CN216017277U - Surface mounting structure for pre-welding of thermistor of IGBT (insulated Gate Bipolar transistor) module - Google Patents
Surface mounting structure for pre-welding of thermistor of IGBT (insulated Gate Bipolar transistor) module Download PDFInfo
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- CN216017277U CN216017277U CN202122581510.0U CN202122581510U CN216017277U CN 216017277 U CN216017277 U CN 216017277U CN 202122581510 U CN202122581510 U CN 202122581510U CN 216017277 U CN216017277 U CN 216017277U
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Abstract
A mounting structure for pre-welding a thermistor of an IGBT module comprises a soldering lug and the thermistor. The soldering lug is long rectangle, four corner facies of soldering lug are towards same one side perk, form spacing angle, terminal surface in the spacing angle is spacing angle, thermistor's both ends tip is provided with the electrode, electrode and soldering lug butt. According to the mounting structure for pre-welding the thermistor of the IGBT module, the thermistor can be fixed only by two welding sheets, and the purposes that the thermistor is easy to place and the welding quality is reliable can be achieved. The requirement on the mounting precision of the automatic equipment is not high, a large amount of time can be saved for debugging and modifying the mounting position of the thermistor, and the production efficiency is improved. The design is suitable for most thermistor models used in the IGBT market, has strong universality, can meet the mounting requirement of the thermistor only by adding a soldering lug forming die on automatic equipment, saves the production cost and improves the production efficiency.
Description
Technical Field
The utility model relates to a IGBT module packaging technology technical field, in particular to IGBT module thermistor pastes dress structure of welded in advance.
Background
In the packaging process of the IGBT module, the fixing mode of the thermistor before reflow soldering is a problem which is difficult to handle, and the currently common fixing modes mainly include the following three modes:
firstly, adopt the tin cream technology, fix thermistor welding end in the design position through the viscidity of tin cream. The scheme is firm, and automatic mounting is easy to realize, but because of the application of the solder paste, in order to ensure the performance of the product, a cleaning procedure needs to be added subsequently to remove residues, so that the production cost and the quality control difficulty of the product are increased, and certain influence is also caused on the environment;
secondly, by adopting the soldering lug process, the circuit board is thin and is easy to be soldered through when being directly soldered, or the circuit in the circuit board is burnt, and the soldering lug is required to be protected, so that the thermistor is required to be fixed by a small special fixture, and the soldering end of the thermistor is not deviated from the soldering lug. Compared with a tin paste process, the scheme does not need to add a new process, but the special fixture used is small, is not easy to realize on an automatic production line, and generally adopts manual operation;
chinese patent CN201410088593.1 discloses a thermistor welding tool and a welding method for an IGBT module, which includes a bottom plate and a positioning plate, and the positioning plate and a top plate are optimally designed to improve welding quality. However, the device still has the problems of complex structure, troublesome operation, higher cost and the like.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a can prevent skew, simple structure, convenient operation's IGBT module thermistor pastes dress structure in advance during thermistor welding to satisfy the industrial demand.
The utility model provides a surface mounting structure of IGBT module thermistor prewelding, its includes that two weld respectively on a circuit board on two adjacent solder joints to and both ends respectively with two solder joint's thermistor, the solder joint is long rectangle, four corner facies of solder joint are towards same one side perk, form the spacing angle, thermistor's both ends tip is provided with the electrode, the electrode welds with two solder joints respectively.
Furthermore, the area of the soldering lug between the four limiting angles is a limiting part, the top surface of the soldering lug is a welding surface, and the end part of the thermistor is welded with the welding surface.
Further, the surface of the electrode is subjected to tin plating treatment.
Further, the thickness of the electrode accounts for one third of the width of the soldering lug.
Furthermore, the thermistor comprises a cylindrical glass cover, the glass cover is clamped between two electrodes, and a thermistor chip is connected between the two electrodes.
Further, the shape of the electrode is circular.
Further, the shape of the electrode is a regular hexagon.
Compared with the prior art, the utility model provides a subsides dress structure of IGBT module thermistor prewelding is through set up a plurality of spacing angles on the welding lug to and the spacing angle of centre gripping between the spacing angle. The thermistor can be fixed only by two soldering lugs, and the purposes of easy placement of the thermistor and reliable welding quality can be achieved without an additional tool clamp. Meanwhile, a special tool clamp is not required to be placed, the requirement on the mounting precision of the automatic equipment is not high, a large amount of time can be saved for debugging the automatic equipment and modifying the mounting position of the thermistor, and the production efficiency of an automatic production line is improved. The design is suitable for most thermistor models used in the IGBT market, has strong universality, can meet the mounting requirement of the thermistor only by adding a soldering lug forming die on automatic equipment, saves the production cost for mass production of factories, and improves the production efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the soldering lug provided by the present invention.
Fig. 2 is a schematic structural view of the thermistor of fig. 1.
Fig. 3 is a schematic view of the thermistor of fig. 1 after welding.
Fig. 4 is a schematic diagram of the soldering lug after being soldered with the circuit board.
Detailed Description
Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
As shown in fig. 1 to fig. 4, it is a structural schematic diagram of a mounting structure for IGBT module thermistor prewelding provided by the present invention. The mounting structure for pre-soldering the thermistor of the IGBT module includes two soldering lugs 10 respectively soldered to two adjacent soldering points on a circuit board, and a thermistor 20 having two ends respectively soldered to the two soldering lugs 10, and the mounting structure for pre-soldering the thermistor of the IGBT module further includes other functional modules, such as connecting grooves, connecting holes, etc., which should be known to those skilled in the art, and will not be described in detail herein.
Referring to fig. 1, the soldering lug 10 is a long rectangular metal block, four corners of the soldering lug 10 are tilted toward the same side to form limiting angles 11, an area of the soldering lug 10 between the four limiting angles 11 is a limiting portion 12, and a top surface of the soldering lug 10 is a welding surface 13. The end of the thermistor 20 is welded to the welding surface 13.
The soldering surface 13 of the soldering lug 10 and the thermistor 20 are connected by reflow soldering.
The thermistor 20 comprises a cylindrical glass cover 21, tin-plated electrodes 22 are arranged at two ends of the glass cover 21, and a thermistor chip 23 is connected between the two electrodes 22. The diameter of the end parts of the two ends of the glass cover 23 is slightly smaller than that of one side of the electrode 22 far away from the glass cover 23, so that when the electrode 22 is abutted to the soldering lug 10, the glass cover 21 is prevented from colliding with the soldering lug 10, and the glass cover 21 is broken. The electrode 22 is a round electrode or a regular hexagon electrode made of pure copper through a cold heading process. The cold heading process is a commercially available prior art, and in the present embodiment, the electrode 22 has a smaller volume, and the cold heading process is more advantageous than the turning process. It is expected that the regular hexagon shape can better prevent the thermistor 20 from rolling on the soldering lug 10, and is convenient for positioning. The tin-plated surface prevents oxidation of the electrode 22 after prolonged exposure to air, which could affect the conductivity. The thickness of the electrode 22 is one third of the width of the soldering lug 10, and the length directions of the two soldering lugs 10 are perpendicular to the thermistor 20.
Referring to fig. 3, the electrode 22 is connected to the tab 10 by reflow soldering, and a portion of the electrode 22 close to the tab 10 is melted and then connected to the soldering surface 12 to form a soldering portion 24.
Compared with the prior art, the utility model provides a subsides dress structure of IGBT module thermistor prewelding passes through set up a plurality of spacing angles 11 on the soldering lug 10 to and the spacing portion 12 of centre gripping between the spacing angle 11. Therefore, the thermistor 20 can be fixed only by two soldering lugs 10, and the purposes of easy placement and reliable welding quality of the thermistor 20 can be achieved without an additional tool clamp. Meanwhile, a special tool clamp is not required to be placed, the requirement on the mounting precision of the automatic equipment is not high, a large amount of time can be saved for debugging the automatic equipment and modifying the mounting position of the thermistor 20, and the production efficiency of an automatic production line is improved. The design is suitable for most thermistor 20 models used in the IGBT market, has strong universality, can meet the mounting requirement of the thermistor 20 only by adding a soldering lug forming die on automatic equipment, saves the production cost for mass production of factories, and improves the production efficiency.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.
Claims (7)
1. The utility model provides a subsides dress structure of IGBT module thermistor prewelding which characterized in that: the utility model provides a bonding structure of IGBT module thermistor prewelding includes that two weld the soldering lug on two adjacent solder joints on a circuit board respectively to and both ends respectively with two soldering lug welded thermistors, the soldering lug is long rectangle, four corner court of soldering lug are with same one side perk, form spacing angle, thermistor's both ends tip is provided with the electrode, the electrode welds with two soldering lugs respectively.
2. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the welding lug is provided with four limiting angles, the welding lug is provided with a limiting part in the area between the four limiting angles, the top surface of the welding lug is a welding surface, and the end part of the thermistor is welded with the welding surface of the limiting part.
3. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the surface of the electrode is treated by tin plating.
4. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the thickness of the electrode accounts for one third of the width of the soldering lug.
5. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the thermistor comprises a cylindrical glass cover, the glass cover is clamped between two electrodes, and a thermistor chip is connected between the two electrodes.
6. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the shape of the electrode is circular.
7. The mounting structure for IGBT module thermistor pre-soldering according to claim 1, characterized in that: the shape of the electrode is regular hexagon.
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CN202122581510.0U CN216017277U (en) | 2021-10-25 | 2021-10-25 | Surface mounting structure for pre-welding of thermistor of IGBT (insulated Gate Bipolar transistor) module |
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CN202122581510.0U CN216017277U (en) | 2021-10-25 | 2021-10-25 | Surface mounting structure for pre-welding of thermistor of IGBT (insulated Gate Bipolar transistor) module |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116900544A (en) * | 2023-09-11 | 2023-10-20 | 赛晶亚太半导体科技(北京)有限公司 | Soldering lug for thermistor welding and mounting, mounting method and IGBT module |
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2021
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116900544A (en) * | 2023-09-11 | 2023-10-20 | 赛晶亚太半导体科技(北京)有限公司 | Soldering lug for thermistor welding and mounting, mounting method and IGBT module |
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