CN116441786A - Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method - Google Patents
Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method Download PDFInfo
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- CN116441786A CN116441786A CN202310459147.6A CN202310459147A CN116441786A CN 116441786 A CN116441786 A CN 116441786A CN 202310459147 A CN202310459147 A CN 202310459147A CN 116441786 A CN116441786 A CN 116441786A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 117
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 98
- 238000005476 soldering Methods 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000002844 melting Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052718 tin Inorganic materials 0.000 claims abstract description 48
- 229910052742 iron Inorganic materials 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000007769 metal material Substances 0.000 claims abstract description 26
- 229920002994 synthetic fiber Polymers 0.000 claims abstract description 26
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 24
- 239000011701 zinc Substances 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 21
- 239000006023 eutectic alloy Substances 0.000 claims abstract description 13
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 13
- 150000002910 rare earth metals Chemical class 0.000 claims abstract description 13
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 13
- 150000003624 transition metals Chemical class 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 28
- 239000012943 hotmelt Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000002648 laminated material Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 230000004907 flux Effects 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 3
- 239000011135 tin Substances 0.000 description 39
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- 239000000956 alloy Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000005672 electromagnetic field Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 238000003915 air pollution Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an electromagnetic hot-melting tin alloy solder and a preparation method and a soldering method thereof, which comprise high-purity iron or other magnetic transition metals and rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy. The special electromagnetic wave heating equipment is utilized to rapidly heat and weld the tin alloy solder from inside to outside to finish the soldering tin process, so that the quality of the soldering tin can be improved, the consumption of the tin alloy, the soldering flux and the electric energy can be greatly reduced, and in addition, the cleaning link after the soldering tin is finished can be reduced, thereby reducing the cost, reducing the pollution to the environment, and particularly avoiding the damage of high temperature to components and improving the service life of products. The solder material has the necessity of completely replacing the prior tin alloy solder.
Description
Technical Field
The invention relates to the field of electronic product manufacturing, in particular to electromagnetic hot-melting tin alloy solder and a preparation method and a soldering method thereof.
Background
Tin alloy solder is a fusible metal with a melting point lower than that of a welded metal, and when the solder is melted, the surface of the welded metal can be soaked under the condition that the welded metal is not melted, and an alloy layer is formed at a contact surface to be connected with the welded metal, so that the tin alloy solder is commonly called as soldering tin in the assembly of common electronic products.
The tin alloy solder is processed and formed according to the specified size when in use, and has a plurality of shapes such as sheet shape, block shape, paste shape, ribbon shape, sphere shape, thread shape and the like;
1) Filiform solders, commonly known as wires, are surrounded by rosin in the center, known as rosin-cored wires, and are commonly used in hand soldering. The outer diameter of rosin-core welding wires is usually 0.5mm, 0.6mm, 0.8mm, 1.Omm, 1.2mm, 1.6mm, 2.Omm, 2.3mm, 3.Omm and the like.
2) Sheet solder, commonly used for the soldering of silicon wafers and other sheet weldments;
3) Strip solder, which is commonly used in automatic assembly production lines, is welded by punching a section of the strip solder by an automatic welding machine so as to improve the production efficiency;
4) Solder paste, which is prepared by mixing solder and soldering flux together, is coated on a printed circuit board and then soldered when soldering, and is widely used in an automatic chip mounting process;
the existing tin alloy solder consists of solder resist and tin alloy according to a certain proportion, and the existing tin alloy mainly consists of tin lead, tin bismuth and tin silver copper alloy, and the general proportion is SN63/PB37, SN42BI58, SN96.5CU0.5AG3.0 and SN99CU0.7AG0.3. The most commonly used alloy before no lead-free requirement is Sn63/Pb37, the tin alloy solder with lead-free requirement mainly comprises three parts of tin/silver/copper, SN96.5CU0.5AG3.0 and SN99CU0.7AG0.3, the original lead component is replaced by silver and copper, a small amount of antioxidant element is replaced by silver and copper, and the element for reducing the melting point is added when the low-temperature requirement exists.
Soldering with tin alloy solder is called soldering. The soldering temperature of the soldering is lower, the soldering can be realized by using a simple tool, and the method is simple. The welding spot is easy to repair and replace components, so the welding method is the most common welding method used in the whole machine assembly in the electronic industry.
The existing tin alloy solder is mainly used for realizing metallurgical connection by directly contacting and heating a heating tool such as an electric soldering iron and a plane welding table or non-contacting and heating such as laser heating or heating from the surface to the inside in a mode of air heating such as reflow soldering to melt solder paste, and the alloy components are cooled and solidified to form welding spots between two welded objects. The existing tin alloy solder has the following defects by adopting the existing hot-melt soldering process:
1. when the existing soldering tin adopts a direct contact heating mode of an electric soldering iron and a plane welding table, the soldering tin quality problems such as false soldering and the like are easily caused due to the influence of factors such as the power and the temperature of the electric soldering iron or the plane welding table, the type of tin alloy material, the quantity of the tin alloy material, the heat dissipation condition of a welded object, the ambient temperature, the air flow degree, the type of a soldering bit, the contact pressure, the contact area and the contact angle when heat is transferred to a welding piece, the proficiency of an operator and the like. In particular, the soldering tin is heated by adopting an electric soldering iron, and the surface of the soldering iron is easily oxidized and is adhered with a layer of black impurities because the soldering iron head is in a high-temperature state for a long time and contacts with weak acid substances such as soldering flux. These impurities form a heat insulating layer, and heat conduction between the soldering bit and the soldering tin weldment is prevented by the fact that the impurities cannot be cleaned in time, so that the welding quality is affected, and carbonized substances on the surface of the soldering bit can remain between welding spots to affect the appearance and even cause electric leakage to affect the product quality. If the temperature of the electric soldering iron or the plane welding table is too high, the components or the PCB is easily damaged. Even the soldering iron head is directly contacted with the molten tin, once the soldering iron head is leaked, electrostatic sensitive components are damaged, great economic loss is caused, and if the performance of the components is reduced, large-scale after-sale events can be caused, so that the brand image of the product is greatly and negatively influenced.
2. The existing tin alloy solder is applied in the form of solder paste in the Surface Mount Technology (SMT) of electronic products. The solder paste is printed and coated on the bonding pad of the printed circuit board, the surface-mounted component is accurately attached to the bonding pad coated with the solder paste, the circuit board is heated by a reflow soldering device (hot air heating device) according to a specific reflow temperature curve, the solder paste is melted, and the alloy components are cooled and solidified to form welding spots between the component and the printed circuit board so as to realize welding. There are also many factors that affect SMT solder quality: for example, the mismatch between the reflow temperature setting and the solder paste type can cause over-temperature oxidation or insufficient temperature or insufficient tin melting time to cause cold welding; solder quality problems of tombstoning (component standing caused by different tin melting degrees of solder pastes on two sides of a surface-mounted component) can occur due to uneven hot air in reflow soldering equipment; the preheat region of the reflow temperature profile is used to raise the temperature of the PCB from ambient to the desired active temperature. In this area, the temperature of the product continuously rises at a speed of not more than 2-5 ℃ per second, and the temperature rise is too fast to cause certain defects, such as micro cracks of a ceramic capacitor, while the temperature rise is too slow, the solder paste is excessively sensitive to temperature, and insufficient time is left for the PCB to reach the active temperature to cause the solder quality to be not feasible, and the setting of the preheating area is influenced by the factors of the ambient temperature, the solder type, the density of the mounted element, the size of the PCB, the thickness of the PCB copper foil and the like, so that the problem of poor solder is difficult to avoid; the SMT process is a continuous high temperature process, and has high temperature resistance requirements on both the PCB and the surface mount component, which may cause damage to the surface mount component, and the high temperature resistance requirements on the PCB and the surface mount component may increase a lot of costs. In addition, the reflow soldering equipment is required to keep a continuous high temperature during working, high-temperature evaporation gas of the soldering flux is required to be discharged, the energy consumption in the production process is high, and the cost is high.
3. The existing tin alloy solder is applied in the form of high-temperature liquid tin alloy in the wave soldering and dip soldering process of the circuit board. Most of PCB soldering tin with more plug-in materials adopts the production process, tin alloy solder is placed in a tin melting tank of a tin furnace, an electric heating tube is used for heating to a liquid state, the PCB after the plug-in is finished is sprayed with soldering flux and then is contacted with the liquid surface of the soldering tin, and tin alloy is attached to a PCB bonding pad and pins of the plug-in materials to finish soldering tin work. The process is affected by the heat dissipation condition of the welded object, the ambient temperature, the quality of the soldering flux, the quantity of the soldering resist, the quality of the tin alloy solder, the proficiency of operators and other factors, so that the quality problems of the soldering tin such as false soldering and false soldering are easily caused. The soldering tin is kept to be high Wen Suoyi, the tin surface is extremely easy to oxidize, and a large amount of tin slag is required to be cleaned in time, so that larger solder loss is caused. The residues generated by the soldering flux and the solder at high temperature are attached to the surface of the PCB, so that the PCB is not attractive, and electric leakage is possibly caused, so that most PCBs need to be washed by a cleaning agent or ultrasonic after wave soldering or dip soldering process, and the process cost is increased, and environmental pollution is also caused.
Statistics indicate that, in the failure of electronic whole machine products, nearly half is due to poor welding. The whole electronic product has thousands of welding spots, and the phenomenon that the whole electronic product cannot work normally due to the quality problem of one or more welding spots is frequently caused. However, it is not really easy to find out the spot that causes the failure from an electronic device with thousands of spots, and particularly, it is often difficult to find out the spot that is actually soldered, sometimes just as it is soldered, but the machine fails due to the aggravation of oxidation for some time. Particularly for high frequency and high voltage equipment, if burrs, voids and bubbles are present in the welding spot, point discharge or excessive internal resistance in the welding spot may occur to cause overheating and ignition. Because of the limitations of the existing tin alloy solder and the process of heating and welding the solder from outside to inside, the quality problem of products caused by the quality of the solder cannot be effectively completely eradicated even though the large quality control cost is input, and the existing tin alloy solder and the existing tin alloy process are adopted to cause larger loss of the solder and the electric energy, larger environmental pollution and higher cost.
Disclosure of Invention
In order to solve the problems, the invention provides electromagnetic hot-melting tin alloy solder and a preparation method and a soldering method thereof, which contain particulate metal laminated materials which can be heated by a specific electromagnetic field in a specific proportion, and utilize special electromagnetic wave heating equipment to rapidly heat and weld the tin alloy solder from inside to outside to finish a soldering process, so that the quality of the soldering tin can be improved, the consumption of the tin alloy and the soldering flux and the loss of electric energy can be greatly reduced, and a cleaning link after the soldering tin is finished can be further subtracted, thereby reducing the cost, reducing the pollution to the environment, and particularly avoiding the damage of high temperature to components and parts and prolonging the service life of products. The solder material has the necessity of completely replacing the prior tin alloy solder.
The invention is realized by the following technical scheme: an electromagnetic hot melt tin alloy solder comprising:
high-purity iron or other magnetic transition metals and rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy form electromagnetic hot-melting tin alloy solder, and the electromagnetic hot-melting tin alloy solder is a microparticle-shaped metal laminated material.
As a preferable technical scheme, the mass percentage of the high-purity iron or other magnetic transition metals and rare earth metals or other magnetic synthetic materials is 28-40%.
As a preferred technical scheme, the mass percentage of the high-purity iron or other magnetic transition metals and the rare earth metals or other magnetic synthetic materials is 38.8 percent.
As a preferable technical scheme, the mass percentage of the high-purity copper or other high-conductivity metal materials and the synthetic materials is 5-15%.
As a preferable technical scheme, the mass percentage of the high-purity copper or other high-conductivity metal materials and the synthetic materials is 8.73 percent.
As a preferable technical scheme, the mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 10-22%.
As a preferred technical scheme, the mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 17.68%.
The invention discloses a preparation method of electromagnetic hot-melting tin alloy solder, which comprises the following steps:
s1, preparing iron with the purity of more than 99.5 percent by mass and 38.8 percent by mass, copper with the purity of more than 99.5 percent by mass and 8.73 percent by mass and zinc with the purity of more than 99.5 percent by mass and 17.68 percent by mass;
s2, preparing a proper amount of tin alloy;
s3, plating copper with the purity of more than 99.5 percent and the mass percent of 8.73 percent, zinc with the purity of more than 99.5 percent and 17.68 percent and a proper amount of tin alloy on the outer part of the high-purity iron in sequence;
s4, preparing the electromagnetic hot-melting tin alloy solder.
According to the method for soldering tin by using the electromagnetic hot-melting tin alloy solder, the electromagnetic hot-melting tin alloy solder is used for rapidly heating and welding from inside to outside by using special electromagnetic wave heating equipment to complete the soldering tin process.
The beneficial effects of the invention are as follows: 1. because the surface heating time is short and the probability of oxidation is small, the tin alloy solder can reduce the content of the soldering flux, so that harmful gas and residues generated after the soldering flux is at high temperature are reduced, and the risks of air pollution and PCB electric leakage are reduced;
2. the tin alloy solder powder can adopt a non-contact specific electromagnetic field heating soldering tin process, and an electric heating body is not required to be directly contacted with solder, so that damage to static sensitive components caused by leakage of the electric heating body is avoided;
3. the invention uses special electromagnetic wave heating equipment to synchronously heat and weld the inner and outer whole tin alloy solder, which is hardly affected by the heat dissipation condition of the welded object, the ambient temperature, the proficiency of operators, and the like, and the residues generated by the high temperature of the solder are hardly left, thus greatly improving the quality of the solder and reducing the control cost of the solder. Particularly, the electric energy of the existing solder in the hand dip soldering and wave soldering and the larger loss of solder which is required to be replaced due to the formation of tin slag due to oxidation and pollution of the solder are avoided;
4. the tin alloy solder powder can also be applied in a solder paste form in a Surface Mount Technology (SMT) of an electronic product, and the special electromagnetic wave heating equipment is utilized to rapidly heat and weld the tin alloy solder from inside to outside to finish the solder welding process, so that the problems of high energy consumption and large pollution to the atmosphere caused by adopting reflow soldering equipment (hot air heating equipment) to the existing tin alloy solder are avoided. In addition, the tin alloy solder of the invention does not need refrigeration to preserve the surface activity because of the internal and external integral synchronous heating and welding, thus reducing the production links and the quality problems generated by the links and the production cost and loss;
5. the tin alloy solder reduces the content of tin alloy and greatly reduces the cost of using soldering tin.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a single particle axis cross section of a 6-type tin alloy solder powder of the present invention;
fig. 2 is a schematic diagram of a single-particle axis single-layer atomic sequence structure of the 6-type tin alloy solder powder of the invention.
Detailed Description
All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.
Any feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. That is, each feature is one example only of a generic series of equivalent or similar features, unless expressly stated otherwise.
In the description of the present invention, it should be understood that the terms "one end," "the other end," "the outer side," "the upper," "the inner side," "the horizontal," "coaxial," "the center," "the end," "the length," "the outer end," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, in the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Terms such as "upper," "lower," and the like used herein to refer to a spatially relative position are used for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In the present invention, unless explicitly specified and limited otherwise, the terms "disposed," "coupled," "connected," "plugged," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
The invention relates to an electromagnetic hot-melting tin alloy solder, which comprises high-purity iron or other magnetic transition metals, some rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy.
In this embodiment, the mass percentage of the high-purity iron or other magnetic transition metal and the mass percentage of the rare earth metal or other magnetic synthetic material are 28-40%, and in particular, in this embodiment, the mass percentage of the high-purity iron is 28%.
The mass percentage of the high-purity copper or other high-conductivity metal materials and synthetic materials is 5-15%, and in particular, in the embodiment, the mass percentage of the high-purity copper is 5%.
The mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 10-22%, and in particular, in the embodiment, the mass percentage of the high-purity zinc is 10%.
Example 2
The invention relates to an electromagnetic hot-melting tin alloy solder, which comprises high-purity iron or other magnetic transition metals, some rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy.
In this embodiment, the mass percentage of the high-purity iron or other magnetic transition metal and the mass percentage of the rare earth metal or other magnetic synthetic material are 28-40%, and in particular, in this embodiment, the mass percentage of the high-purity iron is 38.8%.
The mass percentage of the high-purity copper or other high-conductivity metal materials and synthetic materials is 5-15%, and in particular, in the embodiment, the mass percentage of the high-purity copper is 8.73%.
The mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 10-22%, and in particular, in the embodiment, the mass percentage of the high-purity zinc is 17.68%.
The mass percentage in this embodiment is the optimal configuration.
Example 3
The invention relates to an electromagnetic hot-melting tin alloy solder, which comprises high-purity iron or other magnetic transition metals, some rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy.
In this embodiment, the mass percentage of the high-purity iron or other magnetic transition metal and the mass percentage of the rare earth metal or other magnetic synthetic material are 28-40%, and in particular, in this embodiment, the mass percentage of the high-purity iron is 40%.
The mass percentage of the high-purity copper or other high-conductivity metal materials and synthetic materials is 5-15%, and in particular, in the embodiment, the mass percentage of the high-purity copper is 15%.
The mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 10-22%, and in particular, the mass percentage of the high-purity zinc is 22% in the embodiment.
The invention relates to a preparation method of electromagnetic hot-melting tin alloy solder, taking iron, copper, zinc and tin alloy as examples, comprising the following steps: firstly, preparing iron with the purity of more than 99.5 percent by mass and 38.8 percent by mass, copper with the purity of more than 99.5 percent by mass and 8.73 percent by mass and zinc with the purity of more than 99.5 percent by mass and 17.68 percent by mass; secondly, preparing a proper amount of tin alloy; plating copper with a purity of more than 99.5% and a mass percentage of 8.73%, zinc with a purity of more than 99.5% and a mass percentage of 17.68 and a proper amount of tin alloy on the outer part of the high-purity iron in sequence; and fourthly, preparing the electromagnetic hot-melting tin alloy solder.
Taking 6-type tin alloy solder powder as an example, single particles are prepared by plating 128nm thick pure copper, 270nm thick pure zinc and 400nm thick tin alloy (various commercially available tin alloys such as SN63/PB37, SN42BI58, SN96.5CU0.5AG3.0 and SN99CU0.7AG0.3 are selected according to actual needs) in sequence by using pure iron spherical particles with diameters of about 4.14um, wherein the width of an iron atom is about 4.14um, the width of a copper atom is about 128nm, the width of a zinc atom is about 270nm and the width of a tin alloy atom is about 400nm.
The invention relates to an invention tin alloy solder powder, which contains a specific proportion of metal laminated material capable of being heated by a specific electromagnetic field. The special electromagnetic wave heating equipment is utilized to rapidly heat and weld the tin alloy solder from inside to outside to finish the soldering tin process, so that the quality of the soldering tin can be improved, the consumption of the tin alloy, the soldering flux and the electric energy can be greatly reduced, and in addition, the cleaning link after the soldering tin is finished can be reduced, thereby reducing the cost, reducing the pollution to the environment, and particularly avoiding the damage of high temperature to components and improving the service life of products. The solder material has the necessity of completely replacing the prior tin alloy solder.
The invention can utilize special electromagnetic wave heating equipment to rapidly heat and weld from inside to outside to finish the soldering process, and has the following advantages:
1. because the surface heating time is short and the probability of oxidation is small, the tin alloy solder can reduce the content of the soldering flux, so that harmful gas and residues generated after the soldering flux is at high temperature are reduced, and the risks of air pollution and PCB electric leakage are reduced;
2. the tin alloy solder powder can adopt a non-contact specific electromagnetic field heating soldering process, and does not need an electric heating body to directly contact with solder so as to avoid damage to static sensitive components caused by leakage of the electric heating body;
3. the invention uses special electromagnetic wave heating equipment to synchronously heat and weld the inner and outer whole tin alloy solder, which is hardly affected by the heat dissipation condition of the welded object, the ambient temperature, the proficiency of operators, and the like, and the residues generated by the high temperature of the solder are hardly left, thus greatly improving the quality of the solder and reducing the control cost of the solder. Particularly, the electric energy of the existing solder in the hand dip soldering and wave soldering and the larger loss of solder which is required to be replaced due to the formation of tin slag due to oxidation and pollution of the solder are avoided;
4. the tin alloy solder powder can also be applied in a solder paste form in a Surface Mount Technology (SMT) of an electronic product, and the special electromagnetic wave heating equipment is utilized to rapidly heat and weld the tin alloy solder from inside to outside to finish the solder welding process, so that the problems of high energy consumption and large pollution to the atmosphere caused by adopting reflow soldering equipment (hot air heating equipment) to the existing tin alloy solder are avoided. In addition, the tin alloy solder of the invention does not need refrigeration to preserve the surface activity because of the internal and external integral synchronous heating and welding, thus reducing the production links and the quality problems generated by the links and the production cost and loss;
5. the tin alloy solder reduces the content of tin alloy and greatly reduces the cost of using soldering tin.
The above description is merely a specific embodiment of the present invention, but is merely a preferred example of the present invention, and the scope of the present invention is not limited thereto. Any similar substitutes and modifications made by the principles of the invention as set forth in the claims are intended to be encompassed within the scope of the invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.
Claims (9)
1. An electromagnetic hot melt tin alloy solder, comprising:
high-purity iron or other magnetic transition metals and rare earth metals or other magnetic synthetic materials, high-purity copper or other high-conductivity metal materials and synthetic materials, high-purity zinc or other metal materials which are easy to form eutectic alloy with tin and tin alloy form electromagnetic hot-melting tin alloy solder, and the electromagnetic hot-melting tin alloy solder is a microparticle-shaped metal laminated material.
2. The electromagnetic hot melt tin alloy solder of claim 1, wherein: the mass percentage of the high-purity iron or other magnetic transition metals and rare earth metals or other magnetic synthetic materials is 28-40%.
3. The electromagnetic hot melt tin alloy solder of claim 2, wherein: the mass percentage of the high purity iron or other magnetic transition metals and some rare earth metals or other magnetic synthetic materials is 38.8%.
4. The electromagnetic hot melt tin alloy solder of claim 1, wherein: the mass percentage of the high-purity copper or other high-conductivity metal materials and the synthetic materials is 5-15%.
5. The electromagnetic hot melt tin alloy solder as set forth in claim 4, wherein: the mass percentage of the high-purity copper or other high-conductivity metal materials and the synthetic materials is 8.73 percent.
6. The electromagnetic hot melt tin alloy solder of claim 1, wherein: the mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 10-22%.
7. The electromagnetic hot melt tin alloy solder of claim 1, wherein: the mass percentage of the high-purity zinc or other metal materials which are easy to form eutectic alloy with tin is 17.68 percent.
8. A preparation method of electromagnetic hot-melting tin alloy solder is characterized in that: the method comprises the following steps:
s1, preparing iron with the purity of more than 99.5 percent by mass and 38.8 percent by mass, copper with the purity of more than 99.5 percent by mass and 8.73 percent by mass and zinc with the purity of more than 99.5 percent by mass and 17.68 percent by mass;
s2, preparing a proper amount of tin alloy;
s3, plating copper with the purity of more than 99.5 percent and the mass percent of 8.73 percent, zinc with the purity of more than 99.5 percent and 17.68 percent and a proper amount of tin alloy on the outer part of the high-purity iron in sequence;
s4, preparing the electromagnetic hot-melting tin alloy solder.
9. A method for soldering tin by using electromagnetic hot-melt tin alloy solder, which is characterized in that the electromagnetic hot-melt tin alloy solder according to any one of claims 1 to 8 is used, and a special electromagnetic wave heating device is used for rapid heating and welding from inside to outside to finish a soldering tin process.
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| CN202310459147.6A CN116441786A (en) | 2023-04-26 | 2023-04-26 | Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method |
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| CN202310459147.6A CN116441786A (en) | 2023-04-26 | 2023-04-26 | Electromagnetic hot-melting tin alloy solder, preparation method thereof and soldering method |
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