JP2005030793A - Substrate inspection device and inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein accurate measurement of the substrate height is difficult when solder sticks to pattern lands 12a, 12b for loading an electronic component 9 thereon or the pattern lands 12a, 12b are small, when detecting the substrate height. <P>SOLUTION: This substrate inspection device has a constitution wherein the substrate height on the position specified by a measuring position teaching means 7 is detected by a laser displacement sensor 1 and a displacement measuring means 4, and the substrate height is stored in a substrate height storage means 5, and the substrate height of the electronic component 9 is determined by a substrate height operation means 6 on the basis of the stored substrate height. Hereby, the accurate substrate height is detected by few substrate teaching positions and simple operation processing, and highly accurate inspection is realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an appearance inspection apparatus and an inspection method for a substrate on which a component is mounted or a substrate before component mounting.
[0002]
[Prior art]
A conventional substrate inspection apparatus and method will be described with reference to FIGS. 9, 10, and 11. FIG.
[0003]
FIG. 9 shows a configuration of a main part of a conventional substrate inspection apparatus. A laser displacement sensor 101 includes a laser irradiation unit 102 and a position detection element 103, and performs height detection by a so-called triangulation method. The laser beam L 1 emitted from the laser irradiation unit 102 hits the printed circuit board 10 or the electronic component 9 mounted on the printed circuit board 10, and the reflected light L 2 is received by the position detection element 103. A displacement measuring unit 104 detects the height of the printed circuit board 10 or the electronic component 9 based on the light receiving position of the reflected light L2 on the position detecting element 3.
[0004]
With the above configuration, it is inspected whether the electronic component 9 is mounted at a correct position on the printed circuit board 10. The operation of the conventional inspection apparatus will be described below.
[0005]
As shown in FIG. 10, the laser displacement sensor 101 scans the pattern lands 12a and 12b and the electronic component 9 mounted on the pattern land 12b in the direction of the arrow S0. According to the scanning, the laser beam L1 irradiated from the laser irradiation unit 102 hits the upper surface of the printed board 10, the pattern land 12a, the electronic component 9, the pattern land 12b, and the printed board 10 in this order, and detects the position of the reflected light L2. Light is received by the element 103. Based on the light receiving position of the reflected light L2 on the position detecting element 103, the displacement measuring means 104 increases the printed board 10, the pattern land 12a, the electronic component 9, the pattern land 12b, and the printed board 10 in this order as shown in FIG. Detect the transition of height.
[0006]
From the transition of the height, it is possible to detect the mounting state such as the presence / absence of a component and displacement. At this time, H3 indicates the height of the electronic component 9, and H2 indicates the height of the pattern land 12a and the pattern land 12b of the printed circuit board 10. Further, in a general printed circuit board, a portion without a wiring pattern transmits the laser beam L1, and thus becomes lower than H2 as in H1. Therefore, by setting the pattern land 12a and the pattern land 12b that do not pass the laser beam L1 to the height of the printed circuit board 10, the height of the electronic component 9 can be detected and an accurate mounting state inspection can be performed.
[0007]
For example, in FIG. 11, if it is known that H2 is the height of the printed circuit board 10, it is possible to detect the positional deviation of the electronic component 9 by detecting the rising edge from H2 to H3. In addition, it is possible to correctly inspect the thickness and floating of the electronic component 9 from the difference in height between H2 and H3. However, if the portion of H1 through which the laser beam L1 is transmitted is determined as the height of the printed circuit board 10, an erroneous inspection result will be caused.
[0008]
[Patent Document 1]
Japanese Patent Laid-Open No. 6-260800
[Problems to be solved by the invention]
In such a conventional inspection apparatus and method, in the case of the inspection after soldering or the inspection after solder printing, since there is solder on the pattern land 12a and the pattern land 12b around the electronic component 9, the pattern land Becomes the reference height of the printed circuit board 10. In addition, since the electronic components are closely adjacent to the printed circuit board due to the recent increase in density, there is almost no pattern land around the electronic component 9 when the microchip component is mounted. Increasing the reference height of the printed circuit board 10 is becoming increasingly difficult.
[0010]
The present invention provides a mounting board inspection apparatus and inspection method capable of detecting an accurate printed circuit board height and accurately inspecting the presence / absence, thickness, and float of components even in the above situation. Objective.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, a mounting board inspection apparatus according to the present invention includes a laser irradiation unit for irradiating a laser onto a printed circuit board or an inspection target on the printed circuit board, and the irradiated laser on the printed circuit board or the printed circuit board. A laser displacement sensor having a position detection unit that receives reflected light from the inspection object;
A mounting board inspection apparatus comprising a displacement measuring means for detecting a height of a test object on a printed circuit board or a printed circuit board by the laser displacement sensor,
A measurement position teaching means for designating a plurality of positions of a reference surface that does not transmit a laser on a printed circuit board;
Board height calculation means for calculating the board height at the mounting position of the component on the printed circuit board based on the heights detected for the positions of the plurality of designated reference planes,
Based on the substrate height calculated by the substrate height calculating means, the height of the inspection object on the printed circuit board is obtained, and the inspection object is inspected.
[0012]
As a result, even if there is solder on the pattern land around the component, or even if there is no pattern land around the component in a small adjacent chip mounted in recent years, an accurate board height can be obtained. It is possible to accurately inspect the mounting state of the components based on the board height.
[0013]
Further, the mounting board inspection apparatus of the present invention uses the board height calculated by the board height calculating means as a laser to process a wiring pattern at a height within a predetermined set value range with the board height as a reference. When detected by the displacement sensor, a substrate height correcting means for correcting by detecting the displacement with the detected height of the wiring pattern is provided.
[0014]
Thus, even if the board height calculation means calculates the board height at the mounting position of the component to be inspected, if there is a wiring pattern in the vicinity of the part, the board height at the location of the wiring pattern is calculated. The board height at the position of the component can be replaced, and the board height can be corrected with higher accuracy.
[0015]
Further, the mounting board inspection apparatus of the present invention includes a laser irradiation unit for irradiating a laser onto a printed circuit board or an inspection target on the printed circuit board, and reflected light from the irradiated laser printed circuit board or the inspection target on the printed circuit board. A laser displacement sensor having a position detector for receiving light;
A mounting board inspection apparatus comprising a displacement measuring means for detecting a height of a test object on a printed circuit board or a printed circuit board by the laser displacement sensor,
Each time the laser displacement sensor is sequentially moved to the position of the component to be inspected and the inspection is performed, the moving average value of the substrate height to the mounting position is calculated, and the board height at which the component is mounted is obtained. A calculation means,
Based on the substrate height calculated by the substrate height calculating means, the height of the inspection object on the printed circuit board is obtained, and the inspection object is inspected.
[0016]
As a result, when parts are inspected sequentially, if the board height at the mounting position of the parts can be detected, the average value of the board heights of the previous several points and the newly detected board height is obtained. The height of the board in the vicinity of the component can be obtained, and is particularly effective for a printed board having a high mounting density of the parts.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
[0018]
In FIG. 1, the structure of the principal part of the inspection apparatus of this Embodiment is shown.
[0019]
Reference numeral 1 denotes a laser displacement sensor, which includes a laser irradiation unit 2 and a position detection element 3, and performs height detection by a so-called triangulation method. The laser beam L1 emitted from the laser irradiation unit 2 hits the printed circuit board 10 or the electronic component 9 mounted on the printed circuit board 10, and the reflected light L2 is received by the position detection element 3. Reference numeral 4 denotes a displacement measuring means that detects the height of the printed circuit board 10 or the electronic component 9 based on the light receiving position of the reflected light L2 on the position detecting element 3.
[0020]
The above configuration is the same as the configuration described in the related art, but the following configuration is a configuration specific to the present embodiment.
[0021]
Reference numeral 7 denotes a measurement position teaching means for instructing the position of the reference surface of the printed circuit board 10 in order to obtain the reference height of the printed circuit board 10. The reference surface instructed here is a reference surface that does not transmit the laser beam L1 on the printed circuit board 10. For example, a wiring pattern in which no component is mounted or solder is not on the upper surface, or a substrate recognition mark This is the case. In addition, a plurality of locations on the reference plane are designated.
[0022]
Reference numeral 5 denotes a board height storage means for storing the height detected by the displacement measuring means 4 for the reference surface of the printed board 10 indicated by the measurement position teaching means 7 as the reference height of the printed board 10. Reference numeral 6 denotes a board height calculation means, which is located at any position on the printed board 10 with reference to the heights of locations designated as a plurality of reference planes of the printed board 10 stored in the board height storage means 5. Calculate the board height.
[0023]
The operation of the inspection apparatus of the present embodiment having the above configuration will be described below.
[0024]
As shown in FIG. 2, the laser displacement sensor 1 is in the direction of the arrow S0 on the solder 15a on the pattern land 12a, the electronic component 9 mounted on the pattern land 12b, the solder 15b on the pattern land 12b, and the wiring pattern 11. Scan. According to the scanning, the laser beam L1 emitted from the laser irradiation unit 2 is in the order of the printed circuit board 10, the solder 15a on the pattern land 12a, the electronic component 9, the solder 15b on the pattern land 12b, the printed circuit board 10, and the wiring pattern 11. The position detection element 3 receives the reflected light L2 when it hits the upper surface. Based on the light receiving position of the reflected light L2 on the position detecting element 3, as shown in FIG. 3, the displacement measuring means 4 makes the solder 15a on the printed circuit board 10, the pattern land 12a, the electronic component 9, and the solder on the pattern land 12b. The height transition is detected in the order of 15b, the printed circuit board 10, and the wiring pattern 11.
[0025]
From the transition of the height, it is possible to detect the mounting state such as the presence / absence of a component and displacement. At this time, H3 indicates the height of the electronic component 9, and H5 indicates the height of the solder 15a on the pattern land 12a and the solder 15b on the pattern land 12b. H4 indicates the height of the wiring pattern 11. H1 indicates the detected height of the base material portion of the printed circuit board 10 having no wiring pattern or electronic component on the printed circuit board 10.
[0026]
Here, since the detection values of the solder 15a on the pattern land 12a of H5 and the solder 15b on the pattern land 12b and the wiring pattern of H4 do not transmit the laser beam L1, the correct height can be measured. However, since H1 transmits part of the laser beam L1, the correct height cannot be obtained.
[0027]
Therefore, in the present embodiment, the measurement position teaching unit 7 designates a plurality of locations serving as the reference plane on the printed circuit board 10. The reference surface instructed here is a reference surface that does not transmit the laser beam L1 on the printed circuit board 10. For example, a wiring pattern in which no component is mounted or solder is not on the upper surface, or a substrate recognition mark This is the case.
[0028]
The displacement measuring unit 4 measures the designated plurality of reference surface locations, and the measured substrate height is stored in the substrate height storage unit 5. Then, using the plurality of board heights as a reference, the board height calculation means 6 allows the board height at an arbitrary position on the printed board, for example, the mounting position of the electronic component 9, to be determined from the position where the plurality of measurement positions are designated. It is obtained by calculation by approximating the distance.
[0029]
Accordingly, a correct board height is obtained, and by measuring the height of the electronic component 9 and a point at which the height changes based on the board height, the mounting state such as presence / absence of the electronic component 9 and misalignment. Can be accurately inspected.
[0030]
Moreover, it is a reference surface that does not transmit the laser beam L1 on the printed circuit board 10, for example, a wiring pattern in which no component is mounted or solder is not on the upper surface, or the position of the recognition mark for the substrate. Since the height is determined, even if there are solders 15a and 15b on the pattern land 12a and the pattern land 12b around the electronic component 9, or in recent years, the electronic component 9 can be mounted by microchip mounting in a narrow neighborhood. Even if there is no pattern land around, it is possible to obtain an accurate board height, and it is possible to accurately inspect the mounting state of components based on this board height.
[0031]
With respect to the teaching method of the measurement position teaching means 7 at this time, an example of using the substrate recognition mark will be described with reference to FIG.
[0032]
In FIG. 4, by using the board recognition mark 13a, the multi-sided board recognition mark 13b, and the individual part recognition mark 13c used for the mounting position correction on the printed board, the reference height of the ideal printed board is obtained. can do. That is, each recognition mark has no unnecessary parts around it, and its shape is guaranteed to a certain size, and its position information already exists as CAD data or mounting data, and it does not have to be taught again. That's it.
[0033]
If the measurement position teaching means 7 reads CAD data or mounting data and automatically indicates the measurement position based on the position information of the recognition mark for a substrate as described above, the measurement position is selected by the operator and measured. The trouble of inputting to the position teaching means 7 becomes unnecessary.
[0034]
In addition, the above-described board recognition mark must be detected at any time if accurate inspection and component mounting are to be performed. Therefore, the substrate height can be detected simultaneously with the detection for correction. For example, since the laser displacement sensor 1 can detect the light amount data and the height data, the substrate height can be detected simultaneously with the reading of the recognition mark, so that no loss time only for detecting the substrate height occurs. .
[0035]
Of course, the measurement position teaching means 7 is not limited to the one automatically instructed as described above. The position of the reference plane determined by the operator's judgment may be input by the operator.
[0036]
A plurality of measurement positions specified by the measurement position teaching means 7 are usually warped on the printed circuit board. Also, depending on the holding state of the printed circuit board of the inspection apparatus, the circuit board may be changed depending on the mounting position of the electronic component on the printed circuit board. This is because the height changes.
[0037]
Next, a method for calculating the substrate height by the substrate height calculating means 6 will be described with reference to FIGS.
[0038]
In FIG. 4, three points, one multi-sided substrate recognition mark 13b and two individual component recognition marks 13c, which are the substrate height in the vicinity of the electronic component 9, are selected and surrounded by a broken line composed of these three points. Find a flat plane. At this time, since the electronic component 9 is assumed to be on the plane, the board height at the mounting position of the electronic component 9 is calculated by the following calculation.
[0039]
As shown in FIG. 5, the actual calculation method is to develop the board height at the three measurement positions and the electronic component 9 on the XY plane, and calculate the board height at the location of the electronic component 9. Here, the positions of the three measurement positions on the printed board are K1, K2, and K3, and the mounting position of the electronic component 9 is KT. The intersection KX of two of these three points, in this case, the line connecting K2 and K3 and the other one, in this case, the line connecting K1 and KT is obtained. Then, the height of the position of KX is calculated by calculating the difference between the heights of K2 and K3 by the ratio of the distance between K2 and K3 and the distance between K3 and KX. Subsequently, similarly, the height of the position of KT can be calculated by calculating the difference between the heights of K1 and KX by the ratio of the distance between K1 and KX and the distance between K1 and KT.
[0040]
Here, since the difference in height is very small with respect to the value of the XY coordinates of each point, it can be considered that the points K1, K2, K3, and KT exist on the XY plane. Further, the calculation is simplified by setting any one of K1, K2, and K3, in this case, K3 as the origin of the XY coordinates.
[0041]
In the measurement position teaching means 7, in the above example, the substrate recognition mark is used as the measurement position. However, the present invention is not limited to this. If there is a surface on the printed circuit board that does not transmit the laser beam L1 other than the board recognition mark, it may be selected. Depending on the printed circuit board, there may be no board recognition mark at an appropriate position. In this case, for example, the position on the wiring pattern 14 can be designated as the measurement position.
[0042]
In the case of the multi-sided substrate shown in FIG. 4, when a position on the wiring pattern 14 on one surface is designated as a measurement position, a position on the wiring pattern 14 on another surface is designated as a measurement position. If the operator teaches only one surface, the other surface can be automatically taught by moving and positioning the laser displacement sensor based on the offset data of each surface, and the labor of teaching operation can be saved. In particular, the case of the multi-sided substrate 10a having a large number of substrates as shown in FIG. 6 is more effective.
[0043]
Furthermore, the configuration of the inspection apparatus according to the present embodiment can include substrate height correcting means 8 as shown in FIG.
[0044]
The substrate height correcting means 8 corrects the substrate height calculated by the substrate height calculating means 6 by the amount of displacement and the amount of light obtained by the laser displacement sensor 1 and the displacement measuring means 4.
[0045]
Here, as shown in FIG. 3, if the board height at the mounting position of the electronic component 9 calculated by the board height calculating means 6 is H0, a range of a predetermined set value is set with reference to the H0. If the wiring pattern within the range of the upper limit HU and the lower limit HL is detected by the laser displacement sensor 1 and the displacement measuring means 4 and there is a pattern wiring portion where the light amount can be regarded as a constant value above a certain set value, Replace the height of that location with the correct reference height. In the example of FIG. 3, the substrate height H0 is replaced with the wiring pattern H4 existing between HU and HL. Thus, even if the board height H0 is calculated by the board height calculation means 6 at the mounting position of the electronic component 9 to be inspected, if there is a wiring pattern in the vicinity of the electronic part 9, the wiring pattern The board | substrate height H4 of the location can be substituted to H0, and it can correct | amend to a more accurate board | substrate height.
[0046]
It should be noted that the values of HU and HL are preferably determined based on a range in which H0 will vary due to warping of the printed circuit board. For example, the board height calculation means 6 calculates the board height H0 at the mounting positions of all electronic components on the printed circuit board, and the values of HU and HL are calculated according to the range of fluctuation of the board height H0 at each mounting position. It is also possible to decide.
[0047]
If there is no portion that can be recognized as a pattern wiring between HU and HL, the substrate height is kept at H0 obtained by the substrate height calculation means 6.
[0048]
(Embodiment 2)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. 2, 3, 7, and 8. FIG.
[0049]
In FIG. 7, the structure of the principal part of the inspection apparatus of this Embodiment is shown.
[0050]
In FIG. 7, the laser displacement sensor 1 and the displacement measuring means 4 have the same configurations as those in the first embodiment. In the present embodiment, a substrate height storage unit 15 and a substrate height calculation unit 16 are provided, and the substrate height storage unit 15 sequentially moves the laser displacement sensor 1 to the position of the electronic component to be inspected and inspects it. Each time, the moving average value of the board height up to the mounting position is stored. The board height calculating means 16 calculates a moving average value of the board height up to the mounting position.
[0051]
Next, the operation of the inspection apparatus according to the present embodiment will be described.
[0052]
The operation of scanning the laser displacement sensor 1 on the electronic component 9 is the same as that of the first embodiment described with reference to FIGS.
[0053]
In the present embodiment, first, the substrate recognition mark 13 a shown in FIG. 8 is detected by the laser displacement sensor 1, the substrate height is measured, and the result is stored in the substrate height storage means 15.
[0054]
Next, as shown in FIG. 2, the laser displacement sensor 1 scans the electronic component 9 to detect the height transition as shown in FIG. At this time, assuming that the height of the substrate recognition mark 13a stored in the substrate height storage means 15 is H0, the upper limit HU and the lower limit HL of the predetermined set value range are set based on the height H0. This wiring pattern is detected by the laser displacement sensor 1 and the displacement measuring means 4, and it is determined whether or not there is a part of the pattern wiring that can be regarded as a constant value with a light amount equal to or greater than a certain set value. In the case of FIG. 3, since H4 corresponds to this, the substrate height calculation means 16 calculates the average of H0 and H4, and the calculation result is stored in the substrate height storage means 15 as new H0. At this time, if there is no corresponding wiring pattern, the substrate height remains at H0 up to the previous one.
[0055]
Further, in the inspection of the next electronic component, an average of the wiring pattern height detected in the vicinity of the electronic component and H0 is taken, and the substrate height is set as a new substrate height H0 in the inspection of the electronic component. The information is stored in the storage means 15 and thereafter the above operation is repeated until the inspection of the electronic component on the printed circuit board is completed.
[0056]
In this way, when the electronic components are sequentially inspected, if the substrate height at the mounting position of the electronic components can be detected, by obtaining the average value of the previous several substrate heights and the newly detected substrate height, The board height in the vicinity of the electronic component currently being inspected can be obtained, and is particularly effective for a printed board having a high mounting density of components.
[0057]
【The invention's effect】
As described above, according to the first embodiment of the present invention, even if there is solder on the pattern land around the component, or the pattern land is formed around the component in a minute chip mounting in the recent narrow neighborhood. Even if it is not, it is possible to obtain an accurate board height, and it is possible to accurately inspect the mounting state of the components based on the board height.
[0058]
Further, by providing the board height correcting means, even if the board height at the mounting position of the component to be inspected by the board height calculating means is calculated, if there is a wiring pattern in the vicinity of the part, The board height at the location of the wiring pattern can be replaced with the board height at the position of the component, and the board height can be corrected with higher accuracy.
[0059]
In addition, according to the second embodiment of the present invention, when components are sequentially inspected, if the substrate height at the mounting position of the components can be detected, the number of substrate heights up to that point and the newly detected substrate height are calculated. By obtaining the average value, it is possible to obtain the height of the board in the vicinity of the component currently being inspected, and this is particularly effective for a printed board having a high component mounting density.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a main part of an inspection apparatus according to Embodiment 1 of the present invention. FIG. 2 is a diagram showing scanning of a laser displacement sensor according to the present invention. FIG. 4 is a plan view of the printed circuit board according to the first embodiment of the present invention. FIG. 5 is an XY plan view showing a substrate height calculation method according to the first embodiment of the present invention. FIG. 7 is a configuration diagram of a main part of the inspection apparatus according to the second embodiment of the present invention. FIG. 8 is a plan view of the printed circuit board according to the second embodiment of the present invention. FIG. 10 is a diagram showing the scanning of a conventional laser displacement sensor. FIG. 11 is a transition diagram of the detection height of the conventional laser displacement sensor.
DESCRIPTION OF SYMBOLS 1 Laser displacement sensor 2 Laser irradiation part 3 Position detection element 4 Displacement measurement means 5 Substrate height storage means 6 Substrate height calculation means 7 Measurement position teaching means 8 Substrate height correction means 15 Substrate height storage means 16 Substrate height calculation means

Claims (13)

A laser displacement sensor having a laser irradiation unit that irradiates a printed circuit board or an inspection target on the printed circuit board, and a position detection unit that receives reflected light from the irradiated laser printed circuit board or the inspection target on the printed circuit board When,
A mounting board inspection apparatus comprising a displacement measuring means for detecting a height of a test object on a printed circuit board or a printed circuit board by the laser displacement sensor,
A measurement position teaching means for designating a plurality of positions of a reference surface that does not transmit a laser on a printed circuit board;
Board height calculation means for calculating the board height at the mounting position of the component on the printed circuit board based on the heights detected for the positions of the plurality of designated reference planes,
A board inspection apparatus that obtains the height of an inspection target on a printed circuit board based on the board height calculated by the board height calculation means and inspects the inspection target. 2. The board inspection apparatus according to claim 1, wherein the measurement position teaching means designates a recognition mark on the printed board for correcting the mounting position of the component as the position of the reference plane. 3. The board inspection apparatus according to claim 2, wherein the measurement position teaching means reads CAD data or mounting data and automatically designates the measurement position based on the obtained position information of the board recognition mark. The substrate inspection apparatus according to claim 2, wherein the laser displacement sensor detects the height of the substrate at the position of the recognition mark simultaneously with reading of the position of the recognition mark. 2. The board inspection apparatus according to claim 1, wherein the measurement position teaching means designates a wiring pattern in which no component is mounted or solder is not on the upper surface as the position of the reference surface. In the case of a chamfered substrate, the measurement position teaching means designates the position of a specific surface as a measurement position, and designates the same position as the position designated by a specific surface in other surfaces as the measurement position. The board | substrate inspection apparatus of description. The substrate inspection apparatus according to claim 1, wherein the substrate height calculation means approximates the plurality of measurement positions by distances from the designated positions and obtains them by calculation. The substrate inspection apparatus according to claim 1, wherein the substrate height calculation means is obtained by calculation by approximating a plane including positions at which three measurement positions are designated. If the substrate displacement calculated by the substrate height calculating means is detected by the laser displacement sensor when the wiring pattern is at a height within a predetermined set value range with this substrate height as a reference, the detected height is detected. The board inspection apparatus according to claim 1, further comprising board height correcting means for correcting the wiring pattern by replacing it with the height of the portion of the wiring pattern. A laser displacement sensor having a laser irradiation unit that irradiates a printed circuit board or an inspection target on the printed circuit board, and a position detection unit that receives reflected light from the irradiated laser printed circuit board or the inspection target on the printed circuit board When,
A mounting board inspection apparatus comprising a displacement measuring means for detecting a height of a test object on a printed circuit board or a printed circuit board by the laser displacement sensor,
Each time the laser displacement sensor is sequentially moved to the position of the component to be inspected and the inspection is performed, the moving average value of the substrate height to the mounting position is calculated, and the board height at which the component is mounted is obtained. A calculation means,
A board inspection apparatus that obtains the height of an inspection target on a printed circuit board based on the board height calculated by the board height calculation means and inspects the inspection target. The board height calculation means, when the laser displacement sensor detects a wiring pattern at a height within a predetermined set value range based on the board height at the mounting position of the previous inspection target component, The board inspection apparatus according to claim 10, wherein the detected height and the previous average value are set as the board height at the mounting position of the component. A laser displacement sensor having a laser irradiation unit that irradiates a printed circuit board or an inspection target on the printed circuit board, and a position detection unit that receives reflected light from the irradiated laser printed circuit board or the inspection target on the printed circuit board By the inspection method of inspecting the mounting board by detecting the height of the inspection target on the printed circuit board or the printed circuit board,
Specify multiple locations on the printed circuit board that do not transmit laser light.
Using the height detected for the position of the specified plurality of reference planes as a reference, calculating the board height of the mounting position of the component on the printed board,
A substrate inspection method for inspecting an inspection object by obtaining a height of the inspection object on the printed circuit board based on the calculated substrate height. A laser displacement sensor having a laser irradiation unit that irradiates a printed circuit board or an inspection target on the printed circuit board, and a position detection unit that receives reflected light from the irradiated laser printed circuit board or the inspection target on the printed circuit board By the inspection method of inspecting the mounting board by detecting the height of the inspection target on the printed circuit board or the printed circuit board,
Each time the laser displacement sensor is sequentially moved to the position of the part to be inspected and inspected, the moving average value of the board height up to the mounting position is calculated, and the board height at the mounting position of the part is obtained.
A substrate inspection method for inspecting an inspection object by obtaining a height of the inspection object on the printed circuit board based on the calculated substrate height.

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