WO2018120449A1 - Structure d'extrémité de soudage et composant - Google Patents

Structure d'extrémité de soudage et composant Download PDF

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Publication number
WO2018120449A1
WO2018120449A1 PCT/CN2017/077386 CN2017077386W WO2018120449A1 WO 2018120449 A1 WO2018120449 A1 WO 2018120449A1 CN 2017077386 W CN2017077386 W CN 2017077386W WO 2018120449 A1 WO2018120449 A1 WO 2018120449A1
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WO
WIPO (PCT)
Prior art keywords
terminal
component
end structure
groove
soldering
Prior art date
Application number
PCT/CN2017/077386
Other languages
English (en)
Chinese (zh)
Inventor
刘立平
易源
谷日辉
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201780009699.XA priority Critical patent/CN108604581B/zh
Publication of WO2018120449A1 publication Critical patent/WO2018120449A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present application relates to the field of electronic device technologies, and in particular, to a solder joint structure and components.
  • SMT Surface Mounted Technology
  • pads are placed on the printed board, and soldered ends are placed on the components. By soldering the soldered ends to the pads, the components can be soldered to the printed board. On the board.
  • FIG. 1 is a welding end structure in the prior art.
  • the welding end structure 01 includes a side terminal 011 extending in the longitudinal direction and a lower end extending from the side terminal 011 and extending in the lateral direction.
  • Bottom terminal 012. 2 is a schematic structural view of a component 02 with a soldering end structure 01.
  • the component 02 includes a component body 021 and a soldering end structure 01, and a side terminal 011 and a component body 021 in the soldering end structure 01.
  • FIG. 3 is a schematic structural view of the component 02 after being fixed on the printed board 03.
  • the printed board 03 is provided with a pad 031, and the bottom terminal 012 and the part of the pad 031 in the soldering end structure 01.
  • the side terminal 011 in the soldering end structure 01 and the other partial area on the pad 031 form a right-angled area 04, and by melting the solder in the right-angled area 04, the molten tin can be infiltrated and transferred in the lateral direction.
  • the tin plating of the lower surface of the bottom terminal 012 is melted and the bottom terminal 012 and the pad 031 are fixed, and the molten tin is infiltrated and transferred in the longitudinal direction to melt the tin plating on the outer surface of the side terminal 011, and the side terminal 011 is externally
  • the tin plating on the surface is integrated with the molten tin in the right angle region, and the component 02 can be firmly fixed to the printed board 03 after the tin is cooled.
  • the solder joint structure 01 is in the bending forming process, the tin plating at the corner between the outer surface of the side terminal 011 and the lower surface of the bottom terminal 012 (see the position A in FIG. 2) is easily torn by stretching.
  • the lead 022 is soldered on the lower surface of the bottom terminal 012 (see the position of B in FIG. 2), the tin plating on the lower surface of the bottom terminal 012 is partially melted and shrunk, so that the outer surface of the side terminal 011 is The inner layer material is exposed at a corner between the lower surface of the bottom terminal 012.
  • the inner layer material is usually a copper substrate or a nickel plating layer.
  • the copper and nickel are easily oxidized in the air, and the solder joint structure 01 is bonded to the component.
  • the heating and baking process after the body 021 further exacerbates the oxidation of copper and nickel, and the oxide layer formed by the oxidation will prevent the molten tin in the right-angled region 04 from penetrating in the lateral direction and the longitudinal direction, resulting in the solder in the right-angled region not being able to be bonded to the welded end structure. 01 is effectively fixed, which reduces the reliability of welding.
  • Embodiments of the present application provide a solder tail structure and a component capable of preventing an outer surface and a bottom end of a side terminal
  • the inner layer material is exposed at the corner between the lower surface of the sub-surface, so that the solder in the right-angled region can penetrate smoothly in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welded end structure.
  • the present application provides a solder tail structure including a side terminal extending in a longitudinal direction and a bottom terminal bent from a lower end of the side terminal and extending in a lateral direction, the side terminal being used for
  • the side wall of the mounting component is fixedly attached to the bottom wall of the component to be mounted, and the bottom surface of the bottom terminal is used for soldering and fixing the to-be-mounted
  • the lead wire of the component is provided with a groove or a protrusion, and the lead wire of the component to be mounted is soldered to the bottom surface of the groove or the top surface of the protrusion.
  • the soldering end structure fixes and fixes the side terminal in the soldering end structure to the side wall of the component to be mounted, and fixes the bottom terminal in the soldering end structure to be mounted.
  • the lead wire of the component to be mounted is soldered and fixed to the bottom surface of the groove on the lower surface of the bottom terminal or the top surface of the protrusion, and the surface of the lead is soldered or recessed.
  • the lower surface of the bottom terminal thus extending the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the wire bonding position, thereby reducing the outer surface and the bottom terminal of the side terminal during wire bonding
  • the corner position between the lower surfaces has the possibility of influence.
  • the groove and the projection are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the bottom surface of the protrusion and the lower surface of the bottom terminal must have a corner.
  • the corner When bending or stamping the corner, it is also easy to cause the tinned tensile tear at the corner to form a tin-plated fault, so that when the lead is welded on the bottom surface of the groove or the convex top surface, the fusion The rear tin will stop out-diffusion at this fault, further reducing the possibility of affecting the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal during wire bonding, reducing the outside of the side terminal
  • the possibility of exposing the inner layer material at the corner between the surface and the lower surface of the bottom terminal enables the solder in the right angle region to smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welded end structure.
  • the bottom surface of the recess is a flat surface. In this way, the soldering operation of the leads of the components to be mounted on the bottom surface of the recess is facilitated.
  • the top surface of the protrusion is planar. In this way, the soldering operation of the lead of the component to be mounted on the top surface of the bump is facilitated.
  • the protrusion protrudes from a lower surface of the bottom terminal by a height of less than 0.1 mm.
  • the groove has a depth of 0.5 to 0.8 mm.
  • the depth of the groove is suitable, and the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the welding position of the wire can be effectively extended, and the opening depth of the groove can be avoided. The strength of the welded end structure is reduced.
  • the groove or the protrusion has a width of 0.8 to 1.0 mm along an extending direction of the bottom terminal.
  • the width of the groove or the projection is suitable to satisfy the need for the welding area of the wire bonding operation and to prevent unnecessary waste due to the excessive width of the groove or the projection.
  • the groove extends through the opposite sidewalls of the bottom terminal in a direction perpendicular to the extending path of the bottom terminal, and Groove away One end of the side terminal penetrates an end surface of the bottom terminal away from the side terminal along an extending direction of the bottom terminal. In this way, the wire bonding operation space in the groove is increased, and the welding operation on the smaller-sized welding end structure is facilitated.
  • the welded end structure is integrally formed by a press forming method.
  • the present application provides a component including a component body and a soldering end structure according to any one of the above aspects, wherein a side terminal of the soldering end structure is adhered to a sidewall of the component body Fixing, the bottom terminal of the soldering end structure is closely fixed to the bottom wall of the component body, and the lead wire of the component body is soldered and fixed to the bottom surface of the groove or the top surface of the convex surface of the soldering end structure on.
  • the surface of the lead when the lead wire on the component body is soldered and fixed on the bottom surface of the groove or the top surface of the protrusion on the lower surface of the bottom terminal, the surface of the lead is soldered or recessed.
  • the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the position of the wire bonding is extended, thereby reducing the outer surface and the bottom of the side terminal when the wire is soldered.
  • the position of the corner between the lower surfaces of the terminals has the possibility of influence.
  • grooves and projections are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the top surface of the protrusion and the lower surface of the bottom terminal are necessarily present.
  • the corner when bending or stamping the corner, is also prone to lead-stretching and tearing at the corner, thereby forming a tin-plated fault, so that when the lead is welded on the bottom surface of the groove or the convex top surface, the melting The rear tin will stop out-diffusion at this fault, further reducing the influence of the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal during wire bonding.
  • the possibility is that the possibility of exposing the inner layer material at the corner between the outer surface of the side terminal and the lower surface of the bottom terminal is reduced, so that the solder in the right angle region can smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding of the welding end structure. reliability.
  • the lead of the component body is soldered to a bottom surface of the recess or a top surface of the protrusion by a hot-melt soldering process on.
  • a hot-melt soldering process By soldering in the hot-melt soldering process, the solder joint size between the lead and the bottom surface of the recess or the top surface of the bump can be reduced, and the weight of the component can be reduced.
  • FIG. 1 is a schematic structural view of a prior art welding end structure
  • FIG. 2 is a schematic structural view of a component having the solder terminal structure shown in FIG. 1;
  • FIG. 3 is a schematic structural view of the component shown in FIG. 2 after being mounted on a printed board;
  • FIG. 4(a) is a schematic view showing the first structure of the welded end structure provided by the embodiment of the present application.
  • 4(b) is a second schematic structural view of a solder joint structure according to an embodiment of the present application.
  • FIG. 5( a ) is a first structural schematic view of a groove in a welded end structure according to an embodiment of the present application
  • FIG. 5(b) is a second schematic structural view of a groove in a welded end structure according to an embodiment of the present application.
  • FIG. 5(c) is a third structural schematic view of a groove in a welded end structure according to an embodiment of the present application.
  • FIG. 5( d ) is a fourth structural schematic view of a groove in a welded end structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of components provided by an embodiment of the present application.
  • FIG. 4(a) and 4(b), FIG. 4(a) and FIG. 4(b) are two specific embodiments of the welded end structure of the embodiment of the present application.
  • the welded end structure 100 of the present embodiment includes a longitudinal direction.
  • An extended side terminal 1 and a bottom terminal 2 bent from a lower end of the side terminal 1 and extending in a lateral direction, the side terminal 1 being used for attaching and fixing to a side wall of a component to be mounted,
  • the bottom terminal 2 is for fixing and fixing to the bottom wall of the component to be mounted, and the lower surface of the bottom terminal 2 is provided with a groove in a region for soldering and fixing the lead of the component to be mounted.
  • 3 see FIG. 4(a)
  • formed with a protrusion 4 see FIG. 4(b)
  • the lead wire of the component to be mounted is soldered to the bottom surface of the groove 3 or the The top surface of the projection 4.
  • the soldering end structure 100 provided in the embodiment of the present application is configured to attach and fix the side terminal 1 of the soldering end structure 100 to the sidewall of the component to be mounted, and to fit the bottom terminal 2 of the soldering end structure 100.
  • the lead wire of the component to be mounted can be soldered and fixed to the bottom surface of the recess 3 on the lower surface of the bottom terminal 2 or the top surface of the bump 4, and the lead wire is soldered.
  • the surface is convexly or concavely disposed on the lower surface of the bottom terminal 2, thus extending the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 (see the position A in FIG. 4) and the wire bonding position.
  • the groove 3 and the projection 4 are provided on the lower surface of the bottom terminal 2, and the bottom surface of the groove 3 or the top surface of the projection 4 and the lower surface of the bottom terminal 2 necessarily have a corner, which is bent Or when stamping this corner, it is also easy to cause tinned tensile tear at the corner.
  • the position of the corner between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 has an influence, and the possibility of exposing the inner layer material at the corner between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 is reduced.
  • the solder in the right angle region can be smoothly infiltrated in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welding end structure 100.
  • the bottom surface of the recess 3 may be a curved surface as shown in FIG. 5(c), a plane as shown in FIGS. 5(a) and 5(b) or as shown in FIG. 5(d).
  • the tapered surface and the like are not specifically limited herein, and the top surface of the protrusion 4 may also be a curved surface or a flat surface, etc., and is not specifically limited herein.
  • the lower surface of the bottom terminal 2 should not include the side surface and the bottom surface of the groove 3, nor the side surface and the top surface of the boss.
  • the bottom surface of the groove 3 is a plane.
  • the soldering operation of the leads of the component to be mounted on the bottom surface of the recess 3 can be facilitated.
  • the top surface of the protrusion 4 is a plane.
  • soldering operation of the leads of the component to be mounted on the top surface of the bump 4 can be facilitated.
  • the height of the lower surface of the protrusion 4 protruding from the bottom terminal 2 is less than 0.1 mm.
  • the molten solder formed in the right angle region between the side terminal 1 and the pad can be smoothly penetrated in the lateral and longitudinal directions.
  • the height of the lower surface of the protrusion 4 protruding from the bottom terminal 2 is greater than or equal to 0.1 mm, when the component with the solder terminal structure 100 of the present application is soldered to the printed board, the bottom of the protrusion 4 is easily protruded.
  • the height of the lower surface of the terminal 2 is higher than the height of the molten solder in the right-angled region, so that the molten solder cannot penetrate upward along the outer surface of the side terminal 1, and at the same time, the distance between the lower surface of the bottom terminal 2 and the pad is raised. 4
  • the pad is at least 0.1 mm high, and therefore, the molten solder cannot fix the bottom terminal 2 and the pad together when it penetrates in the lateral direction.
  • the depth of the groove 3 shown in FIG. 5(a) or FIG. 5(b) is 0.5 to 0.8 mm.
  • the depth of the groove 3 is suitable, and the distance between the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 and the wire bonding position can be effectively extended, and the depth of the groove 3 can be avoided. Larger results in a lower strength of the welded end structure 100.
  • the depth of the groove 3 is less than 0.5 mm, the depth of the groove 3 is small, and the distance between the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2 and the wire bonding position is small, and the welding is small.
  • the lead position still easily affects the corner position between the outer surface of the side terminal 1 and the lower surface of the bottom terminal 2; when the depth of the groove 3 is greater than 0.8 mm, the depth of the groove 3 is large, and the bottom terminal 2 is soldered Part of the structural strength is low.
  • the width of the groove 3 or the protrusion 4 is 0.8 to 1.0 mm along the extending direction of the bottom terminal 2.
  • the width of the recess 3 or the projection 4 is suitable to satisfy the demand for the welding area of the wire bonding operation, and to prevent unnecessary waste due to the excessive width of the groove 3 or the projection 4.
  • the width of the groove 3 or the protrusion 4 is less than 0.8 mm, the width of the groove 3 or the protrusion 4 is too small to satisfy the requirement of the welding area for the wire bonding operation, when the width of the groove 3 or the protrusion 4 is When it is larger than 1.0 mm, the width of the groove 3 is too large, which causes unnecessary waste, and the material cost of the welded end structure 100 is high.
  • the groove 3 penetrates the opposite side walls of the bottom terminal 2 in a direction perpendicular to the extending path of the bottom terminal 2 , and the groove 3 is away from the end of the side terminal 1 .
  • An end surface of the bottom terminal 2 that extends away from the side terminal 1 is extended along the extending direction of the bottom terminal 2.
  • the welded end structure 100 is integrally formed by a press forming method.
  • the present application further provides a component, including a component body 200 and a soldering end structure 100 according to any of the above aspects, a side terminal in the soldering end structure 100 and the component body.
  • the bottom end of the soldering end structure 100 is fixed to the bottom wall of the component body 200, and the lead 201 of the component body 200 is soldered and fixed to the soldering end structure 100.
  • the surface soldered by the lead 201 protrudes.
  • the recess is disposed on the lower surface of the bottom terminal, thereby extending the distance between the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal and the soldering position of the lead 201 on the one hand, thereby reducing the side of the lead 201 when soldering Terminal
  • the corner position between the outer surface and the lower surface of the bottom terminal has an influence possibility.
  • a groove and a protrusion are provided on the lower surface of the bottom terminal, and the bottom surface of the groove or the top surface of the protrusion and the lower surface of the bottom terminal There must be a corner between them.
  • the molten tin will stop the outward diffusion at the fault, thereby further reducing the possibility of affecting the corner position between the outer surface of the side terminal and the lower surface of the bottom terminal when the lead 201 is soldered.
  • the possibility of exposing the inner layer material at the corner between the outer surface of the side terminal and the lower surface of the bottom terminal is small, so that the solder in the right angle region can smoothly penetrate in the lateral direction and the longitudinal direction, thereby improving the welding reliability of the welding end structure 100.
  • the lead 201 of the component body 200 is soldered and fixed to the bottom surface of the groove or the top surface of the protrusion by a hot-melt soldering process.
  • soldering by the hot-melt soldering process the solder joint size between the lead 201 and the bottom surface of the recess or the top surface of the bump can be reduced, and the weight of the component can be reduced.

Abstract

L'invention concerne une structure d'extrémité de soudage (100) et un composant (02). Un problème de la technologie existante est résolu, un matériau de couche interne étant facilement exposé au niveau d'un coin entre une surface externe d'une borne de partie latérale (011) et une surface inférieure d'une borne de partie inférieure (012) lorsqu'un fil conducteur (022) est soudé sur une structure d'extrémité de soudage (01). La structure d'extrémité de soudage comprend la borne de partie latérale (1), qui s'étend dans la direction longitudinale, et la borne de partie inférieure (2), qui est formée par pliage au niveau d'une extrémité inférieure de la borne de partie latérale et par déploiement dans la direction transversale ; la borne de partie latérale sert à attacher et à fixer une paroi latérale d'un composant à monter, tandis que la borne de partie inférieure sert à attacher et à fixer une paroi inférieure du composant à monter ; une rainure (3) est ouverte ou une saillie (4) est formée au niveau d'une zone se trouvant sur une surface inférieure de la borne de partie inférieure et servant à souder et à fixer un fil conducteur (201) du composant à monter, le fil conducteur du composant à monter étant soudé et fixé au niveau d'une surface inférieure de la rainure ou sur une surface supérieure de la saillie. La présente invention s'applique à un montage en surface de composants électroniques.
PCT/CN2017/077386 2016-12-26 2017-03-20 Structure d'extrémité de soudage et composant WO2018120449A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780009699.XA CN108604581B (zh) 2016-12-26 2017-03-20 一种焊端结构及元器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201611219942.4 2016-12-26
CN201611219942 2016-12-26

Publications (1)

Publication Number Publication Date
WO2018120449A1 true WO2018120449A1 (fr) 2018-07-05

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PCT/CN2017/077386 WO2018120449A1 (fr) 2016-12-26 2017-03-20 Structure d'extrémité de soudage et composant

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WO (1) WO2018120449A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN110449683B (zh) * 2019-07-31 2021-02-09 嘉兴军胜电子科技有限公司 一种高可靠应用印制电路板组件qfn装焊预处理方法

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US20020146863A1 (en) * 2001-04-10 2002-10-10 Chieh-Yuan Lin Method of mounting an exposed-pad type of semiconductor device over a printed circuit board
CN103002657A (zh) * 2011-09-08 2013-03-27 环旭电子股份有限公司 堆叠式基板模组
CN103280436A (zh) * 2013-04-23 2013-09-04 华为机器有限公司 表贴器件及其制备方法
CN103311206A (zh) * 2013-05-23 2013-09-18 华为技术有限公司 封装有焊端环的电子器件及具有该电子器件的电子设备

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KR100214463B1 (ko) * 1995-12-06 1999-08-02 구본준 클립형 리드프레임과 이를 사용한 패키지의 제조방법
US20150262918A1 (en) * 2014-03-14 2015-09-17 Texas Instruments Incorporated Structure and method of packaged semiconductor devices with bent-lead qfn leadframes

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Publication number Priority date Publication date Assignee Title
US20020146863A1 (en) * 2001-04-10 2002-10-10 Chieh-Yuan Lin Method of mounting an exposed-pad type of semiconductor device over a printed circuit board
CN103002657A (zh) * 2011-09-08 2013-03-27 环旭电子股份有限公司 堆叠式基板模组
CN103280436A (zh) * 2013-04-23 2013-09-04 华为机器有限公司 表贴器件及其制备方法
CN103311206A (zh) * 2013-05-23 2013-09-18 华为技术有限公司 封装有焊端环的电子器件及具有该电子器件的电子设备

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