CN103311206A - Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device - Google Patents
Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device Download PDFInfo
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- CN103311206A CN103311206A CN2013101967968A CN201310196796A CN103311206A CN 103311206 A CN103311206 A CN 103311206A CN 2013101967968 A CN2013101967968 A CN 2013101967968A CN 201310196796 A CN201310196796 A CN 201310196796A CN 103311206 A CN103311206 A CN 103311206A
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- end ring
- weldering
- electronic device
- weldering end
- packaged
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Abstract
The invention is suitable for the technical field of electronic devices and discloses an electronic device encapsulated with a welding end ring and electronic equipment provided with the electronic device. The electronic device comprises a body and the welding end ring, wherein the welding end ring is sleeved on the outer periphery wall of the body and provided with a plane welding end, and the plane welding end is flush with or extrudes out of the outer periphery wall. The electronic equipment comprises a circuit board and the electronic device encapsulated with the welding end ring, wherein a welding pad is arranged on the circuit board, and the plane welding end of the electronic device is welded on the welding pad. According to the electronic device encapsulated with the welding end ring and the electronic equipment provided with the electronic device, as the plane welding end which is flush with or extrudes out of the body is arranged, when the plane welding end is welded on the circuit board, cracks are not easy to generate at a welding spot, stress concentration is reduced, the expandable path of the cracks also becomes larger, so that the electronic device and the electronic equipment do not easily lose efficacy and are high in reliability.
Description
Technical field
The invention belongs to technical field of electronic devices, relate in particular to a kind of electronic equipment that is packaged with the electronic device of weldering end ring and has this electronic device.
Background technology
Present electronic device, MELF packaging for example, its weldering end generally is cylindric, the weldering end is concordant with body, weldering end and PCB(Printed Circuit Board, printed circuit board (PCB)) pad be that line contacts, contact area is little.This class device of the prior art is welded on PCB when going up, and tin cream is less along the height that the weldering end climbs, and causes welding the tin amount of end seldom.Because body is pottery, the CTE(Coefficient of Thermal Expansion of itself and PCB, thermal coefficient of expansion) do not match, and weldering end tin amount seldom can not well play the unmatched effect that reduces CTE, therefore when long-time running, solder joint is easy to generate crackle, thereby can not reach the requirement of product long-term reliability.And weldering end place solder joint upper stress is prone to crackle greatly, but and the crackle extensions path little, be prone to early failure, product reliability is poor.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art, provide a kind of electronic equipment that is packaged with the electronic device of weldering end ring and has this electronic device, its reliability height.
On the one hand, as first kind of performance, the invention provides a kind of electronic device that is packaged with the weldering end ring, comprise body and weldering end ring, it is characterized in that, described weldering end ring is placed in the periphery wall of described body, and described weldering end ring has the face bonding end, and described face bonding is held level with both hands neat or protruded from the periphery wall of described body.
In conjunction with first kind of performance, as second kind of performance, described body is tubular, and described weldering end ring comprises the end weldering end ring at the two ends that are packaged in described body.
In conjunction with second kind of performance, as the third performance, described weldering end ring also comprises the middle part weldering end ring that is packaged in described body stage casing.
In conjunction with the third performance, as the 4th kind of performance, the face bonding end of the face bonding end of described middle part weldering end ring and described end weldering end ring is coplanar.
In conjunction with any performance in second to four, as the 5th kind of performance, described body is cylindric, and described weldering end ring is rectangular, and described body is inscribed within described weldering end ring.
In conjunction with any performance in second to four, as the 6th kind of performance, described body is cylindric, and described weldering end ring is annular, and the lower end of described weldering end ring forms the face bonding end or forms the face bonding end by increasing material by removing material.
In conjunction with any performance in second to four, as the 7th kind of performance, offer groove on the described face bonding end.
In conjunction with any performance in first to fourth, as the 8th kind of performance, described electronic device is gas discharge tube.
In conjunction with any performance in first to fourth, as the 9th kind of performance, described electronic device adopts weldering end ring end face bonding encapsulating structure.
Second aspect, the present invention also provides a kind of electronic equipment, comprises circuit board, and described circuit board is provided with pad, also comprises the above-mentioned electronic device that is packaged with the weldering end ring, and the face bonding end of described electronic device is welded on the described pad.
The electronic equipment that is packaged with the electronic device of weldering end ring and has this electronic device provided by the present invention, the face bonding end that it flushes in body or protrude from body by setting, when the face bonding end is welded in circuit board, the solder joint place is not easy to crack and has reduced in the application sets, even crackle occurs, because open ended tin cream amount is more, but the extensions path of crackle is also bigger, product also is not easy to lose efficacy the product reliability height.
Description of drawings
Fig. 1 is the front view that the rectangular and face bonding end of the weldering end ring that provides of the embodiment of the invention one flushes in the electronic device of body;
Fig. 2 is the left view of the electronic device among Fig. 1;
Fig. 3 is the front view that the rounded and face bonding end of the weldering end ring that provides of the embodiment of the invention one flushes in the electronic device of body;
Fig. 4 is the left view of the electronic device among Fig. 3;
Fig. 5 is the front view that the rectangular and face bonding end of the weldering end ring that provides of the embodiment of the invention one protrudes from the electronic device of body;
Fig. 6 is the left view of the electronic device among Fig. 5;
Fig. 7 is the front view that the rectangular and face bonding end of the weldering end ring that provides of the embodiment of the invention two flushes in the electronic device of body;
Fig. 8 is the left view of the electronic device among Fig. 7;
Fig. 9 is the front view that the rounded and face bonding end of the weldering end ring that provides of the embodiment of the invention two protrudes from the electronic device of body;
Figure 10 is the left view of the electronic device among Fig. 9;
Figure 11 is the front view that the rounded and face bonding end of the weldering end ring that provides of the embodiment of the invention two protrudes from the electronic device of body;
Figure 12 is the left view of the electronic device among Figure 11.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
A kind of electronic device that is packaged with the weldering end ring that the embodiment of the invention provides, comprise body and weldering end ring, described weldering end ring is placed in the periphery wall of described body, and described weldering end ring has the face bonding end, and described face bonding is held level with both hands neat or protruded from the periphery wall of described body.Like this, can make the pad of weldering end ring and PCB have bigger contact area, can hold more tin cream.The solder joint place is not easy to crack and reduced in the application sets, even crackle occurs, because the tin cream amount is more, but the extensions path of crackle is also just big, and product also is not easy to lose efficacy the product reliability height.
Embodiment one:
As depicted in figs. 1 and 2, a kind of electronic device 1 that is packaged with the weldering end ring that the embodiment of the invention provides comprises body 11 and weldering end ring 12, and body 11 can be made by insulating material such as pottery, plastic cement.Weldering end ring 12 is placed in the periphery wall of body 11, and weldering end ring 12 can be in the form of a ring.And weldering end ring 12 has face bonding end 101, and face bonding end 101 flushes in the periphery wall of body 11, and namely the end face of face bonding end 101 is concordant with the minimum point of body 11 periphery walls.The periphery wall of body 11 can be cylindrical, its horizontally set, and the end face of face bonding end 101 and columniform body 11 are tangent.The solder joint place is not easy to crack and reduced in the application sets, even crackle occurs, but the extensions path of crackle is big, and product also is not easy to lose efficacy the product reliability height.
Particularly, as depicted in figs. 1 and 2, body 11 can be tubular, cylindric or polygon tubular for example, weldering end ring 12 comprises the end weldering end ring 12 at the two ends that are packaged in body 11, and end weldering end ring 12 can be in the form of a ring, when specifically using, two end weldering end ring 12 can be placed in or be stuck in the two ends of body 11 respectively, again two electrodes are connected in body 11 or/and end weldering end ring 12.In addition, also can directly electroplate formation weldering end ring 12 at body 11.
In concrete the application, as depicted in figs. 1 and 2, body 11 is cylindric, and weldering end ring 12 is rectangular, and body 11 is inscribed within weldering end ring 12.Weldering end ring 12 bottoms are that face contacts with pad, and weldering end ring 12 can be square, and then weld end ring 12 and can be made as square ring-type and be enclosed within on the body 11 or Direct Electroplating formation weldering end ring 12 on body 11; As shown in Figure 3 and Figure 4, if weldering end ring 12 exceeds body 11, then weld end ring 12 and can be made as annular element and be enclosed within on the body 11, because weldering end ring 12 is bigger than body 11, weldering end ring 12 welding portions can be polished flat and form face bonding end 101; Certainly, also can be with weldering after end ring 12 be enclosed within on the body 11, produce the face bonding end 101 that exceeds body 11 by plating mode in weldering position, end.
Perhaps, as shown in Figure 3 and Figure 4, the periphery wall of body 11 can cylindrical and horizontally set, face bonding end 101 protrudes from the periphery wall of body 11, namely when face bonding end 101 is welded in the pad of PCB, there is the gap between the periphery wall of body 11 and the PCB, tin cream is bigger along the height that the weldering end climbs, can hold more tin cream, the solder joint place is not easy to crack and reduced in the application sets, even crackle occurs, because the tin cream amount is more, but the extensions path of crackle is also bigger, and product also is not easy to lose efficacy the product reliability height.
In concrete the application, as shown in Figure 3 and Figure 4, weldering end ring 12 also can be annular, and the lower end of weldering end ring 12 forms face bonding end 101 or forms face bonding end 101 by increasing material by removing material.The so-called material of removing namely refers to polish a plane by modes such as polishing, cuttings at circular weldering end ring 12.The so-called material that increases namely refers to form a plane by modes such as plating at circular weldering end ring 12.
In concrete the application, as shown in Figure 5 and Figure 6, the shape of body 11 can be set according to actual conditions, and the shape of weldering end ring 12 can be identical with the shape of body 11 or close.
Particularly, offer the groove (not shown) on the face bonding end 101, to hold more tin cream, be beneficial to the raising reliability of products.Alternatively, the cross section of groove can be " V " font, " U " font or semicircle etc.Groove can be provided with one or more, and when being provided with many grooves, each groove can be arranged in parallel, also can crisscrossly arrange.
In concrete the application, electronic device 1 can be gas discharge tube or anti-thunder tube etc.Electronic device 1 can be SMD(Surface Mounted Device, surface mounting component).
In concrete the application, electronic device 1 can adopt weldering end ring 12 end face bonding encapsulating structures, i.e. MELF(Metal Electrode Face Bonding, metal electrode end face bonding) encapsulation.
Present embodiment also provides the preparation method of above-mentioned electronic device 1, may further comprise the steps, and the weldering end ring 12 of preparation body 11 will weld end ring 12 and be placed in body 11.In welding ring being placed between the body 11 or at weldering end ring 12 plane face bonding end 101 being set afterwards, face bonding end 101 is concordant or protrude from the periphery wall of body 11, and end weldering end ring 12 can be packaged in body 11 by MELF.
The embodiment of the invention also provides a kind of electronic equipment, comprises circuit board, and circuit board is provided with pad, also comprises the above-mentioned electronic device 1 that is packaged with weldering end ring 12, and the face bonding end 101 of electronic device 1 is welded on the pad.
Embodiment two:
As shown in Figure 7 and Figure 8, on the basis of the electronic device 1 that is packaged with weldering end ring 12 that embodiment one provides, the electronic device 1 in the present embodiment, its weldering end ring 12 also comprise the middle part weldering end ring 12 that is packaged in body 11 stage casings.Middle part weldering end ring 12 can be provided with two or other suitable quantity, and weld between the end ring 12 all at a distance of arranging itself and two ends.Middle part weldering end ring 12 ends weldering end ring 12 can be packaged in body 11 by MELF.By setting up middle part weldering end ring 12, with respect to the electronic device 1 that has only two end weldering end ring 12, the stress that can effectively alleviate end, two ends weldering end ring 12 is concentrated, and stress is distributed to respectively welds on the end ring 12, is beneficial to the lifting reliability; Weldering end ring 12 is set to face with the way of contact of pad and contacts, the bottom that maybe will weld end ring 12 exceeds body 11, can make tin cream increase and increase the contact area of face bonding end 101 and circuit board at the volume of face bonding end 101, prolonged the path of crackle expansion, the stress that effectively absorbs two end pads is concentrated, thereby promotes reliability.
Particularly, as Fig. 9 and shown in Figure 10, weldering end ring 12 also can be annular, and the lower end of weldering end ring 12 forms face bonding end 101 or forms face bonding end 101 by increasing material by removing material.The so-called material of removing namely refers to polish a plane by modes such as polishing, cuttings at circular weldering end ring 12.The so-called material that increases namely refers to form a plane by modes such as plating at circular weldering end ring 12.
Particularly, the face bonding end 101 of middle part weldering end ring 12 is coplanar with the face bonding end 101 of end weldering end ring 12, so that the face bonding end 101 of the face bonding end 101 that the middle part is welded end ring 12 and end weldering end ring 12 all is welded on the pad of PCB, promote the welding spot reliability of MELF encapsulation.
As Fig. 9 and shown in Figure 10, the lower end of weldering end ring 12 can form face bonding end 101 or form face bonding end 101 by increasing material by removing material.The so-called material of removing namely refers to polish a plane and guarantee that face bonding end 101 protrudes from body 11 at circular weldering end ring 12 by modes such as polishing, cuttings.The so-called material that increases namely refers to form a plane by modes such as plating at circular weldering end ring 12.
In concrete the application, as Figure 11 and shown in Figure 12, body 11 is cylindric, and weldering end ring 12 is rectangular, and body 11 is inscribed within weldering end ring 12.Weldering end ring 12 bottoms are that face contacts with pad, and weldering end ring 12 can be square, and then weld end ring 12 and can be made as square ring-type and be enclosed within on the body 11 or Direct Electroplating formation weldering end ring 12 on body 11; If weldering end ring 12 exceeds body 11, then welding end ring 12 can be made as annular element and be enclosed within on the body 11, because weldering end ring 12 is bigger than body 11, weldering end ring 12 welding portions can be polished flat forms face bonding end 101 and guarantees that face bonding end 101 protrudes from body 11; Certainly, also can be with weldering after end ring 12 be enclosed within on the body 11, produce the face bonding end 101 that protrudes body 11 by plating mode in weldering position, end.
The embodiment of the invention also provides a kind of electronic equipment, comprises circuit board, and circuit board is provided with pad, also comprises the above-mentioned electronic device 1 that is packaged with weldering end ring 12, and the face bonding end 101 of electronic device 1 is welded on the pad.
Below only be preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace or improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. an electronic device that is packaged with the weldering end ring comprises body and weldering end ring, it is characterized in that described weldering end ring is placed in the periphery wall of described body, and described weldering end ring has the face bonding end, and described face bonding is held level with both hands neat or protruded from the periphery wall of described body.
2. the electronic device that is packaged with the weldering end ring as claimed in claim 1 is characterized in that described body is tubular, and described weldering end ring comprises the end weldering end ring at the two ends that are packaged in described body.
3. the electronic device that is packaged with the weldering end ring as claimed in claim 2 is characterized in that, described weldering end ring also comprises the middle part weldering end ring that is packaged in described body stage casing.
4. the electronic device that is packaged with the weldering end ring as claimed in claim 3 is characterized in that, the face bonding end of the face bonding end of described middle part weldering end ring and described end weldering end ring is coplanar.
5. as claim 2 or the 3 or 4 described electronic devices that are packaged with the weldering end ring, it is characterized in that described body is cylindric, described weldering end ring is rectangular, and described body is inscribed within described weldering end ring.
6. as claim 2 or the 3 or 4 described electronic devices that are packaged with the weldering end ring, it is characterized in that, described body is cylindric, and described weldering end ring is annular, and the lower end of described weldering end ring forms the face bonding end or forms the face bonding end by increasing material by removing material.
7. as claim 2 or the 3 or 4 described electronic devices that are packaged with the weldering end ring, it is characterized in that, offer groove on the described face bonding end.
8. as each described electronic device that is packaged with the weldering end ring in the claim 1 to 4, it is characterized in that described electronic device is gas discharge tube.
9. as each described electronic device that is packaged with the weldering end ring in the claim 1 to 4, it is characterized in that described electronic device adopts weldering end ring end face bonding encapsulating structure.
10. an electronic equipment comprises circuit board, and described circuit board is provided with pad, it is characterized in that, comprises that also the face bonding end of described electronic device is welded on the described pad as each described electronic device that is packaged with the weldering end ring in the claim 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310196796.8A CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
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CN201310196796.8A CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
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CN103311206A true CN103311206A (en) | 2013-09-18 |
CN103311206B CN103311206B (en) | 2016-04-13 |
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CN201310196796.8A Active CN103311206B (en) | 2013-05-23 | 2013-05-23 | Be packaged with the electronic device of welding end ring and there is the electronic equipment of this electronic device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018120449A1 (en) * | 2016-12-26 | 2018-07-05 | 华为技术有限公司 | Welding end structure and component |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992016305A1 (en) * | 1991-03-19 | 1992-10-01 | Georg Sillner | Melf varnishing machine |
US20060104007A1 (en) * | 2004-03-02 | 2006-05-18 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
CN101616544A (en) * | 2009-08-12 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of PCB assembly and implementation method |
CN202042476U (en) * | 2011-05-16 | 2011-11-16 | 济南晶恒电子有限责任公司 | Device packaging structure |
CN202474046U (en) * | 2011-12-16 | 2012-10-03 | 周均 | Lithium-ion power battery for leading out cylindrical guide pins in same direction and sealed in girdling way |
-
2013
- 2013-05-23 CN CN201310196796.8A patent/CN103311206B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992016305A1 (en) * | 1991-03-19 | 1992-10-01 | Georg Sillner | Melf varnishing machine |
US20060104007A1 (en) * | 2004-03-02 | 2006-05-18 | Vishay Sprague, Inc. | Surface mount MELF capacitor |
CN101616544A (en) * | 2009-08-12 | 2009-12-30 | 杭州华三通信技术有限公司 | A kind of PCB assembly and implementation method |
CN202042476U (en) * | 2011-05-16 | 2011-11-16 | 济南晶恒电子有限责任公司 | Device packaging structure |
CN202474046U (en) * | 2011-12-16 | 2012-10-03 | 周均 | Lithium-ion power battery for leading out cylindrical guide pins in same direction and sealed in girdling way |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018120449A1 (en) * | 2016-12-26 | 2018-07-05 | 华为技术有限公司 | Welding end structure and component |
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CN103311206B (en) | 2016-04-13 |
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