Surface Mounted
Devices, this is a kind of surface mount device, this while there is the part of PTH foot and SMD element can generally take PIH system
Journey production, this PIH processing procedure is exactly Paste-In-Hole (through-hole print tin cream), and specific implementation process is exactly to utilize steel mesh layer
(Pastemask), position corresponding with the position of the SMD pad hollow out above this steel mesh, the shape and SMD of general hollow out are welded
Disk is the same, undersized, and tin cream (Solder paste) is directly printed in PCB (Print Circuit Board, circuit board)
Electroplating ventilating hole above, then conventional inserts or through-hole component are inserted directly into the electroplating ventilating hole for being printed on tin cream, it is at this moment electric
Tin cream in plated-through-hole can be largely sticked on the leg of plug-in unit part, these tin creams can be again when passing through the high temperature of reflow soldering
The advantages of melting, and then part is welded on circuit board, this PIH making technology is to can reduce cost, shortens process week
Phase.
It is not that first plug-in unit and then part cross wave-soldering and PTH foot burn-on from the part back side again but under above-mentioned PIH technique
It goes, and needing carry out is Reflow Soldering, this just needs to complete to weld in the front brush tin cream of edge PTH hole, and needs coplanar zero
There are certain distances between part and this PTH foot, can reserve enough spaces in this way to this PTH foot print solder paste.
In PCB design, the PTH foot of all parts is not established steel mesh (pastemask), subsequent when opening steel plate, and one
As with the pastemask layer in Gerber document as a reference to production, if the PTH PAD (pad) of this kind of part is not put
The probability that just will increase mistake at pastemask layers is set, causes such part that can not produce, influences production efficiency.
Summary of the invention
To solve the above problems, the present invention provides the packaging method of the PTH foot for PIH technique, device, equipment and depositing
Storage media can effectively ensure that PTH foot is welded, and reduce error probability, guarantee the normal production of part, improve production effect
Rate.
Provided by the present invention for the packaging method of the PTH foot of PIH technique, comprising:
The steel mesh layer to match with its location and shape is set on PTH foot, and the edge of the steel mesh layer is in the PTH foot
Edge peripheral part, and the difference of the horizontal distance of the two is at least 3mm；
Part is set at least 3mm other than the edge of the PTH foot and forbids placement area.
Preferably, in the packaging method of the above-mentioned PTH foot for PIH technique, other than the edge of the PTH foot at least
The part is set within 4mm and forbids placement area.
Preferably, in the packaging method of the above-mentioned PTH foot for PIH technique, further includes:
When having detected that part is placed into the part and forbids placement area, send a warning message.
Provided by the present invention for the packaging system of the PTH foot of PIH technique, comprising:
Steel mesh layer setting unit, for the steel mesh layer to match with its location and shape, the steel mesh to be arranged on PTH foot
The edge of layer is in the peripheral part at the edge of the PTH foot, and the difference of the horizontal distance of the two is at least 3mm；
Part forbids placement area setting unit, for part to be arranged at least 3mm other than the edge of the PTH foot
Forbid placement area.
Preferably, in the packaging system of the above-mentioned PTH foot for PIH technique, the part forbids placement area to be arranged
Unit forbids placement area specifically for the part is arranged at least 4mm other than the edge of the PTH foot.
Preferably, in the packaging system of the above-mentioned PTH foot for PIH technique, further includes:
Warning unit, for sending a warning message when having detected that part is placed into the part and forbids placement area.
Sealed in unit provided by the present invention for the PTH foot of PIH technique includes:
Memory, for storing computer program；
Processor, for executing the computer program to realize such as the PTH foot for PIH technique of any one above
The method of encapsulation.
Storage medium provided by the invention is stored with computer program, the computer program quilt on the storage medium
It realizes when processor executes such as the step of the method for the encapsulation of described in any item PTH feet for PIH technique above.
As can be seen from the above description, provided by the present invention for the packaging method of the PTH foot of PIH technique, due in PTH foot
The steel mesh layer that upper setting matches with its location and shape, the edge of the steel mesh layer the edge of the PTH foot peripheral part,
And the difference of the horizontal distance of the two is at least 3mm, therefore can guarantee when steel mesh is opened using Gerber file in subsequent factory end not
Steel mesh layer corresponding with PTH foot can be missed, is all correctly welded so that all PTH feet be effectively ensured, and due to also existing
Setting part forbids placement area at least 3mm other than the edge of the PTH foot, therefore is just avoided that in design because of part
The closer region of mistake put into the PTH foot periphery and the problem of form even tin with the PTH foot, to reduce wrong general
Rate guarantees the normal production of part, improves production efficiency, furthermore the present invention also provides the encapsulation of the PTH foot for PIH technique
Device, equipment and storage medium can effectively ensure that PTH foot is welded, and reduce error probability, guarantee the normal life of part
It produces, improves production efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of schematic diagram of the part used in existing stored items；
Fig. 2 be it is provided by the embodiments of the present application the first for PIH technique PTH foot packaging method schematic diagram；
Fig. 3 be it is provided by the embodiments of the present application the first for PIH technique PTH foot packaging system schematic diagram；
Fig. 4 is the schematic diagram of the sealed in unit of the PTH foot provided by the embodiments of the present application for PIH technique.
Specific embodiment
Core of the invention thought is to provide packaging method, device, equipment and the storage of the PTH foot for PIH technique
Medium can effectively ensure that PTH foot is welded, and reduce error probability, guarantee the normal production of part, improve production efficiency.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It is provided by the embodiments of the present application the first for PIH technique PTH foot packaging method as shown in Fig. 2, Fig. 2 be this
Schematic diagram of the first of application embodiment offer for the packaging method of the PTH foot of PIH technique, this method include following walk
It is rapid:
S1: the steel mesh layer to match with its location and shape is set on PTH foot, and the edge of the steel mesh layer is described
The peripheral part at the edge of PTH foot, and the difference of the horizontal distance of the two is at least 3mm；
PTH foot therein is a kind of direct insertion element of through-hole, in addition to including this PTH foot in the part which is directed to
Except, can also there are some SMD, that is, SMD+PTH type part, the present embodiment is described for this SMD+PTH type part,
It is not limited to this part, in the prior art, PTH foot are all first plug-in units, then part crosses wave-soldering, and PTH foot is zero
The part back side is burn-on, and the present embodiment is for the PTH foot for being subsequently used for PIH technique, the PIH technique, that is, Paste-In-
Hole, that is, through-hole print tin cream technique, specifically, be exactly tin cream is directly printed above the PTH foot of PCB, then again
Plug-in unit/through-hole component is inserted directly into the PTH foot for being printed on tin cream, and at this moment the tin cream on PTH foot can largely be sticked to plug-in unit
On the leg of part, these tin creams can re-melt when passing through the high temperature of reflow soldering, and then soldering part is on circuit board, can
See and the setting in PCB design is just needed to be in the corresponding steel mesh layer of PTH foot, so as to engineer with correct when subsequent production steel mesh
Gerber file, avoid it from forgetting, it is abnormal to reduce production, and here set at least to the difference of the horizontal distance of the two
3mm, that is to say, that when PTH foot is round, the diameter of corresponding steel mesh layer just than the diameter of PTH foot greatly at least 3mm, and
When PTH foot is quadrangle, each of corresponding steel mesh layer greatly at least 3mm while than corresponding just can guarantee in this way
It brushes into enough tin creams, thus the problem for avoiding tin bad.In the operation of specific PCB design phase are as follows: in part
A corresponding pastemask level is added on each PTH foot, it can existing part encapsulation is opened with allegro software,
Tools-padstack-modify Design Padstack is clicked, then clicks PTH foot, its pastemask_top is modified as
Expansion 3mm (66+120=186mil) more unilateral than pad, then click file-update to design.
S2: part is set at least 3mm other than the edge of the PTH foot and forbids placement area.
In the prior art, PCB engineer is insensitive to such part, can generally handle according to common Dip pin, phase
That anti-surface parts are far from the placement of PTH foot, but having ignored is that coplanar part is accomplished certain intervals from PTH foot, because
This, has done this set in the embodiment, specifically, being just built upon the package for also lacking 3mm other than the edge of PTH foot
The region keepout/top will not execute the operation when placing other parts in this region as operator in this way, thus
The appearance of effective company of avoiding tin problem, improves working efficiency.
As can be seen from the above description, it is provided by the embodiments of the present application the first for PIH technique PTH foot encapsulation side
Method, since the steel mesh layer to match with its location and shape being arranged on PTH foot, the edge of the steel mesh layer is in the PTH foot
Edge peripheral part, and the difference of the horizontal distance of the two is at least 3mm, therefore can guarantee that subsequent factory end utilizes Gerber
File will not miss steel mesh layer corresponding with PTH foot when opening steel mesh, all correctly be welded so that all PTH feet be effectively ensured
It connects, and forbids placement area since part being arranged also at least 3mm other than the edge of the PTH foot, designing
When be just avoided that due to the closer region of parts error put into the PTH foot periphery with the PTH foot formed even tin the problem of,
To reduce error probability, guarantee the normal production of part, improves production efficiency.
The packaging method of the second provided by the embodiments of the present application PTH foot for PIH technique is in the first above-mentioned use
Further include following technical characteristic on the basis of the packaging method of the PTH foot of PIH technique:
The part is set at least 4mm other than the edge of the PTH foot and forbids placement area.
The second method is the further preferred scheme of above-mentioned first method, and there is bigger part to forbid putting area
Domain, standard is tightened up, in this way can the better company's of avoiding tin, and 5mm can be set for the numerical value according to higher demand
Above or other are greater than the numerical value of 5mm or more, are not intended to limit herein.
It is provided by the embodiments of the present application the third for PIH technique PTH foot packaging method, be it is above-mentioned the first or
On the basis of second of packaging method for the PTH foot of PIH technique, further includes:
When having detected that part is placed into the part and forbids placement area, send a warning message.
It is exactly that the Rule of DFM is arranged in package keepout/top level, in this way when same in practical operation
The part in face is accidentally swung in this region, and software will show DRC (Design Rule check) to remind PCB work
This is violation operation to Cheng Shi, part need to be moved out, and early warning can be just released, and engineer more intuitive can be allowed to know in violation of rules and regulations in this way
The reason of.
It is provided by the embodiments of the present application the first for PIH technique PTH foot packaging system as shown in figure 3, Fig. 3 be this
Schematic diagram of the first of application embodiment offer for the packaging system of the PTH foot of PIH technique, the device include:
Steel mesh layer setting unit 301, it is described for the steel mesh layer to match with its location and shape to be arranged on PTH foot
The edge of steel mesh layer is in the peripheral part at the edge of the PTH foot, and the difference of the horizontal distance of the two is at least 3mm PTH therein
Foot is a kind of direct insertion element of through-hole, in the part which is directed to other than including this PTH foot, can also be had
SMD, that is, SMD+PTH type part, the present embodiment is described for this SMD+PTH type part, it is not limited to this
Part, in the prior art, PTH foot are all first plug-in units, and then part crosses wave-soldering, PTH foot be burn-on at the part back side, and
The present embodiment is for the PTH foot for being subsequently used for PIH technique, the PIH technique, that is, Paste-In-Hole, that is, through-hole print
Tin cream technique, specifically, be exactly that tin cream is directly printed above the PTH foot of PCB, it is then again that plug-in unit/through-hole component is direct
Insertion has been printed in the PTH foot of tin cream, and at this moment the tin cream on PTH foot can be largely sticked on the leg of plug-in unit part, these
Tin cream can re-melt when passing through the high temperature of reflow soldering, and then soldering part is on circuit board, it is seen that just need in PCB design
When setting be in the corresponding steel mesh layer of PTH foot, so as to be avoided when subsequent production steel mesh to engineer with correct Gerber file
It is forgotten, it is abnormal to reduce production, and the difference of the horizontal distance of the two is set at least to 3mm here, that is to say, that work as PTH
When foot is round, the diameter of corresponding steel mesh layer is just than the diameter of PTH foot greatly at least 3mm, and when PTH foot is quadrangle,
Each of its corresponding steel mesh layer greatly at least 3mm while than corresponding just can guarantee brush into enough tin creams in this way, from
And the problem for avoiding tin bad.In the operation of specific PCB design phase are as follows: add one on each PTH foot of part
Corresponding pastemask level, it can open existing part encapsulation with allegro software, click tools-padstack-
Modify Design Padstack, then PTH foot is clicked, its pastemask_top is modified as expansion 3mm (66+ more unilateral than pad
120=186mil), then file-update to design is clicked；
Part forbids placement area setting unit 302, for being arranged at least 3mm other than the edge of the PTH foot
Part forbids placement area, and in the prior art, PCB engineer is insensitive to such part, generally can be according to common Dip pin
Processing, that opposite surface parts are far from the placement of PTH foot, but having ignored is that coplanar part is accomplished one from PTH foot
Fixed interval, therefore, has done this set in the embodiment, also lacks 3mm specifically, being just built upon other than the edge of PTH foot
The region package keepout/top will not execute this when placing other parts in this region as operator in this way
Operation, so that the appearance of the effectively company's of avoiding tin problem, improves working efficiency.
In conclusion it is above-mentioned the first for PIH technique PTH foot packaging system, can effectively ensure that PTH foot obtains
Welding reduces error probability, guarantees the normal production of part, improves production efficiency.
The packaging system of the second provided by the embodiments of the present application PTH foot for PIH technique is in the first above-mentioned use
Further include following technical characteristic on the basis of the packaging system of the PTH foot of PIH technique:
The part forbids placement area setting unit to be specifically used for other than the edge of the PTH foot at least 4mm
The part is set and forbids placement area.
This scheme makes it have bigger part and forbids placement area, and standard is tightened up, can preferably avoid in this way
Even tin, and can according to higher demand by the numerical value be set as 5mm or more or other greater than 5mm numerical value more than, this
Place is not intended to limit.
It is provided by the embodiments of the present application the third for PIH technique PTH foot packaging system, be it is above-mentioned the first or
On the basis of second of packaging system for the PTH foot of PIH technique, further includes:
Warning unit, for sending a warning message when having detected that part is placed into the part and forbids placement area.
It is exactly that the Rule of DFM is arranged in package keepout/top level, in this way when same in practical operation
The part in face is accidentally swung in this region, and software will show DRC (Design Rule check) to remind PCB work
This is violation operation to Cheng Shi, part need to be moved out, and early warning can be just released, and engineer more intuitive can be allowed to know in violation of rules and regulations in this way
The reason of.
The sealed in unit of PTH foot provided by the embodiments of the present application for PIH technique is as shown in figure 4, Fig. 4 is that the application is real
The schematic diagram of the sealed in unit of the PTH foot for PIH technique of example offer is applied, which includes:
Memory 401, for storing computer program；
Processor 402, for executing the computer program to realize such as any PTH foot for PIH technique above
Encapsulation method.
Storage medium provided by the embodiments of the present application is stored with computer program, the computer on the storage medium
The step of method of the encapsulation of the PTH foot for PIH technique as described in any above is realized when program is executed by processor.
The sealed in unit and storage medium of the above-mentioned PTH foot for PIH technique, due to be able to carry out it is above-mentioned the first to
Any method in three kinds of methods, therefore can effectively ensure that PTH foot is welded, error probability is reduced, guarantees part
Normal production, improves production efficiency.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (8)
1. the packaging method of the PTH foot for PIH technique characterized by comprising
The steel mesh layer to match with its location and shape is set on PTH foot, and the edge of the steel mesh layer is on the side of the PTH foot
The peripheral part of edge, and the difference of the horizontal distance of the two is at least 3mm；
Part is set at least 3mm other than the edge of the PTH foot and forbids placement area.
2. the packaging method of the PTH foot according to claim 1 for PIH technique, which is characterized in that in the PTH foot
Edge other than the part be set at least 4mm forbid placement area.
3. the packaging method of -2 described in any item PTH feet for PIH technique according to claim 1, which is characterized in that also wrap
It includes:
When having detected that part is placed into the part and forbids placement area, send a warning message.
4. the packaging system of the PTH foot for PIH technique characterized by comprising
Steel mesh layer setting unit, for the steel mesh layer to match with its location and shape to be arranged on PTH foot, the steel mesh layer
Edge is in the peripheral part at the edge of the PTH foot, and the difference of the horizontal distance of the two is at least 3mm；
Part forbids placement area setting unit, forbids for part to be arranged at least 3mm other than the edge of the PTH foot
Placement area.
5. the packaging system of the PTH foot according to claim 4 for PIH technique, which is characterized in that the part is forbidden
Placement area setting unit is forbidden putting specifically for the part is arranged at least 4mm other than the edge of the PTH foot
Region.
6. according to the packaging system of the described in any item PTH feet for PIH technique of claim 4-5, which is characterized in that also wrap
It includes:
Warning unit, for sending a warning message when having detected that part is placed into the part and forbids placement area.
7. the sealed in unit of the PTH foot for PIH technique characterized by comprising
Memory, for storing computer program；
Processor realizes the PTH for PIH technique such as any one of claim 1-3 for executing the computer program
The method of the encapsulation of foot.
8. storage medium, which is characterized in that be stored with computer program on the storage medium, the computer program is processed
The step of device realizes the method for encapsulation of the PTH foot as described in any one of claims 1-3 for PIH technique when executing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810763963.5A CN108966494A (en) | 2018-07-12 | 2018-07-12 | Packaging method, device, equipment and the storage medium of PTH foot for PIH technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810763963.5A CN108966494A (en) | 2018-07-12 | 2018-07-12 | Packaging method, device, equipment and the storage medium of PTH foot for PIH technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108966494A true CN108966494A (en) | 2018-12-07 |
Family
ID=64483271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810763963.5A Pending CN108966494A (en) | 2018-07-12 | 2018-07-12 | Packaging method, device, equipment and the storage medium of PTH foot for PIH technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113220375A (en) * | 2021-04-26 | 2021-08-06 | 深圳市国鑫恒运信息安全有限公司 | Method and system for generating hollow text silk screen based on Allegro software |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5129573A (en) * | 1991-10-25 | 1992-07-14 | Compaq Computer Corporation | Method for attaching through-hole devices to a circuit board using solder paste |
| CN102186312A (en) * | 2011-04-29 | 2011-09-14 | 摩比天线技术（深圳）有限公司 | Through-hole reflow soldering method and formwork for printing circuit board |
| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
-
2018
- 2018-07-12 CN CN201810763963.5A patent/CN108966494A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5129573A (en) * | 1991-10-25 | 1992-07-14 | Compaq Computer Corporation | Method for attaching through-hole devices to a circuit board using solder paste |
| CN102186312A (en) * | 2011-04-29 | 2011-09-14 | 摩比天线技术（深圳）有限公司 | Through-hole reflow soldering method and formwork for printing circuit board |
| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
Non-Patent Citations (1)
| Title |
|---|
| ADMIN: "PCB工艺 让通孔组件传统插件也走回焊炉制程", 《HTTP://WWW.NODPCBA.COM/NEWS/209-CN.HTML》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113220375A (en) * | 2021-04-26 | 2021-08-06 | 深圳市国鑫恒运信息安全有限公司 | Method and system for generating hollow text silk screen based on Allegro software |
| CN113220375B (en) * | 2021-04-26 | 2024-04-19 | 深圳市国鑫恒运信息安全有限公司 | Method and system for generating hollow text silk screen based on Allegro software |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110600402B (en) | Design method of steel mesh opening, design device of steel mesh opening and electronic equipment | |
| CN108966494A (en) | Packaging method, device, equipment and the storage medium of PTH foot for PIH technique | |
| KR20080024059A (en) | Mounting structure | |
| CN105513977A (en) | Intelligent power module and packaging method thereof | |
| US20060294489A1 (en) | Pad layouts of a printed circuit board | |
| CN114682870A (en) | POP hybrid welding process and system | |
| CN102291974B (en) | Cutting side positioning type welding structure and method for preventing pins from shifting | |
| JPH01315167A (en) | Semiconductor device | |
| CN210928161U (en) | Fixing structure of circuit board | |
| CN208623993U (en) | A kind of printing stencil structure | |
| JP2002359461A (en) | Electronic component mounting method, mounting structure, and metal mask | |
| CN219321343U (en) | Bonding pad structure of chip, chip and electronic equipment | |
| CN219536394U (en) | Promote PCB board of components and parts welding yield | |
| CN110958786A (en) | Method for soldering tin on side surface of PCBA (printed Circuit Board Assembly) of on-chip paster | |
| CN107172816B (en) | Method and system for creating DIP type part package | |
| CN212660141U (en) | Packaging structure of cylindrical crystal oscillator fixed by through hole welding pad | |
| CN220874793U (en) | Circuit board with shared bonding pad | |
| CN210745425U (en) | Mainboard of DU equipment and DU equipment | |
| CN219124474U (en) | Silk screen structure for PCB board screen printing | |
| CN210745572U (en) | Acceleration card and DU equipment | |
| CN211128403U (en) | FPC with irritate tin steel sheet ground connection | |
| CN210804204U (en) | Memory device and server | |
| CN214624746U (en) | Capacitor of firm installation | |
| CN219802667U (en) | PCB board pad structure and PCB board | |
| CN100562876C (en) | Electronic element storing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |
|
| RJ01 | Rejection of invention patent application after publication |