JP6025594B2 - Terminal positioning jig - Google Patents

Terminal positioning jig Download PDF

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JP6025594B2
JP6025594B2 JP2013026949A JP2013026949A JP6025594B2 JP 6025594 B2 JP6025594 B2 JP 6025594B2 JP 2013026949 A JP2013026949 A JP 2013026949A JP 2013026949 A JP2013026949 A JP 2013026949A JP 6025594 B2 JP6025594 B2 JP 6025594B2
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terminal
divided body
opening
holding jig
substrate
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JP2014157880A (en
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徹 引頭
徹 引頭
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Shindengen Electric Manufacturing Co Ltd
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本発明は、端子を基板に取り付ける際に用いる端子位置決め保持治具に関する。   The present invention relates to a terminal positioning holding jig used when a terminal is attached to a substrate.

例えば回路基板の一面に、平板状の端子を取り付ける工程では、回路基板の一面に対して端子を垂直に位置決め保持する端子位置決め保持治具を用いて、回路基板と端子とをリフローによって接合している。一例として、特許文献１には、リフローはんだ付け方法が記載されている。こうした端子は、例えば、先端部分に貫通孔が形成され、この貫通孔を含む領域が、外部のコネクタ等に接続される際の嵌合部分（以下、嵌合部と称することがある）とされている。   For example, in the step of attaching a flat terminal to one surface of the circuit board, the circuit board and the terminal are joined by reflow using a terminal positioning holding jig that positions and holds the terminal vertically with respect to the one surface of the circuit board. Yes. As an example, Patent Document 1 describes a reflow soldering method. For example, such a terminal has a through-hole formed at the tip, and a region including the through-hole is a fitting portion (hereinafter sometimes referred to as a fitting portion) when connected to an external connector or the like. ing.

特開平４−２５７２９４号公報JP-A-4-257294

近年、はんだは環境問題などの観点から鉛を含まない、いわゆる鉛フリーはんだを使用することが多くなっている。鉛フリーはんだは、融点を低下させる鉛を含まないため、鉛を含有するはんだと比較して融点が高いという特性がある。一方、端子を覆うスズの融点は、鉛はんだよりは高く、かつ鉛フリーはんだよりは低い。このため、従来のように鉛はんだを用いてスズめっきが施されている端子を回路基板に接続する場合、リフロー炉内で鉛はんだを融点まで加熱しても端子を覆うスズが溶融することはなかった。しかしながら、鉛フリーはんだを用いる場合、端子の嵌合部が溶融熱に直接当たると、端子の表面を覆うスズが溶融し、冷却後、嵌合部にスズが凝集してしまう懸念があった。これにより、端子をコネクタ等に接続した際に、接触抵抗の増加や導通不良などの不具合を生じさせる懸念がある。   In recent years, so-called lead-free solder that does not contain lead is often used from the viewpoint of environmental problems. Since lead-free solder does not contain lead that lowers the melting point, it has a characteristic that the melting point is higher than that of solder containing lead. On the other hand, the melting point of tin covering the terminals is higher than that of lead solder and lower than that of lead-free solder. For this reason, when connecting a tin-plated terminal to the circuit board using lead solder as in the past, even if the lead solder is heated to the melting point in a reflow furnace, the tin covering the terminal will melt. There wasn't. However, when lead-free solder is used, if the fitting portion of the terminal directly contacts the heat of fusion, tin covering the surface of the terminal is melted, and after cooling, there is a concern that tin aggregates in the fitting portion. Thereby, when connecting a terminal to a connector etc., there exists a possibility of producing malfunctions, such as an increase in contact resistance and a conduction defect.

本発明は上記課題に鑑みてなされたものであり、端子を基板に接続する際に、端子表面のめっき層の温度上昇を抑える端子位置決め保持治具を提供することを目的とする。     The present invention has been made in view of the above problems, and an object of the present invention is to provide a terminal positioning holding jig that suppresses the temperature rise of the plating layer on the surface of the terminal when the terminal is connected to the substrate.

上記課題を解決するために、本発明のいくつかの態様は次のような端子位置決め保持治具を提供した。
すなわち、本発明の端子位置決め保持治具は、水平方向に沿って置かれた基板の端子取付位置に、鉛直方向に沿って立てられた端子の取付部を位置決め保持する端子位置決め保持治具であって、前記基板を載置する第一部材と、該第一部材に重ねて配され、前記端子に形成された端子貫通孔とその周辺領域である嵌合部を保持する開口が形成された第二部材と、からなり、前記第一部材と前記第二部材とは互いに着脱自在に形成され、前記開口は、前記第二部材の上面側が閉塞された非貫通孔を成し、前記第二部材は、互いに分割可能な第一分割体および第二分割体からなり、該第一分割体と第二分割体とは互いに隙間無く密着して重ね合わせることが可能であり、前記第一分割体には、前記開口を構成する開口第一領域が形成され、前記第二分割体には、前記開口を構成する開口第二領域が形成され、前記第一分割体と前記第二分割体とを重ねた状態で、前記端子と前記基板との接合に用いることを特徴とする。 In order to solve the above problems, some aspects of the present invention provide the following terminal positioning and holding jig.
That is, the terminal positioning / holding jig of the present invention is a terminal positioning / holding jig that positions and holds the terminal mounting portion standing along the vertical direction at the terminal mounting position of the substrate placed along the horizontal direction. A first member on which the substrate is placed, and an opening that is disposed on the first member and that holds a terminal through hole formed in the terminal and a fitting portion that is a peripheral region thereof. two and the member made of the the first member and the second member is detachably to each other, it said openings, to forming a non-through hole upper surface of the second member is closed, the second member Is composed of a first divided body and a second divided body that can be divided from each other, and the first divided body and the second divided body can be closely adhered to each other without gaps, Is formed with an opening first region constituting the opening, The divided body, the opening second area constituting the opening is formed in a laminated state and the second split body and the first split body, and characterized by using the junction between the said terminal board To do.

本発明の端子位置決め保持治具によれば、リフロー炉で端子を基板にリフローによってはんだ付けする際に、第二部材に形成された開口によって、端子の嵌合部が覆われ、端子の嵌合部がリフロー装置の溶融熱に直接当たることを防止することができる。   According to the terminal positioning and holding jig of the present invention, when the terminal is soldered to the substrate by reflow in a reflow furnace, the terminal fitting portion is covered by the opening formed in the second member, and the terminal fitting is performed. It is possible to prevent the portion from directly contacting the heat of fusion of the reflow device.

本発明の第一実施形態における端子位置決め保持治具の一例を示す要部断面図である。It is principal part sectional drawing which shows an example of the terminal positioning holding jig in 1st embodiment of this invention. 図１における端子を拡大した要部拡大断面図である。It is the principal part expanded sectional view which expanded the terminal in FIG. 本発明の第二実施形態における端子位置決め保持治具の一例を示す要部断面図である。It is principal part sectional drawing which shows an example of the terminal positioning holding jig in 2nd embodiment of this invention. 図３における端子を拡大した要部拡大断面図である。It is the principal part expanded sectional view which expanded the terminal in FIG.

以下、図面を参照して、本発明に係る端子位置決め保持治具の一実施形態について説明する。なお、本実施形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。また、以下の説明で用いる図面は、本発明の特徴をわかりやすくするために、便宜上、要部となる部分を拡大して示している場合があり、各構成要素の寸法比率などが実際と同じであるとは限らない。   Hereinafter, an embodiment of a terminal positioning and holding jig according to the present invention will be described with reference to the drawings. The present embodiment is specifically described for better understanding of the gist of the invention, and does not limit the invention unless otherwise specified. In addition, in the drawings used in the following description, in order to make the features of the present invention easier to understand, there is a case where a main part is shown in an enlarged manner for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.

（第一実施形態）
本発明の端子位置決め保持治具１０は、例えば、半導体装置を構成する基板２５の一面２５ａに対して、端子２１の長手方向を垂直にしてはんだ２９によって接合する際に、この端子２１を保持しておく治具として用いるものである。こうした端子２１は、例えば、半導体装置に接続する外部機器のコネクタなどを電気的に結合させるために用いられる。端子２１は、はんだ２９との密着性を高めるために、例えばスズめっき層で端子２１全体が覆われている。 (First embodiment)
The terminal positioning holding jig 10 of the present invention holds the terminal 21 when, for example, the terminal 21 is joined to the one surface 25a of the substrate 25 constituting the semiconductor device by the solder 29 with the longitudinal direction of the terminal 21 vertical. It is used as a jig to keep. Such a terminal 21 is used, for example, to electrically couple a connector of an external device connected to the semiconductor device. The terminal 21 is entirely covered with a tin plating layer, for example, in order to improve the adhesion with the solder 29.

端子２１は、例えば細長い平板状に形成され、一方の先端付近に端子貫通孔２１ａが形成されている。この端子貫通孔２１ａを含む近傍領域が、外部のコネクタ等を接続する際の嵌合部Ｃとされる。端子貫通孔２１ａを含む近傍領域としては、端子２１にコネクタが嵌合される領域であれば足りる。   The terminal 21 is formed in, for example, an elongated flat plate shape, and a terminal through hole 21a is formed near one end. The vicinity region including the terminal through hole 21a is a fitting portion C when an external connector or the like is connected. As the vicinity region including the terminal through hole 21a, a region where the connector is fitted to the terminal 21 is sufficient.

端子位置決め保持治具１０は、全体が金属、例えば、アルミニウム、アルミニウム合金、ステンレスなどで形成されている。端子位置決め保持治具１０は、互いに重ねて配され、かつ着脱可能な第一部材１１と第二部材１２とから構成されている。
なお、第二部材１２を断熱材によって形成してもよい。例えば、第二部材１２の一部を断熱材によって形成したり、あるいは、第二部材１２の全体を断熱材によって形成してもよい。 The terminal positioning and holding jig 10 is entirely made of metal, for example, aluminum, aluminum alloy, stainless steel or the like. The terminal positioning / holding jig 10 is composed of a first member 11 and a second member 12 which are arranged on top of each other and are detachable.
In addition, you may form the 2nd member 12 with a heat insulating material. For example, a part of the second member 12 may be formed of a heat insulating material, or the entire second member 12 may be formed of a heat insulating material.

第一部材１１は、半導体装置を構成する基板２５を載置可能な平板状の部材である。この第一部材１１には、例えば支持体１４が四隅に固着されている。なお、図１では、支持体１４が２つ開示された例を示している。また、第一部材１１には、基板２５を位置決め支持するための基板支持部が形成されていてもよい。基板支持部は、例えば、基板の外形形状に沿った凹部や、基板の四隅に接する突起などから構成されればよい。   The first member 11 is a flat plate-like member on which the substrate 25 constituting the semiconductor device can be placed. For example, supports 14 are fixed to the first member 11 at four corners. FIG. 1 shows an example in which two supports 14 are disclosed. Further, the first member 11 may be formed with a substrate support portion for positioning and supporting the substrate 25. The substrate support portion may be configured by, for example, a recess along the outer shape of the substrate, a protrusion in contact with the four corners of the substrate, or the like.

第二部材１２は、支持体１４によって第一部材１１に対して所定の間隔を保ちつつ支持される平板状の部材である。この第二部材１２には、上面１２ａ側が閉塞された非貫通孔である開口２２が、例えば複数形成されている。   The second member 12 is a flat plate member that is supported by the support 14 with a predetermined distance from the first member 11. The second member 12 is formed with, for example, a plurality of openings 22 that are non-through holes with the upper surface 12a side closed.

なお、図１においては、端子位置決め保持治具１０の一部を図示しているが、第一部材１１には、複数の基板２５を所定の間隔で載置可能な構造であればよい。また、第二部材１２の開口２２は、これら複数の基板２５に接合される複数の端子２１のそれぞれの接合位置に対応する個所に形成されていればよい。   In FIG. 1, a part of the terminal positioning / holding jig 10 is illustrated, but the first member 11 may have a structure in which a plurality of substrates 25 can be placed at a predetermined interval. The opening 22 of the second member 12 only needs to be formed at a location corresponding to each joining position of the plurality of terminals 21 joined to the plurality of substrates 25.

開口２２は、端子２１の嵌合部Ｃを覆う。これにより、端子２１は、第二部材１２によって垂直に保持されたときに、嵌合部Ｃが外部に露出することがない。   The opening 22 covers the fitting portion C of the terminal 21. Thereby, when the terminal 21 is vertically held by the second member 12, the fitting portion C is not exposed to the outside.

以上のような構成の端子位置決め保持治具１０の作用を説明する。
図１、２に示すような構成の本発明の端子位置決め保持治具１０によれば、基板２５を載置した第一部材１１に対して、第二部材１２を重ねた際に、端子２１は、第二部材１２に形成された開口２２によって嵌合部Ｃが支持され、基板２５上の所定の取付位置（はんだ付け位置）に位置決めされる。この時、端子２１の嵌合部Ｃの側面および上端は、一方が閉塞された非貫通孔である開口２２によって覆われる。 The operation of the terminal positioning and holding jig 10 configured as described above will be described.
According to the terminal positioning and holding jig 10 of the present invention configured as shown in FIGS. 1 and 2, when the second member 12 is stacked on the first member 11 on which the substrate 25 is placed, the terminal 21 is The fitting portion C is supported by the opening 22 formed in the second member 12 and is positioned at a predetermined mounting position (soldering position) on the substrate 25. At this time, the side surface and the upper end of the fitting portion C of the terminal 21 are covered with the opening 22 which is a non-through hole with one side closed.

この状態から、端子２１の取付部Ｅａに、例えばペースト状の鉛フリーのはんだ２９を塗布する。そして、塗布されたはんだ２９は、リフローにより融点に達し溶融する。当該はんだ２９が鉛フリーはんだの場合、鉛はんだと比較してリフロー温度を高く設定する。当該リフロー温度は、端子２１を覆うスズめっき層の融点を超える。   From this state, for example, paste-like lead-free solder 29 is applied to the attachment portion Ea of the terminal 21. The applied solder 29 reaches the melting point by reflow and melts. When the solder 29 is lead-free solder, the reflow temperature is set higher than that of lead solder. The reflow temperature exceeds the melting point of the tin plating layer covering the terminal 21.

基板２５や端子２１が端子位置決め保持治具１０に保持された状態で、リフロー炉内で鉛フリーはんだの融点まで加熱が行われると、端子２１の取付部Ｅａは、第一部材１１と第二部材１２とが離間して重ねられているために溶融熱に直接当たり、はんだ（鉛フリーはんだ）２９の融点に達する。そして、はんだ２９は溶融し、基板２５の一面に対して端子２１の長手方向が垂直になるように、はんだ付けされる。   When heating is performed up to the melting point of lead-free solder in the reflow furnace in a state where the substrate 25 and the terminal 21 are held by the terminal positioning and holding jig 10, the mounting portion Ea of the terminal 21 is connected to the first member 11 and the second member 11. Since the member 12 is separated and overlapped, it directly hits the heat of fusion and reaches the melting point of the solder (lead-free solder) 29. Then, the solder 29 is melted and soldered so that the longitudinal direction of the terminal 21 is perpendicular to one surface of the substrate 25.

一方、このリフロー時に、端子２１の嵌合部Ｃは、第二部材１２の開口２２によって隙間なく覆われることにより、端子２１の嵌合部Ｃが溶融熱に直接当たることを防止する。なお、溶融熱に直接当たるとは、端子２１がリフロー炉内の熱源から伝搬する熱に直接的に当たる状態を含む。   On the other hand, during this reflow, the fitting portion C of the terminal 21 is covered with the opening 22 of the second member 12 without a gap, thereby preventing the fitting portion C of the terminal 21 from directly hitting the melting heat. The direct contact with the heat of fusion includes a state in which the terminal 21 directly contacts the heat propagated from the heat source in the reflow furnace.

しかも、開口２２が形成される第二部材１２は、熱容量の大きい金属ブロックから構成されている。よって、溶融熱に直接当たる端子２１の取付部Ｅａが、はんだ２９の融点まで達しても、溶融熱に直接当たることのない端子２１の嵌合部Ｃは、それよりも十分に低い温度、例えば、端子２１の嵌合部Ｃを覆うスズめっき層の溶融温度よりも低い温度までしか昇温しない。   And the 2nd member 12 in which the opening 22 is formed is comprised from the metal block with a large heat capacity. Therefore, even if the mounting portion Ea of the terminal 21 that directly contacts the melting heat reaches the melting point of the solder 29, the fitting portion C of the terminal 21 that does not directly contact the melting heat has a temperature sufficiently lower than that, for example, The temperature is raised only to a temperature lower than the melting temperature of the tin plating layer covering the fitting portion C of the terminal 21.

また、開口２２を、第二部材１２の上面１２ａ側が閉塞された非貫通孔とすることで、溶融熱が開口２２を通り抜ける熱流を形成することを防止する。   In addition, by forming the opening 22 as a non-through hole in which the upper surface 12 a side of the second member 12 is closed, it is possible to prevent the heat of fusion from passing through the opening 22.

また、端子２１の一端側を第二部材１２の開口２２で覆うようにしたので、端子２１を支持することができる。これにより、水平方向に沿って載置された基板２５に対して、端子２１が傾くことなく垂直方向に接合することができる。   Moreover, since the one end side of the terminal 21 was covered with the opening 22 of the second member 12, the terminal 21 can be supported. Thereby, the terminal 21 can be joined to the board | substrate 25 mounted along the horizontal direction in the perpendicular direction, without inclining.

以上のように、本実施形態の端子位置決め保持治具１０を用いれば、端子２１の取付部Ｅａに塗布されたはんだ２９をリフロー温度まで上昇させても、端子２１の嵌合部Ｃはそれよりも低い温度、例えば、端子２１の嵌合部Ｃを覆うめっき層の融点よりも低い温度までしか上昇しない。よって、端子２１を覆っている、例えばスズめっき層を溶融させることなく、例えば鉛フリーはんだのような融点の高いはんだ２９を用いて端子２１を基板２５に確実に接合することが可能になる。
その結果、基板２５に接合後の端子２１は、コネクタ等に嵌合される嵌合部Ｃにおいて、表面を覆うめっき層が凝集することがなく、表面が平滑なめっき層で覆われた状態を保つことができる。 As described above, when the terminal positioning and holding jig 10 of the present embodiment is used, even if the solder 29 applied to the attachment portion Ea of the terminal 21 is raised to the reflow temperature, the fitting portion C of the terminal 21 is more than that. The temperature rises only to a lower temperature, for example, a temperature lower than the melting point of the plating layer covering the fitting portion C of the terminal 21. Therefore, the terminal 21 can be reliably bonded to the substrate 25 using the solder 29 having a high melting point such as lead-free solder without melting the tin plating layer covering the terminal 21, for example.
As a result, the terminal 21 after being joined to the substrate 25 has a state in which the plating layer covering the surface is not agglomerated in the fitting portion C fitted to the connector or the like, and the surface is covered with a smooth plating layer. Can keep.

なお、上述した実施形態では、第二部材１２の上面１２ａ側に所定の厚みを残した開口によって、一方が閉塞された非貫通孔である開口２２を形成しているが、これ以外にも、例えば、第二部材１２を貫通する開口を形成し、第二部材１２の上面１２ａ側に板材などを接合してこの開口の上面１２ａ側を閉塞することによって、第二部材１２の上面１２ａ側が閉塞された非貫通孔である開口を形成してもよい。   In the above-described embodiment, the opening 22 that is a non-through hole that is closed on one side is formed by an opening that leaves a predetermined thickness on the upper surface 12a side of the second member 12, but in addition to this, For example, the upper surface 12a side of the second member 12 is closed by forming an opening penetrating the second member 12, joining a plate or the like to the upper surface 12a side of the second member 12, and closing the upper surface 12a side of the opening. An opening that is a non-through hole may be formed.

また、第二部材１２の表面に断熱材を形成したり、第二部材１２自体を断熱材で形成することができる。第二部材１２の表面に断熱材層などを更に形成すれば、開口２２の内部の温度上昇をより一層抑制可能となる。また、第二部材１２の構成材料自体に断熱材を用いることも好ましい。この場合、第二部材１２の一部または全部を断熱材によって構成することもできる。   Moreover, a heat insulating material can be formed in the surface of the 2nd member 12, or 2nd member 12 itself can be formed with a heat insulating material. If a heat insulating material layer or the like is further formed on the surface of the second member 12, the temperature rise inside the opening 22 can be further suppressed. It is also preferable to use a heat insulating material for the constituent material itself of the second member 12. In this case, a part or all of the second member 12 can be constituted by a heat insulating material.

（第二実施形態）
第一実施形態と同様の構成に関しては同一の番号を付し、その詳細な説明は省略する。
第二実施形態における端子位置決め保持治具３０は、互いに着脱可能な第一部材１１と第二部材３２とから構成されている。更に、第二部材３２は、互いに分割可能な第一分割体３２Ａおよび第二分割体３２Ｂからなる。この第一分割体３２Ａと第二分割体３２Ｂとは互いに隙間無く密着して重ね合わせることが可能な構成となっている。 (Second embodiment)
The same number is attached | subjected about the structure similar to 1st embodiment, and the detailed description is abbreviate | omitted.
The terminal positioning and holding jig 30 in the second embodiment is composed of a first member 11 and a second member 32 that are detachable from each other. Furthermore, the second member 32 includes a first divided body 32A and a second divided body 32B that can be divided from each other. The first divided body 32 </ b> A and the second divided body 32 </ b> B are configured to be able to overlap each other with no gap therebetween.

第二部材３２を構成する第一分割体３２Ａと第二分割体３２Ｂは、平板状の部材である。第一分割体３２Ａには、開口４２を構成する開口第一領域４２Ａが、例えば複数形成されている。開口第一領域４２Ａは、例えば貫通孔であればよい。第二分割体３２Ｂには、第二分割体３２Ｂの上面（即ち第二部材３２の上面）３２ａ側が閉塞された非貫通孔である開口第二領域４２Ｂが形成されている。   The first divided body 32A and the second divided body 32B constituting the second member 32 are flat-plate members. In the first divided body 32A, for example, a plurality of opening first regions 42A constituting the opening 42 are formed. The opening first region 42A may be, for example, a through hole. In the second divided body 32B, an open second region 42B is formed as a non-through hole in which the upper surface of the second divided body 32B (ie, the upper surface of the second member 32) 32a is closed.

これら第一部材１１、第二部材３２を成す第一分割体３２Ａおよび第二分割体３２Ｂを全て重ね合わせた時に、第一部材１１に載置された基板２５における端子２１の接合位置に対して、第一分割体３２Ａに形成された開口第一領域４２Ａと、第二分割体３２Ｂに形成された開口第二領域４２Ｂとが合致するように配置されている。これによって、開口第一領域４２Ａと開口第二領域４２Ｂとは、第二部材３２の上面３２ａ側が閉塞された非貫通孔を成す開口４２を構成する。   When the first divided body 32 </ b> A and the second divided body 32 </ b> B constituting the first member 11 and the second member 32 are all overlapped, with respect to the bonding position of the terminal 21 on the substrate 25 placed on the first member 11. The first opening area 42A formed in the first divided body 32A and the second opening area 42B formed in the second divided body 32B are arranged so as to coincide with each other. Thus, the opening first region 42A and the opening second region 42B constitute an opening 42 that forms a non-through hole in which the upper surface 32a side of the second member 32 is closed.

開口４２を構成する開口第一領域４２Ａと開口第二領域４２Ｂとは、第一分割体３２Ａおよび第二分割体３２Ｂを重ね合わせた際に、相互の開口領域間に隙間が形成されることなく端子２１の嵌合部Ｃを覆う。これにより、端子２１は、第二部材３２の第一分割体３２Ａおよび第二分割体３２Ｂによって垂直に保持された際に、嵌合部Ｃが外部に露出することがない。   When the first divided body 32A and the second divided body 32B are overlapped, the first opening area 42A and the second opening area 42B constituting the opening 42 are not formed with a gap between the opening areas. The fitting part C of the terminal 21 is covered. Thereby, when the terminal 21 is vertically held by the first divided body 32A and the second divided body 32B of the second member 32, the fitting portion C is not exposed to the outside.

また、端子２１を、２つの分割可能な部材、即ち第二部材３２の第一分割体３２Ａおよび第二分割体３２Ｂで構成することで、第一分割体３２Ａに対して第二分割体３２Ｂを重ねる前に端子２１の位置を微調整することが可能になる。よって、水平方向に沿って載置された基板２５に対して、端子２１が傾くことなく、より正確に垂直に接合することができる。   Further, the terminal 21 is constituted by two dividable members, that is, the first divided body 32A and the second divided body 32B of the second member 32, so that the second divided body 32B is formed with respect to the first divided body 32A. It is possible to finely adjust the position of the terminal 21 before overlapping. Therefore, the terminal 21 can be more accurately vertically bonded to the substrate 25 placed along the horizontal direction without being inclined.

また、第二部材３２を２つの分割可能な部材である第一分割体３２Ａおよび第二分割体３２Ｂで構成することによって、例えば、第一部材１１に第一分割体３２Ａを重ね合わせて端子２１を開口第一領域４２Ａに挿入し、この開口第一領域４２Ａから突出した端子２１の上端を操作して鉛直になるように微調整を行った後、第二分割体３２Ｂを重ね合わせることで、端子２１を基板２５に対して鉛直に位置決めする作業がより一層しやすくなる。   Further, by configuring the second member 32 with the first divided body 32A and the second divided body 32B, which are two parts that can be divided, for example, the first divided body 32A is superimposed on the first member 11 and the terminal 21 is overlapped. Is inserted into the opening first region 42A, and the upper end of the terminal 21 protruding from the opening first region 42A is operated to make a fine adjustment so that the second divided body 32B is overlapped. The operation of positioning the terminal 21 vertically with respect to the substrate 25 is further facilitated.

以上のような構成の端子位置決め保持治具３０によれば、端子２１の嵌合部Ｃは、隙間無く密着して重ねられた第一分割体３２Ａおよび第二分割体３２Ｂによって、一連の穴を成す開口第一領域４２Ａと開口第二領域４２Ｂからなる開口４２で隙間なく覆われる。また、端子２１の上端も一方が閉塞された非貫通孔である開口４２によって覆われる。従って、リフロー時に、端子２１の嵌合部Ｃが溶融熱に直接当たることを防止できる。よって、端子２１を覆っている、例えばスズめっき層を溶融させることなく、例えば鉛フリーはんだのような融点の高いはんだ２９を用いて端子２１を基板２５に確実に接合することが可能になる。   According to the terminal positioning and holding jig 30 having the above-described configuration, the fitting portion C of the terminal 21 has a series of holes formed by the first divided body 32A and the second divided body 32B which are closely stacked without any gap. The opening 42 formed by the opening first region 42A and the opening second region 42B is covered without a gap. Further, the upper end of the terminal 21 is also covered with an opening 42 which is a non-through hole in which one end is closed. Accordingly, it is possible to prevent the fitting portion C of the terminal 21 from directly hitting the melting heat during reflow. Therefore, the terminal 21 can be reliably bonded to the substrate 25 using the solder 29 having a high melting point such as lead-free solder without melting the tin plating layer covering the terminal 21, for example.

１０…端子位置決め保持治具、１１…第一部材、１２…第二部材、２１…端子、２２…開口、２５…基板。   DESCRIPTION OF SYMBOLS 10 ... Terminal positioning holding jig, 11 ... 1st member, 12 ... 2nd member, 21 ... Terminal, 22 ... Opening, 25 ... Board | substrate.

Claims (5)

水平方向に沿って置かれた基板の端子取付位置に、鉛直方向に沿って立てられた端子の取付部を位置決め保持する端子位置決め保持治具であって、
前記基板を載置する第一部材と、該第一部材に重ねて配され、前記端子に形成された端子貫通孔とその周辺領域である嵌合部を保持する開口が形成された第二部材と、からなり、
前記第一部材と前記第二部材とは互いに着脱自在に形成され、
前記開口は、前記第二部材の上面側が閉塞された非貫通孔を成し、
前記第二部材は、互いに分割可能な第一分割体および第二分割体からなり、該第一分割体と第二分割体とは互いに隙間無く密着して重ね合わせることが可能であり、
前記第一分割体には、前記開口を構成する開口第一領域が形成され、前記第二分割体には、前記開口を構成する開口第二領域が形成され、
前記第一分割体と前記第二分割体とを重ねた状態で、前記端子と前記基板との接合に用いることを特徴とする端子位置決め保持治具。 A terminal positioning holding jig for positioning and holding a terminal mounting portion standing along a vertical direction at a terminal mounting position of a substrate placed along a horizontal direction,
A first member on which the substrate is placed, and a second member which is disposed so as to overlap the first member and has an opening for holding a terminal through hole formed in the terminal and a fitting portion which is a peripheral region thereof. And consists of
The first member and the second member are detachably formed from each other,
It said openings, to forming a non-through hole upper surface of the second member is closed,
The second member is composed of a first divided body and a second divided body that can be separated from each other, and the first divided body and the second divided body can be closely adhered to each other without any gaps,
In the first divided body, an opening first region constituting the opening is formed, and in the second divided body, an opening second region constituting the opening is formed,
A terminal positioning holding jig used for joining the terminal and the substrate in a state where the first divided body and the second divided body are overlapped . 前記端子は、表面がスズめっき処理され、前記端子の取付部と前記基板とは鉛フリーはんだによって接合されることを特徴とする請求項１記載の端子位置決め保持治具。 The terminal surface is tin plated, 1 Symbol mounting terminal positioning holding jig according to claim, characterized in that it is joined by the lead-free solder attachment portion and the substrate of the terminal. 前記第一部材と前記第二部材とは、支持体によって所定の隙間を保持して重ねた状態で配置されることを特徴とする請求項１または２記載の端子位置決め保持治具。 3. The terminal positioning holding jig according to claim 1, wherein the first member and the second member are arranged in a state of being stacked while holding a predetermined gap by a support. 4. 前記第二部材の一部を断熱材によって形成したことを特徴とする請求項１ないし３いずれか１項記載の端子位置決め保持治具。 The second claims 1 to 3 terminal positioning holding jig according to any one part characterized by being formed by insulation member. 前記第二部材の全体を断熱材によって形成したことを特徴とする請求項１ないし３いずれか１項記載の端子位置決め保持治具。 The terminal positioning holding jig according to any one of claims 1 to 3, wherein the entire second member is formed of a heat insulating material.
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