CN218586405U - Connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard - Google Patents
Connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard Download PDFInfo
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- CN218586405U CN218586405U CN202222947982.8U CN202222947982U CN218586405U CN 218586405 U CN218586405 U CN 218586405U CN 202222947982 U CN202222947982 U CN 202222947982U CN 218586405 U CN218586405 U CN 218586405U
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Abstract
The utility model is suitable for a liquid crystal handwriting pad technical field provides a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, including PCBA mainboard and diaphragm body, still include: the conductive block comprises two conductive block bodies, wherein the conductive block bodies are provided with salient points with bending elasticity; the PCBA main board is provided with a first groove-shaped welding spot and a second groove-shaped welding spot, and the first groove-shaped welding spot and the second groove-shaped welding spot are respectively fixedly welded with a conductive block body; the PCBA mainboard is provided with a first contact welding spot and a second contact welding spot. The application solves the problems of badness and loss caused by convenient production and maintenance; just the utility model discloses a connected mode is direct bayonet connected mode, can save the manual work for every line of production equipment, promotes production efficiency, and the straight rate connected mode of product is when production, and it is laborsaving to save labour, improves production efficiency to the damage of PCBA mainboard and diaphragm has also been reduced in the assembling process.
Description
Technical Field
The utility model belongs to the technical field of the liquid crystal handwriting pad, especially, relate to a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard.
Background
When a liquid crystal handwriting board is assembled on the market, the connection mode of the diaphragm and the PCBA mainboard is a spot welding mode by adopting a spot welder, and the working principle of the spot welder is as follows: when the welding device works, the two electrodes press the workpiece to enable the two layers of metal to form a certain contact resistance under the pressure of the two electrodes, instantaneous thermal welding is formed at the points of the two contact resistances when welding current flows from one electrode to the other electrode, and the welding current flows from the other electrode to the electrodes along the two workpieces to form a loop instantly.
According to principle and user result of use, spot welder spot welding butt fusion effect receives ambient temperature easily to influence, and the easy welding is insecure when the temperature is low, easily drops, causes customer's problem such as return of goods, in addition during the spot welding butt fusion, because the electric current makes workpiece surface explode easily when passing through two-layer metal of work piece in the twinkling of an eye, produces the physics burn to PCBA mainboard pad and diaphragm copper mesh, and welding current makes the components and parts damage scheduling problem on the PCBA mainboard easily.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, when aiming at solving spot welder welding diaphragm and PCBA mainboard, make the surface of workpiece explode to split and weld insecure problem under the low temperature environment easily.
The utility model discloses a realize like this, a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, including PCBA mainboard and diaphragm body, still include:
the conductive block comprises two conductive block bodies, wherein the conductive block bodies are provided with salient points with elasticity in bending;
the PCBA main board is provided with a first groove-shaped welding spot and a second groove-shaped welding spot, and the first groove-shaped welding spot and the second groove-shaped welding spot are respectively fixedly welded with a conductive block body;
a first contact welding point and a second contact welding point are arranged on the PCBA mainboard, and a pin clamping gap is formed between the elastic salient point of the bending belt and the first contact welding point and between the elastic salient point of the bending belt and the second contact welding point respectively;
the diaphragm body is provided with a first contact piece and a second contact piece, and the first contact piece is fixed between the convex point with elasticity and the first contact welding point in a plugging mode;
the second contact piece is fixed between the bending convex point with elasticity and the second contact welding point in a plugging mode.
According to a further technical scheme, two bending convex points with elasticity are arranged on the conductive block body.
According to a further technical scheme, the two conducting block bodies are attached to corresponding first groove-shaped welding spots and second groove-shaped welding spots on the PCBA mainboard through automatic mounting equipment.
According to a further technical scheme, the conducting block bodies are provided with pins, and the pins on the two conducting block bodies are fixedly connected with the first groove-shaped welding spots and the second groove-shaped welding spots respectively in a reflow soldering mode.
According to a further technical scheme, the conductive block body is made of a metal conductive material.
The embodiment of the utility model provides a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, this application has solved the welding insecure in spot welder spot welding connected mode, and is easy to come off, and the work piece surface bursts apart, PCBA mainboard component damage scheduling problem, has made things convenient for bad problem and loss that production maintenance produced; just the utility model discloses a connected mode is direct bayonet connected mode, can save the manual work for every line of production equipment, promotes production efficiency, and the straight rate connected mode of product is when production, and it is laborsaving to save labour, improves production efficiency to the damage of PCBA mainboard and diaphragm has also been reduced in the assembling process.
Drawings
Fig. 1 is a schematic structural diagram of a connection structure between a liquid crystal handwriting board membrane and a PCBA motherboard according to an embodiment of the present invention in a connection state;
fig. 2 is a schematic structural diagram that a connection structure of a liquid crystal handwriting pad membrane and a PCBA mainboard provided by an embodiment of the present invention is not in a connection state.
In the drawings: the printed circuit board comprises a conductive block body 10, a pin 11, a salient point 12 with bending elasticity, a PCBA mainboard 20, a first groove type welding spot 21, a second groove type welding spot 22, a first contact welding spot 23, a second contact welding spot 24, a diaphragm body 30, a first contact piece 31 and a second contact piece 32.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The following detailed description is provided for the specific embodiments of the present invention.
As shown in fig. 1 and fig. 2, for the utility model discloses a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard that embodiment provided, including PCBA mainboard 20 and diaphragm body 30, still include:
the conductive block comprises conductive block bodies 10, wherein two conductive block bodies 10 are arranged, and salient points 12 with bending elasticity are arranged on the conductive block bodies 10;
a first groove-shaped welding spot 21 and a second groove-shaped welding spot 22 are arranged on the PCBA mainboard 20, and the first groove-shaped welding spot 21 and the second groove-shaped welding spot 22 are respectively fixedly welded with a conductive block body 10;
a first contact welding point 23 and a second contact welding point 24 are arranged on the PCBA main board 20, and pin clamping gaps are formed between the bent elastic salient points 12 and the first contact welding point 23 and the second contact welding point 24 respectively;
the diaphragm body 30 is provided with a first contact piece 31 and a second contact piece 32, and the first contact piece 31 is fixed between the bending strip elastic salient point 12 and the first contact welding point 23 in an inserting and pulling mode;
the second contact piece 32 is fixed between the bent elastic bump 12 and the second contact pad 24 by means of insertion and extraction.
In the embodiment of the present invention, before the use, when the PCBA motherboard 20 is produced, the two conductive block bodies 10 are respectively and fixedly connected to the first groove-shaped welding spot 21 and the second groove-shaped welding spot 22, and the bent elastic bumps 12 on the two conductive block bodies 10 respectively form a pin clamping gap with the first contact welding spot 23 and the second contact welding spot 24; when a production and assembly handwriting board is produced and a production person needs to connect the diaphragm body 30 with the PCBA mainboard 20, the production person inserts the first contact piece 31 and the second contact piece 32 on the diaphragm body 30 into a pin clamping gap formed between the bending elastic bump 12 and the first contact welding point 23 and a pin clamping gap formed between the bending elastic bump 12 and the second contact welding point 24 respectively, the two bending elastic bumps 12 press the upper layers of the first contact piece 31 and the second contact piece 32 respectively, the first contact welding point 23 and the second contact welding point 24 press the lower layers of the first contact piece 31 and the second contact piece 32 respectively, the first contact piece 31 and the second contact piece 32 are clamped and fixed, namely, the circuit conduction between the first groove-shaped welding point 21 and the second groove-shaped welding point 22 of the PCBA mainboard 20 can be realized through the diaphragm body 30, and the first contact piece 31 and the second contact piece 32 on the diaphragm body 30 do not need to be welded with a copper mesh.
As shown in fig. 2, as a preferred embodiment of the present invention, two bumps 12 with elasticity are disposed on the conductive block body 10.
The embodiment of the utility model provides an in, the elastic bump 12 of bending tape possesses elasticity, sets up two elastic bumps 12 of bending tape, improves the stability of centre gripping.
As shown in fig. 2, as a preferred embodiment of the present invention, two of the conductive block bodies 10 are attached to the corresponding first groove-shaped solder joints 21 and second groove-shaped solder joints 22 on the PCBA motherboard 20 by an automatic mounting device.
As shown in fig. 2, as a preferred embodiment of the present invention, the conductive block body 10 is provided with pins 11, two of the pins 11 on the conductive block body 10 are all fixedly connected to the first groove-shaped solder joints 21 and the second groove-shaped solder joints 22 by reflow soldering.
As shown in fig. 1, as a preferred embodiment of the present invention, the conductive block body 10 is made of a metal conductive material.
The embodiment of the utility model provides a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, before using, when PCBA mainboard 20 produces, with two conducting block bodies 10 through automatic subsides dress equipment on corresponding first cell type welding spot 21 and second cell type welding spot 22 on PCBA mainboard 20, participate in 11 on two conducting block bodies 10 all through the mode of reflow soldering respectively with first cell type welding spot 21 and second cell type welding spot 22 fixed connection, bend elastic bump 12 in area on two conducting block bodies 10 forms the clamp foot clearance with first contact welding spot 23 and second contact welding spot 24 respectively; when a handwriting board is produced and assembled, and a production person needs to connect the diaphragm body 30 with the PCBA motherboard 20, the production person inserts the first contact piece 31 and the second contact piece 32 on the diaphragm body 30 into the space between the bending elastic bump 12 and the first contact pad 23 to form a pin clamping gap and the space between the bending elastic bump 12 and the second contact pad 24 to form a pin clamping gap, the two bending elastic bumps 12 press the upper layers of the first contact piece 31 and the second contact piece 32, the first contact pad 23 and the second contact pad 24 press the lower layers of the first contact piece 31 and the second contact piece 32, and the first contact piece 31 and the second contact piece 32 are clamped and fixed, that is, the diaphragm body 30 can be electrically connected with the first groove-shaped welding pad 21 and the second groove-shaped welding pad 22 of the PCBA motherboard 20.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The utility model provides a connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard, includes PCBA mainboard and diaphragm body, its characterized in that still includes:
the conductive block comprises two conductive block bodies, wherein the conductive block bodies are provided with salient points with elasticity in bending;
the PCBA main board is provided with a first groove-shaped welding spot and a second groove-shaped welding spot, and the first groove-shaped welding spot and the second groove-shaped welding spot are respectively fixedly welded with a conductive block body;
a first contact welding point and a second contact welding point are arranged on the PCBA main board, and pin clamping gaps are formed between the elastic salient points of the bending belts and the first contact welding point and between the elastic salient points of the bending belts and the second contact welding point respectively;
the diaphragm body is provided with a first contact piece and a second contact piece, and the first contact piece is fixed between the convex point with elasticity and the first contact welding point in a plugging mode;
the second contact piece is fixed between the bending convex point with elasticity and the second contact welding point in a plugging mode.
2. The connection structure of the liquid crystal writing pad membrane and the PCBA mainboard as recited in claim 1, wherein two bumps with elasticity are arranged on the conductive block body.
3. The structure of claim 2, wherein the two conductive bodies are attached to the PCBA via automatic mounting equipment at the first and second groove-shaped solder joints.
4. The connection structure of the liquid crystal handwriting board membrane and the PCBA main board as claimed in claim 2, wherein pins are arranged on the conductive block bodies, and the pins on the two conductive block bodies are respectively fixedly connected with the first groove-shaped welding spot and the second groove-shaped welding spot in a reflow soldering mode.
5. The connection structure of the liquid crystal handwriting board membrane and the PCBA mainboard of claim 1, wherein the conductive block body is made of a metal conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222947982.8U CN218586405U (en) | 2022-11-07 | 2022-11-07 | Connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222947982.8U CN218586405U (en) | 2022-11-07 | 2022-11-07 | Connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218586405U true CN218586405U (en) | 2023-03-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222947982.8U Active CN218586405U (en) | 2022-11-07 | 2022-11-07 | Connection structure of liquid crystal handwriting pad diaphragm and PCBA mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218586405U (en) |
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2022
- 2022-11-07 CN CN202222947982.8U patent/CN218586405U/en active Active
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