JP4899700B2 - module - Google Patents

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JP4899700B2
JP4899700B2 JP2006210708A JP2006210708A JP4899700B2 JP 4899700 B2 JP4899700 B2 JP 4899700B2 JP 2006210708 A JP2006210708 A JP 2006210708A JP 2006210708 A JP2006210708 A JP 2006210708A JP 4899700 B2 JP4899700 B2 JP 4899700B2
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substrate
hole
heat
wiring
heat conducting
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JP2007081379A (en
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三博 田中
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Daikin Industries Ltd
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Daikin Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明はモジュールに関し、例えばパワーモジュールに適用できる。   The present invention relates to a module, and can be applied to, for example, a power module.

従来から、金属基板やセラミック基板等の基板上にスプレッダを介して素子を載置することで、基板上に設けられた配線に素子を電気的に接続しつつも、素子から生じる熱を基板の素子とは反対側へと伝達することで放熱していた。   Conventionally, by placing an element on a substrate such as a metal substrate or a ceramic substrate via a spreader, while the element is electrically connected to a wiring provided on the substrate, the heat generated from the element is transferred to the substrate. Heat was dissipated by transmitting to the opposite side of the element.

なお、本発明に関連する技術を以下に示す。   In addition, the technique relevant to this invention is shown below.

実用新案登録第２５５５７９６号公報Utility Model Registration No. 2555796 特開２００２−３２５４６８号公報JP 2002-325468 A

しかし、基板として金属基板やセラミック基板等を採用することは、コストがかかる点であまり望ましくない。   However, adopting a metal substrate, a ceramic substrate, or the like as the substrate is not very desirable in terms of cost.

一方、樹脂基板を採用すれば、金属基板やセラミック基板等に比べてコストが低下するが、熱伝導性が低下するため素子で発生した熱が放出されにくく、延いては素子が故障するおそれがあった。   On the other hand, if a resin substrate is used, the cost is lower than that of a metal substrate, a ceramic substrate, etc., but heat conductivity is reduced, so that the heat generated in the element is difficult to be released, and there is a risk that the element will break down. there were.

本発明は、上述した事情に鑑みてなされたものであり、素子で生じた熱を放出しやすくすることが目的とされる。   The present invention has been made in view of the above-described circumstances, and an object thereof is to facilitate the release of heat generated in the element.

この発明の請求項１にかかるモジュールは、配線（１３）が形成された表面（１１）と貫通孔（１２）とを有する基板（１）と、前記貫通孔に埋設される熱伝導部（２１；２３）と、前記基板の前記表面と同じ側にある前記熱伝導部の表面（２１１）の少なくとも一部を覆い、前記基板の前記表面側から前記配線に接続される電気伝導部（２２）と、前記電気伝導部上に載置され、前記電気伝導部側で電気的に接続される素子（３）とを備える。 A module according to a first aspect of the present invention includes a substrate (1) having a surface (11) on which a wiring (13) is formed and a through hole (12), and a heat conduction portion (21) embedded in the through hole. 23) and an electrically conductive portion (22) that covers at least a part of the surface (211) of the heat conducting portion on the same side as the surface of the substrate and is connected to the wiring from the surface side of the substrate. And an element (3) placed on the electric conduction part and electrically connected on the electric conduction part side.

この発明の請求項２にかかるモジュールは、請求項１記載のモジュールであって、前記素子（３）は前記熱伝導部（２１；２３）の直上に位置する。 The module according to a second aspect of the present invention is the module according to the first aspect, wherein the element (3) is located immediately above the heat conducting portion (21; 23).

この発明の請求項３にかかるモジュールは、請求項１または請求項２記載のモジュールであって、前記熱伝導部（２３）は、前記貫通孔（１２）が前記基板（１）を貫通する方向に対する断面が、前記素子（３）から離れるに連れて拡がる。 A module according to a third aspect of the present invention is the module according to the first or second aspect, wherein the heat conducting portion (23) is a direction in which the through hole (12) penetrates the substrate (1). The cross section with respect to increases as the distance from the element (3) increases.

この発明の請求項４にかかるモジュールは、請求項１乃至請求項３のいずれか一つに記載のモジュールであって、前記熱伝導部（２１；２３）と前記電気伝導部（２２）とは同じ物質からなる。 A module according to a fourth aspect of the present invention is the module according to any one of the first to third aspects, wherein the heat conducting portion (21; 23) and the electric conducting portion (22) are Made of the same substance.

この発明の請求項１にかかるモジュールによれば、熱伝導部は、素子で生じる熱を基板に対して素子とは反対側へと伝導することができる。よって、素子で生じる熱が放出されやすい。しかも、電気伝導部は、素子を基板上の配線に電気的に接続することができる。 According to the module of the first aspect of the present invention, the heat conducting section can conduct the heat generated in the element to the side opposite to the element with respect to the substrate. Therefore, heat generated in the element is easily released. In addition, the electrical conductive portion can electrically connect the element to the wiring on the substrate.

この発明の請求項２にかかるモジュールによれば、素子で生じた熱が熱伝導部へと伝わりやすく、以って当該熱が放出されやすい。 According to the module of claim 2 of the present invention, the heat generated in the element is easily transferred to the heat conducting portion, and thus the heat is easily released.

この発明の請求項３にかかるモジュールによれば、熱伝導部を熱が伝わりやすい。 According to the module of claim 3 of the present invention, heat is easily transmitted through the heat conducting portion.

この発明の請求項４にかかるモジュールによれば、熱伝導部と電気伝導部とを一体成形することができる。 According to the module of claim 4 of the present invention, the heat conducting portion and the electric conducting portion can be integrally formed.

以下、この発明にかかるモジュールを説明する。包括的に説明すると、このモジュールは、基板と熱伝導部と電気伝導部と素子とを備えている。基板の表面には配線が形成されており、その表面から反対側の面に貫通するように貫通孔が形成されている。熱伝導部と電気伝導部とは一体的に形成されており、熱伝導部は貫通孔に埋設されている。なお、ここでの熱伝導部と電気伝導部とが一体的に形成されたとは、両者が金型成形や切削加工等により一体形成された場合と、別々に製造された両者が接着剤や溶接等で接合され一体化された場合とを含む。また、電気伝導部は基板の表面側又はその反対側の面に配設されており、前記配線に電気的に接続されている。また、基板の表面側で、熱伝導部又は電気伝導部上に素子が載置されている。素子は、電気伝導部を経由して、又は、熱伝導部から電気伝導部を経由して配線と電気的に接続されている。   The module according to the present invention will be described below. If it explains comprehensively, this module is provided with a substrate, a heat conduction part, an electric conduction part, and an element. Wiring is formed on the surface of the substrate, and a through hole is formed so as to penetrate from the surface to the opposite surface. The heat conduction part and the electric conduction part are integrally formed, and the heat conduction part is embedded in the through hole. Here, the heat conduction part and the electric conduction part are integrally formed when both are integrally formed by molding or cutting, or when both are separately manufactured by adhesive or welding. And the case where they are joined and integrated with each other. In addition, the electrical conductive portion is disposed on the surface side of the substrate or the opposite surface, and is electrically connected to the wiring. In addition, on the surface side of the substrate, an element is placed on the heat conducting unit or the electrical conducting unit. The element is electrically connected to the wiring via the electric conduction part or from the heat conduction part via the electric conduction part.

以下、上記モジュールの各実施形態について説明する。   Hereinafter, each embodiment of the module will be described.

＜第１の実施形態＞
第１の実施形態では、電気伝導部が基板の表面側に設けられた例を説明する。 <First Embodiment>
In the first embodiment, an example will be described in which the electrical conductive portion is provided on the surface side of the substrate.

図１及び図２は、それぞれ本発明の第１の実施形態にかかるモジュールを概念的に示す断面図及び上面図である。当該モジュールは、基板１、スプレッダ２及び素子３を備える。   1 and 2 are a cross-sectional view and a top view, respectively, conceptually showing a module according to the first embodiment of the present invention. The module includes a substrate 1, a spreader 2 and an element 3.

基板１は、表面１１と貫通孔１２とを有する。基板１には、例えば樹脂基板が採用できる。表面１１には配線１３〜１５が施されている。貫通孔１２は、基板の厚み方向９１へと基板１を貫通する。   The substrate 1 has a surface 11 and a through hole 12. As the substrate 1, for example, a resin substrate can be adopted. The surface 11 is provided with wirings 13 to 15. The through hole 12 penetrates the substrate 1 in the thickness direction 91 of the substrate.

スプレッダ２は、熱伝導部２１と電気伝導部２２とを有する。熱伝導部２１は、貫通孔１２に埋設される。電気伝導部２２は、表面１１と同じ側にある熱伝導部２１の表面２１１を覆い、しかも配線１３に接続される。図１では、電気伝導部２２が熱伝導部２１の表面２１１のすべてを覆っているが、例えば当該表面２１１の少なくとも一部を覆うだけであっても良い。電気伝導部２２の配線１３への接続は、例えば半田付けによって行われる。   The spreader 2 includes a heat conducting unit 21 and an electrical conducting unit 22. The heat conducting unit 21 is embedded in the through hole 12. The electrically conductive portion 22 covers the surface 211 of the heat conducting portion 21 on the same side as the surface 11 and is connected to the wiring 13. In FIG. 1, the electric conduction part 22 covers all of the surface 211 of the heat conduction part 21, but it may only cover at least a part of the surface 211, for example. The connection of the electric conduction part 22 to the wiring 13 is performed by soldering, for example.

図２では、熱伝導部２１及び電気伝導部２２のいずれにおいても、方向９１に対する断面が長方形を呈する場合が示されている。熱伝導部２１及び電気伝導部２２の方向９１に対する断面は、例えば円形などの他の形状であっても良い。図３では、当該断面が円形の場合が示されている。また、熱伝導部２１と電気伝導部２２とで、方向９１に対する断面の形状が互いに異なっていても良い。   In FIG. 2, the case where the cross section with respect to the direction 91 exhibits a rectangle is shown in both the heat conducting unit 21 and the electrical conducting unit 22. The cross section of the heat conducting portion 21 and the electric conducting portion 22 with respect to the direction 91 may be another shape such as a circle. In FIG. 3, the case where the said cross section is circular is shown. Further, the heat conducting portion 21 and the electrical conducting portion 22 may have different cross-sectional shapes with respect to the direction 91.

素子３は、電気伝導部２２上に載置され、電気伝導部２２側で電気的に接続される。具体的には、素子３には例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）が採用でき、その端子の少なくとも一つが電気伝導部２２に接続される。他の端子は、例えば素子３の電気伝導部２２と反対側の面に設けられており、図１〜３に示されるようにスプレッダ２と非接触である配線１４，１５にワイヤボンディングで接続される。なお、当該他の端子は、配線１４，１５にリードフレームで接続されても良い。   The element 3 is placed on the electric conduction part 22 and electrically connected on the electric conduction part 22 side. Specifically, for example, an IGBT (Insulated Gate Bipolar Transistor) can be adopted as the element 3, and at least one of its terminals is connected to the electric conduction part 22. The other terminals are provided, for example, on the surface opposite to the electric conduction portion 22 of the element 3, and are connected to the wires 14 and 15 which are not in contact with the spreader 2 by wire bonding as shown in FIGS. The The other terminals may be connected to the wirings 14 and 15 with a lead frame.

かかるモジュールによれば、熱伝導部２１は、素子３で生じる熱を基板１に対して素子３とは反対側へと伝導することができる。よって、素子３で生じる熱が放出されやすい。しかも、電気伝導部２２は、素子３を基板上の配線１３に電気的に接続することができる。   According to such a module, the heat conducting unit 21 can conduct the heat generated in the element 3 to the side opposite to the element 3 with respect to the substrate 1. Therefore, heat generated in the element 3 is easily released. In addition, the electrical conductive portion 22 can electrically connect the element 3 to the wiring 13 on the substrate.

基板１の素子３とは反対側に伝達された熱は、例えばヒートシンク５を介して放出される。   The heat transmitted to the side of the substrate 1 opposite to the element 3 is released through, for example, the heat sink 5.

素子３は、スプレッダ２の熱伝導部２１の直上に載置されることが望ましい。これは、素子３で生じた熱が熱伝導部２１へと伝わりやすく、以って当該熱が放出されやすいからである。   It is desirable that the element 3 is placed immediately above the heat conducting portion 21 of the spreader 2. This is because the heat generated in the element 3 is easily transferred to the heat conducting portion 21 and thus the heat is easily released.

スプレッダ２の熱伝導部２１は、方向９１についての断面が、例えば図４で示される形状を呈するものであってもよい。図４では、当該熱伝導部が符号２３で示されている。すなわち、熱伝導部２３は、方向９１に対する幅ｄが素子３側から素子３とは反対側へといくに連れて大きくなる。この構造は、熱伝導部２３の方向９１に対する断面が、素子３から離れるに連れて拡がると把握することができる。   The heat conducting portion 21 of the spreader 2 may have a cross section in the direction 91 exhibiting a shape shown in FIG. 4, for example. In FIG. 4, the heat conducting portion is indicated by reference numeral 23. In other words, the heat conducting portion 23 increases as the width d with respect to the direction 91 increases from the element 3 side to the opposite side of the element 3. This structure can be understood that the cross section of the heat conducting portion 23 in the direction 91 expands as the distance from the element 3 increases.

熱伝導部２３によれば、素子３で生じた熱が、基板１に対して素子３とは反対側へと伝わりやすい。   According to the heat conducting portion 23, the heat generated in the element 3 is easily transferred to the opposite side of the element 3 with respect to the substrate 1.

熱伝導部２１と電気伝導部２２とは、同じ物質で形成されても良いし、異なる物質で形成されても良い。しかし、熱伝導部２１と電気伝導部２２とが同じ物質で形成されることが、スプレッダ２を一体成形できる点で特に望ましい。   The heat conducting unit 21 and the electrical conducting unit 22 may be formed of the same material or different materials. However, it is particularly desirable that the heat conducting portion 21 and the electric conducting portion 22 are formed of the same material in that the spreader 2 can be integrally formed.

この場合には熱伝導部２１が電気伝導性をも有するので、素子３がヒートシンク５に導通されることを防止するため、例えばスプレッダ２とヒートシンク５との間に絶縁フィルム６が設けられる。しかし、熱伝導部２１が電気伝導部２２とは異なる物質で形成され、電気伝導性を有しない場合には、絶縁フィルム６は省略しても良い。   In this case, since the heat conducting portion 21 also has electrical conductivity, for example, an insulating film 6 is provided between the spreader 2 and the heat sink 5 in order to prevent the element 3 from being conducted to the heat sink 5. However, the insulating film 6 may be omitted when the heat conducting portion 21 is formed of a material different from that of the electrically conducting portion 22 and does not have electrical conductivity.

＜第２の実施形態＞
第２の実施形態では、基板の表面側に設けられた電気伝導部が挿入端子部及びスルーホールを介して基板の配線に接続された例を説明する。 <Second Embodiment>
In the second embodiment, an example will be described in which an electrically conductive portion provided on the surface side of a substrate is connected to a wiring of the substrate through an insertion terminal portion and a through hole.

図５及び図６は、それぞれ第２の実施形態にかかるモジュールを概念的に示す断面図及び上面図であり、図７は本モジュールに用いられるスプレッダを示す側面図である。   5 and 6 are a sectional view and a top view, respectively, conceptually showing the module according to the second embodiment, and FIG. 7 is a side view showing a spreader used in the module.

このモジュールは、基板３０１、スプレッダ３２０及び素子３３０を備えている。   This module includes a substrate 301, a spreader 320 and an element 330.

基板３０１は、表面３０２とその反対側の面３０３と貫通孔３０４とスルーホール３１０とを有している。基板３０１は、例えば、樹脂基板により形成されている。基板３０１の表面には配線３０５，３０６，３０７が形成されている。一の配線３０５は、後述する電気伝導部３２４によって覆われる領域（貫通孔３０４を取囲む領域）から他へ延びるようなパターンで形成されている。また、他の配線３０６，３０７は、後述する電気伝導部３２４の近傍領域から他へ延びるようなパターンで形成されている。また、貫通孔３０４は、基板３０１の厚み方向Ｐに沿って該基板３０１を貫通しており、その基板の表面３０２及び反対側の面３０３に開口している。また、ここでは、貫通孔３０４は、熱伝導部３２２の形状にあわせた平面視略方形孔形状に形成されている。   The substrate 301 has a surface 302, a surface 303 on the opposite side, a through hole 304, and a through hole 310. The substrate 301 is formed of, for example, a resin substrate. Wirings 305, 306, and 307 are formed on the surface of the substrate 301. One wiring 305 is formed in a pattern extending from a region (region surrounding the through-hole 304) covered by an electric conductive portion 324 described later to the other. Further, the other wirings 306 and 307 are formed in a pattern extending from the vicinity of the electric conduction portion 324 described later to the other. Further, the through hole 304 penetrates the substrate 301 along the thickness direction P of the substrate 301 and opens on the surface 302 and the opposite surface 303 of the substrate. Further, here, the through hole 304 is formed in a substantially square hole shape in plan view in accordance with the shape of the heat conducting portion 322.

スルーホール３１０は、基板３０１を貫通する孔３１１の内周部に、メッキ等による導体部３１２を形成した構成とされている。このスルーホール３１０は、後述する電気伝導部３２４によって覆われる領域、ここでは、電気伝導部３２４によって覆われる略方形領域の４つの角部及び各角部間の位置に、合計８個のスルーホール３１０が形成されている。また、各スルーホール３１０の導体部３１２は、配線３０５に電気的に接続されている。なお、スルーホール３１０は、少なくとも一つあればよいが、電気伝導部３２４をバランスよく保持するためには、２つ以上あることが好ましい。この各スルーホール３１０の内周形状は、後述する挿入端子部３２６を挿入可能な形状、ここでは、略角穴状に形成されている。   The through hole 310 is configured such that a conductor portion 312 is formed by plating or the like on the inner peripheral portion of a hole 311 that penetrates the substrate 301. This through-hole 310 has a total of eight through-holes at four corners of a region covered by an electric conductive portion 324 described later, here, a substantially rectangular region covered by the electric conductive portion 324 and each corner. 310 is formed. In addition, the conductor portion 312 of each through hole 310 is electrically connected to the wiring 305. Note that at least one through-hole 310 is sufficient, but it is preferable that there are two or more through-holes 310 in order to hold the electric conduction portion 324 in a balanced manner. The inner peripheral shape of each through-hole 310 is formed into a shape into which an insertion terminal portion 326 described later can be inserted, in this case, a substantially square hole shape.

スプレッダ３２０は、熱伝導部３２２と、電気伝導部３２４とを有している。熱伝導部３２２は、貫通孔３０４に埋設可能な形状、即ち、貫通孔３０４の開口に対応する（ほぼ同じ）平面視形状及び大きさで、かつ、貫通孔３０４の長さ寸法（基板３０１の厚み寸法）と略同じ厚み寸法を有する形状に形成されている。電気伝導部３２４は、表面３０２と同じ側にある熱伝導部３２２の表面３０２を覆うと共にその周縁部で基板３０１の表面３０２を覆う形状を有しており、熱伝導部３２２の周囲につば状にはみ出している。   The spreader 320 includes a heat conducting unit 322 and an electrical conducting unit 324. The heat conducting portion 322 has a shape that can be embedded in the through hole 304, that is, a shape and size in plan view corresponding to the opening of the through hole 304 (substantially the same), and the length dimension of the through hole 304 (the substrate 301 It is formed in a shape having substantially the same thickness dimension as (thickness dimension). The electrically conductive portion 324 has a shape that covers the surface 302 of the heat conducting portion 322 on the same side as the surface 302 and covers the surface 302 of the substrate 301 at the periphery thereof, and has a collar shape around the heat conducting portion 322. It sticks out.

また、上記電気伝導部３２４には、挿入端子部３２６が形成されている。挿入端子部３２６は、電気伝導部３２４のうち熱伝導部３２２側の面（下面）から熱伝導部３２２側（下側）に向けて突出しており、上記スルーホール３１０に対応する位置に形成されている。また、挿入端子部３２６は、スルーホール３１０に挿入可能なピン状、ここでは、角柱ピン状に形成されており、スルーホール３１０に挿入されることで、上記導体部３１２と電気的に接触し、導体部３１２を経て配線３０５に電気的に接続される。なお、挿入端子部３２６がスルーホール３１０に挿入された状態で、半田付けされることが好ましい。このようなスプレッダ３２０は、例えば、銅や銅合金等の熱伝導性の良好な金属で形成される。   In addition, an insertion terminal portion 326 is formed in the electric conduction portion 324. The insertion terminal portion 326 protrudes from the surface (lower surface) on the heat conduction portion 322 side of the electric conduction portion 324 toward the heat conduction portion 322 side (lower side), and is formed at a position corresponding to the through hole 310. ing. In addition, the insertion terminal portion 326 is formed in a pin shape that can be inserted into the through hole 310, here, a prismatic pin shape, and is electrically connected to the conductor portion 312 by being inserted into the through hole 310. Then, it is electrically connected to the wiring 305 through the conductor portion 312. It is preferable that the insertion terminal portion 326 is soldered in a state where the insertion terminal portion 326 is inserted into the through hole 310. Such a spreader 320 is made of a metal having good thermal conductivity such as copper or copper alloy, for example.

素子３３０は、上記素子３と同様構成部材であり、上記第１の実施形態と同様態様で、スプレッダ３２０上に載置固定される。   The element 330 is a constituent member similar to the element 3 and is mounted and fixed on the spreader 320 in the same manner as in the first embodiment.

スプレッダ３２０に対する素子３３０の固定は、例えば、半田付け等でなされる。そして、この素子３３０がスプレッダ３２０上に載置固定されることで、その端子の少なくとも一つ（例えば、電気伝導部２２に接触する面にある端子）が電気伝導部３２４に半田付け等で接続される。このように電気伝導部３２４に接続された端子は、電気伝導部３２４から挿入端子部３２６及びスルーホール３１０を経由して配線３０５に電気的に接続される。なお、他の端子は、上記第１の実施形態と同様に、配線３０６，３０７にワイヤボンディング等で接続されている。   The element 330 is fixed to the spreader 320 by, for example, soldering. The element 330 is placed and fixed on the spreader 320, so that at least one of the terminals (for example, a terminal on the surface in contact with the electric conduction portion 22) is connected to the electric conduction portion 324 by soldering or the like. Is done. Thus, the terminal connected to the electric conduction portion 324 is electrically connected to the wiring 305 from the electric conduction portion 324 via the insertion terminal portion 326 and the through hole 310. The other terminals are connected to the wirings 306 and 307 by wire bonding or the like, as in the first embodiment.

また、基板３０１の反対側の面３０３には、ヒートシンク３４０が設けられている。この反対側の面３０３とヒートシンク３４０との間には、絶縁フィルム３４２が介在しており、スプレッダ３２０とヒートシンク３４０とを電気的に絶縁している。そして、基板１の素子３とは反対側に伝達された熱は、例えばヒートシンク５を介して放出される。   A heat sink 340 is provided on the surface 303 on the opposite side of the substrate 301. An insulating film 342 is interposed between the opposite surface 303 and the heat sink 340 to electrically insulate the spreader 320 and the heat sink 340. Then, the heat transmitted to the side of the substrate 1 opposite to the element 3 is released through, for example, the heat sink 5.

このように構成されたモジュールによると、熱伝導部３２２は、素子３３０で生じる熱を基板３０１に対して素子３３０とは反対側へと伝導することができる。よって、素子３３０で生じる熱が放出されやすい。   According to the module configured as described above, the heat conducting unit 322 can conduct the heat generated in the element 330 to the side opposite to the element 330 with respect to the substrate 301. Therefore, heat generated in the element 330 is easily released.

なお、第１の実施形態で述べたのと同様理由により、素子３３０は、スプレッダ３２０の熱伝導部３２２の直上に載置されることが望ましい。   For the same reason as described in the first embodiment, it is desirable that the element 330 is placed immediately above the heat conducting portion 322 of the spreader 320.

また、素子３３０を、電気伝導部３２４から挿入端子部３２６及びスルーホール３１０を介して配線３０５に電気的に接続することができる。この場合に、挿入端子部３２６をスルーホール３１０に挿入することで、素子３３０が配線３０５に電気的に接続されるため、それらの間を強固に接続することができる。このため、素子３３０と配線３０５間の電気的な接続信頼性を向上させることができる。   In addition, the element 330 can be electrically connected to the wiring 305 from the electric conduction portion 324 through the insertion terminal portion 326 and the through hole 310. In this case, since the element 330 is electrically connected to the wiring 305 by inserting the insertion terminal portion 326 into the through-hole 310, it is possible to connect them firmly. For this reason, the electrical connection reliability between the element 330 and the wiring 305 can be improved.

ところで、本実施形態にかかるモジュールにおいては、基板３０１のうちの反対側の面３０３と、その反対側の面３０３と同じ側にある熱伝導部３２２の表面（下面）とを、略同一平面上に配設した状態で、挿入端子部３２６がスルーホール３１０に挿入されて半田付けされていることが好ましい。これは、例えば、基板３０１の反対側の面３０３と熱伝導部３２２の表面（下面）とを、平面を有する治具の該平面に押し当てつつ、挿入端子部３２６をスルーホール３１０に半田付けすることで実現される。   By the way, in the module according to the present embodiment, the opposite surface 303 of the substrate 301 and the surface (lower surface) of the heat conducting part 322 on the same side as the opposite surface 303 are substantially on the same plane. It is preferable that the insertion terminal portion 326 is inserted into the through hole 310 and soldered in a state of being disposed in the position. For example, the insertion terminal portion 326 is soldered to the through hole 310 while pressing the opposite surface 303 of the substrate 301 and the surface (lower surface) of the heat conducting portion 322 against the flat surface of the jig having a flat surface. It is realized by doing.

これにより、基板３０１の反対側の面３０３に対して熱伝導部３２２の表面の位置をなるべく一定位置に配設することができ、基板３０１の反対側の面３０３に放熱部材等をしっかりと固定できる。   Thereby, the position of the surface of the heat conduction part 322 can be arranged at a fixed position as much as possible with respect to the surface 303 on the opposite side of the substrate 301, and the heat radiation member or the like is firmly fixed to the surface 303 on the opposite side of the substrate 301. it can.

すなわち、基板３０１の表面３０２に電気伝導部３２４の下面を接触させるようにしてスプレッダ３２０を取付けると、基板３０１の反対側の面３０３に対する熱伝導部３２２の表面の位置がばらついてしまう。その主要因は、基板３０１の厚みのばらつきが±１０パーセント程度と大きいのが一般的であることによる。例えば、厚さ１．６ｍｍの基板３０１を用いた場合、±１６０μｍ、つまり、最大で３２０μｍの差が生じ得る可能性がある。そうすると、熱伝導部３２２が反対側の面３０３から大きく突出したり、大きく凹んだりすることがあるので、基板３０１の反対側の面３０３にヒートシンク３４０を取付けた場合に、熱伝導部３２２とヒートシンク３４０とが強く面接触したり、それらの間に隙間が形成されてしまうといった事態が生じ得る。これにより、熱伝導部３２２とヒートシンク３４０との接触態様が不均一となり、両者間の熱接触抵抗にばらつきが生じてしまう。   In other words, when the spreader 320 is attached so that the lower surface of the electric conductive portion 324 is in contact with the surface 302 of the substrate 301, the position of the surface of the heat conductive portion 322 with respect to the surface 303 on the opposite side of the substrate 301 varies. The main factor is that the variation in thickness of the substrate 301 is generally as large as about ± 10%. For example, when a substrate 301 having a thickness of 1.6 mm is used, there is a possibility that a difference of ± 160 μm, that is, a maximum of 320 μm may occur. As a result, the heat conducting portion 322 may protrude or be greatly recessed from the opposite surface 303. Therefore, when the heat sink 340 is attached to the opposite surface 303 of the substrate 301, the heat conducting portion 322 and the heat sink 340 are disposed. May cause a strong surface contact, or a gap may be formed between them. As a result, the contact mode between the heat conducting part 322 and the heat sink 340 becomes non-uniform, resulting in variations in the thermal contact resistance between them.

また、熱伝導部３２２とヒートシンク３４０との接触態様が不均一になると、ヒートシンク３４０は主として熱伝導部３２２に接触した状態で取付けられたり、基板３０１の反対側の面３０３に接触した状態で取付けられたりする。このため、ヒートシンク３４０の取付が不安定となり、基板３０１に加わるストレスもばらついてしまう。   Further, when the contact state between the heat conducting part 322 and the heat sink 340 becomes uneven, the heat sink 340 is attached mainly in contact with the heat conducting part 322 or attached in contact with the opposite surface 303 of the substrate 301. Or For this reason, the mounting of the heat sink 340 becomes unstable, and the stress applied to the substrate 301 also varies.

そこで、上記のように、基板３０１の表面３０２及び電気伝導部３２４の下面を略同一平面上に配設した状態で、それらの各面に接触させるようにしてスプレッダ３２０を取付けることで、熱伝導部３２２とヒートシンク３４０との熱接触抵抗をなるべく一定にして安定した放熱を実現できると共に、ヒートシンク３４０を安定してしっかりと固定することができる。   Therefore, as described above, in the state where the surface 302 of the substrate 301 and the lower surface of the electric conduction portion 324 are disposed on substantially the same plane, the spreader 320 is attached so as to be in contact with each of these surfaces. The heat contact resistance between the portion 322 and the heat sink 340 can be made as constant as possible to achieve stable heat dissipation, and the heat sink 340 can be stably and firmly fixed.

なお、上記熱伝導部３２２と電気伝導部３２４とは、同じ材料で形成されても良いし、異なる材料で形成されても良い。しかし、熱伝導部３２２と電気伝導部３２４とが同じ物質で形成されることが、スプレッダ３２０を一体成形し易いという点で特に望ましい。   The heat conducting part 322 and the electric conducting part 324 may be formed of the same material or different materials. However, it is particularly desirable that the heat conducting unit 322 and the electrical conducting unit 324 are formed of the same material because the spreader 320 can be easily formed integrally.

この場合のように熱伝導部３２２が電気伝導性をも有する場合には、素子３３０がヒートシンク３４０に導通されることを防止するため、上記したようにスプレッダ３２０とヒートシンク３４０との間に絶縁フィルム３４２が設けられる。しかし、熱伝導部２１が電気伝導部２２とは異なる物質で形成され、電気伝導性を有しない場合には、絶縁フィルム６は省略しても良い。   In the case where the heat conducting portion 322 also has electrical conductivity as in this case, the insulating film is interposed between the spreader 320 and the heat sink 340 as described above in order to prevent the element 330 from being conducted to the heat sink 340. 342 is provided. However, the insulating film 6 may be omitted when the heat conducting portion 21 is formed of a material different from that of the electrically conducting portion 22 and does not have electrical conductivity.

＜第３の実施形態＞
第３の実施形態では、電気伝導部が基板の反対側の面に設けられた例を説明する。 <Third Embodiment>
In the third embodiment, an example in which the electrical conductive portion is provided on the opposite surface of the substrate will be described.

図８は、第３の実施形態にかかるモジュールを概念的に示す断面図である。   FIG. 8 is a cross-sectional view conceptually showing the module according to the third embodiment.

このモジュールは、基板４０１、スプレッダ４２０及び素子４３０を備えている。   This module includes a substrate 401, a spreader 420, and an element 430.

基板４０１は、表面４０２とその反対側の面４０３と貫通孔４０４とスルーホール４１０とを有している。基板４０１は、例えば、樹脂基板により形成されている。基板４０１の表面４０２には、配線４０５，４０６，４０７が形成されており、その反対側の面４０３には、裏面配線４０８が形成されている。   The substrate 401 has a surface 402, a surface 403 on the opposite side, a through hole 404, and a through hole 410. The substrate 401 is formed of, for example, a resin substrate. Wirings 405, 406 and 407 are formed on the front surface 402 of the substrate 401, and a back wiring 408 is formed on the surface 403 on the opposite side.

一の配線４０５は、貫通孔４０４の周縁部から他へ延びるパターンに形成されている。また、裏面配線４０８は、基板３０１の反対側の面４０３であって後述する電気伝導部４２４で覆われる領域に形成されている。これらの配線４０５及び裏面配線４０８は、基板４０１の両面４０２，４０３で部分的に重複する領域に形成されており、その重複領域にスルーホール４１０が形成されている。スルーホール４１０は、基板４０１を貫通する孔４１１の内周部に、メッキ等による導体部４１２を形成した構成とされている。この導体部４１２は、基板４０１の表面４０２で配線４０５に電気的に接続されると共に、基板４０１の反対側の面４０３で裏面配線４０８に電気的に接続されている。そして、配線４０５と裏面配線４０８とが、スルーホール４１０を介して電気的に接続されている。   One wiring 405 is formed in a pattern extending from the periphery of the through hole 404 to the other. Further, the back surface wiring 408 is formed in a region which is the surface 403 on the opposite side of the substrate 301 and is covered with an electric conduction portion 424 described later. These wiring 405 and back surface wiring 408 are formed in a region that partially overlaps on both surfaces 402 and 403 of the substrate 401, and a through hole 410 is formed in the overlapping region. The through hole 410 is configured such that a conductor portion 412 is formed by plating or the like on the inner peripheral portion of a hole 411 that penetrates the substrate 401. The conductor portion 412 is electrically connected to the wiring 405 on the front surface 402 of the substrate 401 and is electrically connected to the back surface wiring 408 on the surface 403 on the opposite side of the substrate 401. The wiring 405 and the back surface wiring 408 are electrically connected via the through hole 410.

また、他の配線４０６，４０７は、基板４０１の表面４０２で貫通孔４０４の外周から他へ延びるようなパターンに形成されている。   Further, the other wirings 406 and 407 are formed in a pattern extending from the outer periphery of the through hole 404 to the other side on the surface 402 of the substrate 401.

また、貫通孔４０４は、上記貫通孔３０４と同様構成に形成されている。   Further, the through hole 404 is formed in the same configuration as the through hole 304.

スプレッダ４２０は、熱伝導部４２２と、電気伝導部４２４とを有している。熱伝導部４２２は、貫通孔４０４に埋設可能な形状に形成されている。電気伝導部４２４は、基板４０１の反対側の面４０３と同じ側にある熱伝導部４２２の表面を覆うと共に基板４０１の反対側の面４０３を部分的に覆う形状であり、その反対側の面４０３に接触可能なつば状の張出し部分４２４ａを有している。   The spreader 420 includes a heat conducting unit 422 and an electrical conducting unit 424. The heat conducting portion 422 is formed in a shape that can be embedded in the through hole 404. The electrically conductive portion 424 has a shape that covers the surface of the heat conducting portion 422 on the same side as the surface 403 on the opposite side of the substrate 401 and partially covers the surface 403 on the opposite side of the substrate 401. It has a flange-like overhanging portion 424 a that can contact 403.

この電気伝導部４２４の張出し部分４２４ａは、基板４０１の反対側の面４０３で裏面配線４０８に重ねるように配設されて、その裏面配線４０８に半田付け等で接続されている。そして、電気伝導部４２４は、裏面配線４０８からスルーホール４１０を介して配線４０５に電気的に接続される。   The overhanging portion 424a of the electric conductive portion 424 is disposed on the opposite surface 403 of the substrate 401 so as to overlap the back surface wiring 408, and is connected to the back surface wiring 408 by soldering or the like. Then, the electrically conductive portion 424 is electrically connected to the wiring 405 from the back surface wiring 408 through the through hole 410.

なお、本実施形態では、熱伝導部４２２は、導電性をも有しており、上記電気伝導部４２４と一体形成されている。このようなスプレッダ４２０は、例えば、銅や銅合金等の熱伝導性の良好な金属で形成される。   In the present embodiment, the heat conducting portion 422 also has conductivity, and is integrally formed with the electric conducting portion 424. Such a spreader 420 is formed of a metal having good thermal conductivity such as copper or copper alloy, for example.

素子４３０は、上記素子３と同様構成部材であり、基板４０１の表面４０２側で熱伝導部４２２上に載置される。スプレッダ４２０に対する素子４３０の固定は、例えば、半田付け等でなされる。そして、この素子４３０がスプレッダ４２０上に載置固定されることで、その端子の少なくとも一つ（例えば、熱伝導部４２２に接触する面にある端子）が熱伝導部４２２に半田付け等で接続される。このように熱伝導部４２２に接続された端子は、熱伝導部４２２から電気伝導部４２４、裏面配線４０８からスルーホール４１０を介して配線４０５に電気的に接続される。なお、他の端子は、上記第１の実施形態と同様に、配線４０６，４０７にワイヤボンディング等で接続されている。   The element 430 is a constituent member similar to the element 3 and is placed on the heat conducting portion 422 on the surface 402 side of the substrate 401. The element 430 is fixed to the spreader 420 by, for example, soldering. The element 430 is mounted and fixed on the spreader 420, so that at least one of the terminals (for example, a terminal on a surface in contact with the heat conducting unit 422) is connected to the heat conducting unit 422 by soldering or the like. Is done. The terminals connected to the heat conducting unit 422 in this manner are electrically connected to the wiring 405 from the heat conducting unit 422 through the through hole 410 and the back wiring 408 through the through hole 410. The other terminals are connected to the wirings 406 and 407 by wire bonding or the like, as in the first embodiment.

また、基板４０１の反対側の面４０３には、ヒートシンク４４０が設けられている。具体的には、スプレッダ４２０の電気伝導部４２４の下側表面に、絶縁フィルム４４２を介在させて当接させるようにしてヒートシンク４４０が取付けられている。そして、基板１の素子３とは反対側に伝達された熱は、例えばヒートシンク４４０を介して放出される。   A heat sink 440 is provided on the surface 403 on the opposite side of the substrate 401. Specifically, the heat sink 440 is attached to the lower surface of the electric conductive portion 424 of the spreader 420 so as to contact with the insulating film 442 interposed therebetween. The heat transmitted to the side of the substrate 1 opposite to the element 3 is released through, for example, the heat sink 440.

このように構成されたモジュールによると、熱伝導部４２２は、素子４３０で生じる熱を基板４０１に対して素子４３０とは反対側へと伝導することができる。よって、素子４３０で生じる熱が放出されやすい。   According to the module configured as described above, the heat conducting unit 422 can conduct the heat generated in the element 430 to the side opposite to the element 430 with respect to the substrate 401. Therefore, heat generated in the element 430 is easily released.

また、素子４３０を、熱伝導部４２２から電気伝導部４２４、裏面配線４０８及びスルーホール４１０を介して配線４０５に電気的に接続することができる。   Further, the element 430 can be electrically connected to the wiring 405 from the heat conducting portion 422 through the electric conducting portion 424, the back surface wiring 408, and the through hole 410.

しかも、電気伝導部４２４を基板４０１の反対側の面４０３に当接させるようにして、スプレッダ４２０を配設しているため、基板４０１の反対側の面４０３からのスプレッダ４２０の突出量は、電気伝導部４２４の厚み分（例えば１００μｍ）に応じた一定量となる。このため、電気伝導部４２４とヒートシンク４４０とを安定して当接させることができ、両者間の熱接触抵抗を安定させて安定した放熱を実現できると共に、ヒートシンク４４０を安定してしっかりと固定することができる。   In addition, since the spreader 420 is disposed so that the electrical conductive portion 424 is in contact with the surface 403 on the opposite side of the substrate 401, the amount of protrusion of the spreader 420 from the surface 403 on the opposite side of the substrate 401 is It becomes a certain amount corresponding to the thickness (for example, 100 μm) of the electric conductive portion 424. For this reason, the electric conduction part 424 and the heat sink 440 can be stably brought into contact with each other, the stable thermal radiation can be realized by stabilizing the thermal contact resistance between the two, and the heat sink 440 can be stably and firmly fixed. be able to.

また、電気伝導部４２４に当接させるようにしてヒートシンク４４０を取付けても、電気伝導部４２４と裏面配線４０８との間に応力が作用し難く、両者間の電気的な接続信頼性も良好である。   Further, even if the heat sink 440 is attached so as to be in contact with the electric conduction portion 424, stress is hardly applied between the electric conduction portion 424 and the back surface wiring 408, and the electrical connection reliability between the two is good. is there.

なお、上記第３実施形態では、電気伝導部４２４を裏面配線４０８に面接触させるようにして半田付けしているが、図９に示すようにしてもよい。   In the third embodiment, the electrical conductive portion 424 is soldered so as to be in surface contact with the back surface wiring 408, but may be as shown in FIG.

すなわち、図８に示すモジュールとの相違点を中心に説明すると、図９では、電気伝導部４２４の張出し部分４２４ａのうち、基板４０１の反対側の面４０３に対向する部分にバンプ状の突部５２５を形成している。突部５２５は、略半球状の突起形状を有している。この突部５２５は、裏面配線４０８と張出し部分４２４ａとの間隔を一定距離に保つ役割を有している。従って、張出し部分４２４ａの全体が裏面配線４０８から一定距離に保たれるようにするためには、突部５２５が少なくとも３つ形成されていることが好ましい。   That is, the difference from the module shown in FIG. 8 will be mainly described. In FIG. 9, a bump-like protrusion is formed on a portion of the overhanging portion 424a of the electric conduction portion 424 facing the surface 403 on the opposite side of the substrate 401. 525 is formed. The protrusion 525 has a substantially hemispherical protrusion shape. The protrusion 525 has a role of keeping the distance between the back surface wiring 408 and the overhang portion 424a at a constant distance. Accordingly, it is preferable that at least three protrusions 525 be formed so that the entire overhanging portion 424a is maintained at a constant distance from the back surface wiring 408.

そして、突部５２５を裏面配線４０８の表面に当接させた状態で、電気伝導部４２４と裏面配線４０８とが半田付けされる。このため、裏面配線４０８と張出し部分４２４ａとの間に、突部５２５の突出寸法分の間隔をあけた状態で、電気伝導部４２４と裏面配線４０８とが半田付けされ、それらの間の半田層５２６の厚みをなるべく一定にすることができる。これにより、基板４０１の反対側の面からの電気伝導部４２４の突出量をより安定化することができる。   Then, the electrical conductive portion 424 and the back surface wiring 408 are soldered in a state where the protrusion 525 is in contact with the surface of the back surface wiring 408. For this reason, the electrically conductive portion 424 and the back surface wiring 408 are soldered with a space corresponding to the protruding dimension of the protrusion 525 between the back surface wiring 408 and the overhang portion 424a, and a solder layer between them. The thickness of 526 can be made as constant as possible. Thereby, the protrusion amount of the electric conduction part 424 from the surface on the opposite side of the board | substrate 401 can be stabilized more.

また、上記第３実施形態では、電気伝導部４２４を一旦裏面配線４０８に接続し、裏面配線４０８からスルーホール４１０を経由して配線４０５に電気的に接続する構成としているが、図１０に示すようにしてもよい。   In the third embodiment, the electrical conductive portion 424 is temporarily connected to the back surface wiring 408, and is electrically connected to the wiring 405 from the back surface wiring 408 through the through hole 410, as shown in FIG. You may do it.

図８に示すモジュールとの相違点を中心に説明すると、図１０に示す例では、スルーホール６１０及び挿入端子部６２６を介して電気伝導部４２４を配線６０５に電気的に接続している。   The difference from the module shown in FIG. 8 will be mainly described. In the example shown in FIG. 10, the electrically conductive portion 424 is electrically connected to the wiring 605 through the through hole 610 and the insertion terminal portion 626.

基板４０１の表面４０２に形成された配線６０５は、電気伝導部４２４の上方領域に達するパターンに形成されている。そして、基板４０１のうち配線６０５と電気伝導部４２４との重複領域にスルーホール６１０が形成されている。スルーホール６１０は、基板４０１の表面４０２から反対側の面４０３に達する貫通孔６１１の内周面にメッキ等による導体部６１２が形成された構成とされている。なお、図１０では、裏面配線４０８を省略しているが、省略しなくともよい。   The wiring 605 formed on the surface 402 of the substrate 401 is formed in a pattern that reaches the upper region of the electric conduction portion 424. A through hole 610 is formed in the overlapping region between the wiring 605 and the electric conductive portion 424 in the substrate 401. The through hole 610 is configured such that a conductor portion 612 made of plating or the like is formed on the inner peripheral surface of the through hole 611 reaching the opposite surface 403 from the surface 402 of the substrate 401. In FIG. 10, the back surface wiring 408 is omitted, but it may not be omitted.

また、電気伝導部４２４には、挿入端子部６２６が形成されている。挿入端子部６２６は、電気伝導部４２４の張出し部分４２４ａうち熱伝導部４２２側の面（上面）から熱伝導部４２２側（上側）に向けて突出しており、上記各スルーホール６１０に対応する位置に形成されている。また、挿入端子部６２６は、スルーホール６１０に挿入可能なピン状に形成されており、スルーホール６１０に挿入されることで、上記導体部６１２と電気的に接触し、導体部６１２を経て配線６０５に電気的に接続される。なお、挿入端子部６２６がスルーホール６１０に挿入された状態で、半田付けされてもよい。   In addition, an insertion terminal portion 626 is formed in the electric conduction portion 424. The insertion terminal portion 626 protrudes from the surface (upper surface) on the heat conduction portion 422 side of the overhang portion 424a of the electric conduction portion 424 toward the heat conduction portion 422 (upper side), and is located at a position corresponding to each through hole 610. Is formed. Further, the insertion terminal portion 626 is formed in a pin shape that can be inserted into the through hole 610, and is electrically connected to the conductor portion 612 by being inserted into the through hole 610, and the wiring is made through the conductor portion 612. 605 is electrically connected. The insertion terminal portion 626 may be soldered in a state where the insertion terminal portion 626 is inserted into the through hole 610.

これにより、素子４３０は、熱伝導部４２２から電気伝導部４２４、挿入端子部６２６及びスルーホール６１０を介して配線６０５に電気的に接続される。この場合に、挿入端子部６２６は、スルーホール６１０に挿入されているので、それらの間を強固に接続することができる。このため、素子４３０と配線６０５間の電気的な接続信頼性を向上させることができる。   As a result, the element 430 is electrically connected to the wiring 605 from the heat conducting portion 422 through the electric conducting portion 424, the insertion terminal portion 626, and the through hole 610. In this case, since the insertion terminal portion 626 is inserted into the through hole 610, the insertion terminal portion 626 can be firmly connected between them. Therefore, electrical connection reliability between the element 430 and the wiring 605 can be improved.

なお、図９に示す例と図１０に示す例とを組合わせ、スルーホール６１０及び挿入端子部６２６、突部５２５の双方を用いた構成としてもよい。   Note that the example shown in FIG. 9 and the example shown in FIG. 10 may be combined to use the through hole 610, the insertion terminal portion 626, and the protrusion 525.

＜変形例＞
上記各実施形態では、熱伝導部２１，２３，３２２，４２２の周囲全体からはみ出るような電気伝導部２２，３２２，４２２が形成されているが、熱伝導部２１，２３，３２２，４２２の周囲から部分的にはみ出るように電気伝導部２２，３２４，４２４が形成されていてもよい。 <Modification>
In each of the above-described embodiments, the electric conductive portions 22, 322, 422 are formed so as to protrude from the entire periphery of the heat conducting portions 21, 23, 322, 422. The electrically conductive portions 22, 324 and 424 may be formed so as to partially protrude from.

また、電気伝導部２２，３２４，４２４は、熱伝導部２１，２３，３２２，４２２の表面の少なくとも一部を覆うだけであってもよい。   Moreover, the electric conduction parts 22, 324, 424 may only cover at least a part of the surface of the heat conduction parts 21, 23, 322, 422.

また、各実施形態では、熱伝導部２１，２３，３２２，４２２及び電気伝導部２２，３２４，４２４の平面視形状は長方形状に形成されているが、これらは円形など他の形状であってもよい。   Moreover, in each embodiment, although the planar view shape of the heat conductive parts 21,23,322,422 and the electric conductive parts 22,324,424 is formed in the rectangular shape, these are other shapes, such as a circle, Also good.

また、第１の実施形態で説明したように（図４参照）、第２及び第３の実施形態において、スプレッダ３２０の熱伝導部３２２，４２２は、素子３３０，４３０側からその反対側へといくに連れて順次大きくなる形状、即ち、熱伝導部３２２，４２２の方向Ｐに対する断面が、素子３３０，４３０から離れるに連れて拡がる形状であってもよい。これにより、素子３３０，４３０で生じた熱が、基板３０１，４０１に対して素子３３０，４３０とは反対側へと伝わりやすい。   Further, as described in the first embodiment (see FIG. 4), in the second and third embodiments, the heat conducting portions 322 and 422 of the spreader 320 are moved from the elements 330 and 430 to the opposite side. It may be a shape that gradually increases with time, that is, a shape in which the cross section in the direction P of the heat conducting portions 322 and 422 expands with distance from the elements 330 and 430. Thereby, the heat generated in the elements 330 and 430 is easily transferred to the opposite side of the elements 330 and 430 with respect to the substrates 301 and 401.

第１の実施形態にかかるモジュールを概念的に示す断面図である。It is sectional drawing which shows notionally the module concerning 1st Embodiment. 第１の実施形態にかかるモジュールを概念的に示す上面図である。It is a top view which shows notionally the module concerning 1st Embodiment. 第１の実施形態にかかるモジュールを概念的に示す上面図である。It is a top view which shows notionally the module concerning 1st Embodiment. 第１の実施形態にかかるモジュールを概念的に示す断面図である。It is sectional drawing which shows notionally the module concerning 1st Embodiment. 第２の実施形態にかかるモジュールを概念的に示す断面図である。It is sectional drawing which shows notionally the module concerning 2nd Embodiment. 第２の実施形態にかかるモジュールをい概念的に示す上面図である。It is a top view which shows the module concerning 2nd Embodiment notionally. 同上のモジュールに用いられるスプレッダを示す側面図である。It is a side view which shows the spreader used for a module same as the above. 第３の実施形態にかかるモジュールを概念的に示す断面図である。It is sectional drawing which shows notionally the module concerning 3rd Embodiment. 第３の実施形態にかかるモジュールの変形例を概念的に示す上面図である。It is a top view which shows notionally the modification of the module concerning 3rd Embodiment. 第３の実施形態にかかるモジュールの他の変形例を概念的に示す上面図である。It is a top view which shows notionally the other modification of the module concerning 3rd Embodiment.

符号の説明Explanation of symbols

１，３０１，４０１ 基板
３，３３０，４３０ 素子
１１，３０２，４０２ 表面
３０３，４０３ 反対側の面
１２，３０４，４０４ 貫通孔
１３，３０５，４０５，６０５ 配線
２１，２３，３２２，４２２ 熱伝導部
２２，３２４，４２４ 電気伝導部
２１１ 表面
３１０，４１０，６１０ スルーホール
３２６，６２６ 挿入端子部
４０８ 裏面配線
４２４ａ 張出し部分
５２５ 突部
５２６ 半田層
1,301,401 Substrate 3,330,430 Element 11,302,402 Surface 303,403 Opposite surface 12,304,404 Through hole 13,305,405,605 Wiring 21,23,322,422 Heat conduction part 22, 324, 424 Electrical conduction part 211 Surface 310, 410, 610 Through hole 326, 626 Insertion terminal part 408 Back surface wiring 424 a Overhang part 525 Projection part 526 Solder layer

Claims (4)

配線（１３）が形成された表面（１１）と貫通孔（１２）とを有する基板（１）と、
前記貫通孔に埋設される熱伝導部（２１；２３）と、
前記基板の前記表面と同じ側にある前記熱伝導部の表面（２１１）の少なくとも一部を覆い、前記基板の前記表面側から前記配線に接続される電気伝導部（２２）と、
前記電気伝導部上に載置され、前記電気伝導部側で電気的に接続される素子（３）と
を備える、モジュール。 A substrate (1) having a surface (11) on which a wiring (13) is formed and a through hole (12);
A heat conduction part (21; 23) embedded in the through hole;
An electrically conductive portion (22) that covers at least a portion of the surface (211) of the heat conducting portion on the same side as the surface of the substrate and is connected to the wiring from the surface side of the substrate;
A module comprising: an element (3) placed on the electric conduction part and electrically connected on the electric conduction part side. 前記素子（３）は前記熱伝導部（２１；２３）の直上に位置する、請求項１記載のモジュール。   2. Module according to claim 1, wherein the element (3) is located directly above the heat conducting part (21; 23). 前記熱伝導部（２３）は、前記貫通孔（１２）が前記基板（１）を貫通する方向に対する断面が、前記素子（３）から離れるに連れて拡がる、請求項１または請求項２記載のモジュール。   The said heat conduction part (23) is a cross section with respect to the direction through which the said through-hole (12) penetrates the said board | substrate (1), and expands, as it leaves | separates from the said element (3). module. 前記熱伝導部（２１；２３）と前記電気伝導部（２２）とは同じ物質からなる、請求項１乃至請求項３のいずれか一つに記載のモジュール。   The module according to any one of claims 1 to 3, wherein the heat conducting portion (21; 23) and the electric conducting portion (22) are made of the same material.
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