JP2006126042A - Printed solder inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform quick measuring and inspection by performing measuring in accordance with an effective measuring (scan) route with knowing the shape of a printed circuit board and soldering spots. <P>SOLUTION: A measuring route determination means 11, with knowing arrangement information on solder in a state wherein the printed circuit board is arranged (especially longitudinal and lateral directions), determines a scan route (especially a principal scan direction in which measuring is performed) allowing to perform measuring effectively and in a short time. A measuring means 100, in accordance with the scan route, changes the direction of a sensor 3 by a rotation mechanism section 5c and performs measuring with the arrangement of the board left as it is. The influence of angle errors or the like of the rotation mechanism on measured values is corrected by a correction means 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a printed solder inspection apparatus that measures and inspects a solder formation state when a cream-like solder is printed on a printed board for surface mounting electronic components and the like by a solder printing apparatus or the like. In particular, a technique for determining the direction of the non-contact sensor and the scanning route (direction) based on the solder position information (or range) of the printed board that has been conveyed, and performing more efficient and quick measurement. Concerning.

  Conventionally, a printed solder inspection apparatus has a sensor that irradiates the surface of a substrate (hereinafter, the printed board is simply referred to as “substrate”) with a laser beam or the like and receives reflected light from the surface of the substrate. Measurement values obtained as a result of measurement (triangulation) by the sensor, for example, displacement (including height) of printed solder on the board or luminance (amount of light reflected from the board, received light quantity (light intensity) ) Is included, and is determined by comparison with reference data serving as a determination reference (Patent Document 1).

  In such an inspection apparatus (method), in general, the substrate is transported from a certain direction and stopped at a predetermined inspection position, where the sensor or / and the substrate are placed on the X stage and the Y stage (X axis direction, Y axis). Measurement is performed by scanning (relatively scanning) using a moving table and moving means in each direction, and in the scanning direction, scanning is performed in a direction perpendicular to the main scanning and the main scanning. Measurement is performed during main scanning, and sub-scanning is performed to shift the sensor from the current main scanning position to the position where the next main scanning is to be performed. The range of shifting is determined by the sensor during main scanning. This corresponds to a detection width in the sub-scanning direction that can be detected.

  In such an inspection apparatus (method), the direction of the sensor and the main scanning direction in which the measurement is performed are, for example, in the Y direction regardless of the shape such as the dimensions of the substrate or the position and range of the solder location. If there was, it was measured and inspected in a state of being constant in the Y direction.

Japanese Patent No. 3537382

  Like Patent Document 1 above. When the sensor and the main scanning direction are fixed in a certain direction, for example, as shown in FIG. 6A, the substrate is long in the main scanning direction, and the solder portion is spread in a direction perpendicular to the main scanning direction. As a result, the trajectory of scanning by sub-scanning becomes long (the number of main scans increases), and there is a problem that the measurement speed becomes slow.

  In order to solve this, it is conceivable to change the direction of the board by 90 degrees. However, a board rotating mechanism that changes the direction of a board of any size is provided. There was a problem of getting bigger.

  In addition, although it can be considered that only the area of the solder portion is scanned as shown in FIG. 6C, this is an effective method when there are many empty spaces without solder in the main scanning direction. It cannot be said that it provides an effective solution for the area of variously shaped solder locations.

  An object of the present invention is to improve the above-mentioned disadvantages of the prior art, and to make it possible to change the direction of a small-scale sensor, and at least know the solder location of the substrate, so that an effective measurement route (sensor By providing a measurement according to the movement trajectory), it is possible to provide a technique that enables quick measurement and inspection.

  In order to achieve the above-mentioned problem, the means for solving the problem is configured as follows.

(1) Knowing the solder placement information in the state where the board is placed (particularly in the vertical and width directions), and the scanning route (especially the main scanning direction with specification) that can be measured in a shorter time effectively. Then, according to the scanning route, the arrangement of the substrate is measured as it is.

(2) If it is left as it is, the direction of the sensor and the main scanning direction change, and an error due to this may occur. In particular, in the measurement using light, the angle direction to which light is applied changes, which affects the sensitivity of the sensor itself. Therefore, a rotation mechanism that can change the direction of the sensor in accordance with the change in the main scanning direction is prepared. (3) However, since the influence on the specific value by the sensor is considered due to the angular error of the rotation mechanism, etc., this is corrected. Since this is an error due to a mechanism, it can be corrected.

  Further, (4) when the sensor rotates, the array (coordinates) of the measured values changes, but the changed array is handled inside the apparatus. However, the measured value is compared with, for example, reference data that is a design value in advance, and the quality of the solder formation state is determined. However, if the measured value array changes during the process, the measured value is different from the reference data array. Since the comparison of the determination cannot be performed, the comparison determination is performed after converting the array coordinates of either the measurement value or the reference data.

  Further, (5) in the above (4), the arrangement of either the measurement values or the reference data is converted. However, it is preferable to convert the arrangement of the measurement values so that the arrangement of the original substrates is arranged. That is, the substrate is transported by the transport mechanism, stopped at a predetermined inspection position, and inspected, and the determination result of the inspection is displayed together with the substrate. At that time, since the user sets the direction of the substrate to the transport mechanism in the direction that he / she wants to see, even if the direction is changed as described above during measurement, the determination result of the direction of the substrate and the data Are preferably displayed correspondingly.

  The “scanning” of the main scanning or the sub-scanning is a relative movement of the positional relationship between the substrate and the sensor. Therefore, even if the expression “main scanning or sub scanning of the sensor” is sometimes used, even when scanning is performed by moving the sensor while fixing the substrate, scanning is performed by moving the substrate while fixing the sensor. This is also within the scope of the present invention. Similarly, the sub-scan is interpreted in the same meaning.

Specifically, the invention according to claim 1 irradiates the surface of the printed board with light and receives the reflected light (3) and the sensor relative to the printed board. A moving mechanism section (5) for scanning, a measuring means (100) for acquiring a measured value including a height at each position on the surface of the printed board based on an output of the sensor, and a solder based on the measured value In the printed solder inspection apparatus provided with the determination means (10) for determining the printing state of
It comprises measurement route determining means (11) for receiving at least outline information of the printed board and determining a route for scanning on the arranged printed board, and the moving mechanism section determines the orientation of the sensor on the printed board. Having a rotating mechanism (5c) that rotates in a plane parallel to the surface, and performing the scanning according to the route determined by the measurement route determining means and the direction of the sensor according to the route. It is characterized by.

According to a second aspect of the present invention, in the first aspect of the present invention, the rotation angle of the direction of the sensor by the rotation mechanism unit is approximately 90 degrees, and the movement mechanism unit is A main scan for moving the relative position of the sensor for measurement and a sub-scan for moving the position of the main scan in a direction orthogonal to the main scan direction,
The measurement route determining means further receives the position information of the solder portion, calculates the main scanning direction and the number of times of main scanning for the solder portion of the arranged printed board, and scans in a short time based on the calculated direction. A possible route is determined, and the main scanning direction in the determined route is determined as the direction of the sensor.

The invention according to claim 3 is the invention according to claim 1 or 2, wherein a rotation error correction value storage means (7) for storing in advance a correction value corresponding to the rotation angle of the sensor;
Correction means (6) for reading out a correction value corresponding to the sensor orientation determined by the measurement route determination means from the error correction value storage means, and correcting the measurement value measured by the measurement means using the sensor; Equipped with.

The invention according to claim 4 is the invention according to claim 1, 2, or 3, wherein the outer shape information and the solder including the outer dimensions of the printed board in a state where the printed board is arranged at the inspection position. Design information storage means (13) for storing the position information of the reference data and the reference data used when the determination means determines,
A data format in which either the measurement value from the measurement unit or the reference data read from the design information storage unit is replaced with an array corresponding to the orientation of the sensor determined by the measurement route determination unit and sent to the determination unit 4. The printed solder inspection apparatus according to claim 1, further comprising a changing means (9).

  The invention described in claim 1, 2 or 4 has a rotating mechanism for rotating the sensor, and obtains an effective scanning route (sensor trajectory) from the board outline information and the solder position information. Since the sensor orientation and the scanning method can be determined and measured according to the scanning route, that is, the measurement can be performed according to the effective short scanning route, so that a quick measurement can be performed.

  According to the third aspect, the error caused by the rotation of the sensor by the rotation mechanism can be corrected, so that accurate measurement can be performed even if the direction of the sensor is changed.

  According to the fourth aspect of the present invention, when the orientation of the sensor is changed by the data format changing means, the measurement result corresponding to the arrangement of the board set by the user and the determination result are changed by changing the arrangement of the measured values. Therefore, when these are displayed, they can be observed in an arrangement according to the user's wishes.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a functional block diagram showing the configuration of the present embodiment. FIG. 2 is a schematic structural diagram for explaining the moving mechanism unit 5 of FIG. 3 and 4 are schematic structural diagrams for explaining the rotation mechanism 5c included in the movement mechanism 5 of FIG. FIG. 5 is a diagram for explaining the flow of information (including measurement values and data) in FIG. 1 and the arrangement direction of the measurement values and data. FIG. 6 is a diagram for explaining the relationship between the substrate 1 and the solder portion and the main scanning direction. FIG. 7 is a diagram for explaining another embodiment.

  In FIG. 1, a sensor 3, a moving table 2, and a sensor 3 are moved and scanned relative to a printed board 1 (hereinafter referred to as a substrate 1), and a substrate 1 with respect to the moving mechanism unit 5. Based on this layout, the measurement means 100 is configured by the measurement control means 4 that scans the substrate 1 via the movement control unit 4a.

  The measurement means 100 in FIG. 1 is an example of a laser displacement meter by triangulation, and the sensor 3 performs laser scanning in the X-axis or Y-axis direction while being scanned by the moving mechanism unit 5 with respect to the substrate 1. And a light receiving means for receiving the reflected light from the substrate 1, and in particular, the displacement of the solder portion where the solder is printed, that is, the height of the printed solder portion (Z-axis direction) is the printed solder location. Measured in correspondence with the position of. At that time, the received light amount (luminance) corresponding to the position is also obtained from the solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, as a principle, there is one disclosed in Japanese Patent Laid-Open No. 3-291512 filed by the same applicant.

  The measurement control means 4 stores in the design information storage means 13 which will be described later the layout of printed solder locations or resist locations (shown schematically in FIG. 5) when the substrate 1 to be inspected is designed. Therefore, in response to the layout, the sensor 3 is caused to scan the surface of the substrate 1 relatively along the layout to perform measurement, and the displacement amount of the substrate 1 detected by the sensor 3 and / or The amount of received light (measured value in the height direction) is output as a measured value (may be stored in the storage means as a measured value). As the relative scanning, there are several methods as shown in the following (a) to (c), and any of these methods can be applied to this embodiment. (A) The sensor 3 is fixed, and the movable table 2 is moved on the X axis and the Y axis. (B) The sensor 3 is moved on the X axis, and the movable table 2 is moved on the Y axis (see Patent Document 1). Or vice versa. (C) The movable table 2 is fixed at the time of inspection, and only the sensor 3 is moved on the X axis and the Y axis. Here, for the sake of simplicity, description will be made by adopting the above (c).

  For example, as shown in FIG. 2, the moving mechanism unit 5 uses two X-axis stages 5b to move the Y-axis stage 5a including the sensor 3 with a motor in a direction perpendicular to the paper surface, that is, in the X-axis direction. 5a moves the sensor 3a by a motor in a direction parallel to the paper surface, that is, in the Y-axis direction. These controls are controlled by the movement control unit 4a.

  The Y-axis stage 5a includes a rotation mechanism 5c that holds the sensor 3 and that can rotate the sensor 3 in both the X-axis direction and the Y-axis direction (that is, at least approximately 90 degrees). I have.

  The rotation mechanism 5c changes the orientation of the sensor 3 with respect to a plane parallel to the substrate 1 by rotating the sensor 3 fixed to one of the gears 5ca with the motor 5cb as shown in FIG. . For example, in FIG. 3, the sensor 3 is oriented in the Y-axis direction, so that the orientation can be changed approximately 90 degrees in the X-axis direction as shown in FIG. The Y-axis direction and the X-axis direction in FIGS. 3 and 4 are displayed with reference to the substrate 1.

  The measurement control means 4 scans the sensor 3 with respect to the movement control unit 4a by using the moving mechanism unit 5 as described above (hereinafter referred to simply as “scanning” without expressing the sensor 3). The same applies to “main scanning” and “sub-scanning”). There are two types of scanning at that time: main scanning for measurement and sub-scanning (not measured during sub-scanning) by simply shifting the position of the main scanning in a direction orthogonal to the main scanning direction. The measurement is repeated alternately. The sub-scanning movement range at this time includes a sub-scanning direction range (so-called detection width) in which the solder on the substrate 1 can be measured when the sensor 3 performs main scanning. The main scanning movement range is, for example, scanning in the main scanning direction as shown in FIG. 6A depending on the size of the substrate 1 or as shown in FIG. 6B perpendicular to FIG. 6A. In addition, depending on the effective range of the solder location, it greatly differs depending on whether scanning is performed as shown in FIG. 6C or scanning as shown in FIG. Since the movement range of one sub-scan is almost constant regardless of FIGS. 6A, 6B, 6C, or 6D, it can be determined in advance (measured during sub-scan) Not to do.)

  In the present embodiment, the movement control unit 4a has a configuration in which the main scanning direction can be changed to either FIG. 6A or FIG. 6B, that is, either the X-axis direction or the Y-axis with respect to the substrate 1. Can be adopted. In this case, if the main scanning direction of the sensor 3 is changed, the measurement direction is changed, and if it is left as it is, the measurement direction and the direction of the light (laser) of the sensor 3 are changed. . Therefore, when the main scanning direction is changed, the movement control unit 4a causes the rotation mechanism unit 5c to change the orientation of the sensor 3 in accordance with the change in the main scanning direction before the start of scanning.

  The measurement route determining means 11 is solder including external information including the dimensions of the substrate 1 stored in the design information storage means 13 to be described later, and the position of the solder location (the position of the solder portion which is the assembly range of the solder locations). Based on the positional information, the scanning route with the shortest scanning time is obtained, the main scanning direction and the sensor orientation are determined (of course, the sub-scanning direction is also determined), and the above. The movement control unit 4a is notified, and scanning along that route is executed.

  The route determination of the shortest time by the measurement route determination means 11 is performed as follows, for example. First, as a premise, the external shape information of the substrate 1 includes dimensions in a state where the substrate 1 is arranged at the inspection position, that is, in a state where the width direction and the length direction of the substrate 1 are fixed in the X-axis direction and the Y-axis direction. It is. This dimension is a dimension of the position of the recognition mark which is a reference for determining the size of the solder position at the time of measurement. The recognition mark is attached to the substrate 1 in advance so that it can be recognized by the sensor 3. Further, the outer dimensions are the width W and the length L, the position of the solder portion extends over the widths W1 to W2 (W> W2> W1), and the length extends over L1 to L2 (L> L2> L1). .

(A) An effective scanning range is determined. (Select Fig. 6 (c) or Fig. 6 (d))
When the width W2-W1 of the solder portion is smaller than the width W of the substrate 1, the measurement route determination unit 11 sets the width W2-W1 as the measurement target range in the width direction. When the width W2-W1 and the width W are close, the width W may be set as the measurement target range. Similarly, when the length L2-L1 of the solder portion is smaller than the length L of the substrate 1, the length L2-L1 is set as the measurement range in the length direction, and when the length L2-L1 is close to the length L, The length L may be the measurement range. As described above, since a solder portion effective for measurement can be selected and measured, the measurement time can be effectively shortened. Even if the effective scanning range is not particularly determined and the width W and length L of the substrate 1 are used instead of the width W2-W1 and the length L2-L1, the vertical or horizontal direction of the substrate 1 is calculated by the following calculation. Since any one of these can be determined as the main scanning direction, it is within the scope of the present invention.

  In the following description, an example in which the range of the solder portion width W2-W1 and length L2-L1 is selected as the measurement target range will be described.

(B) The measurement time in each scanning route is calculated (comparison between FIG. 6C and FIG. 6D is selected and any one is selected).
The measurement route determination unit 11 performs the following calculation. However, in actual calculation, since each main scanning and sub-scanning are switched in each scanning time, it is necessary to consider each running time.
Formula (1) Formula for obtaining the time required for the route when the main scanning direction is the length direction
ΔL × T × N + ΔT × (N−1)
N-1> = ΔW / ΔS
Formula (2) Formula for obtaining the time required for the route when the main scanning direction is the width direction
ΔW × T × N + ΔT × (N−1)
N-1> = ΔL / ΔS
Where ΔL = L2−L1,
T = scanning (movement) time per unit distance in the main scanning direction
N = number of times of main scanning of solder part
ΔW = W2-W1
ΔS: In the sub-scanning movement range, solder on the substrate 1 when the sensor 3 performs main scanning
Range in the sub-scanning direction that can be measured, that is, detection width
ΔT = time required for one sub-scan (time to move the detection width)
N-1 = number of times of sub-scanning the solder part

(C) Route determination The measurement route determination means 11 compares the value of the above equation (1) with the value of the equation (2), adopts the equation with the smaller value, that is, determines the route, and calculates it. The main scanning direction used is adopted. In addition, the main scanning direction, the main scanning number N and the sub-scanning number N-1 in the employed formula are notified to the movement control unit 4a, and the determined route is scanned. The direction of the sensor 3 is the main scanning direction.

  A simple experimental numerical example is shown. When the main scanning direction is 500 mm and the sub-scanning direction is 150 mm, the main scanning direction is 150 mm and the sub-scanning direction is 500 mm. If the speed is 164 mm / sec and the sub-scanning time is 0.3 sec, the former measurement time is about 70% of the latter measurement time.

  The correction means 6 corrects the measurement value output from the measurement control means 4 by reading out the correction value corresponding to the direction of the sensor 3 from the rotation error correction value storage means 6. This is for correcting the measurement error of the sensor 3 in accordance with the rotation error of the rotation mechanism 5c corresponding to the direction (or main scanning direction) of the sensor 3 determined by the measurement route determination means 11. The correction target is, for example, for correcting the solder position corresponding to the rotation error when the measurement value is represented by displacement data corresponding to the solder position (substrate position). That is, the coordinates of the displacement data are corrected. The rotation error correction value storage means 7 stores, for example, both or one of the correction value when the orientation of the sensor 3 is in the X-axis direction and the correction value when the sensor 3 is in the Y-axis direction. As the correction value, a value obtained in advance by a test is used. For example, if the measured value when the orientation of the sensor 3 is the X-axis direction is calibrated in advance, the correction value for the X-axis direction is unnecessary, and the sensor In order to correct when the direction 3 is in the Y-axis direction, only the correction value for the Y-axis direction needs to be stored.

  The determination data generation means 8 receives the measurement value corrected by the correction means 6 (which is temporarily stored in a storage means (not shown)) and identifies delicate patterns such as filters, solder bridges and solder pattern edges. Based on a number of predetermined image parameter values indicating sensitivity, the measured value is processed into determination data representing the amount of printed solder at each printed solder location. The determination data generation means 8 has means for calculating the height, area, and / or volume at the printed solder location. And as data for judgment, it is data used as an element showing the amount of solder in a printed solder location, and the height, area, volume, and defect of each solder location (detection of a state where there is no solder amount to be present), etc. Is output. Note that not all of the above images are required to determine the quality of the substrate 1, but at least one of height, area, volume, and defect is indispensable.

  In the present invention, the determination data output from the determination data generation means 8 is also a measured value representing the shape of the solder. In the above description, the correction unit 6 is inserted before the determination data generation unit 8. However, the correction unit 6 may be inserted after the determination data generation unit 8 to correct the determination data.

  Note that the determination data generation means 8 is for evaluating the solder state in terms of area or volume, and may be omitted if the evaluation is made simply by the height. However, in this case, the reference data to be described later is reference data regarding the height, and the determination unit 10 determines whether the solder state is high or not.

  The data format changing unit 9 converts the array coordinates of the determination data output from the determination data generation unit 8 in accordance with the direction (main scanning direction) of the sensor 3 determined by the measurement route determination unit 11. In other words, it matches with the direction of the external dimension of the substrate 1 stored in the design information storage unit 13 before the measurement route determination unit 11 determines.

  Next, the reason will be described. In a main part of the apparatus, for example, a storage means (not shown) for storing measurement values and a determination data generation means 8 handle the measurement values based on the main scanning direction since the measurement direction is the main scanning direction. . Therefore, when the main scanning direction is changed by the measurement route determining unit 11, the array coordinates of the measurement values are different from the coordinates (width-length relationship) of the substrate 1 originally stored in the design information storage unit 13. . That is, the determination data (measured value) is compared with, for example, reference data that is a design value stored in advance in the design information storage unit 13 to determine whether the solder is formed. When is changed, the array of measured values is changed, so that it is different from the array of reference data, and the comparison of judgment cannot be performed. Therefore, the array coordinates of the determination data (measurement value) are converted. However, if the determination unit 10 only determines, the array coordinates of the reference data may be converted instead of converting the array coordinates of the determination data.

  However, the arrangement position of the substrate 1 stored in the design information storage means 13 is an arrangement position desired by the operator for observation and is the reference data, and the change in the main scanning direction is measured. Because of the above problem, it is preferable to perform coordinate conversion on the determination data (measurement value).

  The determination unit 10 compares the determination data (measured value) for each solder location, which is obtained by aligning the arrangement coordinates of the data, with reference data, and performs pass / fail determination. At this time, since the determination data and the reference data are data corresponding to the solder positions, the determination means 10 reads and compares the determination data and the reference data at the same position by the reading unit, thereby determining pass / fail. Do. In FIG. 1, the reading unit is included in the determination unit 10 for the sake of convenience, but this is not restrictive. In addition, when the determination means 10 outputs, when the rotation mechanism part 5c is rotating, it is preferable to convert array coordinates according to the rotation. This may be performed by the user interface 12 described later.

  The display control unit 12a causes the display unit 12b to display the result of determination by the determination unit 10 and the layout (arrangement, dimensions, solder position of the substrate 1) stored in the design information storage unit 13. The display example is shown in the lower right part of FIG. In the display example, the determination result is the entire determination result. For example, NG (No) is displayed, and a portion that is determined to be NG in the layout is displayed in black. Even from this display, it is desirable that the data format changing means 9 converts the array coordinates on the determination data side.

  Since the outline of the contents stored in the design information storage means 13 has already been partially explained above, the parts not explained will be explained. The design information storage means 13 uses the same kind of design values as the determination data, that is, the design values for the height, area, volume, and defect of the solder location as reference data, and the substrate 1 is arranged at the inspection position. Is stored as data on the coordinates corresponding to the direction. Practically, the design information storage means 13 stores a layout (placement diagram, dimensions, solder position, etc. of the substrate 1) for each type of the substrate 1 to be inspected, and at the start of inspection, the type list of the substrate 1 Is displayed on the display means 12b and can be selected by the operation means 12c.

  The user interface 12 includes a display control unit 12a, a display unit 12b, and an operation unit 12c. The main operation of the user interface 12 is as described above. In general, the substrate 1 is transported by the transport mechanism and stops at the inspection position, where it is scanned and inspected by the moving mechanism section 5 (the moving mechanism section 5 and a part of the transport mechanism can be combined). . In such a case, it is desirable for the operator that the arrangement of the substrate 1 on the transport mechanism or the arrangement of the substrate 1 at the inspection position is the same as the arrangement of the substrate 1 as an image on the display means 12b. For example, when an NG solder location is displayed on the display during inspection, it is easy to confirm an abnormal location on the substrate 1. The display example of FIG. 5 is schematically shown. However, since the actual solder portion and abnormal portion of the substrate 1 are very small, it is more effective that the actual arrangement matches the image arrangement. It is.

  In the above configuration, the measurement control unit 4, the correction unit 6, the determination data generation unit 8, the data format change unit 9, the determination unit 10, the measurement route determination unit and the display control unit 12a are the CPU and the functions described above for the CPU. And a memory (RAM) that stores data in the functional operation process. The design information storage means 13 and the rotation error correction value storage means 7 are constituted by a memory and are managed by the CPU.

Next, a series of main operations according to the embodiment will be described with reference to FIG.
(A) The design information storage means 13 stores in advance the layout information of the substrate 1 in the state of being placed at the inspection position, the outline information including dimensions, and the position information of the solder portion on the substrate 1. Further, reference data (solder height, area, volume, defect) in the layout is stored. As an example here, as shown in FIG. 5, the length direction of the substrate 1 will be described as the Y-axis direction, and the width direction will be described as the X-axis direction.

(B) The measurement route determining means 11 receives the layout from the design information storage means 11 and compares the position information of the solder portion with the external dimensions. If the position (range) of the solder portion is smaller than the external dimensions, The part is determined as a scanning target, and if the position (range) of the solder portion is substantially the same as the outer dimension, the outer dimension itself is determined as the scanning target. As an example, it is assumed that the former is determined.

(C) Furthermore, the measurement route determination means 11 performs the main scanning by calculating the above formulas (1) and (2) based on the position information (width W1 to W2, length L1 to L2) of the solder portion. The direction and the direction of the sensor 3 are determined. In this case, as an example, the X-axis direction is determined as the main scanning direction and the direction of the sensor 3.

(D) The measuring unit 100 causes the movement mechanism unit 5 to rotate the direction of the sensor 3 by 90 degrees to change the X-axis direction via the movement control unit 4a, and changes the main scanning direction to the X-axis direction. The height (displacement) of the surface of the substrate 1 is measured by scanning the range of the solder portion (width W1 to W2, length L1 to L2) with the sub-scanning direction as the Y-axis direction. Measurement values are output in a coordinate array with the main scanning direction as a reference (this may be stored at this time).
(E) The correcting means 6 reads and corrects the measured value from the measuring means 100 by reading out the correction value for 90 ° rotation stored in the rotation error correction value storing means 7.

(F) The determination data generation means 8 generates determination data that represents the solder amount such as the solder height, area, and volume based on the corrected measurement values (not shown in FIG. 5). ). The measurement value output from the correction unit 6 or the arrangement coordinates of the determination data generated from the determination data generation unit 8 is typically the output of the correction unit 6 in FIG. 5 because the main scanning direction is the X-axis direction. As shown, it is 90 degrees different from the array coordinates of the reference data in the design information storage means 13.

(G) The data format changing unit 9 converts the array coordinates of the determination data from the determination data generation unit 8 by 90 degrees in the Y-axis direction as shown in FIG. 5, and matches the array coordinates of the reference data. .
(H) The determination means 10 compares the coordinate-converted determination data with the reference data, and performs a pass / fail determination for each solder location and the board 1 as a whole.
(I) The display unit 12b displays the determination result according to the layout of the design information storage unit 13, and simultaneously displays the determination result. In the display example of FIG. 5, the black solder portion is NG (no), and the overall determination result is also displayed as NG.

[Other Embodiments]
Another embodiment is shown based on FIG. In the embodiment of FIG. 1, the rotation error correction is performed on the measurement value, and the determination unit 10 reads and determines the corrected measurement value (or determination data) and the reference data at the same position. However, in the embodiment shown in FIG. 7, when the determination unit 10 determines, the reference data and the determination data are aligned and determined. In FIG. 7, the main parts having the same reference numerals as those in FIG. 1 have the same functions. Hereinafter, a configuration and operation different from those in FIG. 1 will be described with reference to FIG.

  In FIG. 7, the reference position correction unit 6 a receives the information of the recognition mark position attached to the substrate 1 from the measurement unit 100 and corrects the position with the correction value from the rotation error correction value storage unit 7. Note that the measuring means 100 specifies each recognition mark position (a reference position on the design value and also a reference position of the reference data) based on the amount of received light, and outputs position information. Hereinafter, the display of the measured value and the reference data will be described by representing (x, y, z) in a simulated manner (x, y are coordinate information, and z is displacement data). If the recognition mark position before correction is (0, 0, 1), for example, the correction value (10, 0, 1) is corrected, and the corrected value (10, 0, 1) is newly input to the determination means. As a standard reference position.

  The determination unit 10 includes a coordinate correction & reading unit. The coordinate correction & reading unit compares and determines the range of the reference data, for example, the area of the position (10, 10, 1) from (0, 0, 1) with the determination data at the corresponding position. In this case, the range of reference data (0, 0, 1) to (10, 10, 1) is converted and corrected based on the new reference position (10, 0, 1) received from the reference position correction means 6a. The obtained range (10, 0, 1) to (20, 10, 1) is obtained. Then, the determination means 10 receives from the determination data generation means 8 the area of the measured value in the corrected range (10, 0, 1) to (20, 10, 1) (the number of soldered points, that is, z is 0). The number of dots having a value other than 1) is read out and compared with the area in the range of (0, 0, 1) to (10, 10, 1) of the reference data. In the above description, the principle is the same even if the relationship between the reference data and the determination data is changed.

That is, in the embodiment of FIG. 7, the conversion coordinates for correction are generated by the reference position correction unit 6a,
Based on the correction conversion coordinates, the determination unit 10 reads out the reference data and the determination data at the corresponding coordinates, and compares and determines.

  In the embodiment of FIG. 7, since the determination data is read based on the coordinates corrected for the rotation error, the processing speed is faster than the case where the coordinates of the measurement values in the embodiment of FIG. 1 are converted.

It is a figure for demonstrating the functional block of embodiment of this invention. FIG. 2 is a schematic structural diagram for explaining a moving mechanism unit in the embodiment of FIG. 1. It is a typical structure figure (front view) for demonstrating the rotation mechanism part contained in the moving mechanism part of FIG. It is a typical structure figure (side view) for demonstrating the rotation mechanism part contained in the moving mechanism part of FIG. It is a figure for demonstrating the flow of the information (a measurement value and data are included) in FIG. 1, and the arrangement direction of a measurement value and data. It is a figure for demonstrating the relationship between a board | substrate and a solder part, and the direction of main scanning. It is a figure for demonstrating the functional block of other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate (printed board), 2 Movement stand (conveyance mechanism), 3 Sensor, 4 Measurement control means, 4a Movement control part, 5 Movement mechanism part, 5c Rotation mechanism part, 6 Correction means, 7 Rotation error correction value storage means, 8 determination data generation means, 9 data format change means, 10 determination means, 12 user interface, 12a display control means, 12b display means, 12c operation means, 13 design information storage means

Claims (4)

A sensor (3) for irradiating light on the surface of the printed board and receiving the reflected light, and a moving mechanism (5) for scanning the sensor relative to the printed board. Measurement means (100) for obtaining a measurement value including the height at each position on the surface of the printed circuit board based on the output of the above, and a determination means (10) for judging the printing state of the solder based on the measurement value. In printed solder inspection equipment,
Measuring route determining means (11) for receiving at least outline information of the printed board and determining a route for scanning the printed board;
Further, the moving mechanism unit includes a rotation mechanism unit (5c) that rotates the direction of the sensor in a plane parallel to the surface of the printed board, and is based on the route determined by the measurement route determination unit and the sensor. A printed solder inspection apparatus, wherein the scanning is performed in accordance with a direction corresponding to the route. The rotation angle of the direction of the sensor by the rotation mechanism is approximately 90 degrees,
The moving mechanism unit alternately performs a main scan for moving the relative position of the sensor for measurement and a sub-scan for moving the position of the main scan in a direction perpendicular to the main scan direction as the scan. The configuration to be
The measurement route determining means further receives position information of the solder portion, calculates the main scanning direction and the number of times of main scanning with respect to the solder portion of the arranged printed board, and based on the calculated time in the short time The printed solder inspection apparatus according to claim 1, wherein a scannable route is determined, and a main scanning direction in the determined route is determined as an orientation of the sensor. Rotation error correction value storage means (7) for storing in advance a correction value corresponding to the rotation angle of the sensor;
Correction means (6) for reading out a correction value corresponding to the sensor orientation determined by the measurement route determination means from the error correction value storage means and correcting the measurement value measured by the measurement means using the sensor; The printed solder inspection apparatus according to claim 1, further comprising: Design information storage for storing the outline information and the solder position information including the outline dimensions of the printed board in a state where the printed board is arranged at the inspection position, and the reference data used when the determination means determines Means (13);
Data to be sent to the determination means after replacing the arrangement of either the measurement value from the measurement means or the reference data read from the design information storage means in accordance with the orientation of the sensor determined by the measurement route determination means The printed solder inspection apparatus according to claim 1, 2 or 3, further comprising a format changing means (9).

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