CN114051374B

CN114051374B - Avoidance method, avoidance inspection method, package inspection unit, and structure inspection tool

Info

Publication number: CN114051374B
Application number: CN202111270346.XA
Authority: CN
Inventors: 欧阳军
Original assignee: Zhuzhou Megmeet Electric Co ltd
Current assignee: Zhuzhou Megmeet Electric Co ltd
Priority date: 2021-10-29
Filing date: 2021-10-29
Publication date: 2023-07-25
Anticipated expiration: 2041-10-29
Also published as: CN114051374A

Abstract

The embodiment of the invention relates to the technical field of AI equipment plug-in components and SMT processes, and discloses a avoidance method, a avoidance inspection method, a packaging inspection unit and a structure inspection tool. The avoidance method comprises the following steps: calculating the size and the motion trail of the shearing jig; determining a three-dimensional diagram of the cutting jig; determining a package inspection unit; placing a package detection unit on the printed circuit board; and fixing the surface mount device on the printed circuit board according to the package detection unit. The avoidance inspection method comprises the following steps: the AI equipment obtains a structure checking tool according to the three-dimensional graph of the cutting jig; the structure checking tool is abutted against the printed circuit board; judging whether a gap exists after the structure checking tool is attached to the printed circuit board, if so, judging that effective avoidance exists; if the gap exists, judging that the gap is invalid. According to the invention, the surface mount device is fixed on the PCB according to the packaging inspection unit, so that interference between the shearing jig and the surface mount device is avoided; the structure inspection tool can judge whether the shearing tool is interfered with the surface mount device or not.

Description

Avoidance method, avoidance inspection method, package inspection unit, and structure inspection tool

Technical Field

The invention relates to the technical field of AI equipment plug-in components and SMT processes, in particular to a avoidance method, a avoidance inspection method, a packaging inspection unit and a structure inspection tool.

Background

As shown in fig. 1, in the prior art, when the vertical type inserting device 300 is automatically inserted onto the PCB400 using the vertical AI apparatus (not shown), pins of the vertical type inserting device 300 are mainly bent or cut by the cutting jig 200. When the vertical type package device 300 and the surface mount device 500 are respectively located on two different surfaces of the PCB400, the cutting jig 200 must be moved to the vicinity of the pins of the vertical type package device 300, and the pins of the vertical type package device 300 are bent or cut. At this time, since the cutting jig 200 and the surface mount device 500 are on the same side of the PCB400, the movement of the cutting jig 200 inevitably collides with the surface mount device 500, resulting in damage to the surface mount device 500.

In the prior art, when the surface mount device 500 is to be avoided, the avoiding space of the surface mount device 500 with different heights is generally defined only in the X and/or Y directions; or the avoidance interval is not clear, the PCB designer does not consider the avoidance of the surface mount device 500 in the SMT process, and in this case, the operator of the vertical AI device can only feed back to the PCB designer to improve according to the interference situation that has occurred during the actual operation.

In the above-described operation, there are the following problems: first, since the shearing jig 200 forms 45 ° with the plug-in header 100, if the existing X and/or Y direction avoidance is adopted, a larger avoidance space is needed to consider the height of each position, so that the design space of the PCB400 is wasted; second, because the cutting jig 200 is at the bottom layer, that is, the cutting jig 200 is blocked by the PCB400, when the vertical AI device is plugged, an operator cannot easily see the actual interference condition, only the damage of the surface mount device 500 can determine whether interference occurs, and the actual slight interference cannot be seen, and the PCB400 designer does not have reasonable data as a basis to change the PCB400 when avoiding interference again.

Disclosure of Invention

Based on the above, it is necessary to provide a clearance method, a clearance inspection method, a package inspection unit and a structure inspection tool for solving the problem that the cutting jig cannot avoid the surface mount device well in the pin cutting process of the opposite type package device in the prior art.

In order to solve the technical problems, one technical scheme adopted by the embodiment of the invention is as follows:

a method of avoiding comprising: calculating the size of the cutting jig and the motion track of the cutting jig when cutting pins of the vertical type plug-in device; determining a three-dimensional diagram of the cutting jig comprising a plurality of height areas according to the size of the cutting jig and the motion track of the cutting jig when cutting pins of the vertical type plug-in device; determining a packaging inspection unit comprising a plurality of plane areas according to the three-dimensional diagram of the cutting jig; the planar area corresponds to the height area; the packaging inspection unit is arranged at the mounting position of the vertical type plug-in device on the printed circuit board; fixing surface mount devices on the printed circuit board at the back of the surface where the vertical type plug-in devices are located, corresponding to each plane area; the cutting jig further comprises a height datum plane; the surface of the shearing jig is divided into a plurality of height areas according to the height reference plane; the dimensions of the shearing jig comprise a space dimension and a structural dimension; the space dimension comprises the length, the width and the height of the cutting jig; the structural dimension comprises the distance between the plurality of height areas and the height reference surface, the size of the knife edge of the cutting jig and the position of the knife edge on the cutting jig; the motion track of the cutting jig is obtained under the condition that the cutting jig and the surface mounting element are not interfered.

A method of avoidance inspection, comprising: obtaining a structure inspection tool according to the three-dimensional diagram of the cutting jig; the structure inspection tool is abutted against the surface of the printed circuit board, on which the surface mount device is fixed; judging whether a gap exists after the structure checking tool is attached to the printed circuit board, if no gap exists, judging that effective avoidance exists; if the gap exists, judging that the gap is invalid.

A package inspection unit comprising: a planar reference surface corresponding to the height reference surface described above; and a plurality of planar areas corresponding to the plurality of height areas; the plurality of plane areas are used for prompting the mounting and fixing positions of the surface mounting device.

As a further improvement of the above, the package inspection unit is placed at a mounting position of the vertical type package device on the printed circuit board.

A structural inspection tool, comprising: the surface of the detection end is provided with a step shape corresponding to the plurality of height areas; and the pins extend outwards from the detection end and are used for being inserted into pin mounting through holes on the printed circuit board.

As a further improvement of the above solution, the first end face of the detection end is a detection reference surface, and the pins extend out from the detection reference surface; the detection reference surface corresponds to the height reference surface; the detection reference surface is attached to the surface of the printed circuit board and used for judging whether the avoidance position is effective or not.

As a further improvement of the above, the structure inspection tool further includes a handle; the handle is fixed at the second end of the detection end; the second end is the other end of the detection end opposite to the first end.

According to the invention, the package inspection units with different plane areas are arranged on the PCB, so that the SMDs with different heights can determine the fixed positions of the SMDs on the PCB according to the different plane areas, the layout space of the PCB is fully utilized, the cost is saved, and the phenomenon that the cutting jig interferes with the SMD when the cutting jig cuts pins of the vertical type plug-in device is avoided.

The structure checking tool can also more intuitively judge whether the shearing jig and the SMD interfere before the vertical type plug-in device is plugged; and the structure inspection tool is simple in structure and easy to manufacture.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to scale, unless expressly stated otherwise.

FIG. 1 is a schematic diagram of a prior art card head and cutting tool operating electronics on a PCB;

FIG. 2 is a flow chart of a method for avoiding a potential space provided by an embodiment of the present invention;

FIG. 3 is a flowchart of a method for checking a avoidance bit according to an embodiment of the present invention;

FIG. 4 is a three-dimensional view of a cutting jig according to an embodiment of the present invention;

fig. 5 is a block diagram of a package inspection unit provided in an embodiment of the present invention;

FIG. 6 is a first block diagram of a structural inspection tool provided in accordance with an embodiment of the present invention;

fig. 7 is a second block diagram of a structural inspection tool provided in an embodiment of the present invention.

Detailed Description

In order that the invention may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to/mounted on "another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like as used in this specification, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the invention described below can be combined with one another as long as they do not conflict with one another.

Referring to fig. 1, in order to better understand the technical scheme of the present invention, an explanation will be given of an insert head 100 and a cutting jig 200 related to the technical scheme of the present invention.

Plug-in head 100: the card head 100 is fixedly mounted on a vertical AI device (not labeled) and is an actuator of the vertical AI device (not labeled), and the card head 100 clamps the vertical card device 300 to be automatically inserted onto a printed circuit board 400 (Printed circuit board, PCB).

The card head 100 clamps the vertical type card 300 and automatically inserts pins of the vertical type card 300 into pin vias of the PCB 400.

Shearing jig 200: the cutting jig 200 may be moved upward and against the surface of the PCB400 to cut the lengthy pins of the vertical interposer device 300 through the PCB 400.

PCB400: between the card head 100 and the cutting jig 200.

A first surface of the PCB400 to which the surface mount device 500 (Surface mount device, SMD) is fixed; a second surface, facing away from the first surface, has a vertical insert device 300 secured thereto.

The first surface is adjacent to the cutting jig 200, facilitating the cutting jig 200 to trim lengthy pins of the vertical type cartridge device 300 passing through the PCB 400.

Fig. 2 shows a method for avoiding a vehicle according to the present invention. By the avoidance method, when the cutting jig 200 cuts pins of the vertical type plug-in device 300, the cutting jig 200 can avoid the SMD500. The avoidance method comprises the following steps:

s110: the size of the cutting jig 200 and the movement trace of the cutting jig 200 when cutting pins of the vertical type cartridge device 300 are calculated.

Specifically, the dimensions of the cutting jig 200 include the spatial dimensions and the structural dimensions of the cutting jig 200.

The space dimension comprises the maximum width, the maximum length and the maximum height of the whole volume of the cutting jig 200; the structural dimensions include the relative positions of the surfaces of the cutting jig 200, the size of each blade, the position of the blade on the cutting jig 200, and the like.

The motion trajectory is a motion trajectory generated by the cutting jig 200 with respect to the PCB400 when the cutting jig 200 cuts the pins of the vertical type package 300, and is obtained by confirming that the cutting jig 200 does not interfere (e.g., collide) with the SMD500 on the PCB400 during cutting the pins of the vertical type package 300.

S120: according to the space size and the motion track of the cutting jig 200, a three-dimensional diagram of the cutting jig 200 including a plurality of height areas is determined. The three-dimensional image is a three-dimensional image simulating the actually used cutting jig 200.

Fig. 4 is a three-dimensional view of the cutting jig 200.

Three knife edges are arranged on the surface, close to the PCB400, of the shearing jig 200, and the three knife edges comprise a first knife edge 201, a second knife edge 203 and a third knife edge 205. The cutting jig 200 may be close to the PCB400 upwards, and pins of the vertical interposer device 300 extend into the knife edge, which is closed to cut the pins.

Specifically, the first blade 201 is a common blade for cutting one of the pins of the vertical plug-in device 300 having a pin pitch of 2.5mm and/or 5mm. The aperture of the first blade 201 is 1.0mm.

The second knife edge 203 is matched with the first knife edge and is used for cutting off the other pin of the vertical plug-in device 300 with the pin distance of 2.5 mm; the third blade 205 cooperates with the first blade to cut the other pin of the vertical plug-in device with a pin pitch of 5mm. The aperture of both the second and third blades 203, 205 is 0.6mm.

For example, when cutting pins of the vertical type plug-in device 300, if a pin distance between two pins of the vertical type plug-in device 300 is 2.5mm, a first blade 201 and a second blade 203 of the cutting tool 200 are used, the first pin of the vertical type plug-in device 300 extends into one of the blades, for example, the first blade 201, the second pin extends into the second blade 203, the first blade 201 and the second blade 203 are closed, and an overlong part of the pin is cut.

If the pin distance between two pins of the vertical type plug-in device 300 is 5mm, the first blade 201 and the third blade 205 of the cutting tool 200 are used, the first pin of the vertical type plug-in device 300 stretches into one of the blades, for example, the first blade 201, the second pin stretches into the third blade 205, the first blade 201 and the third blade 205 are closed, and the overlong part of the pin is cut.

With continued reference to fig. 4, the three-dimensional view of the cutting jig 200 may be divided into several different height regions according to the heights of the different surfaces of the cutting jig 200 relative to the reference plane.

In the three-dimensional view of the cutting jig 200, a first height region 207, a second height region 209, a third height region, a fourth height region 211, a fifth height region, a sixth height region, and a seventh height region 213 are included.

Wherein the first height region 207 serves as a height reference plane; the second height area 209 is a 1.8mm height area, i.e. the distance between the surface where the second height area 209 is located and the surface where the first height area 207 is located is 1.8mm; the third height region is a hole corresponding to the third knife edge 205; the fourth height region 211 is a 1.2mm height region, i.e., the distance between the surface of the fourth height region 211 and the surface of the first height region 207 is 1.2mm; the fifth height region is a hole corresponding to the second knife edge 203; the sixth height region is a hole corresponding to the first knife edge 201; the seventh height region 213 is a 3.5mm height region, i.e. the distance between the surface where the seventh height region 213 is located and the surface where the first height region 207 is located is 3.5mm.

S130: determining a package inspection unit 600 including a plurality of planar areas according to the three-dimensional map of the cutting jig 200; the plurality of planar areas corresponds to the plurality of height areas.

Specifically, a two-dimensional diagram is obtained from the three-dimensional diagram of the cutting jig 200, and then a package inspection unit 600 as shown in fig. 5 is obtained in a packaging machine layer of the design software according to the two-dimensional diagram, where the package inspection unit 600 has a plurality of planar areas corresponding to a plurality of height areas.

It should be noted that the design software includes, but is not limited to, protein, DXP, aluminum designer, and the like.

Referring to fig. 5, in order to construct the package inspection unit 600, the package inspection unit 600 is divided into several planar areas corresponding to several height areas of the three-dimensional view of the cutting jig 200.

Specifically, the planar regions include a first planar region 601, a second planar region 603, a third planar region 605, a fourth planar region 607, a fifth planar region 609, a sixth planar region 611, and a seventh planar region 613.

Wherein, the first plane area 601 corresponds to the first height area 207 and is a forbidden coverage area of the SMD 500; the second plane area 603 corresponds to the second height area 209 and is a forbidden coverage area of the SMD500 with a height of 1.8mm; the third planar region 605 corresponds to a third elevation region and/or a third knife edge 205; the fourth plane area 607 corresponds to the fourth height area 211 and is a forbidden coverage area of the SMD500 with a height of 1.2mm; fifth planar region 609 corresponds to a fifth elevation region and/or second knife edge 203; the sixth planar region 611 corresponds to a sixth height region and/or to the aperture of the first blade 201 (common blade); the seventh planar area 613 corresponds to the seventh height area 213, being a keep out area of the 3.5mm height SMD500.

S140: the package inspection unit 600 is placed at a mounting position of the vertical type package device 300 on the PCB 400.

In placing the package inspection unit 600 in the mounting position of the vertical type package device 300 on the PCB400, care should be taken that the third planar area 605, the fifth planar area 609 and the sixth planar area 611 of the package inspection unit 600 coincide with the pin vias of the corresponding pitch (2.5 mm, 5 mm) on the PCB400, respectively.

For example, the third planar region 605 and the sixth planar region 611 respectively coincide with two pin vias on the PCB400 having a pitch of 5mm, and the fifth planar region 609 and the sixth planar region 611 respectively coincide with two pin vias on the PCB400 having a pitch of 2.5mm.

During the design process of the PCB400, the package inspection unit 600 is led into the mounting position of the vertical type plug-in device 300 on the PCB400, so as to obtain the PCB400 with the package inspection unit 600, and the SMDs 500 with different heights can be correspondingly arranged in a partition mode according to the height limitation of different plane areas of the PCB400 during the mounting.

S150: the SMD500 is fixed on the PCB400 at the back of the mounting surface of the vertical type package 300 and in correspondence to each planar area.

Specifically, according to the heights of the SMDs 500, the SMDs 500 are divided into several types, the SMDs 500 with different heights are respectively fixed in the corresponding planar areas of the PCB400, and the SMDs 500 with different heights respectively correspond to the different planar areas, so that the shearing jig 200 can be prevented from interfering with the SMDs 500 when the shearing jig 200 shears the pins of the vertical type plug-in device 300.

The mounting process of the SMD500 on the PCB400 is as follows:

the SMDs 500 are divided into several groups, for example, the several SMDs 500 are divided into three groups with 1.2mm, 1.8mm, 3.5mm as demarcation points, the first group of SMDs 500 having a height of less than or equal to 1.2mm, the second group of SMDs 500 having a height of greater than 1.2mm and less than or equal to 1.8mm, and the third group of SMDs 500 having a height of greater than 1.8mm and less than or equal to 3.5mm.

The second set of SMDs 500 is exemplified herein for mounting and fixing the SMDs 500 on the PCB400, and it is understood that the mounting and fixing methods of the SMDs 500 with other heights are similar to the above, which is omitted for brevity.

When the height of the SMD500 does not exceed 1.8mm, the SMD500 may be mounted in the second plane area 603 or the seventh plane area 613, but if the SMD500 having a height exceeding 1.8mm is mounted in the second plane area 603, when the cutting jig 200 cuts the pins of the vertical type mounted device 300, the cutting jig 200 interferes with the SMD500, resulting in crashing the SMD500, thereby increasing the repair cost.

The first plane area 601 is a SMD500 no-layout area, and any SMD500 is prevented from being mounted and fixed on the no-layout area.

The invention also provides a avoidance checking method which is used for judging whether the avoidance is effective or not. Specifically, the avoidance inspection method includes the following steps:

s210: the structure inspection tool 700 is obtained from the three-dimensional view of the cutting jig 200.

Referring to fig. 6, a first configuration of a configuration inspection tool 700 is shown.

Specifically, the structure inspection tool 700 includes a detection end 701, where the surface shape of the detection end 701 corresponds to the height area of the three-dimensional map of the cutting tool 200, i.e., the detection end 701 is a stepped outer surface.

Wherein, a first end of the detecting end 701 is a detecting reference surface 702, and corresponds to the first height region 207 (or the height reference surface); the first pin 703 and the second pin 704a are extended outwards at positions corresponding to the sixth height region (or the first knife edge 201) and the fifth height region (or the second knife edge 203) on the detection reference surface 702, and the distance between the first pin 703 and the second pin 704a is 2.5mm.

In some embodiments, a handle 705 is secured to a second end of the detection end 701 opposite the first end for ease of handling and access to the structural inspection tool 700.

The handle 705 may be integrally formed with the sensing end 701 or may be secured to the sensing end 701 by welding or threading.

Fig. 7 shows a second configuration of a configuration inspection tool 700.

The first structure differs from the second structure in that: the structure inspection tool 700 of the second structure extends outward beyond the second pin 704b at a position corresponding to the third height region (or the third knife edge 205) on the inspection reference surface 702, and the first pin 703 is spaced from the second pin 704b by a distance of 5mm.

It should be understood that, although only two cases of the pin pitch of the structure inspection tool 700 being 2.5mm and 5mm are described in this embodiment, the pin pitch of the structure inspection tool 700 is not limited to the two types, and the designer can flexibly change the pin pitch of the structure inspection tool 700 according to actual production requirements.

S220: the structure inspection tool 700 is abutted against the side surface of the printed circuit board 400 on which the surface mount device 500 is fixed.

S230: judging whether a gap exists after the structure checking tool 700 is abutted against the printed circuit board 400, and if the gap exists, judging that the gap is effective; if there is a gap, it is determined as invalid avoidance.

Specifically, the process of the structure inspection tool 700 for checking whether the SMD500 interferes with the cutting jig 200 is as follows:

after the SMD500 is mounted on the first surface of the PCB400, and before the vertical type interposer 300 is mounted on the second surface, two pins of the structure inspection tool 700 are inserted into pin vias of the PCB400 from one side of the first surface of the PCB400, so that the inspection reference surface 702 is abutted against the first surface of the PCB400, at which time it can be seen whether the SMD500 interferes with the structure inspection tool 700.

The method for judging whether the structure checking tool 700 interferes with the SMD500 is as follows: no gap exists between the detection reference surface 702 of the structural inspection tool 700 and the first surface of the PCB400 after the detection reference surface 702 is abutted, and it is determined that the structural inspection tool 700 and the SMD500 do not interfere;

after the detection reference surface 702 of the structure inspection tool 700 is abutted against the first surface of the PCB400, a gap exists between the detection reference surface 702 and the first surface, and it is determined that the structure inspection tool 700 interferes with the SMD500.

When the structure inspection tool 700 interferes with the SMD500, it may be determined that the cutting tool 200 interferes with the SMD500 when cutting the pins of the vertical type package device 300, and in this case, it is not preferable to perform the next process of inserting the vertical type package device 300 on the second surface of the PCB 400.

When the structure inspection tool 700 and the SMD500 do not interfere, it can be determined that the cutting jig 200 does not interfere with the SMD500 when cutting the pins of the vertical type package device 300, and in this case, the next process can be performed.

The invention puts the package inspection unit 600 with different plane areas into the PCB400, so that the SMD500 with different heights can determine the fixed position of the SMD500 on the PCB400 according to the different plane areas, thereby not only fully utilizing the layout space of the PCB400 and saving the cost, but also avoiding the phenomenon that the cutting jig 200 interferes with the SMD500 when the cutting jig 200 cuts the pins of the vertical type cartridge device 300.

The structure inspection tool 700 can further intuitively determine whether the shearing jig 200 interferes with the SMD500 before the vertical insertion device 300 is inserted; and the structural inspection tool 700 is simple in structure and easy to manufacture.

The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the invention.

Claims

1. A method of avoiding a vehicle, comprising:

calculating the size of the cutting jig and the motion track of the cutting jig when cutting pins of the vertical type plug-in device; determining a three-dimensional diagram of the cutting jig comprising a plurality of height areas according to the size of the cutting jig and the motion track of the cutting jig when cutting pins of the vertical type plug-in device;

determining a packaging inspection unit comprising a plurality of plane areas according to the three-dimensional diagram of the cutting jig; the planar area corresponds to the height area;

the packaging inspection unit is arranged at the mounting position of the vertical type plug-in device on the printed circuit board;

fixing surface mount devices on the printed circuit board at the back of the surface where the vertical type plug-in devices are located, corresponding to each plane area;

the cutting jig further comprises a height datum plane; the surface of the shearing jig is divided into a plurality of height areas according to the height reference plane;

the dimensions of the shearing jig comprise a space dimension and a structural dimension; the space dimension comprises the length, the width and the height of the cutting jig; the structural dimension comprises the distance between the plurality of height areas and the height reference surface, the size of the knife edge of the cutting jig and the position of the knife edge on the cutting jig;

the motion track of the cutting jig is obtained under the condition that the cutting jig and the surface mounting element are not interfered.

2. A method of level avoidance verification comprising:

obtaining a structural inspection tool according to the three-dimensional view of the shearing jig of claim 1;

the structure inspection tool is abutted against the surface of the printed circuit board, on which the surface mount device is fixed;

judging whether a gap exists after the structure checking tool is attached to the printed circuit board, if no gap exists, judging that effective avoidance exists; if the gap exists, judging that the gap is invalid.

3. A package inspection unit, comprising:

a planar datum surface corresponding to the height datum surface of claim 1;

and a plurality of planar areas corresponding to the plurality of height areas;

the plurality of plane areas are used for prompting the mounting and fixing positions of the surface mounting device.

4. A package inspection unit according to claim 3, wherein said package inspection unit is placed at a mounting position of said vertical type package device on said printed circuit board.

5. A structural inspection tool, comprising:

a detection end, the surface of which is provided with a ladder shape corresponding to the plurality of height areas in claim 1;

and the pins extend outwards from the detection end and are used for being inserted into pin mounting through holes on the printed circuit board.

6. The structural inspection tool of claim 5, wherein the first end face of the inspection end is an inspection datum surface from which the pins extend outwardly;

the detection reference surface corresponds to the height reference surface; the detection reference surface is attached to the surface of the printed circuit board and used for judging whether the avoidance position is effective or not.

7. The structural inspection tool of claim 6, further comprising a handle;

the handle is fixed at the second end of the detection end; the second end is the other end of the detection end opposite to the first end.