CN108098096B - Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof - Google Patents
Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof Download PDFInfo
- Publication number
- CN108098096B CN108098096B CN201611055624.9A CN201611055624A CN108098096B CN 108098096 B CN108098096 B CN 108098096B CN 201611055624 A CN201611055624 A CN 201611055624A CN 108098096 B CN108098096 B CN 108098096B
- Authority
- CN
- China
- Prior art keywords
- pin header
- pin
- tin
- ring
- welding ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a selective wave-soldering pin header structure, which comprises: the length of the needle arranging main body exposed out of the welded part welding ring part meets the following conditions:w is the width of a welding ring of a welded part, D is the width of a pin header main body, h is the height of a pin header chamfering part, P is the distance between the centers of two adjacent pin headers, and G is the maximum distance between the pin headers and the inner ring of the welding ring. The invention also discloses a manufacturing method of the selective wave-soldering pin header structure and a method for judging the tin connection probability of the selective wave-soldering pin header structure. The pin header structure and the manufacturing method thereof can avoid the residual tin material between the adjacent pin headers, or cause tin connection, or form a tin ball. The method for judging the tin connection probability of the selective wave-soldering pin arrangement structure can judge the tin connection probability of the pin arrangement used by the welded part and the pin arrangement matched with the welded part.
Description
Technical Field
The invention relates to the field of automobiles, in particular to a selective wave soldering Pin (Pin Pin) structure. The invention also relates to a manufacturing method of the selective wave-soldering pin header structure and a method for judging the tin connection probability of the selective wave-soldering pin header structure.
Background
With the continuous advance of miniaturization, high integration and high precision of the electronic manufacturing industry, the integration complexity of a pin header is higher and higher, the pin pitch is smaller and smaller, the welding capacity of the traditional wave soldering process for the small pitch period with high integration is insufficient, and the high tin connection rate is accompanied in production.
Currently, since the connector manufacturing industry still uses the pad specification with Pitch of 2.5mm to 3.5mm to design a connector or pin header, the pin header exposure length is typically designed to be 1.5mm to 1.8mm (including a 0.5mm length pin header). When facing a connector with smaller Pitch (less than 2.5mm), the connector still adopts a through hole with more than 1.3mm-1.5mm plus a pad with a single side of 0.2mm-0.3mm, and the minimum distance between the pad and the pad is less than or equal to 0.4 mm. The fundamental reason for adopting the design scheme in the connector industry is that the larger pad size has larger adaptability to the size deviation of the connector, and the die cost, the production reject ratio and the process difficulty of the connector are reduced in a phase-changing manner.
However, in the above connector scheme, the excessive exposed length of the pin header and the excessive pad design result in a large amount of poor solder connection, and particularly when the multi-nozzle process of selective wave soldering is applied, the poor solder connection rate is even over 90%. The existing solution to the tin-connecting is to add tin-removing bonding pads, or to use small-sized vias and small-sized bonding pads to avoid tin-connecting. The parameters of the probe exposure length, the size of the through hole and other products are usually designed on the basis of empirical values or conjectures, and then experimental verification is carried out in practical application, if the experimental effect is not obvious, the design needs to be revised again, and the test sample needs to be manufactured and tested again, so that a large amount of time and production cost are wasted. Moreover, at present, there is no general method for judging the probability of tin connection generated by the pin header in a certain specification in the production process, and the probability of tin connection generated when the pin header in a certain specification is applied to a welding set in a certain specification cannot be judged.
Disclosure of Invention
The invention aims to provide a selective wave-soldering pin header structure capable of avoiding continuous tin during soldering.
The invention solves another technical problem by providing a manufacturing method of a selective wave soldering pin header structure which can avoid continuous tin during soldering.
The invention solves another technical problem by providing a method for judging the tin connection probability of the selective wave-soldering pin arrangement structure.
In order to solve the above technical problems, the present invention provides a selective wave-soldering pin header structure, including: a pin header body and a pin header head;
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
w is the width of a welding ring of a welded part, D is the width of a pin header main body, h is the height of a pin header chamfering part, P is the distance between the centers of two adjacent pin headers, and G is the maximum distance between the pin headers and the inner ring of the welding ring.
The integral length Ha of the pin header is H + Hp + H; wherein Hp is the depth of the solder ring.
Wherein, the pin header main part is the cuboid that the bottom surface is square. When the pin header main body is a cuboid with a square bottom surface, the center of the square bottom surface is coincident with the circle center of the welding ring, and the vertical distance from the inner ring of the welding ring to one side of the square is the maximum distance G between the pin header and the inner ring of the welding ring.
The pin header main body can also be a cylinder, and when the pin header main body is a cylinder, the distance between the circle center of the bottom surface of the cylinder and the circle center of the welding ring when the circle center of the bottom surface of the cylinder coincides is the maximum distance G between the pin header and the inner ring of the welding ring.
When the pin header main body is in other shapes, analogy is given to the method for calculating the maximum distance G between the pin header and the inner ring of the welding ring, for example, the method for calculating G when the bottom surface of the pin header is a regular pentagon and a hexagon refers to the calculation method of a square.
The invention provides a manufacturing method of a selective wave-soldering pin header structure, which comprises the following steps:
acquiring the width W of a welding ring, the inner diameter d of the welding ring, the depth Hp of the welding ring (the depth of the welding ring is equal to the thickness of the PCB plate and is equal to the length of the unexposed part of the pin header main body) and the distance P1 between the centers of two adjacent welding rings;
presetting the width of a pin header main body as D, wherein D is less than D, and then setting the maximum distance G between the pin header and the inner ring of the welding ring as D-D; the height of the chamfering part of the pin header is h;
in order to avoid that the tension of the tin connecting bonding pad and the row pins on the tin material is smaller than that of the nozzle on the tin material, the tension formula between the two rows of pins is obtained as follows:
N(2H+2W+2G)＜＝N(2L+S)
namely:
namely:
namely:
wherein N represents a tensile force;
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
then, the whole length of the pin header is Ha ═ H + Hp + H.
Wherein, the pin header main part is square.
The invention provides a method for judging tin connection probability of a selective wave-soldering pin arrangement structure, which comprises the following steps:
obtaining the width W of a welding ring of a welded piece, the inner diameter D of the welding ring, the depth Hp of the welding ring, the center-to-center distance P1 between two adjacent welding rings and the width D of a pin header main body, wherein the maximum distance G between the pin header and the inner ring of the welding ring is D-D, and the height of a chamfering part of the pin header is h;
calculating to obtain a length threshold Hy of the part of the pin header main body exposed out of the welded ring of the welded part;
obtaining the length Hx of the welding ring part of the welded part actually exposed when the pin header main body is welded;
and judging the tin connection probability of the pin arrangement structure through the size relationship of Hy and Hx.
Further improving, when Hy is less than Hx, judging that the tin connection probability is 100 percent, namely judging that tin connection is realized;
when Hy is more than or equal to Hx and is more than 0, the tin connection probability is judged to be 0, namely, the tin connection is judged not to be generated.
Further improving, when Hy is less than Hx, judging that the tin connection probability is 80%;
when Hy is more than or equal to Hx and is more than 0, the tin connecting probability is judged to be 20%.
The invention is fixedly arranged on the connector or the bonding pad when in work. When in welding, the tin material nozzle moves upwards, and the solder contacts the bonding pad and the pin header to form a welding spot in a molten state after fully contacting. During detinning, the welding spot is still in a molten state, tin forming the welding spot is left by virtue of the tension of the welding spot and the row needle to the tin, and the redundant tin is pulled back into the nozzle by virtue of the tension of the tin in the nozzle and the downward gravity of the nozzle. When the good welding spot requires a detinning state, the tension of the welding disc and the row pin to the tin material is smaller than the tension of the nozzle to the tin material. According to the principle, the length threshold of the row needle main body exposed out of the welding ring part of the welded piece is obtained through calculating the height of the chamfered part of the row needle head according to the obtained width of the welding ring, the inner diameter of the welding ring, the depth of the welding ring, the distance between the centers of two adjacent welding rings, the width of the row needle main body, the maximum distance between the row needle and the inner ring of the welding ring and the height of the chamfered part of the row needle head, so that the tension of a welding disc and the row needle on the tin material is smaller than that of a nozzle on the tin material, and the purpose that continuous tin connection cannot be formed during tin. The pin header structure and the manufacturing method thereof can avoid the residual tin material between the adjacent pin headers, or cause tin connection, or form a tin ball. The method for judging the tin connection probability of the selective wave-soldering pin arrangement structure can judge the tin connection probability of the welded part and the pin arrangement used by matching the welded part, and improves the applicability of the welded part and the pin arrangement used by matching the welded part.
Drawings
The invention will be described in further detail with reference to the following detailed description and accompanying drawings:
fig. 1 is a first structural schematic diagram of the present invention, which shows a positional relationship between a pin header and a solder ring when the pin header main body is a rectangular parallelepiped whose bottom surface is square.
FIG. 2 is a second schematic structural view of the present invention, showing the positional relationship between the solder nozzle and the pin header during detinning.
Description of the reference numerals
W is the width of the weld ring,
d is the width of the pin header body
h is the height of the chamfer part of the pin header
P is the distance between the centers of two adjacent pins
G is the maximum distance between the pin header and the inner ring of the welding ring
S is the distance between two welding rings
d is the inner diameter of the weld ring
Hp is the depth of the weld ring
P1 is the distance between centers of two adjacent welding rings
L is the length of the chamfer of the pin header
A is a welded part, e.g. PCB
B is a pin header body
C is a row needle head
X is a tin material
Y is a tin material nozzle
Z is a connector or pad
Detailed Description
As shown in fig. 1 and fig. 2, the selective wave-soldering pin header structure of the present invention includes: the bottom surface is a square cuboid pin header body and a conical pin header;
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
w is the width of a welding ring of a welded part, D is the width of a pin header main body, h is the height of a pin header chamfering part, P is the distance between the centers of two adjacent pin headers, and G is the maximum distance between the pin headers and the inner ring of the welding ring.
The integral length Ha of the pin header is H + Hp + H; wherein Hp is the depth of the solder ring.
When the pin header main body is a cylinder, the distance between the circle center of the bottom surface of the cylinder and the circle center of the welding ring when the circle center of the bottom surface of the cylinder coincides is the maximum distance G between the pin header and the inner ring of the welding ring.
When the pin header main body is in other shapes, analogy is given to the method for calculating the maximum distance G between the pin header and the inner ring of the welding ring, for example, the method for calculating G when the bottom surface of the pin header is a regular pentagon and a hexagon refers to the calculation method of a square.
The invention provides a manufacturing method of a selective wave-soldering pin header structure, which comprises the following steps:
acquiring the width W of a welding ring of a welded piece, the inner diameter d of the welding ring, the depth Hp of the welding ring and the distance P1 between the centers of two adjacent welding rings;
presetting the width of a pin header main body as D, wherein D is less than D, and then setting the maximum distance G between the pin header and the inner ring of the welding ring as D-D; the height of the chamfering part of the pin header is h;
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
then, the whole length of the pin header is Ha ═ H + Hp + H.
Wherein, the pin header main part is square.
The invention provides a method for judging tin connection probability of a selective wave-soldering pin arrangement structure, which comprises the following steps:
obtaining the width W of a welding ring of a welded piece, the inner diameter D of the welding ring, the depth Hp of the welding ring, the center-to-center distance P1 between two adjacent welding rings and the width D of a pin header main body, wherein the maximum distance G between the pin header and the inner ring of the welding ring is D-D, and the height of a chamfering part of the pin header is h;
calculating to obtain a length threshold Hy of the part of the pin header main body exposed out of the welded ring of the welded part;
obtaining the length Hx of the welding ring part of the welded part actually exposed when the pin header main body is welded;
and judging the tin connection probability of the pin arrangement structure through the size relationship of Hy and Hx.
The length threshold Hy can be used for preliminary judgment, and when Hy is less than Hx, the tin connection probability is judged to be 100 percent, namely tin connection is judged;
when Hy is more than or equal to Hx and is more than 0, the tin connection probability is judged to be 0, namely, the tin connection is judged not to be generated.
Further judging that the tin connecting probability is 80 percent when Hy is less than Hx;
when Hy is more than or equal to Hx and is more than 0, the tin connecting probability is judged to be 20%.
The following will illustrate specific pin arrangement parameters to further explain the present invention for improving the tin connecting effect.
First, improve the tin effect through the pad size
The length is 2.0mm, the row needle width is 0.45mm, the exposed length is 1.3mm (including chamfer length with height of 0.5 mm), the size of the pad hole ring is 0.2mm, and the through hole is 1.2 mm;
according to the formula of the invention and the above conditions, H is less than or equal to 1.34-2W-2G;
in the design, the minimum W and the minimum G can be designed to be 0.15, H H is less than or equal to 0.79mm, the overall exposure length of the pin header is less than or equal to 1.29mm, and the exposure length of the pin header can be temporarily not modified.
Reducing the size of the through hole to 0.7mm and the size of the ring hole to 0.15mm according to the result of the formula;
it was calculated that the reasonable pin header length should be less than 1.29mm (including 0.5mm high chamfers).
A welding test was performed.
The one-time tin-connecting defect is reduced to be below 0.03 percent from 100 percent, and a more efficient nozzle is applied, and the production capacity is improved to 3200pcs from 650 pcs/shift (the production quantity is more than 10000pcs, and pcs refers to a single-piece product).
Secondly, the tin connection effect is improved by modifying the size of the bonding pad and matching the exposure length of the corresponding pin header;
the length is 2.2mm, the width of the pin header is 0.8mm, the exposed length is 1.8mm (including the chamfer length with the height of 0.5 mm), the size of the pad hole ring is 0.2mm, and the through hole is 1.4 mm;
according to the formula of the invention and the above conditions, H is less than or equal to 1.34-2W-2G;
assuming that the limit values are taken, setting W to 0 and G to 0, i.e. H cannot exceed 1.34mm, the above parameter configuration needs to change the exposed length of the pin header and match the corresponding size of the pad to improve the problem of tin connection;
the improvement scheme comprises the following steps:
reducing the size of the through hole to 1.2mm, and reducing the size of the hole ring to 0.15 mm;
the first reject ratio is reduced from more than 70 percent to about 26.7 percent;
the second step of the improvement scheme is as follows:
calculating the reasonable pin header length to be less than 1.14mm (including 0.5mm chamfer) according to the new pad size;
cutting the exposed length of the pin header to be 1.1 +/-0.1 mm;
the one-time defective rate is reduced from more than 26.7 percent to about 2.3 percent, and the tin-connecting probability of 2.3 percent can be ignored when the tin-connecting tolerance is enlarged, and the situation of tin-connecting is not considered to exist.
The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (8)
1. A selective wave-soldering pin header structure comprising: arrange needle main part and row syringe needle, its characterized in that:
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
w is the width of a welding ring of a welded part, D is the width of a pin header main body, h is the height of a pin header chamfering part, P is the distance between the centers of two adjacent pin headers, and G is the maximum distance between the pin headers and the inner ring of the welding ring.
2. The selective wave solder pin header structure of claim 1, wherein: the integral length Ha of the pin header is H + Hp + H; wherein Hp is the depth of the solder ring.
3. The selective wave solder pin header structure of claim 1, wherein: the pin header main body is a cuboid with a square bottom surface.
4. A method for manufacturing a selective wave-soldering pin header structure is characterized by comprising the following steps:
acquiring the width W of a welding ring of a welded piece, the inner diameter d of the welding ring, the depth Hp of the welding ring and the distance P1 between the centers of two adjacent welding rings;
presetting the width of a pin header body as D, wherein D is less than D, and then, the maximum distance G between the pin header and the inner ring of the welding ring is (D-D)/2; the height of the chamfering part of the pin header is h;
the length of the part of the pin header body, which is exposed out of the welding ring of the welded part, meets the following conditions:
then, the whole length of the pin header is Ha ═ H + Hp + H.
5. The method of manufacturing a selective wave-soldering pin header structure of claim 4, wherein: the pin header main body is a cuboid with a square bottom surface.
6. A method for judging tin connection probability of a selective wave-soldering pin arrangement structure is characterized by comprising the following steps:
acquiring the width W of a welding ring of a welded piece, the inner diameter D of the welding ring, the depth Hp of the welding ring, the center-to-center distance P1 between two adjacent welding rings and the width D of a pin header main body, wherein the maximum distance G between a pin header and the inner ring of the welding ring is (D-D)/2, and the height of a chamfered part of the pin header is h;
calculating to obtain a length threshold Hy of the part of the pin header main body exposed out of the welded ring of the welded part;
obtaining the length Hx of the welding ring part of the welded part actually exposed when the pin header main body is welded;
and judging the tin connection probability of the pin arrangement structure through the size relationship of Hy and Hx.
7. The method for determining the tin connection probability of the selective wave-soldering pin arrangement structure according to claim 6, wherein:
when Hy is less than Hx, judging that the tin connection probability is 100 percent;
when Hy is more than or equal to Hx and is more than 0, the tin connecting probability is judged to be 0.
8. The method of determining the probability of tin-attachment for the selective wave-soldering pin arrangement structure as set forth in claim 6, wherein:
when Hy is less than Hx, judging that the tin connection probability is 80 percent;
when Hy is more than or equal to Hx and is more than 0, the tin connecting probability is judged to be 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611055624.9A CN108098096B (en) | 2016-11-25 | 2016-11-25 | Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611055624.9A CN108098096B (en) | 2016-11-25 | 2016-11-25 | Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108098096A CN108098096A (en) | 2018-06-01 |
| CN108098096B true CN108098096B (en) | 2020-02-25 |
Family
ID=62205279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611055624.9A Active CN108098096B (en) | 2016-11-25 | 2016-11-25 | Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108098096B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113766765A (en) * | 2021-08-18 | 2021-12-07 | 惠州雷曼光电科技有限公司 | Circuit board and soldering assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0043224A2 (en) * | 1980-06-26 | 1982-01-06 | McKenzie, Joseph A., Jr. | Component mask for printed circuit boards |
| US4735587A (en) * | 1986-02-12 | 1988-04-05 | Specialty Electronics, Inc. | Pin header with board retention tail |
| CN101209004A (en) * | 2005-08-25 | 2008-06-25 | 三美电机株式会社 | Printed wiring board |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN201601902U (en) * | 2010-03-23 | 2010-10-06 | 伟创力电子科技（上海）有限公司 | Wave-soldering plug-in component fixing device |
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
-
2016
- 2016-11-25 CN CN201611055624.9A patent/CN108098096B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0043224A2 (en) * | 1980-06-26 | 1982-01-06 | McKenzie, Joseph A., Jr. | Component mask for printed circuit boards |
| US4735587A (en) * | 1986-02-12 | 1988-04-05 | Specialty Electronics, Inc. | Pin header with board retention tail |
| CN101209004A (en) * | 2005-08-25 | 2008-06-25 | 三美电机株式会社 | Printed wiring board |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN201601902U (en) * | 2010-03-23 | 2010-10-06 | 伟创力电子科技（上海）有限公司 | Wave-soldering plug-in component fixing device |
| CN103152991A (en) * | 2013-03-28 | 2013-06-12 | 北京经纬恒润科技有限公司 | Printed circuit board layout method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108098096A (en) | 2018-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010098098A (en) | Method of manufacturing electronic apparatus | |
| CN101656216A (en) | Method of manufacturing electronic components having bump | |
| CN108098096B (en) | Selective wave-soldering pin arrangement structure, manufacturing method and tin connection probability judgment method thereof | |
| CN102593012B (en) | Manufacturing method of semiconductor device | |
| JP2006253342A (en) | Method of bonding semiconductor device and flux transfer pin | |
| CN111730161B (en) | Copper particle double-side pre-welding device and welding method | |
| JP2007234749A (en) | Manufacturing method of chip-shape solid electrolytic capacitor | |
| KR20180130009A (en) | CYLINDRICAL FORMED BODY FOR Cu PILLARS FOR SEMICONDUCTOR CONNECTION | |
| CN113695695A (en) | Method for soldering tin paste for semiconductor chip | |
| CN211102002U (en) | Nondestructive unsoldering soldering iron head for direct-insert type single-row pin device | |
| JP3272993B2 (en) | Relay board, method of manufacturing the same, and method of connecting the same | |
| CN217193602U (en) | Sintering mold for improving welding quality | |
| CN113066786A (en) | Laser welding method for LED integrated package | |
| CN110233110B (en) | Welding method of GaN flip chip | |
| CN110933859A (en) | Method for correcting BGA design through BGA adapting circuit board | |
| CN207806922U (en) | A kind of contact weldering contact structure improving welding performance | |
| US10177108B2 (en) | Method of manufacturing electronic component module and electronic component module | |
| CN203590595U (en) | PCB through-hole structure | |
| CN114142269B (en) | High-speed connector conductor pin structure and tin planting technology thereof | |
| CN107900547A (en) | A kind of contact welding surface structure for improving welding performance | |
| CN216146519U (en) | Connecting structure of surface-mounted element | |
| CN201119116Y (en) | Universal pin welding tray | |
| JP5556309B2 (en) | Electronic component mounting apparatus, electronic component, and substrate | |
| CN117649807A (en) | High-reliability flip-chip process LED nixie tube | |
| TW201810470A (en) | Wire bonding method and wire bonding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |