CN210609848U

CN210609848U - Circuit board and electronic equipment

Info

Publication number: CN210609848U
Application number: CN201921566456.9U
Authority: CN
Inventors: 杨磊; 刘婷
Original assignee: Shanghai Junzheng Network Technology Co Ltd
Current assignee: Shanghai Junzheng Network Technology Co Ltd
Priority date: 2019-09-20
Filing date: 2019-09-20
Publication date: 2020-05-22
Anticipated expiration: 2029-09-20

Abstract

A circuit board and an electronic device include: a substrate; the circuit wiring layer is arranged on the substrate; the solder mask layer is arranged on the circuit wiring layer; the shielding cover is covered on the substrate and comprises an upper wall and a side wall surrounding the periphery of the upper wall; and the short-circuit prevention layer is arranged on the surface of the solder mask layer and is positioned between the side wall of the shielding cover and the solder mask layer. The utility model effectively prevents the short circuit between the wiring and the shield cover by adding the short circuit prevention layer between the shield cover and the solder mask; the shielding cover does not need to be grooved, so that the difficulty of designing the shielding cover is reduced, the manufacturing process of the shielding cover is simplified, and the manufacturing cost of the shielding cover is reduced; the shielding cover is a complete sealing structure, and the shielding effect is ensured.

Description

Circuit board and electronic equipment

Technical Field

The utility model relates to the field of electronic technology, especially, relate to a circuit board and electronic equipment.

Background

Along with the development of electronic technology, the function of various equipment is more and more, in order to prevent mutual interference between each module, often need the shield cover to get up each module, again because will beautifully make the very intensive of walking on the circuit board with little volume, the splice bar of a lot of shield covers is transferred and all is walked the line, like this maintenance and equipment normal work because the friction can cause the solder mask (like green oil) on walking the line impaired, lead to walking the line and take place the short circuit with the shield cover, make the complete machine function unusual, lead to the complete machine to scrap even when serious.

In order to prevent the short circuit between the wires and the shielding case, the shielding case is manufactured by grooving the corresponding shielding case to avoid the wires. Referring to fig. 1, there is shown a prior art shield can 4 comprising an upper wall (not shown) and a side wall 41 surrounding the periphery of the upper wall; the end of the sidewall 41 is provided with a groove 42 corresponding to the position of the trace to prevent the end of the shield from contacting the solder mask of the trace, thereby achieving the purpose of preventing the trace from short circuit with the shield.

Although the shielding case with the design can prevent the short circuit between the wires and the shielding case, the shielding case has the following defects that ① increases the difficulty of designing the shielding case, ② complicates the manufacturing process of the shielding case and increases the manufacturing cost of the shielding case, and ③ reduces the shielding effect because the shielding case is provided with the groove.

SUMMERY OF THE UTILITY MODEL

In view of the shortcoming of the above prior art, an object of the utility model is to provide a circuit board, it not only can prevent to walk line and shield cover short circuit, also can effectual solution current scheme lead to the shield cover design degree of difficulty big, the preparation technology is complicated, the cost of manufacture is high, shielding effect is not good scheduling problem.

In order to achieve the above object, the present invention provides a circuit board, including:

a substrate;

the circuit wiring layer is arranged on the substrate;

the solder mask layer is arranged on the circuit wiring layer;

the shielding cover is covered on the substrate and comprises an upper wall and a side wall surrounding the periphery of the upper wall; and

and the short-circuit prevention layer is arranged on the surface of the solder mask layer and is positioned between the side wall of the shielding cover and the solder mask layer.

Preferably, the solder mask layer is green ink or black ink.

Preferably, the short-circuit prevention layer is a silk-screen printing layer.

Preferably, the silk-screen layer is white oil.

Preferably, the thickness of the silk-screen layer is 0.1-1.0 mil.

Preferably, the shield is a hermetic shield.

Preferably, the shielding case is integrally formed.

Preferably, the side wall of the shielding case is formed by extending and bending the edge of the upper wall, or the side wall is welded to the periphery of the upper wall.

Preferably, the base plate is the even number plywood, the upside of base plate is equipped with solder mask, the downside of base plate is equipped with down solder mask, the surface of going up solder mask is equipped with prevents short circuit layer, the surface of solder mask is equipped with down prevents short circuit layer down.

The utility model also provides an electronic equipment, including above-mentioned circuit board.

The utility model provides a circuit board has following technological effect:

1. through set up the short circuit prevention layer between shield cover and solder mask, prevent effectively walking line and shield cover short circuit, more specifically, prevent effectively that the short circuit phenomenon that the friction in repair, transportation, the use caused.

2. Compared with the existing scheme of grooving on the shielding cover, the shielding cover on the circuit board does not need grooving, the difficulty of designing the shielding cover is reduced, the manufacturing process of the shielding cover is simplified, and the manufacturing cost of the shielding cover is reduced.

3. Compared with the existing scheme of grooving on the shielding cover, the shielding cover on the circuit board does not need grooving, namely the shielding cover is completely sealed, and the shielding effect is guaranteed.

The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings, so as to fully understand the objects, the features and the effects of the present invention.

Drawings

Fig. 1 is a prior art shield designed to prevent short circuit between a trace and the shield, wherein a groove is formed on a sidewall of the shield.

Fig. 2 is a schematic structural diagram of a preferred embodiment of the circuit board of the present invention.

Fig. 3 is a schematic structural view of a preferred embodiment of a shield used in the present invention.

Wherein, 1-short-circuit prevention layer, 2-electronic component, 3-solder mask, 4-existing shielding cover, 41-existing shielding cover side wall, 42-groove, 5-shielding cover, 51-side wall, and 6-substrate.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.

It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.

Some exemplary embodiments of the invention have been described for illustrative purposes, and it is to be understood that the invention may be practiced otherwise than as specifically described.

Referring to fig. 2-3, there is shown an implementation of a circuit board according to the present invention, which includes a substrate 6, a circuit routing layer (not shown in the figures), a solder mask layer 3, a shielding cage 5 (shown in fig. 3, the circuit board in fig. 2 is used as a shield), and an anti-short circuit layer 1 between the solder mask layer 3 and the shielding cage 5.

The substrate 6 may be a single layer board or a multilayer board, such as a double, four or even multilayer structure. Common substrate materials are bakelite boards, fiberglass boards, and various plastic boards. The substrate 6 is provided with electronic components 2 that can perform desired functions.

A circuit trace layer is disposed on the substrate, typically using copper.

The solder resist layer 3 is disposed on the circuit wiring layer, more specifically, the solder resist layer 2 is typically disposed on the circuit wiring layer on the upper surface or the lower surface of the substrate 6, and the solder resist layer 3 may be a green ink or a black ink, etc.

The shield 5 is placed on the base plate 6 as shown in fig. 2 and mainly serves to prevent the module itself from being radiated by the outside or from radiating to the outside module. The shield 5 may be of various configurations, and fig. 3 shows the shield 5 as a square shield, it being understood that the square shield of the present embodiment may alternatively be a cylindrical shield or other irregular shield. More specifically, the shape and size of the shield case 5 are determined by the shape and size of the electronic component or module to be shielded actually. The shielding 5 may be designed as an integral part or may be formed by joining several parts, for example by welding. The shield case is made of a material having a signal shielding function, such as cupronickel and stainless steel. In the present embodiment, the shielding case 5 includes an upper wall (not shown) and a side wall 51 surrounding the periphery of the upper wall, and the region formed by the upper wall and the side wall 51 forms a shielding cavity. The side wall 51 may be formed by extending and bending the edge of the upper wall, or the side wall 51 may be welded directly to the edge of the upper wall. The upper wall is square in the present embodiment, it should be understood that the upper wall can be designed into a circle, an ellipse, a triangle, a polygon or other irregular figures according to actual needs, and the shape of the side wall 51 is selected according to the shape of the upper wall and the actual needs. The utility model discloses a shield cover 5 need not the grooving in lateral wall 51 department, is the totally enclosed structure, has guaranteed the shielding effect promptly, has reduced the degree of difficulty of design shield cover again, has simplified the manufacturing process of shield cover, has reduced the cost of manufacture of shield cover.

The shielding case 5 is covered on the substrate 6, the short-circuit preventing layer 1 is printed on the solder mask layer 3 on the circuit trace corresponding to the lower part of the side wall 51 of the shielding case 5, namely, the short-circuit preventing layer 1 is positioned between the side wall 51 of the shielding case 5 and the solder mask layer 3, and the side wall 51 of the shielding case 5 is not in direct contact with the solder mask layer 3. The main function of the short-circuit prevention layer 1 is to prevent the side wall 51 of the shielding case 5 from scratching the solder resist layer 3, and further prevent the circuit wiring layer from short-circuiting with the shielding case 5. The short-circuit prevention layer 1 is a silk-screen layer, in this embodiment, the silk-screen layer is white oil, and the thickness of the white oil can be selected to be 0.1-1.0 mil as required. The shape, size and length of the short prevention layer 1 may be determined according to the routing under the sidewall 51 of the shield can 5 on the substrate 6.

It should be understood that the upper and lower sides of the substrate 1 may be provided with solder resist layers 3, i.e. an upper solder resist layer and a lower solder resist layer, and the short-circuit prevention layer 1 is provided on the upper and lower solder resist layers.

In another embodiment of the present invention, an electronic device (not shown in the drawings) is provided, which includes the circuit board or its equivalent in the above embodiments.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A circuit board, comprising:

a substrate;

the circuit wiring layer is arranged on the substrate;

the solder mask layer is arranged on the circuit wiring layer;

2. The circuit board of claim 1, wherein the solder resist layer is green ink or black ink.

3. The circuit board of claim 1, wherein the short prevention layer is a silk-screen layer.

4. The circuit board of claim 3, wherein the screen printed layer is white oil.

5. The circuit board of claim 3, wherein the screen printed layer has a thickness of 0.1 to 1.0 mil.

6. The circuit board of claim 1, wherein the shield is a hermetic shield.

7. The circuit board of claim 6, wherein the shield is integrally formed.

8. The circuit board of claim 6, wherein the side wall of the shield case is formed by extending and bending the edge of the upper wall, or the side wall is welded to the periphery of the upper wall.

9. The circuit board of claim 1, wherein the substrate is an even-numbered board, an upper solder resist layer is provided on an upper side of the substrate, a lower solder resist layer is provided on a lower side of the substrate, an upper short-circuit prevention layer is provided on a surface of the upper solder resist layer, and a lower short-circuit prevention layer is provided on a surface of the lower solder resist layer.

10. An electronic device, characterized in that it comprises a circuit board according to any one of claims 1-9.