JP2009036658A - Printed board testing device and scanning method of printed board testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology capable of scanning an objective area to be tested while inhibiting useless scanning based on known design information. <P>SOLUTION: A projection range-calculating means 31 receives a layout which represents a measuring area of solder print within a printed board on a X- and Y-axis coordinate and then calculates an X-axis projection range where the measuring area is projected on X-axis and a Y-axis projection range where the measuring area is projected on Y-axis; a scanning range-deciding means 32a decides a main scanning number of times to measure an entire measuring area and main scanning positions in X-axis direction at the main scanning times from the X-axis projection range and a predetermined distance [L-δ] and decides a main scanning range in Y-axis direction at the main scanning times from the Y-axis projection range; and a scanning control section 25a controls a sub-scanning mechanism based on the decided scanning positions and controls a main scanning mechanism based on the decided main scanning range in Y-axis direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a printed board inspection apparatus that scans and inspects a desired measurement range of a printed board that is an object to be measured, in particular, the shape of a printed solder surface with a sensor. Scanning is performed by a procedure in which the measurement range is main-scanned to the main scanning end position by the sensor, the sensor position is changed to the next main scanning start position by sub-scanning, and the main scanning is started from the next start position. However, at that time, the entire measurement area of the printed board was scanned regardless of the presence or absence of solder. For example, by selecting an area where the solder location is predicted by design and scanning only that area, it is effective. The present invention relates to a technique for shortening the time for measurement and the time for inspection by scanning only the measurement range to be measured.

  Conventionally, for example, as a printed solder inspection apparatus, as a result of having a sensor that irradiates the surface of a printed board with a laser beam or the like and receives reflected light from the surface of the printed board, the measurement (triangulation) by the sensor Measurement values obtained, for example, measurement values of displacement (including height) or brightness (including the amount of light reflected from the printed board and the amount of received light (intensity of light)) of the printed solder on the printed board. Based on the above, determination is made by comparison with reference data that is a reference for determination (Patent Documents 1 and 2).

  In such an inspection apparatus (method), in general, the printed board is transported from a certain direction and stopped at a predetermined inspection position, where the sensor or / and the printed board are moved to the X stage and the Y stage (X axis direction, Measurement is performed by performing scanning (relative scanning is performed) using a moving table and moving means in each direction in the Y-axis direction. In the scanning direction, scanning is performed in a direction orthogonal to the main scanning and the main scanning. There is sub-scanning and measurement is performed during main scanning, and sub-scanning is performed to shift the sensor from the current main scanning position to the position where the next main scanning is to be performed. This corresponds to the detection width in the sub-scanning direction that can be detected by the sensor. This is shown in FIG. FIG. 7 is a diagram schematically illustrating the trajectories of main scanning and sub scanning from above the printed board. In FIG. 7, the distance L between adjacent main scans (substantially one sub-scan distance) is determined within a range in which the sensor can sense in a direction orthogonal to the main scan direction.

  Note that scanning refers to changing the measurement position by the sensor in the measurement range of the surface of the object to be measured by moving the relative position of the sensor and the printed board that is the object to be measured. Actual measurement is performed during main scanning. In scanning, that is, relative position movement, either one of the sensor and the object to be measured or both movements are possible. In Patent Documents 1 and 2, main scanning is performed by moving the measured object side, and sub-scanning is performed by moving the sensor side.

  Conventionally, rectangular scanning as shown in FIG. 7 has been repeated over almost the entire surface of the print base.

Japanese Patent No. 3592594 Japanese Patent No. 3537382

  In general, the number of printed boards handled in a production line as a printed board inspection apparatus is considerable, and time efficiency is required. That is, as a printed board inspection apparatus, it is a problem that is always required to operate efficiently by increasing the measurement speed or reducing the measurement time.

  However, in the above-described conventional technique, an area without solder is also scanned, so that useless time is generated. In particular, scanning a sensor generally requires time because it involves mechanical movement.

  The object of the present invention is to improve the above-mentioned disadvantages of the prior art, and the solder area of the printed board (individual areas of solder, or a set of them when they are close together) Since it is known in advance, the present invention provides a technique capable of scanning an area to be inspected by preventing unnecessary scanning based on design information.

  In order to achieve the above object, the invention according to claim 1 is directed to a line sensor that receives light reflected from the surface by irradiating a printed board including a solder region over a length L in the X-axis direction. 2), a main scanning mechanism (11) for causing the printed board and the line sensor to relatively scan in parallel with the Y axis direction orthogonal to the X axis, and the next main scanning in the X axis direction side. A sub-scanning mechanism (3) for performing sub-scanning, the position of which is changed for each main scanning by a predetermined distance [L−δ] (where 0 ≦ δ << L) based on the length L. In the printed circuit board inspection apparatus for inspecting the solder state of the printed circuit board based on the output, the measurement area including one or a plurality of the soldered areas in advance is defined on the X-axis and the Y-axis. Receiving the board design information expressed in the coordinate system, the measurement An X-axis projection range when the region is projected onto the X-axis, a projection range calculation unit (31) that calculates a Y-axis projection range when the region is projected onto the Y-axis, the X-axis projection range, and the Y-axis projection A scanning route determining means (32) for determining a scanning route on the XY coordinate system for scanning the line sensor for the entire measurement region based on the range and the predetermined distance [L-δ]; A scanning control unit (25a) for controlling the main scanning mechanism and the sub-scanning mechanism according to the scanned route.

  According to a second aspect of the present invention, in the first aspect of the invention, the scanning route determining means is configured to measure the entire measurement region from the X-axis projection range and a predetermined distance [L-δ]. Main scanning range determining means for determining the number of main scanning and the main scanning position in the X-axis direction for each main scanning time, and determining the main scanning range in the Y-axis direction for each main scanning time from the Y-axis projection range ( 32a), and the scanning route is determined based on the main scanning position in the X-axis direction and the main scanning range in the Y-axis direction at each main scanning time.

  According to a third aspect of the present invention, there is provided a line sensor (2) for receiving a reflected light from the surface by irradiating a printed board including a solder region over a length L in the X-axis direction, and the printed board. Based on the length L, the main scanning mechanism (11) that causes the line sensor to perform the main scanning relatively in parallel with the Y-axis direction orthogonal to the X-axis, and the next main scanning position on the X-axis direction side. In a scanning method of a printed circuit board inspection apparatus comprising: a sub-scanning mechanism (3) that performs sub-scanning that is changed every main scanning by a predetermined distance [L−δ] (where 0 ≦ δ << L). Receiving the board design information representing the measurement area including one or a plurality of the solder areas in advance in an XY coordinate system composed of the X axis and the Y axis for the printed board to be inspected; When a measurement area is projected on the X axis based on the board design information X-axis projection range, a projection range calculation stage for calculating the Y-axis projection range when projected onto the Y-axis, and the entire measurement area are measured from the X-axis projection range and the predetermined distance [L-δ] Main scanning range for determining the main scanning position in the X-axis direction for each main scanning time and determining the main scanning range in the Y-axis direction for each main scanning time from the Y-axis projection range The XY coordinate system for causing the line sensor to scan the entire measurement area based on the main scanning position in the X-axis direction and the main scanning range in the Y-axis direction at each determination stage and the main scanning time A scanning route determining step for determining and storing the above scanning route, and at the time of inspection, the sub-scanning mechanism and the main scanning mechanism are controlled based on the scanning route to execute the inspection.

  According to the present invention, the measurement range is calculated based on the board design information indicating the solder area when the printed board is designed, and the sensing width L in the direction perpendicular to the main scanning direction by the line sensor is used as a reference. The main scanning position and the scanning range are determined, and at the time of inspection, the determined scanning range is main scanned to scan only a desired measurement range. Since it is possible to scan only necessary portions without wastefully scanning non-regions, measurement time can be shortened.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a functional block diagram showing the configuration of the present embodiment. FIG. 2 is a view for explaining a procedure for obtaining a scanning range by projecting the solder area of the printed board onto the X coordinate and the Y coordinate. FIG. 3 is a diagram for explaining a scanning procedure based on the scanning range of FIG. FIG. 4 is a diagram showing a modification of the scanning procedure of FIG. FIG. 5 is a diagram illustrating an example of the sub-scanning mechanism of the scanning mechanism. FIG. 6 is a diagram illustrating an example of a main scanning mechanism of the scanning mechanism. 5 and 6 show techniques that have been used conventionally.

  FIG. 1 is a diagram showing a functional configuration of an embodiment of the present invention. The scanning mechanism portion in FIG. 1 has substantially the same structure as that of the prior art, and will be briefly described later with reference to FIGS. The main part of the code | symbol corresponding to the code | symbol in FIG. 5 and FIG. However, the main scanning mechanism 11 and the sub-scanning mechanism 3 in the scanning mechanism unit 1 of FIG. 1 are representatively represented by the central main parts related to the main scanning and sub-scanning of FIGS. For the sake of explanation, the sub-scanning mechanism 3 and the line sensor 2 are separated in FIG. 1, but in FIGS. 5 and 6, the sub-scanning mechanism is a mechanism for mounting and moving the line sensor 2. In FIG. 1, the clamper 9 and the main scanning mechanism 11 are described separately. However, in FIGS. 5 and 6, the main scanning mechanism 11 moves the conveying means on which the clamper 9 is mounted to perform the main scanning. ing.

[Scanning mechanism]
The scanning mechanism sequentially moves or changes the relative position (or distance and direction) between the printed board w and the line sensor 2 so that the line sensor 2 can measure over the entire measurement range of the printed board w. To do. Since scanning is a relative movement between the object to be measured and the sensor, it is sufficient that either one can be moved. Here, as an example, the technique shown in FIGS. 5 and 6 is used. Since the scanning is accompanied by “movement” for changing the measurement position as a specific operation, it may be described as “movement”. However, the term “scanning” will be used in the following description.

  First, the scanning mechanism will be described with reference to FIGS. In FIG. 5, the scanning mechanism unit 1 is mainly composed of a line sensor 2, a sub-scanning mechanism 3, and a transport device 4 that sequentially transports an uninspected printed board w. The main scanning mechanism 11 is included in the transport device in this example.

  The printed board w is a so-called object to be measured, and is a printed board to be inspected with cream solder printed on the surface. A part or all of the surface of the printed board w can be a measurement range. In the following description, the entire printed board w will be described as the measurement range.

  In this example, the line sensor 2 is a sensor that measures the displacement of the surface of the printed board w in the measurement range by performing triangulation. Therefore, a laser light source that irradiates the printed board w with laser light and a displacement detector that detects reflected light reflected from the printed board w are provided.

  The sub-scanning mechanism 3 moves the support 3a that supports the line sensor 2 in the X direction via the rail 3c by driving the X-axis motor 3b. That is, the sub-scan is performed in the X direction.

  As shown in FIGS. 5 and 6, the transport device 4 is wound around a pair of cylindrical pulleys 6, 6 so that two transport belts 5, 5 are along the transport direction of the printed board w. . One pulley 6 is provided with a transport motor 7 and rotates the transport belts 5 and 5 to transport the uninspected printed board w in the X positive direction. A stopper 8 that is movable up and down in the height direction (Z direction) is provided at a predetermined position between the two conveyor belts 5 and 5, and stops the uninspected printed board w being conveyed. Also, a clamper 9 that can move up and down in the Z direction is provided in the vicinity of the stopper 8 between the two conveyor belts 5 and 5. When the clamper 9 is inspected by the line sensor 2, the conveyor belts 5 and 5 are provided. Instead, the printed board w is placed, and the printed board w is sandwiched between the butting plates 10 and 10 that are movable in the Y direction orthogonal to the transport direction.

  The transport device 4 is provided with a main scanning mechanism 11. The main scanning mechanism 11 supports the transport device 4 with a support 11a, and moves the transport device 4 itself in the Y direction perpendicular to the transport direction via the rail 11c by driving the Y-axis motor 11b. That is, main scanning is performed.

[Scan Function / Configuration]
In FIG. 1, the measurement control means 25 has a scanning control unit 25a, controls the scanning mechanism unit 1 to perform scanning, and measures at the position where main scanning is performed based on the output from the line sensor 2 at that time. The displacement amount is sent as a measurement value to the measurement value storage means 26 for storage. In addition, the line sensor 2 can detect the displacement of the height direction in the measurement location of a measurement range using an optical sensor (after-mentioned). In addition, the amount of light from the measurement location can also be detected (may be provided separately).

  The line sensor 2 has a plurality of sensors arranged over a distance L in a direction (X-axis direction) orthogonal to the main scanning direction (for example, the Y-axis direction), and scans laser light in the arrangement direction at high speed. The displacement of the printed board w (or its solder area) is measured almost simultaneously over the distance L. Accordingly, the displacement can be measured over the range of the width L by one main scanning (the distance L corresponds to the main scanning width). When one main scan is completed, the main scan is performed by shifting the main scan position by a width [L−δ] (where 0 ≦ δ << L) in the X direction. The distance δ is a range measured by doubling between adjacent main scans. This is to make sure that there is no measurement omission.

  The scanning control unit 25 a controls the scanning mechanism unit 1 based on information from the design information storage unit 30, the projection range calculation unit 31, the scanning route determination unit 32, and the control procedure storage unit 33. Hereinafter, the design information storage unit 30, the projection range calculation unit 31, the scanning route determination unit 32, the control procedure storage unit 33, and the scanning control unit 25a will be described in this order.

  The design information storage means 30 mainly stores board information, reference data, and layout (information) as board design information. The board information stores bibliographic information including identification information for specifying the printed board w to be inspected, inspection conditions, etc., and displays them in a list on the user interface 29 so that they can be selected at the start of inspection. is there. The reference data is design data used as a reference when the determination unit 28 determines the quality of the solder state for each solder location (position) of the printed board w. Therefore, the reference data is the same as the type of data generated by the data generation unit 27 based on the measurement value, and is data indicating the height, area, volume, etc. of the solder location, for example.

The layout (information) includes information indicating the position and range of the solder location when the printed board w is designed, and information indicating the position and range of the mark indicating the position serving as the reference for the printed board. Hereinafter, solder locations (or solder areas) and marks are represented so that their positions and ranges can be specified in a two-dimensional, XY coordinate system. Note that the minimum unit solder location is also represented by its position and range. Therefore, when the position range of the solder location is formed in a continuous lump, a solder area is formed.
Note that the “measurement area” used in the following description includes both a solder location (or solder area) and a mark area indicating a relative reference position of the coordinate position of the solder location on the printed board w. It is included.

  The projection range calculation means 31 measures one or a plurality of solder points and marks indicating the reference position of the printed board w in the printed board w for the printed board w to be inspected from the design information storage means 30. In response to a layout (board design information) that expresses the target in coordinates consisting of the X-axis and Y-axis, the X-axis projection range when the measurement target area is projected on the X-axis and the projection on the Y-axis A Y-axis projection range is calculated.

  FIG. 3 is a diagram illustrating a simulated X-axis projection range and a Y-axis projection range when the printed board w is projected based on the layout. Actually, the layout is numerical information of coordinates, and the projection range calculation means 31 performs calculation processing to obtain the projection range. FIG. 2 is an explanatory diagram.

In FIG. 2, a mark 1 is a mark indicating the reference position, and generally there are at least two at both ends. Areas 1, 2, and 3 each represent a solder area in a simulated manner.
The projection range calculation means 31 primarily obtains the ranges indicated by x1-x2, x3-x5, x4-x6, x7-x8, x9-x10 as the X-axis projection range, and then overlapped portions. Are obtained secondarily, including x1-x2, x3-x6, x7-x8, and x9-x10. As the Y-axis projection range, y1-y2, y3-y4, y5-y7, y6-y8, y9-y10 (however, y8 = Y9 in FIG. 2) are obtained.

The scanning range determination unit 32a first determines the main scanning position (and the number of scans). If the main scanning is in the Y-axis direction, it is determined based on the X-axis projection range. Further, the main scanning range in the X-axis direction that can be performed by one main scanning is determined by the distance L that is the sensing length of the line sensor 2 and is the main scanning width. It is determined by the following method (1) or (2) that the main scanning is repeated with a margin of ≦ δ << L).
(1) Assuming that the scanning range determination means 32a performs k main scannings for the entire range in advance along the X axis, as shown in FIG. 2, positions M1 = 0 to 0 on the X axis of the first main scanning. L, second position M2 = [L−δ] to [L−δ] + L, kth position Mk = [L−δ] × (k−1) to [L−δ] × (k−1) + L is allocated, and it is determined whether or not there is x1-x2, x3-x6, x7-x8, x9-x10 in the X-axis projection range at or across any of the allocated main scanning positions M1 to Mk. To do. As a result, M1, M2, M3, Mk-2, Mk-1, and Mk are necessary as the main scanning positions for satisfying all the X-axis projection ranges, and the number of times is six.
(2) Allocate x1-x2, x3-x6, x7-x8, and x9-x10 in the X-axis projection range to the main scanning position based on the distance L and the distance δ. In other words, in the above (1), the number of main scans is allocated in advance for the portion without the X-axis projection (empty section) in FIG. 2 even though the main scan is not performed. For the x-axis projection ranges x7-x8 and x9-x10, the position X7 is assigned as the start position. That is, the X-axis projection ranges x1-x2, x3-x6 are allocated in the same manner as the 0 position is allocated as the start position.

  Next, the scanning range determining unit 32a covers the Y-axis projection ranges y1-y2, y2-y3, y4-y6, x5-y7, y7-y8 according to the determined main scanning position. A scanning range in the Y-axis direction for scanning is determined. From FIG. 2, the range y1-y2 is required at the position x2 belonging to the main scan M1, but the range y3-y4 is also required at the position x3 belonging to the main scan M1. Accordingly, in the main scanning M1, scanning in the main scanning range S1 = y1 to y4 is necessary. In the main scanning M2, similarly, the main scanning range S2 of the range y3-y4 and the range y6-y8 is necessary. In this case, the main scanning range S2 = y3-y8 may be set. In the case of the main scanning M3, the main scanning range S3 = y6-y8 is necessary. Each of the main scans Mk-2 and Mk-1 requires a main scan range Sk-2 = Sk-1 = y5 to y7. In the main scanning Mk, the main scanning range Sk = y9 to y10 is necessary. As described above, the description has been made so that the method of determining the main scanning range in the y-axis direction can be understood based on FIG. 2, but actually, the scanning range determining means 32a is logically based on the layout irrespective of the notation of the figure decide. For example, the scanning range determination unit 32a searches the layout data to check whether there is an area of the measurement location that belongs to the main scanning M1 (X-axis coordinate position = 0 to L). Confirm that mark 1 and area 1 exist. Then, it is checked whether or not the projection range of the mark 1 and the area 1 on the X axis is within the range of the main scanning M1. Since there is a projection range (X1-X2, X3-L) on the X-axis, the projection range on the Y-axis is examined, and (y1-y2, y3-y4, where y2 and y3 are close to each other) In this case, it may be set as y1-y4.) Is determined to be the main scanning range of the main scanning M1.

  In FIG. 1, the scanning route determining means 32 is a short distance based on the main scanning position in the X-axis direction determined by the scanning range determining means 32a and the position information indicating the main scanning range in the Y-axis direction at each main scanning position. That is, a scanning route that can be scanned in a short time is determined. FIG. 3 is a diagram showing an example of the scanning route. In FIG. 3, R1, R2, R3, R4, R5, and R6 indicate the scanning route and direction, and R12, R23, R34, R45, and R56 indicate the sub-scanning route and direction for changing the position between main scans. Show. Among these, R12, R34, and R56 are moved obliquely by performing the moving operation of the main scanning mechanism 11 and the sub-scanning mechanism 3 simultaneously. R23 and R45 are not moved by the main scanning mechanism 11, but can be moved only by the operation of the sub-scanning mechanism 3. Note that R12, R23, R34, R45, and R56 may be moved at right angles as shown in FIG. 4, instead of being moved obliquely as shown in FIG. That is, it is moved at a right angle with respect to R12 of FIG. 3 as R12a and R12b of FIG. In this case, the main scanning mechanism 11 and the sub-scanning mechanism 3 perform serial operations rather than simultaneously.

  The control procedure storage unit 33 includes the start coordinate position of each route in the order of the scan routes determined by the scan route determination unit 32 in the order of R1, R12, R2, R23, R3, R34, R4, R45, R5, R56, and R6. The end coordinates are stored together with the ID of the printed board w.

  In the scanning control unit 25a of the measurement control unit 25, the main scanning mechanism of the scanning mechanism 1 is based on the scanning route procedure (route order) of the printed board w to be scanned from the control procedure storage unit 33 and its detailed coordinate position. 11 and information for controlling the sub-scanning mechanism 3 sequentially, that is, speed, acceleration, moving direction, moving time (moving distance) and the like in each route are generated, and control is performed based on the generated sequential control information.

[Inspection equipment]
Next, the general printed board inspection apparatus will be described with reference to FIG.

  In FIG. 1, the measurement control means 25 receives the layout indicating the measurement range (solder area and mark) on the surface of the printed board w from the design information storage means 30 as described above, and moves the line sensor 2 to the printed board w. The measurement range is scanned relatively to obtain a measurement value including a displacement in the height direction. The line sensor 2 is an example of a laser displacement meter by triangulation, a laser light source capable of irradiating a laser while being scanned relatively by the moving mechanism unit 5 with respect to the printed board w, and reflection from the printed board w. It consists of a light receiving means that receives light, and measures the measurement range, for example, the displacement of the solder spot on which the solder is printed, that is, the height of the printed solder spot (in the Z-axis direction) is measured in correspondence with the position of the printed solder spot, It is converted into digital data and stored in the measured value storage means 26.

  The data generation unit 27 receives the measurement values from the storage unit 26 and prints the measurement values based on a number of predetermined image parameter values indicating sensitivity for identifying delicate patterns such as filters, solder bridges, and solder pattern edges. Processing is performed to data for determination representing the amount of solder printed at the solder location. Further, the data generation means 27 includes means for performing calculation for generating the height, area, and / or volume of the printed solder location as the determination data. This judgment data is data that represents the amount of solder at the printed solder location, and the types include the height, area, volume, and deficiency of each solder location (detection of a state where there is no solder amount to be present) ), Positional deviation, bridge, height unevenness, etc. are output. Note that not all of the above-described determination data is required to determine the quality of the printed board w, but at least one of height, area, volume, defect, misalignment, bridge, and height unevenness is not included. One is essential.

  Note that the data generation means 27 is for evaluating the solder state in terms of area or volume, and may be omitted if the evaluation is simply based on the height. However, in this case, reference data to be described later is reference data regarding the height, and the determination unit 28 determines whether the solder state is high or not.

  The determination unit 28 compares the determination data generated from the measurement value with reference data of the same solder location stored in advance in the design information storage unit 30 for each solder location, and performs pass / fail determination.

  The display control unit 29b displays the determination result by the determination unit 28 in association with the layout (placement, dimensions, solder position) of the printed board w stored in the design information storage unit 30 via the determined solder location. 29c is displayed. For example, it is possible to visually specify a portion where a measurement range in the layout is determined to be defective (NG).

  The design information storage means 30 stores, as reference data, design values of the same type as the determination data, that is, design values for the height, area, volume, deficiency, misalignment, bridge, and height unevenness of the solder location. ing. Further, the design information storage means 30 stores a layout (placement diagram, dimensions, solder position, etc. of the printed board w) for each type of printed board w to be inspected, and the type of printed board w at the start of inspection. The list is displayed on the display means 29c and can be selected by the operation means 29a.

  The user interface 29 includes a display control unit 29b, a display unit 29c, and an operation unit 29a. The main operation is as described above.

  In the above configuration, the projection range calculation unit 31, the scanning route determination unit 32, the measurement control unit 25, the scanning control unit 25a, the data generation unit 27, the determination unit 28, and the display control unit 29b are the CPU and the functions described above for the CPU. And a memory (RAM) that stores data in the functional operation process. The design information storage means 30, the control procedure storage means 33, and the measured value storage means 26 are constituted by a memory and managed by the CPU.

It is a figure which shows the function structure of embodiment of this invention. It is a figure for demonstrating the projection to the X-axis and a Y-axis from the layout as a measurement reference | standard information on a printed circuit board, and a scanning range. It is a figure for demonstrating the procedure which scans a scanning range. It is a figure for demonstrating the other example of the scanning procedure of a scanning range. It is a figure which shows the example of the subscanning mechanism of a scanning mechanism. It is a figure which shows the example of the main scanning mechanism of a scanning mechanism. It is a figure for demonstrating the conventional scanning procedure.

Explanation of symbols

1 scanning mechanism, 2 line sensor, 3 sub-scanning mechanism, 3a support,
3b X-axis motor, 3c rail, 4 conveyor, 5 conveyor belt, 6 pulley,
7 transport motor, 8 stopper, 9 clamper, 10 abutting plate, 11 main scanning mechanism,
11a support, 11b Y-axis motor, 11c rail, 25 measurement control means,
25a scanning control unit, 26 measured value storage means, 27 data generation means, 28 determination means,
29 user interface, 29a operation means, 29b display control means,
29c display means, 30 design information storage means, 31 projection range calculation means,
32 scanning route determination means, 32a scanning range determination means, 33 control procedure storage means,
w Printed board

Claims (3)

A line sensor (2) that receives light reflected on the surface of the printed board including the solder region over a length L in the X-axis direction and receives the reflected light from the surface, and the printed board and the line sensor are relative to each other. A main scanning mechanism (11) that performs the main scanning in parallel with the Y-axis direction substantially orthogonal to the X-axis, and a predetermined distance [L−δ] based on the length L with the next main scanning position on the X-axis direction side. (Where 0 ≦ δ << L), and a sub-scanning mechanism (3) that performs sub-scanning that is changed every main scanning, and a print that inspects the solder state of the printed board based on the output of the line sensor In plate inspection equipment,
The printed board is preliminarily received board design information in which a measurement area including one or a plurality of the solder areas is represented by an XY coordinate system including the X axis and the Y axis, and the measurement area is defined as the X axis. A projection range calculation unit (31) that calculates an X-axis projection range when projected onto the Y-axis and a Y-axis projection range when projected onto the Y-axis;
Based on the X-axis projection range, the Y-axis projection range, and the predetermined distance [L−δ], a scanning route on the XY coordinate system for scanning the line sensor for all measurement regions is determined. A printed circuit board inspection apparatus comprising: a scanning route determining means (32); and a scanning control unit (25a) for controlling the main scanning mechanism and the sub-scanning mechanism according to the determined scanning route. The scanning route determining means includes
From the X-axis projection range and a predetermined distance [L-δ], the number of main scans for measuring the entire measurement region and the main scan position in the X-axis direction of each main scan are determined, and each main scan is determined. A main scanning range determining means (32a) for determining a main scanning range in the Y-axis direction in the scanning operation from the Y-axis projection range;
The printed circuit board inspection apparatus according to claim 1, wherein the scanning route is determined based on a main scanning position in the X-axis direction and a main scanning range in the Y-axis direction at each main scanning time. A line sensor (2) that receives light reflected on the surface of the printed board including the solder region over a length L in the X-axis direction and receives the reflected light from the surface, and the printed board and the line sensor are relative to each other. A main scanning mechanism (11) that performs the main scanning in parallel with the Y-axis direction substantially orthogonal to the X-axis, and a predetermined distance [L−δ] based on the length L with the next main scanning position on the X-axis direction side. ] (Where 0 ≦ δ << L), a sub-scanning mechanism (3) that performs sub-scanning that is changed every main scanning,
Before inspection
For the printed board to be inspected, receiving board design information in which a measurement area including one or a plurality of the solder areas is represented in an XY coordinate system including the X axis and the Y axis;
A projection range calculation step of calculating an X-axis projection range when the measurement region is projected onto the X-axis based on the substrate design information, and a Y-axis projection range when projected onto the Y-axis;
From the X-axis projection range and the predetermined distance [L−δ], the number of main scans for measuring the entire measurement region and the main scan position in the X-axis direction of each main scan are determined, and each main scan is determined. A main scanning range determination step of determining a main scanning range in the Y-axis direction in the scanning time from the Y-axis projection range;
Scanning on the XY coordinate system for scanning the line sensor over the entire measurement region based on the main scanning position in the X-axis direction and the main scanning range in the Y-axis direction at each main scanning time A scanning route determination stage for determining and storing a route;
A method for scanning a printed circuit board inspection apparatus, wherein the inspection is executed by controlling the sub-scanning mechanism and the main scanning mechanism based on the scanning route at the time of inspection.