CN104349604A - Fixing plugboard for printed circuit board - Google Patents

Fixing plugboard for printed circuit board Download PDF

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Publication number
CN104349604A
CN104349604A CN201310330390.4A CN201310330390A CN104349604A CN 104349604 A CN104349604 A CN 104349604A CN 201310330390 A CN201310330390 A CN 201310330390A CN 104349604 A CN104349604 A CN 104349604A
Authority
CN
China
Prior art keywords
clamping plate
printed substrate
plate
slot
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310330390.4A
Other languages
Chinese (zh)
Other versions
CN104349604B (en
Inventor
孙超
刘桂
陈斌
伍小途
李路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gree Electric Appliances Inc of Zhuhai
Original Assignee
Gree Electric Appliances Inc of Zhuhai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gree Electric Appliances Inc of Zhuhai filed Critical Gree Electric Appliances Inc of Zhuhai
Priority to CN201310330390.4A priority Critical patent/CN104349604B/en
Publication of CN104349604A publication Critical patent/CN104349604A/en
Application granted granted Critical
Publication of CN104349604B publication Critical patent/CN104349604B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a fixing plugboard for a printed circuit board. The fixing plugboard comprises a plugboard body, the plugboard body is provided with a slot, and the width of the slot is adaptive to the thickness of the printed circuit board. According to the fixing plugboard for the printed circuit board, provided by the invention, the plugboard body is provided with the slot for clamping the printed circuit board, when the printed circuit board passes through a peak furnace, the fixing plugboard is pressed to at least one side of the printed circuit board, the slot of the fixing plugbaord and the edge of the printed circuit board cooperate in a clamping mode so as to be fixed together, thus deformation is reduced. Before furnace operation, the fixing plugboard is pressed to the at least one side of the printed circuit board, the printed circuit board can be fixed, deformation due to heating of the printed circuit board is prevented, the risk of falling off from the conveying track of the peak furnace is avoided, and the risk of fusion soldering tin rushing to the top surface of the printed circuit board is also avoided, such that the problem that a lot of printed circuit boards are took out from a production line is prevented, and the quality of the printed circuit board and the production efficiency are improved.

Description

A kind of printed substrate fixing insertion
Technical field
The present invention relates to circuit board wave-soldering technical field, more particularly, relate to a kind of printed substrate fixing insertion.
Background technology
Wave-soldering is a kind of soft soldering method, the solder that it will melt, upwards drive via mechanical pump or electromagnetic pump, jet flow forms the solder wave meeting designing requirement, and make the surface to be welded of the printed substrate being provided with electronic devices and components in advance by solder wave, make the electronic devices and components welding end or the realization electrical connection between pin and printed circuit pads that are exposed to printed substrate surface to be welded.
The processing procedure adopting solder wave process to weld printed substrate is: the tin stream crest that printed substrate is formed with the surface contact of pad with it in Wave soldering furnace, after printed substrate crosses tin stream crest, through supercooling, its corresponding electronic devices and components are fixed by solder metal tin, realize electrical connection eventually through solder joint.
Some printed substrates are when crossing Wave soldering furnace at present, due to the reason such as printed substrate is large and thin or hollow out is more, cause printed substrate middle recessed in the temperature distortion of Wave soldering furnace preheating section, serious even can drop from delivery track, not serious also can face when crossing tin stream crest the danger that melting scolding tin rushes to printed wire plate top surface, thus cause a large amount of printed substrate to roll off the production line, have a strong impact on quality and production efficiency.
Therefore, how avoiding printed substrate to deform when crossing Wave soldering furnace, becoming the technical problem that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of printed substrate fixing insertion, deforming when crossing Wave soldering furnace to avoid printed substrate.
For achieving the above object, the invention provides following technical scheme:
A kind of printed substrate fixing insertion, comprise plate body, described plate body offers slot, the width of described slot and the thickness of printed substrate adapt.
Preferably, in above-mentioned printed substrate fixing insertion, described plate body comprises:
Side plate;
Be arranged at the clamping plate group on described side plate, described clamping plate group comprises the first clamping plate and the second clamping plate, forms described slot between described first clamping plate and the second clamping plate.
Preferably, in above-mentioned printed substrate fixing insertion, described clamping plate group is along spaced apart multiple on the length direction of described side plate, and forms the escape groove for avoiding the pad on described printed substrate between adjacent two described clamping plate groups.
Preferably, in above-mentioned printed substrate fixing insertion, described first clamping plate, the second clamping plate and described side plate are integral type structure.
Preferably, in above-mentioned printed substrate fixing insertion, described first clamping plate and described second clamping plate parallel.
Preferably, in above-mentioned printed substrate fixing insertion, described slot is less than the width of the other end away from the width of one end of described side plate.
Preferably, in above-mentioned printed substrate fixing insertion, described plate body comprises side plate, and is arranged at the clamping plate group on described side plate, and described clamping plate group comprises the first clamping plate and the second clamping plate;
Described first clamping plate are near the side of described second clamping plate, and/or described second clamping plate are provided with resilient coating near the side of described first clamping plate;
When described first clamping plate and described second clamping plate are equipped with described resilient coating, between two-layer described resilient coating, form described slot;
When only there being described first clamping plate to be provided with described resilient coating, between described resilient coating and described second clamping plate, form described slot;
When only there being described second clamping plate to be provided with described resilient coating, between described resilient coating and described first clamping plate, form described slot.
Preferably, in above-mentioned printed substrate fixing insertion, described plate body comprises side plate, and is arranged at the clamping plate group on described side plate, and described clamping plate group comprises the first clamping plate and the second clamping plate;
Described first clamping plate are near the side of described second clamping plate, and/or described second clamping plate are provided with snubber elastomeric device near the side of described first clamping plate, and described snubber elastomeric device is connected with adjustable splint;
When described first clamping plate and described second clamping plate are equipped with described adjustable splint, between two described adjustable splints, form described slot;
When only there being described first clamping plate to be provided with described adjustable splint, between described adjustable splint and described second clamping plate, form described slot;
When only there being described second clamping plate to be provided with described adjustable splint, between described adjustable splint and described first clamping plate, form described slot.
Preferably, in above-mentioned printed substrate fixing insertion, described snubber elastomeric device is spaced apart multiple.
Preferably, in above-mentioned printed substrate fixing insertion, also comprise the scrap (bridge) be arranged on described side plate, described scrap (bridge) and described clamping plate group lay respectively at the both sides of described side plate.
As can be seen from above-mentioned technical scheme, printed substrate fixing insertion provided by the invention, plate body is offered the slot establishing printed substrate for card, when printed substrate crosses Wave soldering furnace, one piece of fixing insertion is entered at least one side pressure of printed substrate, the slot of fixing insertion and the edge snap fit of printed substrate, make it be fixed together, thus reduce distortion.Cross stokehold, fixing insertion is entered at least one side pressure of printed substrate, the fixation to printed substrate can be played, be out of shape after preventing printed substrate to be heated, therefore the risk dropped from the delivery track of Wave soldering furnace is avoided, it also avoid the danger that melting scolding tin rushes to printed wire plate top surface, then avoid the problem that a large amount of printed substrate rolls off the production line, improve quality and the production efficiency of printed substrate.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the printed substrate fixing insertion that Fig. 1 provides for the embodiment of the present invention;
The end view of the printed substrate fixing insertion that Fig. 2 provides for the embodiment of the present invention;
The end view of the printed substrate fixing insertion that Fig. 3 provides for another embodiment of the present invention;
The end view of the printed substrate fixing insertion that Fig. 4 provides for yet another embodiment of the invention.
Embodiment
Core of the present invention is to provide a kind of printed substrate fixing insertion, deforms when crossing Wave soldering furnace to avoid printed substrate.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1 and Fig. 2, the structural representation of the printed substrate fixing insertion that Fig. 1 provides for the embodiment of the present invention; The end view of the printed substrate fixing insertion that Fig. 2 provides for the embodiment of the present invention.
The printed substrate fixing insertion that the embodiment of the present invention provides, comprise plate body, plate body offers slot 101, the width of slot 101 and the thickness of printed substrate adapt, and namely the width of slot 101 can meet the side being connected to printed substrate.The width of slot 101 can be equal with the thickness of printed substrate, and the width of certain slot 101 also can be slightly less than the thickness of printed substrate, with the distortion by plate body, reaches the object clamping printed substrate.
Printed substrate fixing insertion provided by the invention, plate body is offered the slot 101 establishing printed substrate for card, when printed substrate crosses Wave soldering furnace, one piece of fixing insertion is entered at least one side pressure of printed substrate, the slot 101 of fixing insertion and the edge snap fit of printed substrate, make it be fixed together, thus reduce distortion.Cross stokehold, fixing insertion is entered at least one side pressure of printed substrate, the fixation to printed substrate can be played, be out of shape after preventing printed substrate to be heated, therefore the risk dropped from the delivery track of Wave soldering furnace is avoided, it also avoid the danger that melting scolding tin rushes to printed wire plate top surface, then avoid the problem that a large amount of printed substrate rolls off the production line, improve quality and the production efficiency of printed substrate.
In the present invention one specific embodiment, plate body comprises side plate 106 and clamping plate group.
Wherein, clamping plate group is arranged on side plate 106, and clamping plate group comprises the same side that the first clamping plate 104 and the second clamping plate 105, first clamping plate 104 and the second clamping plate 105 are positioned at side plate 106, and extends along the length direction of side plate 106.Form slot 101 between first clamping plate 104 and the second clamping plate 105, namely the first clamping plate 104 and the second clamping plate 105 are equivalent to two sidewalls of this slot 101, and side plate 106 is equivalent to the diapire of this slot 101.
Further, clamping plate group is along spaced apart multiple on the length direction of side plate 106, and forms the escape groove 103 for avoiding the pad on printed substrate between adjacent two clamping plate groups.The position of this escape groove 103 can be set according to the design feature of printed substrate usually, in other words, the position at adjacent two clamping plate group intervals can be set according to the design feature of printed substrate.The position of escape groove 103 is corresponding with the position of the pad of printed substrate, when clamping this fixing insertion, should ensure that escape groove 103 matches with pad, thus make clamping plate group avoid pad, and avoiding affects follow-up solder wave process.
In the present invention one specific embodiment, the first clamping plate 104, second clamping plate 105 and side plate 106 are integral type structure, namely printed substrate fixing insertion can integrally casting shaping.It will be appreciated by persons skilled in the art that the first clamping plate 104, second clamping plate 105 and side plate 106 are also welded as a whole by the mode of welding, or connected as one by other connected mode.
Further, the first clamping plate 104 and the second clamping plate 105 parallel, and namely the width of slot 101 is wide.Certainly, the width of slot 101 also can be not wide, as slot 101 to be less than the width of the other end away from the width of one end of side plate 106, first clamping plate 104 and the second clamping plate 105 all can be in tilted layout relative to side plate 106, and make the width of slot 101 openend be less than the width of the other end, the object clamping printed substrate can be realized equally.
Refer to Fig. 3, the end view of the printed substrate fixing insertion that Fig. 3 provides for another embodiment of the present invention.
In the present invention one specific embodiment, plate body comprises side plate 106, and is arranged at the clamping plate group on side plate 106, and clamping plate group comprises the first clamping plate 104 and the second clamping plate 105.
First clamping plate 104 are near the side of the second clamping plate 105, and the second clamping plate 105 are provided with resilient coating 107 near the side of the first clamping plate 104, form slot 101 between two buffer layer 107.Resilient coating 107 can be any material with buffering effect and makes, such as rubber, silica gel etc., to avoid causing scratch to the surface of printed substrate.
It should be noted that, resilient coating 107 also can only on clamping plate disposed therein.Such as, be only provided with resilient coating 107 at the first clamping plate 104 near the side of the second clamping plate 105, and the second clamping plate 105 do not arranged resilient coating 107, between resilient coating 107 and the second clamping plate 105, form slot 101.Correspondingly, also only at the second clamping plate 105, the side of the first clamping plate 104 can be provided with resilient coating 107, and the first clamping plate 104 not arranged resilient coating 107, between resilient coating 107 and the first clamping plate 104, form slot 101.
The present invention, by arranging resilient coating 107 on clamping plate (the first clamping plate 104, second clamping plate 105), significantly can reduce the scratch that hard material causes print circuit board surface.The situation of resilient coating 107 is provided with for the first clamping plate 104 and the second clamping plate 105; the effect of protection all can be played to the upper and lower surface of printed substrate; and be provided with the situation of resilient coating 107 one of in the first clamping plate 104 and the second clamping plate 105, the effect of protection also can be played to the corresponding side of printed substrate.
Refer to Fig. 4, the end view of the printed substrate fixing insertion that Fig. 4 provides for yet another embodiment of the invention.
In the present invention one specific embodiment, plate body comprises side plate 106, and is arranged at the clamping plate group on side plate 106, and clamping plate group comprises the first clamping plate 104 and the second clamping plate 105.
First clamping plate 104 are near the side of the second clamping plate 105, and the second clamping plate 105 are provided with snubber elastomeric device 109 near the side of the first clamping plate 104, snubber elastomeric device 109 are connected with adjustable splint 108, form slot 10 between two adjustable splints 108.
In the present embodiment, the width of the slot 10 between two adjustable splints 108 is adjustable, namely reaches the object regulating slot 10 width, therefore, it is possible to adapt to the printed substrate of various thickness by compression snubber elastomeric device 109.When printed substrate being clipped between two adjustable splints 108, the snubber elastomeric device 109 be connected with adjustable splint 108 will be compressed, thus ensure this printed substrate of clamping, because snubber elastomeric device 109 has cushioning effect, therefore also damage can not be caused to printed substrate.
As long as it will be appreciated by persons skilled in the art that and a clamping plate (the first clamping plate 104, second clamping plate 105) arranges snubber elastomeric device 109 and adjustable splint 108 wherein, the object regulating slot 101 width just can be played.Therefore, adjustable splint 108 also can only on clamping plate disposed therein (the first clamping plate 104, second clamping plate 105).Such as only at the first clamping plate 104, the side of the second clamping plate 105 is provided with snubber elastomeric device 109, snubber elastomeric device 109 is connected with adjustable splint 108, between adjustable splint 108 and the second clamping plate 105, form slot 101.Correspondingly, also only can be provided with snubber elastomeric device 109 at the second clamping plate 105 near the side of the first clamping plate 104, snubber elastomeric device 109 be connected with adjustable splint 108, between adjustable splint 108 and the first clamping plate 104, form slot 101.
Further, snubber elastomeric device 109 is spaced apart multiple, such as, shown in Fig. 4 two, also can be other quantity such as 3,4 etc.When snubber elastomeric device 109 is one, the object of mobile adjustable splint 108 can be realized equally, namely can change the width of slot 101 equally.Snubber elastomeric device 109 can be spring, also can be the part that other has elastic effect, as rubber parts etc.
It will be appreciated by persons skilled in the art that and also can resilient coating 107 disclosed in above-described embodiment be set on adjustable splint 108.
In order to optimize technique scheme further, the present invention also can comprise the scrap (bridge) 102 be arranged on side plate 106, and scrap (bridge) 102 and clamping plate group lay respectively at the both sides of side plate 106.When printed substrate crosses Wave soldering furnace, enter one piece of fixing insertion at least one side pressure of printed substrate, the scrap (bridge) 102 of fixing insertion will be set up at delivery track, play the effect of support.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims (10)

1. a printed substrate fixing insertion, is characterized in that, comprises plate body, described plate body offers slot (101), and the width of described slot (101) and the thickness of printed substrate adapt.
2. printed substrate fixing insertion as claimed in claim 1, it is characterized in that, described plate body comprises:
Side plate (106);
Be arranged at the clamping plate group on described side plate (106), described clamping plate group comprises the first clamping plate (104) and the second clamping plate (105), forms described slot (101) between described first clamping plate (104) and the second clamping plate (105).
3. printed substrate fixing insertion as claimed in claim 2, it is characterized in that, described clamping plate group is along spaced apart multiple on the length direction of described side plate (106), and forms the escape groove (103) for avoiding the pad on described printed substrate between adjacent two described clamping plate groups.
4. printed substrate fixing insertion as claimed in claim 2, it is characterized in that, described first clamping plate (104), the second clamping plate (105) and described side plate (106) are integral type structure.
5. printed substrate fixing insertion as claimed in claim 2, it is characterized in that, described first clamping plate (104) and described second clamping plate (105) parallel.
6. printed substrate fixing insertion as claimed in claim 2, is characterized in that, described slot (101) is less than the width of the other end away from the width of one end of described side plate (106).
7. printed substrate fixing insertion as claimed in claim 1, it is characterized in that, described plate body comprises side plate (106), and is arranged at the clamping plate group on described side plate (106), and described clamping plate group comprises the first clamping plate (104) and the second clamping plate (105);
Described first clamping plate (104) are near the side of described second clamping plate (105), and/or described second clamping plate (105) are provided with resilient coating (107) near the side of described first clamping plate (104);
When described first clamping plate (104) and described second clamping plate (105) are equipped with described resilient coating (107), between two-layer described resilient coating (107), form described slot (101);
When only there being described first clamping plate (104) to be provided with described resilient coating (107), between described resilient coating (107) and described second clamping plate (105), form described slot (101);
When only there being described second clamping plate (105) to be provided with described resilient coating (107), between described resilient coating (107) and described first clamping plate (104), form described slot (101).
8. printed substrate fixing insertion as claimed in claim 1, it is characterized in that, described plate body comprises side plate (106), and is arranged at the clamping plate group on described side plate (106), and described clamping plate group comprises the first clamping plate (104) and the second clamping plate (105);
Described first clamping plate (104) are near the side of described second clamping plate (105), and/or described second clamping plate (105) are provided with snubber elastomeric device (109) near the side of described first clamping plate (104), and described snubber elastomeric device (109) is connected with adjustable splint (108);
When described first clamping plate (104) and described second clamping plate (105) are equipped with described adjustable splint (108), between two described adjustable splints (108), form described slot (101);
When only there being described first clamping plate (104) to be provided with described adjustable splint (108), between described adjustable splint (108) and described second clamping plate (105), form described slot (101);
When only there being described second clamping plate (105) to be provided with described adjustable splint (108), between described adjustable splint (108) and described first clamping plate (104), form described slot (101).
9. printed substrate fixing insertion as claimed in claim 8, it is characterized in that, described snubber elastomeric device (109) is for spaced apart multiple.
10. the printed substrate fixing insertion as described in any one of claim 2-9, it is characterized in that, also comprise the scrap (bridge) (102) be arranged on described side plate (106), described scrap (bridge) (102) and described clamping plate group lay respectively at the both sides of described side plate (106).
CN201310330390.4A 2013-07-31 2013-07-31 A kind of printed wiring board fixing insertion Expired - Fee Related CN104349604B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310330390.4A CN104349604B (en) 2013-07-31 2013-07-31 A kind of printed wiring board fixing insertion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310330390.4A CN104349604B (en) 2013-07-31 2013-07-31 A kind of printed wiring board fixing insertion

Publications (2)

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CN104349604A true CN104349604A (en) 2015-02-11
CN104349604B CN104349604B (en) 2018-04-20

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012452A (en) * 2017-12-04 2018-05-08 毛燕婷 A kind of circuit board processing unit (plant)
CN108541174A (en) * 2018-05-31 2018-09-14 湖北省雄雄电子科技有限公司 A kind of controller for electric vehicle that water resistance is good
CN112714543A (en) * 2020-12-29 2021-04-27 福建中科智与科技有限公司 Intelligent movable rack main control board

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739452A (en) * 1986-02-28 1988-04-19 Mitsubishi Denki Kabushiki Kaisha Mounting structure for a printed circuit board
US20010015889A1 (en) * 2000-02-22 2001-08-23 Nec Corporation Reinforcing structure for a printed circuit board
CN2777906Y (en) * 2005-03-10 2006-05-03 深圳Tcl新技术有限公司 Sn damping clamp assembly
CN2847810Y (en) * 2005-12-05 2006-12-13 英业达股份有限公司 Circuit board fixing structure
CN101184375A (en) * 2007-12-18 2008-05-21 苏州明富自动化设备有限公司 Clamping apparatus for PCB
CN201244721Y (en) * 2008-06-12 2009-05-27 中国航空工业第一集团公司第六一三研究所 Anti-deforming combined clamp for wave soldering of printed board with heat radiation board
CN101696927A (en) * 2009-09-30 2010-04-21 苏州明富自动化设备有限公司 Clamping device of optical detector
CN102647855A (en) * 2011-02-16 2012-08-22 技嘉科技股份有限公司 Auxiliary clamping jig for plate cutting machine
CN203537675U (en) * 2013-07-31 2014-04-09 珠海格力电器股份有限公司 Fixing plugboard used for printed circuit board

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4739452A (en) * 1986-02-28 1988-04-19 Mitsubishi Denki Kabushiki Kaisha Mounting structure for a printed circuit board
US20010015889A1 (en) * 2000-02-22 2001-08-23 Nec Corporation Reinforcing structure for a printed circuit board
CN2777906Y (en) * 2005-03-10 2006-05-03 深圳Tcl新技术有限公司 Sn damping clamp assembly
CN2847810Y (en) * 2005-12-05 2006-12-13 英业达股份有限公司 Circuit board fixing structure
CN101184375A (en) * 2007-12-18 2008-05-21 苏州明富自动化设备有限公司 Clamping apparatus for PCB
CN201244721Y (en) * 2008-06-12 2009-05-27 中国航空工业第一集团公司第六一三研究所 Anti-deforming combined clamp for wave soldering of printed board with heat radiation board
CN101696927A (en) * 2009-09-30 2010-04-21 苏州明富自动化设备有限公司 Clamping device of optical detector
CN102647855A (en) * 2011-02-16 2012-08-22 技嘉科技股份有限公司 Auxiliary clamping jig for plate cutting machine
CN203537675U (en) * 2013-07-31 2014-04-09 珠海格力电器股份有限公司 Fixing plugboard used for printed circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108012452A (en) * 2017-12-04 2018-05-08 毛燕婷 A kind of circuit board processing unit (plant)
CN108012452B (en) * 2017-12-04 2019-11-26 龙南骏亚精密电路有限公司 A kind of circuit board processing unit (plant)
CN108541174A (en) * 2018-05-31 2018-09-14 湖北省雄雄电子科技有限公司 A kind of controller for electric vehicle that water resistance is good
CN108541174B (en) * 2018-05-31 2020-06-26 湖北省雄雄电子科技有限公司 Electric vehicle controller with good waterproof performance
CN112714543A (en) * 2020-12-29 2021-04-27 福建中科智与科技有限公司 Intelligent movable rack main control board

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Granted publication date: 20180420