CN101616544A - A kind of PCB assembly and implementation method - Google Patents
A kind of PCB assembly and implementation method Download PDFInfo
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- CN101616544A CN101616544A CN200910162095A CN200910162095A CN101616544A CN 101616544 A CN101616544 A CN 101616544A CN 200910162095 A CN200910162095 A CN 200910162095A CN 200910162095 A CN200910162095 A CN 200910162095A CN 101616544 A CN101616544 A CN 101616544A
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- pad
- cylindrical device
- preventing offsetting
- described cylindrical
- offsetting
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Abstract
The invention discloses a kind of PCB assembly, comprising: cylindrical device and circuit board, the body for having insulated outer surface in the middle of the described cylindrical device, two ends are the weldering end; Described circuit board comprises first pad and second pad, described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, described circuit board also comprises at least two preventing offsetting pads, has scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device, when skew takes place described cylindrical device, described cylindrical device position is corrected by the surface tension of the scolder on the described preventing offsetting pad.Among the present invention, solve rolling and the off normal problem of cylindrical device in the course of processing, and possess the automatic calibration capability after the MELF device off normal, thereby reach the purpose of evading weld defect.
Description
Technical field
The present invention relates to components and parts and circuit board mounting technology field, relate in particular to a kind of PCB assembly and implementation method.
Background technology
MELF (Metal Electrode Face, surface of metal electrode) device, front view comprise body and weldering end (have scolding tin, can be welded to pad) with insulated outer surface as shown in Figure 1a, and length is L, and diameter is D3, and weldering end length is C.Wherein, the MELF body is the circle with insulated outer surface, and weldering end can be circle or the circular end of an end is square for two ends.When the weldering end all was circle, end view was shown in Fig. 1 b, and MELF body diameter is D2, and circular weldering end diameter is D1.
In the prior art, the MELF device is welded to employing ordinary pads design on the circuit board, as described in Fig. 2 a, two pads 220 and 230 is set on the circuit board 210, the solid line bar is represented the pad profile, and dotted line is represented the steel mesh design outline.Schematic diagram was shown in Fig. 2 b after the MELF device was welded to circuit board, and two weldering ends of MELF device 240 are welded to respectively on pad 220 and the pad 230.
Because the MELF device is circular, has bigger destabilizing factor, in the paster process, if take place to paste partially, promptly device just in time is not attached on the pad, and the further off normal of device after then causing easily welding causes failure welding; In addition, in reflow process, track transfer circuit plate instability can cause equally that the serious off normal of device causes failure welding on the circuit board.
In order to overcome above-mentioned defective, on pad, carry out particular design in the prior art, shown in Fig. 3 a, 340, two grooves 340 of groove of the increase respectively on pad 320 and pad 330 are symmetrical arranged, the circular contour coupling of groove 340 and MELF device.The MELF device is welded to schematic diagram on the circuit board 310 shown in Fig. 3 b, and the circular profile of 340 pairs of MELF devices 350 of groove supports to reach and prevents that device from rolling, the purpose of off normal.
Yet this kind design is accurately under the prerequisite, to possess certain feasibility at paster; But it is very accurate to accomplish in the actual paster process, if paster is inaccurate or device off normal in reflow process, because solder surface tension force is dispersed in two and cuts apart on the face of (pad that is separated by groove 340), when device weldering end is offset to wherein some, then the surface tension of this face generation can make off normal more serious greater than the surface tension of another face generation.Therefore, this kind design requires relatively harsher, impracticable to the tolerance of device, the machining tolerance of pad.
Summary of the invention
The invention provides a kind of PCB assembly and implementation method, solve rolling and the off normal problem of cylindrical device in the course of processing.
The invention provides a kind of PCB assembly, comprising: cylindrical device and circuit board, the body for having insulated outer surface in the middle of the described cylindrical device, two ends are the weldering end; Described circuit board comprises first pad and second pad, described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, described circuit board comprises that also at least one pair of is positioned at the preventing offsetting pad of described cylindrical device both sides, has scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device, when skew takes place cylindrical device described in the welding process, described cylindrical device position is corrected by the surface tension of the scolder on the described preventing offsetting pad.
Be respectively equipped with the groove of symmetry on described first pad and second pad, be positioned at the relative side of described first pad,, the profile of described cylindrical device is supported with the outline of described cylindrical device with second pad.
Described preventing offsetting pad is at least one pair of, and symmetry is positioned at described cylindrical device both sides; When described preventing offsetting pad when being a pair of, be positioned at described cylindrical device middle part.
Described preventing offsetting pad is a rectangle, and its length direction is parallel with described cylindrical device length direction.
Described preventing offsetting pad does not contact described cylindrical device when described cylindrical device is not offset:
Described preventing offsetting pad center is apart from D＞SQRT ((described preventing offsetting pad is apart from the described cylindrical device radius R of described cylindrical device bottom level H+)
2-R
2).
Described preventing offsetting pad center apart from D greater than SQRT ((H+R)
2-R
2)+4mil is less than SQRT ((H+R)
2-R
2)+8mil.
The invention provides a kind of implementation method of PCB assembly, be applied to comprise in the structure of cylindrical device and circuit board, the body for having insulated outer surface in the middle of the described cylindrical device, two ends are the weldering end; Described circuit board comprises first pad and second pad, and described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, said method comprising the steps of:
The preventing offsetting pad that at least one pair of is positioned at described cylindrical device both sides is set on described circuit board, has scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device;
When skew takes place cylindrical device described in the welding process, described cylindrical device position is corrected by the surface tension of the scolder on the described preventing offsetting pad.
Also comprise:
The groove of symmetry is set respectively on described first pad and second pad, is positioned at the relative side of described first pad with second pad, and with the outline of described cylindrical device, the profile of described cylindrical device is supported.
Also comprise:
Make described preventing offsetting pad when described cylindrical device is not offset, not contact described cylindrical device, be specially and carry out following setting:
Described preventing offsetting pad center is apart from D＞SQRT ((described preventing offsetting pad is apart from the described cylindrical device radius R of described cylindrical device bottom level H+)
2-R
2).
Further:
Described preventing offsetting pad center apart from D greater than SQRT ((H+R)
2-R
2)+4mil is less than SQRT ((H+R)
2-R
2)+8mil.
Compared with prior art, the present invention has the following advantages:
Among the present invention, solve rolling and the off normal problem of cylindrical device in the course of processing, and possess the automatic calibration capability after the MELF device off normal, thereby reach the purpose of evading weld defect.Therefore, can carry out well processed to cylindrical device, practical function is good.
Description of drawings
Fig. 1 a is a MELF front view in the prior art;
Fig. 1 b is a MELF end view in the prior art;
Fig. 2 a in the prior art is welded to the MELF device ordinary pads schematic diagram that adopts on the circuit board;
Fig. 2 b is that the MELF device is welded to schematic diagram behind the circuit board in the prior art;
Fig. 3 a is an improved pad schematic diagram in the prior art;
Fig. 3 b is that the MELF device is welded to improved pad schematic diagram in the prior art;
Fig. 4 a and Fig. 4 b are PCB assembly schematic diagrames among the present invention;
Fig. 5 a and Fig. 5 b are the cylindrical PCB assembly schematic diagrames that is provided with groove among the present invention on circuit board;
Fig. 6 is the cutaway view when the preventing offsetting pad is not worked among the present invention;
Fig. 7 is the cutaway view that skew back preventing offsetting pad action effect takes place cylindrical device among the present invention;
Fig. 8 is a schematic diagram calculation among the present invention;
Fig. 9 is the implementation method flow chart of a kind of PCB assembly among the present invention.
Embodiment
A kind of PCB assembly is provided among the present invention, as shown in Figs. 4a and 4b, comprising: cylindrical device 460 and circuit board 410, the body for having insulated outer surface in the middle of the cylindrical device 460, two ends are the weldering end; Circuit board 410 comprises first pad 420 and second pad 430, first pad 420 and second pad 430 are used for holding welding with two welderings of cylindrical device 460 respectively, circuit board 410 also comprises at least two preventing offsetting pads 450, the design steel mesh is windowed on the preventing offsetting pad 450, the profile coupling of preventing offsetting pad 450 spacings and cylindrical device 460, when skew takes place cylindrical device 460 in welding process, cylindrical device 460 positions are corrected by the surface tension of the scolder on the preventing offsetting pad 450.
In another embodiment, in order to strengthen anti-inclined to one side effect, can on first pad 420 and second pad 430, be respectively equipped with groove 440, shown in Fig. 5 a and 5b, groove 440 is positioned at first pad, 420 to second pads, 430 relative sides, with the outline of cylindrical device 460, the profile of cylindrical device 460 is supported.Certainly, first pad and second pad also can be other shapes except conventional pad design.It is how right that the preventing offsetting pad also can be set to, and symmetry is positioned at described cylindrical device both sides; When described preventing offsetting pad when being a pair of, be positioned at described cylindrical device middle part.
Cylindrical device among the present invention is that example describes with the MELF device, but other devices with same alike result (intermediate body member is for circular, and two ends are the weldering end) are suitable equally.Certainly, if be the weldering end if some device is middle, and two ends are the body with insulated outer surface, then can be with the preventing offsetting pad design to the device two ends.
Under the situation of normal process, when cylindrical device 460 off normal did not take place, preventing offsetting pad 450 was not worked, and as shown in Figure 6, circular arc is expressed as scolder.
When off normal takes place in cylindrical device 460, as shown in Figure 7, (melt solder also is contracted on the pad in reflow process, it does the time spent, scolder is liquid), melt solder on the preventing offsetting pad 450 is also pushed on pad, contact with the cylindrical device 460 after the off normal, the ceramic base material that is encapsulated as owing to cylindrical device 460 bodies, can not take place wetting with scolder, liquid solder can push away the opposite direction of cylindrical device 460 to off normal owing to capillary existence at this moment, thereby reaches the purpose of correcting off normal.
In the preventing offsetting pad design, as shown in Figure 8, should make preventing offsetting pad and described cylindrical device outline:
Be D＞SQRT ((H+R)
2-R
2).
Wherein, the radius of MELF device is R, and raising of scolder is H, and the preventing offsetting pad center is D apart from the value at designs center.
Under steel mesh is windowed the situation of control, can suppose the circular arc of scolder convex form for rule, the preventing offsetting pad is as the criterion not contact the MELF device not doing the time spent; According to off normal situation and the empirical value that reality allows, D to be revised, suggestion D value is:
SQRT((H+R)
2-R
2)+4mil～8mil；
The foregoing description is a pair of with the preventing offsetting pad, and it is that example describes that symmetry is positioned at described cylindrical device both sides, in the practical application, can use many to the preventing offsetting pad.In addition, the preventing offsetting pad also can adopt asymmetric mode to be provided with, and for example, a side is a preventing offsetting pad, and opposite side is two preventing offsetting pads, is isosceles triangle and distributes; Or respectively there are two preventing offsetting pads, journey trapezoidal profile etc. in both sides.
When described preventing offsetting pad was rectangle, it was more obvious to play the preventing offsetting effect, and its length direction is parallel with the cylindrical device length direction.But the preventing offsetting pad also can be other shapes, for example circle etc.
The invention provides a kind of implementation method of PCB assembly, be applied to comprise in the structure of cylindrical device and circuit board, the body for having insulated outer surface in the middle of the described cylindrical device, two ends are the weldering end; Described circuit board comprises first pad and second pad, and described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, and described method may further comprise the steps as shown in Figure 9:
Step 901 is provided with the preventing offsetting pad that at least one pair of is positioned at described cylindrical device both sides on described circuit board, have scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device.
In order to increase the stability of cylindrical device, the groove of symmetry can also be set respectively on described first pad and second pad, be positioned at the relative side of described first pad with described second pad, and with the outline of described cylindrical device, the profile of described cylindrical device is supported.
Step 902 when skew takes place cylindrical device described in the welding process, is corrected described cylindrical device position by the surface tension of the scolder on the preventing offsetting pad.Because the scolder on the described preventing offsetting pad does not contact described cylindrical device when described cylindrical device is not offset, can not impact cylindrical device; When skew takes place cylindrical device, contact, be prevented from being offset with scolder on the described preventing offsetting pad.In order to reach above-mentioned effect, need carry out following setting: described preventing offsetting pad center is apart from D＞SQRT ((described preventing offsetting pad is apart from the described cylindrical device radius R of described cylindrical device bottom level H+)
2-R
2).For example, can described preventing offsetting pad center be set to greater than SQRT ((H+R) apart from D
2-R
2)+4mil is less than SQRT ((H+R)
2-R
2)+8mil.
Among the present invention, solve rolling and the off normal problem of cylindrical device in the course of processing, and possess the automatic calibration capability after the MELF device off normal, thereby reach the purpose of evading weld defect.Therefore, can carry out well processed to cylindrical device, practical function is good.
More than disclosed only be several specific embodiment of the present invention, still, the present invention is not limited thereto, any those skilled in the art can think variation all should fall into protection scope of the present invention.
Claims (10)
1, a kind of PCB assembly comprises: cylindrical device and circuit board, and the body for having insulated outer surface in the middle of the described cylindrical device, two ends are the weldering end; Described circuit board comprises first pad and second pad, described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, it is characterized in that, described circuit board comprises that also at least one pair of is positioned at the preventing offsetting pad of described cylindrical device both sides, has scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device, when skew takes place cylindrical device described in the welding process, described cylindrical device position is corrected by the surface tension of the scolder on the described preventing offsetting pad.
2, PCB assembly as claimed in claim 1, it is characterized in that, be respectively equipped with the groove of symmetry on described first pad and second pad, be positioned at the relative side of described first pad with second pad, with the outline of described cylindrical device, the profile of described cylindrical device is supported.
3, PCB assembly as claimed in claim 1 is characterized in that, described preventing offsetting pad is at least one pair of, and symmetry is positioned at described cylindrical device both sides; When described preventing offsetting pad when being a pair of, be positioned at described cylindrical device middle part.
4, PCB assembly as claimed in claim 1 is characterized in that, described preventing offsetting pad is a rectangle, and its length direction is parallel with described cylindrical device length direction.
5, PCB assembly as claimed in claim 1 is characterized in that, described preventing offsetting pad does not contact described cylindrical device when described cylindrical device is not offset:
Described preventing offsetting pad center is apart from D＞SQRT ((described preventing offsetting pad is apart from the described cylindrical device radius R of described cylindrical device bottom level H+)
2-R
2).
6, PCB assembly as claimed in claim 5 is characterized in that, described preventing offsetting pad center apart from D greater than SQRT ((H+R)
2-R
2)+4mil is less than SQRT ((H+R)
2-R
2)+8mil.
7, a kind of implementation method of PCB assembly is applied to comprise in the structure of cylindrical device and circuit board, the body for having insulated outer surface in the middle of the described cylindrical device, and two ends are the weldering end; Described circuit board comprises first pad and second pad, and described first pad and second pad are used for holding welding with two welderings of described cylindrical device respectively, it is characterized in that, said method comprising the steps of:
The preventing offsetting pad that at least one pair of is positioned at described cylindrical device both sides is set on described circuit board, has scolder on the described preventing offsetting pad, the profile coupling of described preventing offsetting solder pad space length and cylindrical device;
When skew takes place cylindrical device described in the welding process, described cylindrical device position is corrected by the surface tension of the scolder on the described preventing offsetting pad.
8, implementation method as claimed in claim 7 is characterized in that, also comprises:
The groove of symmetry is set respectively on described first pad and second pad, is positioned at the relative side of described first pad with second pad, and with the outline of described cylindrical device, the profile of described cylindrical device is supported.
9, implementation method as claimed in claim 7 is characterized in that, also comprises:
Make described preventing offsetting pad when described cylindrical device is not offset, not contact described cylindrical device, be specially and carry out following setting:
Described preventing offsetting pad center is apart from D＞SQRT ((described preventing offsetting pad is apart from the described cylindrical device radius R of described cylindrical device bottom level H+)
2-R
2).
10, implementation method as claimed in claim 9 is characterized in that, further:
Described preventing offsetting pad center apart from D greater than SQRT ((H+R)
2-R
2)+4mil is less than SQRT ((H+R)
2-R
2)+8mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101620956A CN101616544B (en) | 2009-08-12 | 2009-08-12 | PCB component and realizing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101620956A CN101616544B (en) | 2009-08-12 | 2009-08-12 | PCB component and realizing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101616544A true CN101616544A (en) | 2009-12-30 |
| CN101616544B CN101616544B (en) | 2012-05-23 |
Family
ID=41495836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101620956A Active CN101616544B (en) | 2009-08-12 | 2009-08-12 | PCB component and realizing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101616544B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
| CN103311206A (en) * | 2013-05-23 | 2013-09-18 | 华为技术有限公司 | Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device |
| CN105992461A (en) * | 2016-05-27 | 2016-10-05 | 努比亚技术有限公司 | Fixing structure for components and PCB and mobile terminal |
| CN107683018A (en) * | 2016-08-02 | 2018-02-09 | 矽品精密工业股份有限公司 | Electronic device |
| CN108781515A (en) * | 2016-02-18 | 2018-11-09 | 三菱电机株式会社 | Electronic device and its manufacturing method |
| DE102014222601B4 (en) | 2013-12-09 | 2022-05-12 | Mitsubishi Electric Corporation | Device with mounted electronic components and semiconductor device with the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090055673A (en) * | 2007-11-29 | 2009-06-03 | 삼성전자주식회사 | Printed circuit board assembly and manufacturing method for the same |
| CN201146630Y (en) * | 2008-01-28 | 2008-11-05 | 微盟电子(昆山)有限公司 | Electron carrier plate and pad-soldering structure |
-
2009
- 2009-08-12 CN CN2009101620956A patent/CN101616544B/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
| CN103152991B (en) * | 2013-03-28 | 2015-12-23 | 北京经纬恒润科技有限公司 | A kind of layout method of printed circuit board (PCB) |
| CN103311206A (en) * | 2013-05-23 | 2013-09-18 | 华为技术有限公司 | Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device |
| CN103311206B (en) * | 2013-05-23 | 2016-04-13 | 华为技术有限公司 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
| DE102014222601B4 (en) | 2013-12-09 | 2022-05-12 | Mitsubishi Electric Corporation | Device with mounted electronic components and semiconductor device with the same |
| CN108781515A (en) * | 2016-02-18 | 2018-11-09 | 三菱电机株式会社 | Electronic device and its manufacturing method |
| CN108781515B (en) * | 2016-02-18 | 2021-03-12 | 三菱电机株式会社 | Electronic device and method for manufacturing the same |
| CN105992461A (en) * | 2016-05-27 | 2016-10-05 | 努比亚技术有限公司 | Fixing structure for components and PCB and mobile terminal |
| CN105992461B (en) * | 2016-05-27 | 2019-08-16 | 努比亚技术有限公司 | A kind of fixed structure and mobile terminal of component and pcb board |
| CN107683018A (en) * | 2016-08-02 | 2018-02-09 | 矽品精密工业股份有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101616544B (en) | 2012-05-23 |
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Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee after: Xinhua three Technology Co., Ltd. Address before: 310053 Hangzhou hi tech Industrial Development Zone, Zhejiang province science and Technology Industrial Park, No. 310 and No. six road, HUAWEI, Hangzhou production base Patentee before: Huasan Communication Technology Co., Ltd. |
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