WO2018120449A1

WO2018120449A1 - Welding end structure and component

Info

Publication number: WO2018120449A1
Application number: PCT/CN2017/077386
Authority: WO
Inventors: 刘立平; 易源; 谷日辉
Original assignee: 华为技术有限公司
Priority date: 2016-12-26
Filing date: 2017-03-20
Publication date: 2018-07-05
Also published as: CN108604581B; CN108604581A

Abstract

A welding end structure (100) and a component (02). A problem in the existing technology is solved, wherein an inner layer material is easily exposed at a corner between an external surface of a side portion terminal (011) and a lower surface of a bottom portion terminal (012) when a lead wire (022) is welded on a welding end structure (01). The welding end structure comprises the side portion terminal (1), which extends in the longitudinal direction, and the bottom portion terminal (2), which is formed by bending at a lower end of the side portion terminal and extending in the latitudinal direction; the side portion terminal is used for attaching and fixing to a sidewall of a component to be mounted, while the bottom portion terminal is used for attaching and fixing to a bottom wall of the component to be mounted; a groove (3) is opened or a protrusion (4) is formed at an area which is on a lower surface of the bottom portion terminal and which is used for welding and fixing a lead wire (201) of the component to be mounted, the lead wire of the component to be mounted being welded and fixed at a bottom surface of the groove or on a top surface of the protrusion. The present invention is used for surface mounting electronic components.

Description

Welding end structure and components

This application claims the priority of the Chinese Patent Application filed on Dec. 26, 2016, the Chinese Patent Application No. 201611219942.4, entitled "A Device Pin and Device Using the Device Pin", the entire contents of which are hereby incorporated by reference. The citations are incorporated herein by reference.

Technical field

The present application relates to the field of electronic device technologies, and in particular, to a solder joint structure and components.

Background technique

At present, Surface Mounted Technology (SMT) is able to directly attach or solder components to the surface of printed boards without drilling the insertion holes on the printed board. A popular technology and process. In order to solder the components to the printed board, pads are placed on the printed board, and soldered ends are placed on the components. By soldering the soldered ends to the pads, the components can be soldered to the printed board. On the board.

For example, FIG. 1 is a welding end structure in the prior art. Referring to FIG. 1, the welding end structure 01 includes a side terminal 011 extending in the longitudinal direction and a lower end extending from the side terminal 011 and extending in the lateral direction. Bottom terminal 012. 2 is a schematic structural view of a component 02 with a soldering end structure 01. Referring to FIG. 2, the component 02 includes a component body 021 and a soldering end structure 01, and a side terminal 011 and a component body 021 in the soldering end structure 01. The side wall is fixedly bonded, and the bottom terminal 012 of the soldering end structure 01 is fixedly bonded to the bottom wall of the component body 021, and the lead 022 of the component body 021 is soldered and fixed to the lower surface of the bottom terminal 012. 3 is a schematic structural view of the component 02 after being fixed on the printed board 03. Referring to FIG. 3, the printed board 03 is provided with a pad 031, and the bottom terminal 012 and the part of the pad 031 in the soldering end structure 01. In the area bonding, the side terminal 011 in the soldering end structure 01 and the other partial area on the pad 031 form a right-angled area 04, and by melting the solder in the right-angled area 04, the molten tin can be infiltrated and transferred in the lateral direction. The tin plating of the lower surface of the bottom terminal 012 is melted and the bottom terminal 012 and the pad 031 are fixed, and the molten tin is infiltrated and transferred in the longitudinal direction to melt the tin plating on the outer surface of the side terminal 011, and the side terminal 011 is externally The tin plating on the surface is integrated with the molten tin in the right angle region, and the component 02 can be firmly fixed to the printed board 03 after the tin is cooled.

However, since the solder joint structure 01 is in the bending forming process, the tin plating at the corner between the outer surface of the side terminal 011 and the lower surface of the bottom terminal 012 (see the position A in FIG. 2) is easily torn by stretching. When the lead 022 is soldered on the lower surface of the bottom terminal 012 (see the position of B in FIG. 2), the tin plating on the lower surface of the bottom terminal 012 is partially melted and shrunk, so that the outer surface of the side terminal 011 is The inner layer material is exposed at a corner between the lower surface of the bottom terminal 012. The inner layer material is usually a copper substrate or a nickel plating layer. The copper and nickel are easily oxidized in the air, and the solder joint structure 01 is bonded to the component. The heating and baking process after the body 021 further exacerbates the oxidation of copper and nickel, and the oxide layer formed by the oxidation will prevent the molten tin in the right-angled region 04 from penetrating in the lateral direction and the longitudinal direction, resulting in the solder in the right-angled region not being able to be bonded to the welded end structure. 01 is effectively fixed, which reduces the reliability of welding.

Summary of the invention

Embodiments of the present application provide a solder tail structure and a component capable of preventing an outer surface and a bottom end of a side terminal The inner layer material is exposed at the corner between the lower surface of the sub-surface, so that the solder in the right-angled region can penetrate smoothly in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welded end structure.

To achieve the above objective, the embodiment of the present application adopts the following technical solutions:

In a first aspect, the present application provides a solder tail structure including a side terminal extending in a longitudinal direction and a bottom terminal bent from a lower end of the side terminal and extending in a lateral direction, the side terminal being used for The side wall of the mounting component is fixedly attached to the bottom wall of the component to be mounted, and the bottom surface of the bottom terminal is used for soldering and fixing the to-be-mounted The lead wire of the component is provided with a groove or a protrusion, and the lead wire of the component to be mounted is soldered to the bottom surface of the groove or the top surface of the protrusion.

The soldering end structure provided by the embodiment of the present application fixes and fixes the side terminal in the soldering end structure to the side wall of the component to be mounted, and fixes the bottom terminal in the soldering end structure to be mounted. After the bottom wall of the component, the lead wire of the component to be mounted is soldered and fixed to the bottom surface of the groove on the lower surface of the bottom terminal or the top surface of the protrusion, and the surface of the lead is soldered or recessed. The lower surface of the bottom terminal, thus extending the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the wire bonding position, thereby reducing the outer surface and the bottom terminal of the side terminal during wire bonding The corner position between the lower surfaces has the possibility of influence. On the other hand, the groove and the projection are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the bottom surface of the protrusion and the lower surface of the bottom terminal must have a corner. When bending or stamping the corner, it is also easy to cause the tinned tensile tear at the corner to form a tin-plated fault, so that when the lead is welded on the bottom surface of the groove or the convex top surface, the fusion The rear tin will stop out-diffusion at this fault, further reducing the possibility of affecting the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal during wire bonding, reducing the outside of the side terminal The possibility of exposing the inner layer material at the corner between the surface and the lower surface of the bottom terminal enables the solder in the right angle region to smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welded end structure.

In conjunction with the first aspect, in a first possible implementation of the first aspect, the bottom surface of the recess is a flat surface. In this way, the soldering operation of the leads of the components to be mounted on the bottom surface of the recess is facilitated.

In conjunction with the first aspect, in a second possible implementation of the first aspect, the top surface of the protrusion is planar. In this way, the soldering operation of the lead of the component to be mounted on the top surface of the bump is facilitated.

In conjunction with the first aspect, in a third possible implementation of the first aspect, the protrusion protrudes from a lower surface of the bottom terminal by a height of less than 0.1 mm. Thus, when the component with the solder tail structure of the present application is soldered to the printed board, the molten solder formed in the right angle region between the side terminal and the pad can be smoothly infiltrated in the lateral direction and the longitudinal direction.

In conjunction with the first aspect, in a fourth possible implementation of the first aspect, the groove has a depth of 0.5 to 0.8 mm. Thus, the depth of the groove is suitable, and the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the welding position of the wire can be effectively extended, and the opening depth of the groove can be avoided. The strength of the welded end structure is reduced.

In conjunction with the first aspect, in a fifth possible implementation of the first aspect, the groove or the protrusion has a width of 0.8 to 1.0 mm along an extending direction of the bottom terminal. Thus, the width of the groove or the projection is suitable to satisfy the need for the welding area of the wire bonding operation and to prevent unnecessary waste due to the excessive width of the groove or the projection.

In conjunction with the first aspect, in a sixth possible implementation manner of the first aspect, the groove extends through the opposite sidewalls of the bottom terminal in a direction perpendicular to the extending path of the bottom terminal, and Groove away One end of the side terminal penetrates an end surface of the bottom terminal away from the side terminal along an extending direction of the bottom terminal. In this way, the wire bonding operation space in the groove is increased, and the welding operation on the smaller-sized welding end structure is facilitated.

In conjunction with the first aspect, in a seventh possible implementation of the first aspect, the welded end structure is integrally formed by a press forming method. One-piece molding, simple molding process, short time-consuming and high efficiency.

In a second aspect, the present application provides a component including a component body and a soldering end structure according to any one of the above aspects, wherein a side terminal of the soldering end structure is adhered to a sidewall of the component body Fixing, the bottom terminal of the soldering end structure is closely fixed to the bottom wall of the component body, and the lead wire of the component body is soldered and fixed to the bottom surface of the groove or the top surface of the convex surface of the soldering end structure on.

The component provided in the embodiment of the present invention, when the lead wire on the component body is soldered and fixed on the bottom surface of the groove or the top surface of the protrusion on the lower surface of the bottom terminal, the surface of the lead is soldered or recessed. On the lower surface of the bottom terminal, thus, on the one hand, the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the position of the wire bonding is extended, thereby reducing the outer surface and the bottom of the side terminal when the wire is soldered. The position of the corner between the lower surfaces of the terminals has the possibility of influence. On the other hand, grooves and projections are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the top surface of the protrusion and the lower surface of the bottom terminal are necessarily present. The corner, when bending or stamping the corner, is also prone to lead-stretching and tearing at the corner, thereby forming a tin-plated fault, so that when the lead is welded on the bottom surface of the groove or the convex top surface, the melting The rear tin will stop out-diffusion at this fault, further reducing the influence of the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal during wire bonding. The possibility is that the possibility of exposing the inner layer material at the corner between the outer surface of the side terminal and the lower surface of the bottom terminal is reduced, so that the solder in the right angle region can smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding of the welding end structure. reliability.

In conjunction with the second aspect, in a first possible implementation of the second aspect, the lead of the component body is soldered to a bottom surface of the recess or a top surface of the protrusion by a hot-melt soldering process on. By soldering in the hot-melt soldering process, the solder joint size between the lead and the bottom surface of the recess or the top surface of the bump can be reduced, and the weight of the component can be reduced.

DRAWINGS

The drawings used in the examples or the description of the prior art are briefly described below.

1 is a schematic structural view of a prior art welding end structure;

2 is a schematic structural view of a component having the solder terminal structure shown in FIG. 1;

3 is a schematic structural view of the component shown in FIG. 2 after being mounted on a printed board;

4(a) is a schematic view showing the first structure of the welded end structure provided by the embodiment of the present application;

4(b) is a second schematic structural view of a solder joint structure according to an embodiment of the present application;

FIG. 5( a ) is a first structural schematic view of a groove in a welded end structure according to an embodiment of the present application;

FIG. 5(b) is a second schematic structural view of a groove in a welded end structure according to an embodiment of the present application;

FIG. 5(c) is a third structural schematic view of a groove in a welded end structure according to an embodiment of the present application;

FIG. 5( d ) is a fourth structural schematic view of a groove in a welded end structure provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of components provided by an embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship of the indications of the "in", "in", "outside" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present application and the simplified description, and does not indicate or imply the indicated device or The elements must have a particular orientation, are constructed and operated in a particular orientation, and are therefore not to be construed as limiting.

In the description of the present application, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined. Connections, or integral connections; the specific meanings of the above terms in this application can be understood by one of ordinary skill in the art.

4(a) and 4(b), FIG. 4(a) and FIG. 4(b) are two specific embodiments of the welded end structure of the embodiment of the present application. The welded end structure 100 of the present embodiment includes a longitudinal direction. An extended side terminal 1 and a bottom terminal 2 bent from a lower end of the side terminal 1 and extending in a lateral direction, the side terminal 1 being used for attaching and fixing to a side wall of a component to be mounted, The bottom terminal 2 is for fixing and fixing to the bottom wall of the component to be mounted, and the lower surface of the bottom terminal 2 is provided with a groove in a region for soldering and fixing the lead of the component to be mounted. 3 (see FIG. 4(a)) or formed with a protrusion 4 (see FIG. 4(b)), the lead wire of the component to be mounted is soldered to the bottom surface of the groove 3 or the The top surface of the projection 4.

The soldering end structure 100 provided in the embodiment of the present application is configured to attach and fix the side terminal 1 of the soldering end structure 100 to the sidewall of the component to be mounted, and to fit the bottom terminal 2 of the soldering end structure 100. After being fixed on the bottom wall of the component to be mounted, the lead wire of the component to be mounted can be soldered and fixed to the bottom surface of the recess 3 on the lower surface of the bottom terminal 2 or the top surface of the bump 4, and the lead wire is soldered. The surface is convexly or concavely disposed on the lower surface of the bottom terminal 2, thus extending the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 (see the position A in FIG. 4) and the wire bonding position. (See the position B in Fig. 4), thereby reducing the influence of the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 (see the position A in Fig. 4) during wire bonding. Possibly, on the other hand, the groove 3 and the projection 4 are provided on the lower surface of the bottom terminal 2, and the bottom surface of the groove 3 or the top surface of the projection 4 and the lower surface of the bottom terminal 2 necessarily have a corner, which is bent Or when stamping this corner, it is also easy to cause tinned tensile tear at the corner. , thereby forming a tin-plated fault, such that when the lead is soldered on the bottom surface of the recess 3 or the top surface of the bump 4, the molten tin will stop diffusing outward at the fault, thereby further reducing the soldering of the lead wire. The position of the corner between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 has an influence, and the possibility of exposing the inner layer material at the corner between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 is reduced. The solder in the right angle region can be smoothly infiltrated in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welding end structure 100.

In the above embodiment, the bottom surface of the recess 3 may be a curved surface as shown in FIG. 5(c), a plane as shown in FIGS. 5(a) and 5(b) or as shown in FIG. 5(d). The tapered surface and the like are not specifically limited herein, and the top surface of the protrusion 4 may also be a curved surface or a flat surface, etc., and is not specifically limited herein.

It should be noted that, for convenience of description, the lower surface of the bottom terminal 2 should not include the side surface and the bottom surface of the groove 3, nor the side surface and the top surface of the boss.

Optionally, referring to FIG. 5( a ) and FIG. 5( b ), the bottom surface of the groove 3 is a plane. Thus, the soldering operation of the leads of the component to be mounted on the bottom surface of the recess 3 can be facilitated.

Optionally, referring to FIG. 4(b), the top surface of the protrusion 4 is a plane. Thus, the soldering operation of the leads of the component to be mounted on the top surface of the bump 4 can be facilitated.

Optionally, referring to FIG. 4(b), the height of the lower surface of the protrusion 4 protruding from the bottom terminal 2 is less than 0.1 mm. Thus, when the component with the solder termination structure 100 of the present application is soldered to the printed board, the molten solder formed in the right angle region between the side terminal 1 and the pad can be smoothly penetrated in the lateral and longitudinal directions. . If the height of the lower surface of the protrusion 4 protruding from the bottom terminal 2 is greater than or equal to 0.1 mm, when the component with the solder terminal structure 100 of the present application is soldered to the printed board, the bottom of the protrusion 4 is easily protruded. The height of the lower surface of the terminal 2 is higher than the height of the molten solder in the right-angled region, so that the molten solder cannot penetrate upward along the outer surface of the side terminal 1, and at the same time, the distance between the lower surface of the bottom terminal 2 and the pad is raised. 4 The pad is at least 0.1 mm high, and therefore, the molten solder cannot fix the bottom terminal 2 and the pad together when it penetrates in the lateral direction.

Alternatively, the depth of the groove 3 shown in FIG. 5(a) or FIG. 5(b) is 0.5 to 0.8 mm. Thus, the depth of the groove 3 is suitable, and the distance between the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 and the wire bonding position can be effectively extended, and the depth of the groove 3 can be avoided. Larger results in a lower strength of the welded end structure 100. When the depth of the groove 3 is less than 0.5 mm, the depth of the groove 3 is small, and the distance between the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 and the wire bonding position is small, and the welding is small. The lead position still easily affects the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2; when the depth of the groove 3 is greater than 0.8 mm, the depth of the groove 3 is large, and the bottom terminal 2 is soldered Part of the structural strength is low.

Alternatively, the width of the groove 3 or the protrusion 4 is 0.8 to 1.0 mm along the extending direction of the bottom terminal 2. Thus, the width of the recess 3 or the projection 4 is suitable to satisfy the demand for the welding area of the wire bonding operation, and to prevent unnecessary waste due to the excessive width of the groove 3 or the projection 4. When the width of the groove 3 or the protrusion 4 is less than 0.8 mm, the width of the groove 3 or the protrusion 4 is too small to satisfy the requirement of the welding area for the wire bonding operation, when the width of the groove 3 or the protrusion 4 is When it is larger than 1.0 mm, the width of the groove 3 is too large, which causes unnecessary waste, and the material cost of the welded end structure 100 is high.

Optionally, referring to FIG. 5( b ), the groove 3 penetrates the opposite side walls of the bottom terminal 2 in a direction perpendicular to the extending path of the bottom terminal 2 , and the groove 3 is away from the end of the side terminal 1 . An end surface of the bottom terminal 2 that extends away from the side terminal 1 is extended along the extending direction of the bottom terminal 2. Thus, the wire bonding operation space in the recess 3 is increased, facilitating the soldering operation on the smaller-sized solder joint structure 100.

Optionally, the welded end structure 100 is integrally formed by a press forming method. One-piece molding, simple molding process, short time-consuming and high efficiency.

Referring to FIG. 6 , the present application further provides a component, including a component body 200 and a soldering end structure 100 according to any of the above aspects, a side terminal in the soldering end structure 100 and the component body. The bottom end of the soldering end structure 100 is fixed to the bottom wall of the component body 200, and the lead 201 of the component body 200 is soldered and fixed to the soldering end structure 100. The bottom surface of the groove or the top surface of the protrusion.

The component provided in the embodiment of the present invention, when the lead 201 on the component body 200 is soldered and fixed on the bottom surface of the recess or the top surface of the recess on the lower surface of the bottom terminal, the surface soldered by the lead 201 protrudes. Or the recess is disposed on the lower surface of the bottom terminal, thereby extending the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the soldering position of the lead 201 on the one hand, thereby reducing the side of the lead 201 when soldering Terminal The corner position between the outer surface and the lower surface of the bottom terminal has an influence possibility. On the other hand, a groove and a protrusion are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the top surface of the protrusion and the lower surface of the bottom terminal There must be a corner between them. When bending or stamping the corner, it is also easy to cause the tinned tensile tear at the corner to form a tin-plated fault, so that the bottom surface of the groove or the top surface of the protrusion is welded. When the lead 201 is used, the molten tin will stop the outward diffusion at the fault, thereby further reducing the possibility of affecting the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal when the lead 201 is soldered. The possibility of exposing the inner layer material at the corner between the outer surface of the side terminal and the lower surface of the bottom terminal is small, so that the solder in the right angle region can smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welding end structure 100.

Optionally, the lead 201 of the component body 200 is soldered and fixed to the bottom surface of the groove or the top surface of the protrusion by a hot-melt soldering process. By soldering by the hot-melt soldering process, the solder joint size between the lead 201 and the bottom surface of the recess or the top surface of the bump can be reduced, and the weight of the component can be reduced.

In the description of the specification, specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that the above embodiments are only used to explain the technical solutions of the present application, and are not limited thereto; although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still The technical solutions described in the foregoing embodiments are modified, or the equivalents of the technical features are replaced by the equivalents. The modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

A solder end structure comprising a side terminal extending in a longitudinal direction and a bottom terminal bent from a lower end of the side terminal and extending in a lateral direction, the side terminal being used for a side wall of a component to be mounted The bottom terminal is for fixing and fixing to the bottom wall of the component to be mounted, and the lower surface of the bottom terminal is used for soldering and fixing the component to be mounted. The lead wire is provided with a groove or a protrusion formed thereon, and the lead wire of the component to be mounted is soldered to the bottom surface of the groove or the top surface of the protrusion.
The welded end structure of claim 1 wherein the bottom surface of the recess is planar.
The welded end structure of claim 1 wherein the top surface of the projection is planar.
The solder tail structure according to claim 1, wherein said protrusion protrudes from a lower surface of said bottom terminal to a height of less than 0.1 mm.
The welded end structure according to claim 1, wherein the groove has a depth of 0.5 to 0.8 mm.
The solder tail structure according to claim 1, wherein the groove or the protrusion has a width of 0.8 to 1.0 mm along an extending direction of the bottom terminal.
The solder tail structure according to claim 1, wherein the groove penetrates through opposite side walls of the bottom terminal in a direction perpendicular to an extending path of the bottom terminal, and the groove is away from One end of the side terminal penetrates an end surface of the bottom terminal away from the side terminal along an extending direction of the bottom terminal.
The welded end structure according to claim 1, wherein the welded end structure is integrally formed by a press forming method.
A component, comprising: a component body; and the soldering end structure according to any one of claims 1 to 8, wherein a side terminal of the soldering end structure and a sidewall of the component body are attached Fixing, the bottom terminal of the soldering end structure is closely fixed to the bottom wall of the component body, and the lead wire of the component body is soldered and fixed to the bottom surface of the groove or the top of the protrusion in the soldering end structure On the surface.
The component according to claim 9, wherein the lead of the component body is soldered to the bottom surface of the recess or the top surface of the bump by a hot press soldering process.