CN103002657A - Stack-based substrate module - Google Patents
Stack-based substrate module Download PDFInfo
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- CN103002657A CN103002657A CN2011102687039A CN201110268703A CN103002657A CN 103002657 A CN103002657 A CN 103002657A CN 2011102687039 A CN2011102687039 A CN 2011102687039A CN 201110268703 A CN201110268703 A CN 201110268703A CN 103002657 A CN103002657 A CN 103002657A
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- substrate
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Abstract
The invention discloses a stack-based substrate module which comprises a first substrate and a second substrate. The first substrate is provided with a plurality of solder pads, and the solder pads respectively extend to the outside of a stacking area of the first substrate from the inside of the stacking area; a plurality of solderable ends are arranged at the outer side edge of the second substrate, and respectively extend from the outer side edge of the second substrate to upper and lower surfaces of the second substrate; and the second substrate is stacked in the stacking area of the first substrate, side edges of the second substrate are aligned with edges of the stacking area, the solder pads correspond to the solderable ends, rooms among the solder pads and the solderable ends are suitable for accommodating solder paste, and the solder pads and the solderable ends can be connected with one another by means of reflow soldering. The stack-based substrate module is beneficial for a manufacturer to judge whether a soldering effect of the first substrate and the second substrate is deficient or not in a visual inspection manner, side surfaces of the substrate module can realize a tin suction effect, so that the soldering effect is improved.
Description
Technical field
The present invention relates to a kind of substrate module, particularly relate to a kind of stack substrate module.
Background technology
Relevant existing double-basis template die group, the two substrates size that it adopts is all identical, and namely the periphery of above-mentioned two substrates roughly is flush state.Therefore, when double-basis template die group is wanted to be welded in circuit board, double-basis template die group can only utilize the surface of corresponding circuits plate solder side to weld, can't make like this double-basis template die group reach the effect that tin is eaten in the side, and then easily to cause welding effect be not fine, and be not easy to know whether welding has disappearance (such as the sky weldering) in the range estimation situation.
Summary of the invention
The technical problem to be solved in the present invention is can't reach the effect that tin is eaten in the side when overcoming in the prior art double-basis template die bond pads, and then cause the bad defective of welding effect, a kind of stack substrate module is provided, is beneficial to the producer and judges welding result in the mode of range estimation.
The present invention solves above-mentioned technical problem by following technical proposals: a kind of stack substrate module, its characteristics be, it comprises:
One first substrate, it has several weld pads, and those weld pads extend to outside this stack region in a stack region of this first substrate respectively; And
One second substrate, but its outer side edges has several welding ends, but those welding ends extend to up and down two surfaces of this second substrate from this second substrate outer side edges respectively;
Wherein, this second substrate is stacked in the stack region of this first substrate, and this second substrate side and this stack region justified margin, but those weld pads are corresponding with the position of those welding ends, but be suitable for putting tin cream between those weld pads and those welding ends, but and by reflow to connect those weld pads and those welding ends.
Preferably, but be placed in tin cream between those welding ends and those weld pads, but its attachment that produces by reflow extends to the position that those welding ends are positioned at this second substrate outer side edges.
Preferably, this first substrate has a detection zone, and this detection zone is positioned at this stack region outside, and those weld pads extend to this detection zone from this stack region respectively.
Preferably, this first substrate has an element region, and it is inboard that this element region is positioned at this stack region, and the element region of this first substrate is used for welding at least one electronic component.
Preferably, but each welding end bend in the same direction from this second substrate outer side edges and extend to up and down two surfaces of this second substrate.
Preferably, but the cross section of each welding end take the shape of the letter U, but and each welding end be positioned at this second substrate up and down the position on two surfaces be mutually corresponding.
Preferably, a wherein surface soldered on two surfaces is in this first substrate about this second substrate, and another surface is used for being welded in a circuit board.
Preferably, this circuit board is formed with several welded gaskets, the position of those welded gaskets and shape are roughly corresponding to those weld pads of this first substrate, but be suitable for putting tin cream between those welding ends of this second substrate and those welded gaskets of this circuit board, but and by reflow to connect those welded gaskets and those welding ends.
Preferably, but be placed in tin cream between those welding ends and those welded gaskets, but its attachment that produces by reflow extends to the position that those welding ends are positioned at this second substrate outer side edges.
Preferably, this second substrate outer side edges is arranged with and forms several grooves, and those grooves are arcuation and connect up and down two surfaces of this second substrate, but those welding ends lay respectively at those grooves and extend to up and down two surfaces of this second substrate.
Positive progressive effect of the present invention is: stack substrate module provided by the present invention is stacked in the stack region of first substrate by second substrate, and the second substrate side is other and the stack region justified margin, be beneficial to the producer and judge in the range estimation mode whether the welding effect of first substrate and second substrate has disappearance, and the substrate module has the effect that tin is eaten in the side, so that the effect of welding also can be better.
Description of drawings
Fig. 1 is the perspective exploded view of stack substrate module of the present invention.
Fig. 2 is first substrate two surfaces floor map of soldering of electronic components of stack substrate module of the present invention.
Fig. 3 is the floor map that is provided with tin cream between stack substrate module first substrate of the present invention and the second substrate.
Fig. 4 is that stack substrate module of the present invention is arranged at the floor map of tin cream after reflow between first substrate and the second substrate.
Fig. 5 is that stack substrate module of the present invention is arranged at the schematic perspective view of tin cream after reflow between first substrate and the second substrate.
Fig. 5 A is that stack substrate module second substrate of the present invention is the L shape, and is arranged at the schematic perspective view of tin cream after reflow between first substrate and the second substrate.
Fig. 6 is the schematic perspective view that stack substrate module of the present invention is used for being arranged at circuit board.
Fig. 7 is the floor map that is provided with tin cream between stack substrate module second substrate of the present invention and the circuit board.
Fig. 8 is that stack substrate module of the present invention is arranged at the floor map of tin cream after reflow between second substrate and the circuit board.
Fig. 9 is that stack substrate module of the present invention is arranged at the schematic perspective view of tin cream after reflow between second substrate and the circuit board.
Figure 10 is the schematic perspective view of stack substrate module the second embodiment of the present invention.
[Reference numeral]
1 first substrate
11 weld pads
12 stack region
13 detection zones
14 element regions
141 weld pads
2 second substrates
But 21 welding ends
22 grooves
3,3 ' electronic component
4,4 ' tin cream
5 circuit boards
51 welded gaskets
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to describe technical scheme of the present invention in detail.
The first embodiment:
Such as Fig. 1～shown in Figure 9, it is the first embodiment of the present invention, and wherein, Fig. 1, Fig. 5, Fig. 6 and Fig. 9 are the schematic perspective view of the present embodiment, and Fig. 2, Fig. 3, Fig. 4, Fig. 7 and Fig. 8 are the floor map of the present embodiment.
With reference to Fig. 1, the present embodiment is a kind of stack substrate module, comprises mutually stacking first substrate 1 and second substrate 2.Above-mentioned first substrate 1 has several weld pads 11, and described weld pad 11 extends to outside the stack region 12 in the stack region 12 of first substrate 1 respectively.
In more detail, detection zone 13, stack region 12 and element region 14 can be divided in described first substrate 1 surface.Above-mentioned detection zone 13 is positioned at stack region 12 outsides, and described weld pad 11 extends to detection zone 13 from stack region 12 respectively.And element region 14 is positioned at stack region 12 inboards, and element region 14 can be formed with the weld pad 141 that several are used for soldering of electronic components 3, is used for making electronic component 3 be welded in element region 14.In addition, another surface of first substrate 1 also can be used for soldering of electronic components 3 ' (as shown in Figure 2).
The profile of described second substrate 2 is roughly corresponding to the stack region 12 of first substrate 1.Moreover, but second substrate 2 outer side edges have several welding ends 21, but and above-mentioned welding end 21 extend to second substrate from second substrate 2 outer side edges respectively about in the of 2 two surface.
In more detail, but the cross section of each welding end 21 takes the shape of the letter U (as shown in Figure 3), but to be each welding end 21 from second substrate 2 outer side edges bend in the same direction extends to second substrate about in the of 2 two surface, but and each welding end 21 to be positioned at the position on second substrate two surfaces about in the of 2 mutually corresponding.
Described second substrate 2 is stacked in the stack region 12 of first substrate 1, and second substrate 2 sides and stack region 12 justified margins, but above-mentioned weld pad 11 is corresponding with the position of welding end 21.And, but being suitable for putting 4 (as shown in Figure 3) of tin cream (solder paste) between weld pad 11 and the welding end 21, above-mentioned tin cream 4 can be by reflow (Reflow) but to connect weld pad 11 and welding end 21.
In more detail, but be placed in the tin cream 4 between welding end 21 and the weld pad 11, the impact (but tendency and welding material mutual bond) of its attachment that produces by reflow because being subject to cohesive force, but the position (as shown in Figure 4) that makes it extend to welding end 21 and be positioned at second substrate 2 outer side edges.
Thus, above-mentioned tin cream 4 can make the connection area of itself and second substrate 2 increase, and then make the combination of first substrate 1 and second substrate 2 more firm after reflow.And, as shown in Figure 5, but the producer can observe the attachment that tin cream 4 reflows are produced in the mode of range estimation and whether extend to the position that welding end 21 is positioned at second substrate 2 outer side edges, is used for judging whether first substrate 1 and second substrate 2 have disappearance (such as the sky weldering) generation in the welding.
In addition, in the present embodiment, second substrate 2 is take the square shape as example, but when practical application, second substrate 2 also can be L shape, linearity or other suitable shapes.When second substrate 2 was the L shape, stack substrate module can form the structure shown in Fig. 5 A after reflow.
Moreover as shown in Figure 6 and Figure 7, a wherein surface soldered on above-mentioned second substrate two surfaces about in the of 2 is in first substrate 1, and another surface soldered is in circuit board 5.Described circuit board is formed with several welded gaskets 51, and the shape of above-mentioned welded gasket 51 and position are roughly corresponding to the weld pad 11 of first substrate 1.And, but be suitable for putting tin cream 4 ' between the welded gasket 51 of the welding end 21 of second substrate 2 and circuit board 5, but described tin cream 4 ' can be by reflow with connecting welding pad 51 and welding end 21.
In more detail, but be placed in the tin cream 4 ' between welding end 21 and the welded gasket 51, the impact (but tendency and welding material mutual bond) of its attachment that produces by reflow because being subject to cohesive force, but the position (as shown in Figure 8) that makes it extend to welding end 21 and be positioned at second substrate 2 outer side edges.
Thus, above-mentioned tin cream 4 ' can make the connection area of itself and second substrate 2 increase, and then make the combination of second substrate 2 and circuit board 5 more firm after reflow.And, as shown in Figure 9, but the producer can observe the attachment that tin cream 4 ' reflow produced in the mode of range estimation and whether extend to the position that welding end 21 is positioned at second substrate 2 outer side edges, and whether be used for decision circuitry plate 5 has the disappearance (such as the sky weldering) in the welding to produce with second substrate 2.
The second embodiment:
As shown in figure 10, it is the second embodiment of the present invention, and the present embodiment and the first embodiment are similar, and difference is mainly that second substrate 2 outer side edges are arranged with and is formed with several grooves 22.
In more detail, above-mentioned groove 22 is arcuation and connects second substrate that about in the of 2 two surfaces, but and welding end 21 lay respectively at groove 22 and extend to second substrate that about in the of 2 two surfaces.Therefore, but be placed in tin cream 4 (not shown) between welding end 21 and the weld pad 11, but it will extend to the position that welding end 21 is positioned at above-mentioned groove 22 by the attachment that reflow produces.Thus, the present embodiment can increase the bonding area of second substrate 2, so that first substrate 1 is more firm with engaging of second substrate 2.
In like manner, the (not shown) when second substrate 2 of the present embodiment is used for being welded in circuit board 5, but owing to the tin cream 4 ' that is placed between welding end 21 and the welded gasket 51, but it will extend to the position that welding end 21 is positioned at above-mentioned groove 22 by the attachment that reflow produces.Be used for making the bonding area of second substrate 2 to increase, and then make circuit board 5 more firm with engaging of second substrate 2.
According to the embodiment of the invention, but above-mentioned stack substrate module can extend to the position that welding end 21 is positioned at second substrate 2 outer side edges by tin cream 4, the 4 ' attachment that produces through reflow, makes second substrate more firmly be connected in respectively first substrate 1 and circuit board 5 in two surfaces about in the of 2.
And, but the producer can observe the attachment that tin cream 4,4 ' reflow produced in the mode of range estimation and whether extend to the position that welding end 21 is positioned at second substrate 2 outer side edges, is used for judging the disappearance whether second substrate 2 produces on welding with first substrate 1 or circuit board 5.
In addition, by groove 22 designs of second substrate 2, but can make the bonding area of second substrate 2 increase, and then make second substrate more firmly be connected in respectively first substrate 1 and circuit board 5 in two surfaces about in the of 2.
Although more than described the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited by appended claims.Those skilled in the art can make various changes or modifications to these execution modes under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (10)
1. a stack substrate module is characterized in that, it comprises:
One first substrate, it has several weld pads, and those weld pads extend to outside this stack region in a stack region of this first substrate respectively; And
One second substrate, but its outer side edges has several welding ends, but those welding ends extend to up and down two surfaces of this second substrate from this second substrate outer side edges respectively;
Wherein, this second substrate is stacked in the stack region of this first substrate, and this second substrate side and this stack region justified margin, but those weld pads are corresponding with the position of those welding ends, but be suitable for putting tin cream between those weld pads and those welding ends, but and by reflow to connect those weld pads and those welding ends.
2. stack substrate module as claimed in claim 1 is characterized in that, but is placed in the tin cream between those welding ends and those weld pads, but its attachment that produces by reflow extends to the position that those welding ends are positioned at this second substrate outer side edges.
3. stack substrate module as claimed in claim 2 is characterized in that, this first substrate has a detection zone, and this detection zone is positioned at this stack region outside, and those weld pads extend to this detection zone from this stack region respectively.
4. stack substrate module as claimed in claim 1 is characterized in that, this first substrate has an element region, and it is inboard that this element region is positioned at this stack region, and the element region of this first substrate is used for welding at least one electronic component.
5. stack substrate module as claimed in claim 1 is characterized in that, but each welding end bends in the same direction from this second substrate outer side edges and extends to up and down two surfaces of this second substrate.
6. stack substrate module as claimed in claim 1 is characterized in that, but the cross section of each welding end take the shape of the letter U, but and each welding end be positioned at this second substrate up and down the position on two surfaces be mutually corresponding.
7. stack substrate module as claimed in claim 1 is characterized in that, a wherein surface soldered on two surfaces is in this first substrate about this second substrate, and another surface is used for being welded in a circuit board.
8. stack substrate module as claimed in claim 7, it is characterized in that, this circuit board is formed with several welded gaskets, the position of those welded gaskets and shape are roughly corresponding to those weld pads of this first substrate, but be suitable for putting tin cream between those welding ends of this second substrate and those welded gaskets of this circuit board, but and by reflow to connect those welded gaskets and those welding ends.
9. stack substrate module as claimed in claim 8 is characterized in that, but is placed in the tin cream between those welding ends and those welded gaskets, but its attachment that produces by reflow extends to the position that those welding ends are positioned at this second substrate outer side edges.
10. stack substrate module as claimed in claim 1, it is characterized in that, this second substrate outer side edges is arranged with and forms several grooves, and those grooves are arcuation and connect up and down two surfaces of this second substrate, but those welding ends lay respectively at those grooves and extend to up and down two surfaces of this second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102687039A CN103002657A (en) | 2011-09-08 | 2011-09-08 | Stack-based substrate module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102687039A CN103002657A (en) | 2011-09-08 | 2011-09-08 | Stack-based substrate module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103002657A true CN103002657A (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102687039A Pending CN103002657A (en) | 2011-09-08 | 2011-09-08 | Stack-based substrate module |
Country Status (1)
| Country | Link |
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| CN (1) | CN103002657A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120449A1 (en) * | 2016-12-26 | 2018-07-05 | 华为技术有限公司 | Welding end structure and component |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
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| CN2512114Y (en) * | 2001-10-31 | 2002-09-18 | 威盛电子股份有限公司 | Duplicated piled reversing welding-ball matrix package body |
| CN1426271A (en) * | 2001-12-05 | 2003-06-25 | 株式会社村田制作所 | Circuit board device and its mounting method |
| CN1747153A (en) * | 2004-09-07 | 2006-03-15 | 日月光半导体制造股份有限公司 | Substrate plate structure with tin-ball fixed welding pad and combination structure therewith |
| US20060186517A1 (en) * | 1999-10-15 | 2006-08-24 | Jang Sung S | Semiconductor package having improved adhesiveness and ground bonding |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5570274A (en) * | 1993-11-29 | 1996-10-29 | Nec Corporation | High density multichip module packaging structure |
| US20060186517A1 (en) * | 1999-10-15 | 2006-08-24 | Jang Sung S | Semiconductor package having improved adhesiveness and ground bonding |
| CN1332597A (en) * | 2000-05-15 | 2002-01-23 | 日立Aic株式会社 | Electronic element apparatus and manufacture thereof |
| CN2512114Y (en) * | 2001-10-31 | 2002-09-18 | 威盛电子股份有限公司 | Duplicated piled reversing welding-ball matrix package body |
| CN1426271A (en) * | 2001-12-05 | 2003-06-25 | 株式会社村田制作所 | Circuit board device and its mounting method |
| CN1747153A (en) * | 2004-09-07 | 2006-03-15 | 日月光半导体制造股份有限公司 | Substrate plate structure with tin-ball fixed welding pad and combination structure therewith |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018120449A1 (en) * | 2016-12-26 | 2018-07-05 | 华为技术有限公司 | Welding end structure and component |
| CN108604581A (en) * | 2016-12-26 | 2018-09-28 | 华为技术有限公司 | A kind of welding end structure and component |
| CN108604581B (en) * | 2016-12-26 | 2020-04-28 | 华为技术有限公司 | Welding end structure and component |
| CN113015324A (en) * | 2019-12-19 | 2021-06-22 | 华为技术有限公司 | Circuit board assembly, electronic device, and method of processing circuit board assembly |
| WO2021120877A1 (en) * | 2019-12-19 | 2021-06-24 | 华为技术有限公司 | Circuit board assembly, electronic device, and method for processing circuit board assembly |
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Application publication date: 20130327 |