CN114051374A - Avoidance method, avoidance inspection method, package inspection unit and structure inspection tool - Google Patents

Avoidance method, avoidance inspection method, package inspection unit and structure inspection tool Download PDF

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Publication number
CN114051374A
CN114051374A CN202111270346.XA CN202111270346A CN114051374A CN 114051374 A CN114051374 A CN 114051374A CN 202111270346 A CN202111270346 A CN 202111270346A CN 114051374 A CN114051374 A CN 114051374A
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China
Prior art keywords
height
jig
cutting jig
inspection tool
circuit board
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CN202111270346.XA
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CN114051374B (en
Inventor
欧阳军
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Zhuzhou Megmeet Electric Co ltd
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Zhuzhou Megmeet Electric Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages

Abstract

The embodiment of the invention relates to the technical field of AI equipment plug-ins and SMT processes, and discloses an avoiding method, an avoiding inspection method, a packaging inspection unit and a structure inspection tool. The bit avoiding method comprises the following steps: calculating the size and the motion track of the shearing jig; determining a three-dimensional graph of a shearing jig; determining a package inspection unit; placing a package detection unit on a printed circuit board; and fixing the surface mount device on the printed circuit board according to the packaging detection unit. The bit avoidance detection method comprises the following steps: the AI equipment obtains a structure inspection tool according to the three-dimensional graph of the shearing jig; the structure inspection tool abuts against the printed circuit board; judging whether a gap exists after the structure inspection tool is attached to the printed circuit board, and if no gap exists, judging that the structure inspection tool is an effective avoiding position; if the gap exists, the bit is judged to be invalid and avoided. According to the invention, the surface mounting device is fixed on the PCB according to the packaging inspection unit, so that the interference between the shearing jig and the surface mounting device is avoided; whether the shearing jig interferes with the surface mounting device or not can be judged through the structure inspection tool.

Description

Avoidance method, avoidance inspection method, package inspection unit and structure inspection tool
Technical Field
The invention relates to the technical field of AI equipment plug-ins and SMT processes, in particular to a position avoiding method, a position avoiding inspection method, a packaging inspection unit and a structure inspection tool.
Background
Referring to fig. 1, in the prior art, when a vertical type inserted device 300 is automatically inserted onto a PCB400 using a vertical type AI apparatus (not shown), pins of the vertical type inserted device 300 are mainly bent or cut by a cutting jig 200. When the vertical type inserted device 300 and the surface mounted device 500 are respectively located on two different surfaces of the PCB400, the cutting jig 200 must be moved to the vicinity of the pins of the vertical type inserted device 300 to bend or cut the pins of the vertical type inserted device 300. At this time, since the cutting jig 200 and the surface mount device 500 are located at the same side of the PCB400, the movement of the cutting jig 200 inevitably collides and interferes with the surface mount device 500, thereby causing damage to the surface mount device 500.
In the prior art, when the surface mounted device 500 is to be avoided, the avoiding space of the surface mounted device 500 with different heights is generally defined only in the X and/or Y directions; or the avoidance interval is not clear, and the PCB designer does not consider avoiding the surface mount device 500 in the SMT process, and in this case, the vertical AI device operator can only feed back the interference situation that has occurred during actual operation to the PCB designer for improvement.
In the above operation, there are the following problems: firstly, as the shearing jig 200 and the plug-in head 100 form a 45-degree angle, for example, avoiding positions according to the existing X and/or Y directions, a larger avoiding space is inevitably needed for considering the heights of all positions, thus the design space of the PCB400 is wasted; secondly, since the cutting jig 200 is at the bottom layer, that is, the cutting jig 200 is blocked by the PCB400, when the vertical AI device is plugged in, an operator cannot easily see the actual interference situation, whether the interference occurs can be determined only by the damage of the surface mount device 500, the slight interference cannot be seen actually, and the PCB400 designer does not have reasonable data to modify the PCB400 when avoiding the interference again.
Disclosure of Invention
Therefore, it is necessary to provide a position avoiding method, a position avoiding inspection method, a packaging inspection unit and a structure inspection tool for solving the problem that the cutting jig cannot be well avoided from the surface mounting device in the pin cutting process of the opposite vertical type inserting device in the cutting jig in the prior art.
In order to solve the above technical problem, one technical solution adopted by the embodiment of the present invention is:
a bit avoiding method comprises the following steps: calculating the size of the shearing jig and the motion track of the shearing jig when the shearing jig shears the pins of the vertical plug-in device; determining a three-dimensional graph of the cutting jig comprising a plurality of height areas according to the size of the cutting jig and the motion track of the cutting jig when the cutting jig cuts the pins of the vertical plug-in device; determining a packaging inspection unit comprising a plurality of plane areas according to the three-dimensional graph of the cutting jig; the plane area corresponds to the height area; placing the packaging detection unit at the mounting position of the vertical plug-in device on the printed circuit board; and fixing surface mounting devices in the back surface of the printed circuit board where the vertical plug-in devices are located, corresponding to each plane area.
As a further improvement of the above scheme, the shearing jig further comprises a height reference plane; the surface of the shearing jig is divided into a plurality of height areas according to the height reference surface.
As a further improvement of the above scheme, the size of the cutting jig includes a space size and a structure size; the space size comprises the length, the width and the height of the cutting jig; the structural size comprises the distance between the height areas and the height reference plane, the size of the cutting edge of the cutting jig and the position of the cutting edge on the cutting jig.
As a further improvement of the above scheme, the motion trajectory of the cutting jig is obtained under the condition that the cutting jig and the surface mount component do not interfere with each other.
A bit avoidance test method comprises the following steps: obtaining a structure inspection tool according to the three-dimensional drawing of the shearing jig; the structure inspection tool is attached to the surface of the printed circuit board on which the surface mount device is fixed; judging whether a gap exists after the structure inspection tool is attached to the printed circuit board, and if the gap does not exist, judging that the gap is effectively avoided; if the gap exists, the bit is judged to be invalid and avoided.
A package inspection unit comprising: a planar reference surface corresponding to the height reference surface described above; and a plurality of planar regions corresponding to the plurality of height regions; the plurality of plane areas are used for prompting the mounting and fixing positions of the surface mounting devices.
As a further improvement of the above solution, the package detection unit is disposed at a mounting position of the vertical insertion device on the printed circuit board.
A structure inspection tool comprising: a detection end, the surface of which is arranged into a step shape corresponding to the plurality of height areas; and the pins extend outwards from the detection end and are used for being plugged with the pin mounting through holes on the printed circuit board.
As a further improvement of the above solution, a first end face of the detection end is a detection reference surface, and the pin extends outward from the detection reference surface; the detection reference surface corresponds to the height reference surface; the detection reference surface is attached to the surface of the printed circuit board and used for judging whether the avoidance position is effective or not.
As a further improvement of the above, the structure inspection tool further comprises a handle; the handle is fixed at the second end of the detection end; the second end is the other end of the detection end opposite to the first end.
The invention puts the packaging inspection units with different plane areas into the PCB, so that the SMD with different heights can determine the fixed position on the PCB according to the different plane areas, thereby not only fully utilizing the layout space of the PCB and saving the cost, but also avoiding the phenomenon that the shearing jig interferes with the SMD when the shearing jig shears the pins of the vertical plug-in device.
Whether the shearing jig interferes with the SMD before the vertical insertion device is inserted can be judged more intuitively through the structure inspection tool; and the structure inspection tool has a simple structure and is easy to manufacture.
Drawings
One or more embodiments are illustrated in drawings corresponding to, and not limiting to, the embodiments, in which elements having the same reference number designation may be represented as similar elements, unless specifically noted, the drawings in the figures are not to scale.
FIG. 1 is a schematic diagram of a prior art interposer and cutting tool for handling electronic devices on a PCB;
fig. 2 is a flowchart of a bit avoidance method according to an embodiment of the present invention;
fig. 3 is a flowchart of a bit-avoidance testing method according to an embodiment of the present invention;
FIG. 4 is a three-dimensional view of a prior art shearing tool;
FIG. 5 is a block diagram of a package inspection unit provided by an embodiment of the present invention;
FIG. 6 is a first block diagram of a structural inspection tool provided in accordance with an embodiment of the present invention;
fig. 7 is a second structural diagram of a structural inspection tool according to an embodiment of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It is noted that when an element is referred to as being "secured to"/"mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used in this specification, the terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and simplicity in description, and do not indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Referring to fig. 1, in order to better understand the technical solution of the present invention, a plug-in head 100 and a cutting jig 200 related to the technical solution of the present invention will be explained.
Plug-in head 100: the plug-in connector 100 is fixedly mounted on a vertical AI device (not shown), and is an actuator of the vertical AI device (not shown), and the plug-in connector 100 clamps the vertical insertion device 300 and automatically inserts the vertical insertion device onto a Printed circuit board 400 (PCB).
The header 100 holds the vertical entry device 300 and automatically inserts the pins of the vertical entry device 300 into the pin vias of the PCB 400.
Shearing the jig 200: the cutting jig 200 can be moved upward and against the surface of the PCB400 to cut the excess length of the pins of the vertical insertion device 300 through the PCB 400.
The PCB 400: between the inserter head 100 and the cutting jig 200.
A Surface Mount Device (SMD) 500 is fixed to a first Surface of the PCB 400; a second surface, facing away from the first surface, is secured with a vertical insertion device 300.
The first surface is close to the cutting jig 200, which facilitates the cutting jig 200 to trim the overlong pins of the vertical insertion device 300 passing through the PCB 400.
Fig. 2 shows a bit avoiding method according to the present invention. By the avoiding method, when the cutting jig 200 cuts the pin of the vertical insertion device 300, the cutting jig 200 can avoid the SMD 500. The bit avoiding method comprises the following steps:
s110: the size of the cutting jig 200 and the movement locus of the cutting jig 200 when cutting the pins of the vertical insertion device 300 are calculated.
Specifically, the size of the cutting jig 200 includes the spatial size and the structural size of the cutting jig 200.
The space size comprises the maximum width, the maximum length and the maximum height of the whole volume of the shearing jig 200; the structural dimensions include the relative positions of the surfaces of the cutting jig 200, the sizes of the edges, the positions of the edges on the cutting jig 200, and the like.
The movement trajectory is a movement trajectory of the cutting jig 200 with respect to the PCB400 when the cutting jig 200 cuts the pin of the vertical type mounted device 300, and is confirmed when the cutting jig 200 does not interfere with (e.g., collide with) the SMD500 on the PCB400 while the pin of the vertical type mounted device 300 is being cut.
S120: according to the space size and the motion track of the cutting jig 200, a three-dimensional diagram of the cutting jig 200 including a plurality of height regions is determined. The three-dimensional diagram is a three-dimensional image simulating the cutting jig 200 actually used.
Fig. 4 is a three-dimensional view of the cutting jig 200.
The surface of the shearing jig 200 close to the PCB400 is provided with three edges, including a first edge 201, a second edge 203 and a third edge 205. The cutting jig 200 may be upwardly close to the PCB400, and the pins of the vertical insertion device 300 may be inserted into the blade, and the blade may be closed to cut the pins.
Specifically, the first blade 201 is a common blade for cutting one of the pins of the vertical insertion device 300 with a pitch of 2.5mm and/or 5 mm. The aperture of the first knife edge 201 is 1.0 mm.
The second knife edge 203 is matched with the first knife edge and is used for cutting off the other pin of the vertical plug-in device 300 with the pin pitch of 2.5 mm; the third blade 205 is matched with the first blade and is used for cutting off the other pin of the vertical plug-in device with the pin pitch of 5 mm. The aperture of the second and third edges 203, 205 is 0.6 mm.
For example, when the pins of the vertical insertion device 300 are cut, if the pitch between two pins of the vertical insertion device 300 is 2.5mm, the first blade 201 and the second blade 203 of the cutting jig 200 are used, the first pin of the vertical insertion device 300 extends into one of the blades, such as the first blade 201, the second pin extends into the second blade 203, and the first blade 201 and the second blade 203 are closed, so as to cut off the overlong pin.
If the foot distance between two pins of the vertical insertion device 300 is 5mm, the first blade 201 and the third blade 205 of the cutting tool 200 are used, the first pin of the vertical insertion device 300 extends into one of the blades, such as the first blade 201, the second pin extends into the third blade 205, the first blade 201 and the third blade 205 are closed, and the overlong part of the pin is cut off.
With continued reference to fig. 4, the three-dimensional view of the cutting tool 200 may be divided into several different height regions according to the heights of the different surfaces of the cutting tool 200 relative to the reference plane.
The three-dimensional drawing of the cutting jig 200 includes a first height region 207, a second height region 209, a third height region, a fourth height region 211, a fifth height region, a sixth height region, and a seventh height region 213.
Wherein, the first height area 207 is used as a height reference plane; the second height area 209 is a 1.8mm height area, i.e. the distance between the surface of the second height area 209 and the surface of the first height area 207 is 1.8 mm; the third height region is a hole corresponding to the third blade 205; the fourth height area 211 is a 1.2mm height area, i.e. the distance between the surface of the fourth height area 211 and the surface of the first height area 207 is 1.2 mm; the fifth height area is a hole corresponding to the second knife edge 203; the sixth height area is a hole corresponding to the first blade opening 201; the seventh height area 213 is a 3.5mm height area, i.e. the distance between the surface where the seventh height area 213 is located and the surface where the first height area 207 is located is 3.5 mm.
S130: determining a packaging inspection unit 600 comprising a plurality of plane areas according to the three-dimensional drawing of the cutting jig 200; the plurality of planar regions correspond to the plurality of height regions.
Specifically, a two-dimensional diagram is obtained from the three-dimensional diagram of the cutting jig 200, and then the package inspection unit 600 shown in fig. 5 is obtained in the package mechanical layer of the design software according to the two-dimensional diagram, where the package inspection unit 600 has a plurality of planar regions corresponding to a plurality of height regions.
The design software includes, but is not limited to, protein, DXP, aluminum designer, and other design software.
Referring to fig. 5, the package inspection unit 600 is divided into several planar regions corresponding to several height regions of the three-dimensional drawing of the cutting jig 200, as a structural diagram of the package inspection unit 600.
Specifically, the planar areas include a first planar area 601, a second planar area 603, a third planar area 605, a fourth planar area 607, a fifth planar area 609, a sixth planar area 611, and a seventh planar area 613.
The first plane area 601 corresponds to the first height area 207 and is an SMD500 keep-out area; the second plane area 603 corresponds to the second height area 209 and is a forbidden area of the SMD500 with a height of 1.8 mm; the third planar region 605 corresponds to the third height region and/or the third edge 205; the fourth plane area 607 corresponds to the fourth height area 211 and is a forbidden area of the SMD500 with a height of 1.2 mm; the fifth planar area 609 corresponds to a fifth height area and/or the second edge 203; the sixth planar area 611 corresponds to the sixth height area and/or the aperture of the first edge 201 (common edge); the seventh planar area 613 corresponds to the seventh height area 213, which is a keep-out area of the SMD500 having a height of 3.5 mm.
S140: the package inspection unit 600 is placed at a mounting position of the vertically mounted device 300 on the PCB 400.
When placing the package inspection unit 600 in the mounting position of the vertical type packaged device 300 on the PCB400, care should be taken that the third, fifth and sixth planar regions 605, 609 and 611 of the package inspection unit 600 coincide with the corresponding pitch (2.5mm, 5mm) of the pin vias on the PCB400, respectively.
For example, the third planar area 605 and the sixth planar area 611 respectively coincide with two pin vias on the PCB400 with a pitch of 5mm, and the fifth planar area 609 and the sixth planar area 611 respectively coincide with two pin vias on the PCB400 with a pitch of 2.5 mm.
During the design process of the PCB400, the package inspection unit 600 is introduced into the mounting position of the vertical type inserted device 300 on the PCB400 to obtain the PCB400 with the package inspection unit 600, and the SMDs 500 with different heights can be correspondingly arranged in different areas according to the height limitation of different planar areas of the PCB400 during mounting.
S150: the SMD500 is fixed on the PCB400 at the rear of the mounting surface of the vertical type package device 300, and corresponding to each planar area.
Specifically, the SMDs 500 are divided into several types according to the height of the SMD500, the SMDs 500 with different heights are respectively fixed in the corresponding planar areas of the PCB400, and the SMDs 500 with different heights respectively correspond to different planar areas, so that the interference between the cutting jig 200 and the SMD500 when the cutting jig 200 cuts the pins of the vertical insertion device 300 can be avoided.
The mounting process of the SMD500 on the PCB400 is as follows:
the SMDs 500 are divided into several groups, for example, several SMDs 500 are divided into three groups with 1.2mm, 1.8mm, 3.5mm as a division point, the height of 1.2mm or less is the first group SMD500, the height of 1.2mm or less and 1.8mm or less is the second group SMD500, the height of 1.8mm or more and 3.5mm or less is the second group SMD 500.
Here, the mounting and fixing of the SMD500 on the PCB400 is exemplarily illustrated by taking the second set of SMDs 500 as an example, and it is understood that mounting and fixing methods of SMDs 500 with other heights are similar thereto, and are not described in detail for brevity.
When the height of the SMD500 is not more than 1.8mm, the SMD500 may be mounted and fixed in the second planar region 603 or the seventh planar region 613, but if the SMD500 having a height of more than 1.8mm is mounted and fixed in the second planar region 603, when the cutting jig 200 cuts the pins of the vertical type insertion device 300, the cutting jig 200 may interfere with the SMD500, resulting in breaking the SMD500, thereby increasing the repair cost.
The first planar area 601 is an SMD500 keep out area on which any SMD500 is prohibited from being mounted and fixed.
The invention also provides a bit avoidance checking method, which is used for judging whether the bit avoidance is effective or not. Specifically, the bit avoidance detection method comprises the following steps:
s210: the structure inspection tool 700 is obtained from the three-dimensional view of the cutting jig 200.
Referring to fig. 6, a first configuration of a configuration inspection tool 700 is shown.
Specifically, the structure inspection tool 700 includes a detection end 701, and the surface shape of the detection end 701 corresponds to the height area of the three-dimensional drawing of the shearing jig 200, that is, the detection end 701 is a stepped outer surface.
A first end of the detecting end 701 is a detecting reference plane 702, and corresponds to the first height region 207 (or height reference plane); on the detection reference surface 702, corresponding to the sixth height area (or the first knife edge 201) and the fifth height area (or the second knife edge 203), a first pin 703 and a second pin 704a extend outwards respectively, and the distance between the first pin 703 and the second pin 704a is 2.5 mm.
In some embodiments, to facilitate handling and access of the structural inspection tool 700, a handle 705 is secured to the sensing end 701 at a second end opposite the first end.
The handle 705 may be integrally formed with the sensing tip 701 or may be fixed to the sensing tip 701 by welding or screwing.
Fig. 7 shows a second configuration of the structure inspection tool 700.
The first configuration differs from the second configuration in that: the structure inspection tool 700 of the second structure extends outward from the second pin 704b at a position corresponding to the third height region (or the third knife edge 205) on the detection reference plane 702, and the distance between the first pin 703 and the second pin 704b is 5 mm.
It is to be understood that, although only two cases of the pin pitch of the structure inspection tool 700 being 2.5mm and 5mm are described in the present embodiment, the pin pitch of the structure inspection tool 700 is not limited to the two types, and the designer can flexibly change the pin pitch of the structure inspection tool 700 according to the actual production needs.
S220: the structure inspection tool 700 is attached to a surface of the printed circuit board 400 on which the surface mount device 500 is mounted.
S230: judging whether a gap exists after the structure inspection tool 700 is attached to the printed circuit board 400, and if the gap does not exist, judging that the gap is effectively avoided; if there is a gap, the bit is judged to be invalid and avoided.
Specifically, the process of the structure checking tool 700 checking whether the SMD500 interferes with the cutting jig 200 is as follows:
after the SMD500 is mounted and fixed on the first surface of the PCB400 and before the vertical mounted device 300 is mounted on the second surface, the two pins of the structure inspection tool 700 are inserted into the pin through holes of the PCB400 from one side of the first surface of the PCB400, so that the detection reference surface 701 is abutted against the first surface of the PCB400, and it can be seen whether the SMD500 interferes with the structure inspection tool 700.
The method for determining whether the structure inspection tool 700 interferes with the SMD500 includes: there is no gap after the detection reference surface 701 of the structure inspection tool 700 is attached to the first surface of the PCB400, and it is determined that the structure inspection tool 700 does not interfere with the SMD 500;
when the detection reference surface 701 of the structure inspection tool 700 is in contact with the first surface of the PCB400, a gap is formed between the detection reference surface 701 and the first surface, and it is determined that the structure inspection tool 700 interferes with the SMD 500.
When the structure inspection tool 700 interferes with the SMD500, it is determined that the cutting jig 300 interferes with the SMD500 when the cutting jig 200 cuts the pins of the vertical mounted device 300, and in this case, it is not suitable to perform the next process of inserting the vertical mounted device 300 on the second surface of the PCB 400.
When the structure inspection tool 700 does not interfere with the SMD500, it can be determined that the cutting jig 300 does not interfere with the SMD500 when the cutting jig 200 cuts the pins of the vertical insertion device 300, and in this case, the next process can be performed.
The invention puts the packaging inspection unit 600 with different plane areas into the PCB400, so that the SMD500 with different heights can determine the fixed position on the PCB400 according to the different plane areas, thereby not only fully utilizing the layout space of the PCB400 and saving the cost, but also avoiding the phenomenon that the shearing jig 200 interferes with the SMD500 when the shearing jig 200 shears the pins of the vertical plug-in device 300.
Whether the shearing jig 200 interferes with the SMD500 before the vertical insertion device 300 is inserted can be more intuitively judged by the structure checking tool 700; and the structure inspection tool 700 is simple in structure and easy to manufacture.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A bit avoiding method is characterized by comprising the following steps:
calculating the size of the shearing jig and the motion track of the shearing jig when the shearing jig shears the pins of the vertical plug-in device;
determining a three-dimensional graph of the cutting jig comprising a plurality of height areas according to the size of the cutting jig and the motion track of the cutting jig when the cutting jig cuts the pins of the vertical plug-in device;
determining a packaging inspection unit comprising a plurality of plane areas according to the three-dimensional graph of the cutting jig; the plane area corresponds to the height area;
placing the packaging detection unit at the mounting position of the vertical plug-in device on the printed circuit board;
and fixing surface mounting devices in the back surface of the printed circuit board where the vertical plug-in devices are located, corresponding to each plane area.
2. The avoiding method according to claim 1, wherein the cutting jig further comprises a height reference plane;
the surface of the shearing jig is divided into a plurality of height areas according to the height reference surface.
3. The avoiding method according to claim 2, wherein the dimensions of the cutting jig include a space dimension and a structure dimension;
the space size comprises the length, the width and the height of the cutting jig;
the structural size comprises the distance between the height areas and the height reference plane, the size of the cutting edge of the cutting jig and the position of the cutting edge on the cutting jig.
4. The avoiding method according to claim 2, wherein the movement locus of the cutting jig is obtained under the condition that the cutting jig and the surface mount component do not interfere with each other.
5. A bit avoidance test method is characterized by comprising the following steps:
obtaining a structural inspection tool from the three-dimensional view of the clipping jig according to any one of claims 2 to 4;
the structure inspection tool is attached to the surface of the printed circuit board on which the surface mount device is fixed;
judging whether a gap exists after the structure inspection tool is attached to the printed circuit board, and if the gap does not exist, judging that the gap is effectively avoided; if the gap exists, the bit is judged to be invalid and avoided.
6. A package inspection unit, comprising:
a planar reference surface corresponding to the height reference surface of any one of claims 2 to 4;
and a plurality of planar regions corresponding to the plurality of height regions;
the plurality of plane areas are used for prompting the mounting and fixing positions of the surface mounting devices.
7. The package inspection unit of claim 6, wherein the package inspection unit is positioned at a mounting location of the vertical insertion device on the printed circuit board.
8. A structural inspection tool, comprising:
a detection end, the surface of which is provided in a stepped profile corresponding to the plurality of height regions of any one of claims 2 to 4;
and the pins extend outwards from the detection end and are used for being plugged with the pin mounting through holes on the printed circuit board.
9. The structure inspection tool of claim 8, wherein a first end surface of the inspection terminal is an inspection reference surface from which the pin extends;
the detection reference surface corresponds to the height reference surface; the detection reference surface is attached to the surface of the printed circuit board and used for judging whether the avoidance position is effective or not.
10. The structure inspection tool of claim 8, further comprising a handle;
the handle is fixed at the second end of the detection end;
the second end is the other end of the detection end opposite to the first end.
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