JP4833421B2 - Light emitting device and mounting board - Google Patents

Light emitting device and mounting board Download PDF

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Publication number
JP4833421B2
JP4833421B2 JP2001064506A JP2001064506A JP4833421B2 JP 4833421 B2 JP4833421 B2 JP 4833421B2 JP 2001064506 A JP2001064506 A JP 2001064506A JP 2001064506 A JP2001064506 A JP 2001064506A JP 4833421 B2 JP4833421 B2 JP 4833421B2
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light emitting
insulating substrate
mounting
emitting element
internal electrodes
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JP2002270903A (en
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宏基 石長
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Rohm Co Ltd
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Rohm Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

PROBLEM TO BE SOLVED: To provide a back emission chip-type light emitting device which is soldered by reflow soldering or dip soldering and high in degree of freedom of mounting. SOLUTION: A pair of internal electrodes 2a and 3a is formed in the inner region of one surface 1a of a nearly rectangular insulating board 1. Wirings 2b and 3b are extended from the internal electrodes 2a and 3a toward one side edge of the insulating board 1. A light emitting chip 4 is connected between the internal electrodes 2a and 3a via bonding wires 5. External electrodes 10 and 11 are formed around corners of the side edge of the insulating board 1. The wires 2b and 3b are connected to the external electrodes 10 and 11. No external electrode is provided to the other side edge of the surface 1a of the board 1, and the other side edge of the surface 1a ensures a temporarily fixing region 13.

Description

【０００１】
【発明の属する技術分野】
本発明は、センサや各種薄型機器などに組み込まれる発光素子、特に、裏面発光チップ型発光素子、およびそれを用いた実装基板に関するものである。
【０００２】
【従来の技術】
図３は、従来の裏面発光チップ型発光素子の構造を示す図解的な断面図であり、図４は、その図解的な平面図である。
矩形の絶縁基板５１の一方表面５１ａ上には、その内方の領域に１対の矩形の内部電極５２ａ，５３ａが形成されている。内部電極５２ａ，５３ａからは、対向する端辺に向かって帯状の配線部５２ｂ，５３ｂがそれぞれ延設されている。内部電極５２ａ，５３ａ、および配線部５２ｂ，５３ｂは、絶縁基板５１の両側辺の中央に沿って配されている。内部電極５２ａと内部電極５３ａとは、一定の間隔をあけて対向している。
【０００３】
一方の内部電極５２ａ上には１つの発光体チップ５４がダイボンディングされている。この発光体チップ５４は、他方の内部電極５３ａとボンディングワイヤ５５で電気的に接続されている。絶縁基板５１の一方表面５１ａ上において、発光体チップ５４、ボンディングワイヤ５５、および内部電極５３ａ，５３ｂを含む領域は、透光性部材５６によって保護されている。
絶縁基板５１の端辺付近には、一方表面５１ａ上から端面にかけて、外部電極５７，５８が形成されている。外部電極５７，５８は、導電性および半田濡れ性を有する材料により、前記２つの端辺の全幅にわたって形成されている。配線部５２ｂと外部電極５７とは接続されており、配線部５３ｂと外部電極５８とは接続されている。
【０００４】
この裏面発光チップ型発光素子が実装される実装基板６１は、貫通孔６０を備えている。実装面６１ａ上で貫通孔６０近傍には、電極パッド６２が形成されている。実装にあたって、たとえば、電極パッド６２上にクリーム半田が塗布される。そして、透光性部材５６が貫通孔６０に挿入され、外部電極５７，５８がクリーム半田上に載置された後、裏面発光チップ型発光素子が実装基板６１の上になる向きでリフロー加熱される。
【０００５】
これにより、電極パッド６２と外部電極５７，５８とが、半田５９によって接合される。外部電極５７，５８は絶縁基板５１の一方表面５１ａ上と端面との２面に形成されているので、裏面発光チップ型発光素子は、絶縁基板５１の上面および端面から支持されることになる。実装後は、矢印Ａの方向、すなわち実装基板６１の実装面６１ａとは反対側から、裏面発光チップ型発光素子の発光を見ることができる。
【０００６】
【発明が解決しようとする課題】
ところが、この裏面発光チップ型発光素子を実装基板６１に実装する際、裏面発光チップ型発光素子の一方表面５１ａ上において、電極パッド６２に対向する領域の大部分には、半田で接続されるべき外部電極５７，５８が存在している。このため、この裏面発光チップ型発光素子を予め実装基板６１に仮固定して、フロー半田付けやディップ半田付けをしようとすると、仮固定のための接着剤は、外部電極５７，５８が配置されている領域の少なくとも一部に塗布せざるを得ない。このような領域に接着剤を塗布すると、外部電極５７，５８と電極パッド６２との接合不良を招く。すなわち、裏面発光チップ型発光素子の一方表面５１ａ上において、接合を妨げずに仮固定のための接着剤を塗布できる領域がほとんど存在しない。したがって、このような裏面発光チップ型発光素子は、実装基板への実装方法がリフロー半田付けなどに限られていた。
【０００７】
このため、実装基板への部品の実装が、全体としてフロー半田付けやディップ半田付けに適したものであっても、裏面発光チップ型発光素子だけのためにリフロー半田付けを行わなければならず、生産の合理性を欠くことがあった。
そこで、本発明の目的は、フロー半田付けやディップ半田付けをすることが可能な発光素子、およびそれを用いた実装基板を提供することである。
本発明の他の目的は、実装方法の選択の幅が広い発光素子、およびそれを用いた実装基板を提供することである。
【０００８】
【課題を解決するための手段および発明の効果】
上記の課題を解決するための、請求項１記載の発明は、実装基板に面実装された発光素子であって、１対の端辺、および各端辺の両端部に位置する角部を有する形状の絶縁基板と、この絶縁基板の一方表面の内方の領域に形成された２つの内部電極と、上記絶縁基板の上記一方表面上に設けられ、上記２つの内部電極に接続された発光体チップと、上記絶縁基板の上記一方表面上に形成され、上記２つの内部電極から上記絶縁基板の縁部に向かって延設された２つの配線部と、上記絶縁基板の上記一方表面の一端辺の両角部に形成され、上記２つの配線部にそれぞれ電気接続された２つの外部電極と、上記絶縁基板の上記一方表面の縁部付近において、上記外部電極が形成された側の一端辺とは反対側の一端辺付近に確保された仮固定領域とを含み、上記絶縁基板の上記外部電極が設けられた側の上記両角部には、スルーホールが形成されており、上記外部電極が、半田によりフィレットを形成するように実装基板に接合されており、上記仮固定領域は、実装基板の実装面において、上記半田とは異なる接着剤で実装基板に接着されていることを特徴とする発光素子である。
【０００９】
この発明の構成によれば、仮固定領域に仮固定用の接着剤を塗布して、裏面発光チップ型発光素子を実装基板に仮固定することができる。この状態で、実装基板の電極パッドと裏面発光チップ型発光素子の外部電極との間に溶融半田を導入して半田付けを行うことができる。すなわち、所定時間、電極パッドと外部電極との対向部に、流動している溶融半田を導入（フロー半田付け）するか、または、外部電極と電極パッドとを含む部分を静止した溶融半田の中に浸漬（ディップ半田付け）する。これにより、電極パッドと外部電極とが、半田によって接合される。すなわち、この裏面発光チップ型発光素子は、フロー半田付けやディップ半田付けにより、実装基板に実装することが可能である。
【００１０】
無論、この裏面発光チップ型発光素子をリフロー半田付けにより実装基板に実装することも可能である。したがって、この裏面発光チップ型発光素子は、実装方法の選択の幅が広い。
上記２つの配線部は、上記内部電極から共通の方向に延設されていてもよい。上記２つの配線部は略平行に配されたものであってもよい。上記仮固定領域は、上記２つの内部電極に対して、上記外部電極とは反対側に確保されていてもよい。絶縁基板の縁部において、外部電極を一方向側に集めることにより、内部電極に対して外部電極とは反対側に広い仮固定領域を確保することができる。したがって、この裏面発光チップ型発光素子を、接着剤を用いて実装基板に強固に仮固定することができる。
【００１１】
上記絶縁基板は、略矩形状を有するものであってもよい。この場合、この絶縁基板の一端辺の両角部付近に上記外部電極が配置され、上記絶縁基板の上記一端辺に対向する他の端辺付近に、上記仮固定領域が確保されていてもよい。上記他の端辺付近には、いずれの外部電極（電気接合部）も設けられていないことが好ましい。
この構成により、外部電極と実装基板の電極パッドとの接合を妨げることなく、実装基板に対する裏面発光チップ型発光素子の仮固定を行うことができる。
【００１２】
外部電極は、前記一方表面からこの４分の１スルーホールの内面にかけて形成されていてもよい。
請求項２記載の発明は、上記外部電極が形成された側の一端辺とは反対側の一端辺の両角部には、スルーホールが形成されていないことを特徴とする請求項１に記載の発光素子である。
請求項３記載の発明は、上記２つの内部電極の一方に、発光体チップがダイボンディングされており、上記発光体チップと、上記２つの内部電極の他方とが、ボンディングワイヤにより接続されていることを特徴とする請求項１または２に記載の発光素子である。
請求項４記載の発明は、上記発光体チップを覆う透光性部材をさらに含むことを特徴とする請求項１ないし３のいずれかに記載の発光素子である。
請求項５記載の発明は、貫通孔が形成された実装基板であって、当該実装基板の一方表面に設けられた、電極パッド、および仮固定用の上記接着剤と、上記一方表面に設けられた請求項１ないし４のいずれかに記載の発光素子であって、上記仮固定用の上記接着剤が上記仮固定領域に接着され、当該発光素子が発する光が、上記貫通孔を介して、当該実装基板の上記一方表面とは反対側の他方表面側に取り出されるように設けられた発光素子とを含む実装基板である。
【００１３】
【発明の実施の形態】
以下では、この発明の実施の形態を、添付図面を参照して詳細に説明する。
図１は、この発明の一実施形態に係る裏面発光チップ型発光素子の図解的な側面図であり、図２はその図解的な平面図である。
略矩形の絶縁基板１の一方表面１ａ上には、内方の領域に、１対の矩形の内部電極２ａ，３ａが形成されている。内部電極２ａ，３ａからは、共通の方向、すなわち絶縁基板１の一端辺に向かって帯状の配線部２ｂ，３ｂが延設されて（引き出されて）いる。配線部２ｂ，３ｂは、端辺付近を除き互いに平行である。内部電極２ａと内部電極３ａとは、上記端辺に平行な方向に一定の間隔をあけて対向している。
【００１４】
内部電極２ａ上には発光体チップ４がダイボンディングされている。発光体チップ４は、発光ダイオードチップとすることができる。この発光体チップ４と内部電極３ａとが、ボンディングワイヤ５により接続されている。
絶縁基板１の一方表面１ａ上において、発光体チップ４、ボンディングワイヤ５、内部電極２ａ，３ａを含む領域は、透光性部材６によって保護されている。
絶縁基板１の上記一端辺上の両角部には、４分の１スルーホールが形成されており、この両角部付近には、４分の１スルーホールの内面１ｔから一方表面１ａにかけて、外部電極１０，１１が形成されている。外部電極１０，１１は、導電性および半田濡れ性を有する材料により構成されている。絶縁基板１の他の２つの角部には、４分の１スルーホールは形成されていない。
【００１５】
配線部２ｂと外部電極１０とは接続されており、配線部３ｂと外部電極１１とは接続されている。以上の接続状態により、外部電極１０と外部電極１１との間に通電すれば、発光体チップ４が発光する。
絶縁基板１の一方表面１ａ上で、上記一端辺に対向する他の端辺、すなわち、４分の１スルーホールが形成されていない２つの角部を含む端辺付近には、いずれの外部電極（電気接合部）も設けられておらず、仮固定領域１３となっている。
【００１６】
この裏面発光チップ型発光素子が実装される実装基板７（図１参照）上には、外部電極１０，１１に対向する位置に電極パッド８が形成されている。実装にあたって、まず、仮固定領域１３と実装基板７とが対向する部分に仮固定用の接着剤１２を介在させることにより、裏面発光チップ型発光素子を、実装基板７の所定位置に仮固定する。次に、所定時間、外部電極１０，１１と電極パッド８との対向部に、流動している溶融半田を導入（フロー半田付け）するか、または、外部電極１０，１１と電極パッド８とを含む部分を静止した溶融半田の中に浸漬（ディップ半田付け）する。これにより、電極パッド８と外部電極１０，１１とが、半田９によって接合される。
【００１７】
仮固定領域１３には、いずれの外部電極（電気接合部）も設けられていない。したがって、外部電極１０，１１と実装基板７の電極パッド８との接合を妨げることなく、実装基板７に対する裏面発光チップ型発光素子の仮固定を行うことができる。
外部電極１０，１１は、絶縁基板１の一方表面１ａ上と４分の１スルーホールの内面１ｔとの２面に形成されているので、裏面発光チップ型発光素子は絶縁基板１の上面および上面に垂直な面から支持されることになる。
【００１８】
無論、この裏面発光チップ型発光素子をリフロー半田付けにより実装基板７に実装することも可能である。その場合、電極パッド８上にクリーム半田を塗布し、外部電極１０，１１がクリーム半田と対向するように裏面発光チップ型発光素子が載置された後、裏面発光チップ型発光素子が実装基板７の上になる向きでリフロー加熱する。これにより、電極パッド８と外部電極１０，１１とが、半田９によって接合される。したがって、この裏面発光チップ型発光素子は、実装方法の選択の幅が広い。
【００１９】
透光性部材６の上部を球面状とし、いわゆるレンズ付きの裏面発光チップ型発光素子とすることもできる。
仮固定領域は、必ずしも一端辺の全幅にわたって設けられている必要はない。絶縁基板は、略矩形でなくてもよい。その他、特許請求の範囲に記載された事項の範囲で種々の設計変更を施すことが可能である。
【図面の簡単な説明】
【図１】本発明の一実施形態に係る裏面発光チップ型発光素子の図解的な断面図である。
【図２】図１の裏面発光チップ型発光素子の図解的な平面図である。
【図３】従来の裏面発光チップ型発光素子の図解的な断面図である。
【図４】図３の裏面発光チップ型発光素子の図解的な平面図である。
【符号の説明】
１ 絶縁基板
２ａ，３ａ 内部電極
３ａ，３ｂ 配線部
４ 発光体チップ
１０，１１ 外部電極
１３ 仮固定領域[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting element incorporated in a sensor, various thin devices, and the like , in particular, a backside light emitting chip type light emitting element , and a mounting substrate using the same .
[0002]
[Prior art]
FIG. 3 is a schematic sectional view showing the structure of a conventional backside light emitting chip type light emitting element, and FIG. 4 is a schematic plan view thereof.
On one surface 51a of the rectangular insulating substrate 51, a pair of rectangular internal electrodes 52a and 53a are formed in the inner region. From the internal electrodes 52a and 53a, strip-shaped wiring portions 52b and 53b extend toward the opposite end sides, respectively. The internal electrodes 52 a and 53 a and the wiring parts 52 b and 53 b are arranged along the center of both sides of the insulating substrate 51. The internal electrode 52a and the internal electrode 53a are opposed to each other with a certain interval.
[0003]
One light emitter chip 54 is die-bonded on one internal electrode 52a. The light emitting chip 54 is electrically connected to the other internal electrode 53 a by a bonding wire 55. On the one surface 51 a of the insulating substrate 51, a region including the light emitting chip 54, the bonding wire 55, and the internal electrodes 53 a and 53 b is protected by a translucent member 56.
In the vicinity of the end side of the insulating substrate 51, external electrodes 57 and 58 are formed from one surface 51a to the end surface. The external electrodes 57 and 58 are formed over the entire width of the two ends by a material having conductivity and solder wettability. The wiring part 52b and the external electrode 57 are connected, and the wiring part 53b and the external electrode 58 are connected.
[0004]
The mounting substrate 61 on which the backside light emitting chip type light emitting element is mounted includes a through hole 60. An electrode pad 62 is formed in the vicinity of the through hole 60 on the mounting surface 61a. For mounting, for example, cream solder is applied on the electrode pads 62. Then, after the translucent member 56 is inserted into the through hole 60 and the external electrodes 57 and 58 are placed on the cream solder, the back light emitting chip type light emitting element is reflow-heated so as to be on the mounting substrate 61. The
[0005]
Thereby, the electrode pad 62 and the external electrodes 57 and 58 are joined by the solder 59. Since the external electrodes 57 and 58 are formed on the two surfaces of the one surface 51 a and the end surface of the insulating substrate 51, the backside light emitting chip type light emitting element is supported from the upper surface and the end surface of the insulating substrate 51. After mounting, light emission of the backside light emitting chip type light emitting element can be seen from the direction of arrow A, that is, from the side opposite to the mounting surface 61a of the mounting substrate 61.
[0006]
[Problems to be solved by the invention]
However, when this backside light emitting chip type light emitting element is mounted on the mounting substrate 61, a large part of the region facing the electrode pad 62 on one surface 51a of the backside light emitting chip type light emitting element should be connected by solder. External electrodes 57 and 58 are present. For this reason, when this backside light emitting chip type light emitting device is temporarily fixed to the mounting substrate 61 in advance and the flow soldering or the dip soldering is attempted, the external electrodes 57 and 58 are disposed as the adhesive for the temporary fixing. It must be applied to at least a part of the area. If an adhesive is applied to such a region, poor bonding between the external electrodes 57 and 58 and the electrode pad 62 is caused. That is, on the one surface 51a of the backside light emitting chip type light emitting element, there is almost no region where an adhesive for temporary fixing can be applied without hindering bonding. Therefore, in such a backside light emitting chip type light emitting element, the mounting method on the mounting substrate is limited to reflow soldering.
[0007]
For this reason, even if the mounting of components on the mounting board is suitable for flow soldering and dip soldering as a whole, reflow soldering must be performed only for the backside light emitting chip type light emitting element, There was a lack of rational production.
An object of the present invention is to provide a mounting substrate using the available light emission element to the soldering or dip soldering flow, and it.
Another object of the present invention is to provide a mounting substrate using light emission element width selection implementation is not wide, and it.
[0008]
[Means for Solving the Problems and Effects of the Invention]
In order to solve the above-mentioned problem, the invention according to claim 1 is a light emitting element surface-mounted on a mounting substrate , and has a pair of end sides and corner portions located at both end portions of each end side. Shaped insulating substrate, two internal electrodes formed in an inner region of one surface of the insulating substrate, and a light emitting body provided on the one surface of the insulating substrate and connected to the two internal electrodes A chip, two wiring portions formed on the one surface of the insulating substrate and extending from the two internal electrodes toward the edge of the insulating substrate, and one end of the one surface of the insulating substrate Two external electrodes formed at both corners and electrically connected to the two wiring portions, respectively, and one end side on the side where the external electrodes are formed in the vicinity of the edge of the one surface of the insulating substrate. Temporary fixing area secured near one end of the opposite side Through holes are formed in both corners of the insulating substrate on the side where the external electrodes are provided, and the external electrodes are joined to the mounting substrate so as to form a fillet by soldering. The temporary fixing region is a light emitting element in which the mounting surface of the mounting substrate is bonded to the mounting substrate with an adhesive different from the solder .
[0009]
According to the structure of this invention, the adhesive agent for temporary fixing can be apply | coated to a temporary fixing area | region, and a back surface light emitting chip type light emitting element can be temporarily fixed to a mounting substrate. In this state, it is possible to perform soldering by introducing molten solder between the electrode pad of the mounting substrate and the external electrode of the backside light emitting chip type light emitting element. That is, flowing molten solder is introduced (flow soldering) into the facing portion between the electrode pad and the external electrode for a predetermined time, or the portion including the external electrode and the electrode pad is placed in a stationary molten solder. Immerse in (dip soldering). Thereby, an electrode pad and an external electrode are joined by solder. That is, this backside light emitting chip type light emitting element can be mounted on a mounting substrate by flow soldering or dip soldering.
[0010]
Of course, it is also possible to mount the backside light emitting chip type light emitting element on the mounting substrate by reflow soldering. Therefore, the backside light emitting chip type light emitting element has a wide range of selection of mounting methods.
The two wiring portions may be extended from the internal electrode in a common direction. The two wiring portions may be arranged substantially in parallel. The temporary fixing region may be secured on the opposite side to the external electrode with respect to the two internal electrodes. By gathering the external electrodes on one side at the edge of the insulating substrate, a wide temporary fixing region can be secured on the opposite side of the internal electrodes from the external electrodes. Therefore, the backside light emitting chip type light emitting element can be firmly fixed temporarily to the mounting substrate using the adhesive.
[0011]
The insulating substrate may have a substantially rectangular shape. In this case, the external electrode may be disposed near both corners of one end of the insulating substrate, and the temporary fixing region may be secured near another end facing the one end of the insulating substrate. It is preferable that no external electrode (electrical joint) is provided near the other end side.
With this configuration, the backside light emitting chip type light emitting element can be temporarily fixed to the mounting substrate without hindering the bonding between the external electrode and the electrode pad of the mounting substrate.
[0012]
The external electrode may be formed from the one surface to the inner surface of the quarter through hole.
The invention according to claim 2 is characterized in that through holes are not formed at both corners of one end side opposite to the one end side on which the external electrode is formed. It is a light emitting element.
According to a third aspect of the present invention, a light emitting chip is die-bonded to one of the two internal electrodes, and the light emitting chip and the other of the two internal electrodes are connected by a bonding wire. The light-emitting element according to claim 1 or 2.
A fourth aspect of the present invention is the light emitting device according to any one of the first to third aspects, further comprising a translucent member that covers the light emitting chip.
According to a fifth aspect of the invention, a mounting board having a through hole formed, provided on one surface of the mounting substrate, and the electrode pads, and the temporary fixing of the adhesive, provided on the one surface a light-emitting device according to any one of claims 1 to 4, the adhesive of the temporary fixing is bonded to the temporary fixing region, light the light-emitting element is emitted through the through hole, The mounting board includes a light emitting element provided so as to be taken out to the other surface side opposite to the one surface of the mounting board.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic side view of a backside light emitting chip type light emitting device according to an embodiment of the present invention, and FIG. 2 is a schematic plan view thereof.
On one surface 1a of the substantially rectangular insulating substrate 1, a pair of rectangular internal electrodes 2a and 3a are formed in the inner region. From the internal electrodes 2a and 3a, strip-like wiring portions 2b and 3b are extended (extracted) in a common direction, that is, toward one end of the insulating substrate 1. The wiring portions 2b and 3b are parallel to each other except near the end sides. The internal electrode 2a and the internal electrode 3a are opposed to each other with a certain interval in a direction parallel to the end side.
[0014]
A light emitting chip 4 is die-bonded on the internal electrode 2a. The light emitter chip 4 can be a light emitting diode chip. The light emitting chip 4 and the internal electrode 3 a are connected by a bonding wire 5.
On the one surface 1 a of the insulating substrate 1, a region including the light emitting chip 4, the bonding wire 5, and the internal electrodes 2 a and 3 a is protected by the translucent member 6.
A quarter through hole is formed at both corners on the one end side of the insulating substrate 1, and an external electrode is formed near the both corners from the inner surface 1 t of the quarter through hole to one surface 1 a. 10 and 11 are formed. The external electrodes 10 and 11 are made of a material having conductivity and solder wettability. A quarter through hole is not formed in the other two corners of the insulating substrate 1.
[0015]
The wiring part 2b and the external electrode 10 are connected, and the wiring part 3b and the external electrode 11 are connected. When the current is applied between the external electrode 10 and the external electrode 11 in the above connection state, the light emitting chip 4 emits light.
On the one surface 1a of the insulating substrate 1, there is no external electrode in the vicinity of the other end facing the one end, that is, the end including two corners where the quarter through-hole is not formed. (Electrical junction) is not provided, and is a temporarily fixed region 13.
[0016]
On the mounting substrate 7 (see FIG. 1) on which the backside light emitting chip type light emitting element is mounted, an electrode pad 8 is formed at a position facing the external electrodes 10 and 11. In mounting, first, the backside light emitting chip type light emitting element is temporarily fixed at a predetermined position of the mounting substrate 7 by interposing a temporary fixing adhesive 12 at a portion where the temporary fixing region 13 and the mounting substrate 7 face each other. . Next, for a predetermined time, flowing molten solder is introduced (flow soldering) into the facing portion between the external electrodes 10 and 11 and the electrode pad 8, or the external electrodes 10 and 11 and the electrode pad 8 are connected to each other. The part to be included is immersed (dip soldering) in a stationary molten solder. As a result, the electrode pad 8 and the external electrodes 10 and 11 are joined by the solder 9.
[0017]
None of the external electrodes (electrical joints) is provided in the temporary fixing region 13. Therefore, the backside light emitting chip type light emitting element can be temporarily fixed to the mounting substrate 7 without hindering the bonding between the external electrodes 10 and 11 and the electrode pads 8 of the mounting substrate 7.
Since the external electrodes 10 and 11 are formed on the two surfaces of the one surface 1a of the insulating substrate 1 and the inner surface 1t of the quarter through-hole, the backside light emitting chip type light emitting element is formed on the upper surface and the upper surface of the insulating substrate 1. It will be supported from a plane perpendicular to.
[0018]
Of course, it is also possible to mount this backside light emitting chip type light emitting element on the mounting substrate 7 by reflow soldering. In that case, after applying cream solder on the electrode pad 8 and mounting the backside light emitting chip type light emitting element so that the external electrodes 10 and 11 face the cream solder, the backside light emitting chip type light emitting element is mounted on the mounting substrate 7. Reflow heating in the direction of the top. As a result, the electrode pad 8 and the external electrodes 10 and 11 are joined by the solder 9. Therefore, the backside light emitting chip type light emitting element has a wide range of selection of mounting methods.
[0019]
The upper part of the translucent member 6 may have a spherical shape, so that a so-called backside light emitting chip type light emitting element with a lens can be obtained.
Temporarily fixing region need not name that is necessarily provided over the entire width of the one edge. The insulating substrate may not be substantially rectangular. In addition, various design changes can be made within the scope of matters described in the claims.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of a backside light emitting chip type light emitting device according to an embodiment of the present invention.
2 is a schematic plan view of the backside light emitting chip type light emitting device of FIG. 1. FIG.
FIG. 3 is a schematic cross-sectional view of a conventional backside light emitting chip type light emitting device.
4 is a schematic plan view of the backside light emitting chip type light emitting device of FIG. 3. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2a, 3a Internal electrode 3a, 3b Wiring part 4 Light emitter chip | tip 10, 11 External electrode 13 Temporary fixing area | region

Claims (5)

実装基板に面実装された発光素子であって、
１対の端辺、および各端辺の両端部に位置する角部を有する形状の絶縁基板と、
この絶縁基板の一方表面の内方の領域に形成された２つの内部電極と、
上記絶縁基板の上記一方表面上に設けられ、上記２つの内部電極に接続された発光体チップと、
上記絶縁基板の上記一方表面上に形成され、上記２つの内部電極から上記絶縁基板の縁部に向かって延設された２つの配線部と、
上記絶縁基板の上記一方表面の一端辺の両角部に形成され、上記２つの配線部にそれぞれ電気接続された２つの外部電極と、
上記絶縁基板の上記一方表面の縁部付近において、上記外部電極が形成された側の一端辺とは反対側の一端辺付近に確保された仮固定領域とを含み、
上記絶縁基板の上記外部電極が設けられた側の上記両角部には、スルーホールが形成されており、
上記外部電極が、半田によりフィレットを形成するように実装基板に接合されており、
上記仮固定領域は、実装基板の実装面において、上記半田とは異なる接着剤で実装基板に接着されていることを特徴とする発光素子。 A light emitting device surface-mounted on a mounting board,
An insulating substrate having a pair of edges and a corner located at both ends of each edge;
Two internal electrodes formed in an inner region of one surface of the insulating substrate;
A light emitting chip provided on the one surface of the insulating substrate and connected to the two internal electrodes;
Two wiring portions formed on the one surface of the insulating substrate and extending from the two internal electrodes toward the edge of the insulating substrate;
Two external electrodes formed at both corners of one end of the one surface of the insulating substrate and electrically connected to the two wiring parts,
In the vicinity of the edge of the one surface of the insulating substrate, including a temporary fixing region secured near one end side opposite to the one end side on which the external electrode is formed,
Through holes are formed in both corners of the insulating substrate on the side where the external electrodes are provided ,
The external electrode is bonded to the mounting substrate so as to form a fillet with solder,
The light-emitting element , wherein the temporary fixing region is bonded to the mounting board with an adhesive different from the solder on the mounting surface of the mounting board . 上記外部電極が形成された側の一端辺とは反対側の一端辺の両角部には、スルーホールが形成されていないことを特徴とする請求項１に記載の発光素子。  2. The light emitting device according to claim 1, wherein through holes are not formed at both corners of one end side opposite to the one end side on which the external electrode is formed. 上記２つの内部電極の一方に、発光体チップがダイボンディングされており、上記発光体チップと、上記２つの内部電極の他方とが、ボンディングワイヤにより接続されていることを特徴とする請求項１または２に記載の発光素子。  The light emitter chip is die-bonded to one of the two internal electrodes, and the light emitter chip and the other of the two internal electrodes are connected by a bonding wire. Or the light emitting element of 2. 上記発光体チップを覆う透光性部材をさらに含むことを特徴とする請求項１ないし３のいずれかに記載の発光素子。  The light-emitting element according to claim 1, further comprising a translucent member that covers the light-emitting chip. 貫通孔が形成された実装基板であって、
当該実装基板の一方表面に設けられた、電極パッド、および仮固定用の上記接着剤と、
上記一方表面に設けられた請求項１ないし４のいずれかに記載の発光素子であって、上記仮固定用の上記接着剤が上記仮固定領域に接着され、当該発光素子が発する光が、上記貫通孔を介して、当該実装基板の上記一方表面とは反対側の他方表面側に取り出されるように設けられた発光素子とを含む実装基板。A mounting board in which a through hole is formed,
Provided on one surface of the mounting substrate, and the adhesive of the electrode pads, and the temporary fixing,
A light emitting device according to any one of 4 claims 1 provided on the one surface, the adhesive of the temporary fixing is bonded to the temporary fixing region, the light which the light emitting element emits, the A mounting substrate including a light emitting element provided so as to be taken out to the other surface side opposite to the one surface of the mounting substrate through a through hole.
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US20060292747A1 (en) * 2005-06-27 2006-12-28 Loh Ban P Top-surface-mount power light emitter with integral heat sink
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