CN203590595U

CN203590595U - PCB through-hole structure

Info

Publication number: CN203590595U
Application number: CN201320732416.3U
Authority: CN
Inventors: 何波; 莫千万; 麦炤元
Original assignee: Mitac Computer Shunde Ltd
Current assignee: Mitac Computer Shunde Ltd; Shunda Computer Factory Co Ltd
Priority date: 2013-11-19
Filing date: 2013-11-19
Publication date: 2014-05-07
Anticipated expiration: 2023-11-19

Abstract

Disclosed is a PCB through-hole structure comprising a first through-hole and a second through-hole. The first through-hole is connected to a TOP surface of a PCB, and has a hole depth less than the thickness of the PCB. One end of the second through-hole is connected to the first through-hole, and the other end of the second through-hole is connected to a BOTTOM surface of the PCB. The second through-hole has a hole depth less than the thickness of the PCB, and an aperture diameter greater than that of the first through-hole. According to the utility model, a pin of a dual in-line component is disposed correspondingly into the PCB through-hole, one end of the pin is disposed in the first through-hole, and the other end of the pin is disposed in the second through-hole; in soldering, the molten solder flows into the PCB through-hole; since the aperture diameter of the second through-hole is greater than that of the first through-hole, the second through-hole has a larger flowing space for the solder and cooling time of the solder can be extended so that the solder can easily flow to the surface of the PCB; and thus, maintenance is facilitated, the scrap rate of the PCB is reduced, and the cost is reduced.

Description

A kind of PCB through-hole structure

Technical field

The utility model relates to a kind of PCB through-hole structure, particularly relates to a kind of PCB via design being applied in dual inline type element.

Background technology

Dual in-line package technology, be called for short DIP encapsulation, it is the simplest a kind of packaged type, refer to adopt the integrated circuit (IC) chip of dual-in-line form encapsulation, most middle small scale integrated circuits all adopt this packing forms, the cpu chip that its number of pins is generally no more than 100, DIP encapsulation has two row's pins, need to directly be inserted in identical PCB via count and the circuit board arranged for how much on weld.

Refer to Fig. 1, it is PCB through-hole structure in prior art, pcb board 10 is provided with some PCB through holes 1, this PCB through hole 1 one end is connected with the TOP face 101 of pcb board 10, the other end is connected with the BOTTOM face 102 of pcb board 10, and the aperture up and down of PCB through hole 1 is identical, described PCB through hole 1 is cylinder, yet the structure of this PCB through hole 1 makes product produce heat dissipation problem, because the internal layer Copper Foil of PCB through hole 1 becomes more and more thicker, area is also increasing, cause the upper tin height of chip pin to become worse and worse, in addition, when this class component needs repairing, because the aperture of PCB through hole 1 is less and PCB heat radiation is too fast, cause scolder to solidify too fast, the problem that the pin of appearance DIP element cannot be removed completely or insert, cause the Copper Foil on pcb board 10 to be corroded by scolder, the serious pcb board 10 that makes is scrapped, production cost is improved.

In view of this, be necessary to provide a kind of PCB through-hole structure, this PCB through-hole structure can solve the high problem of cost existing in above-mentioned technology in fact.

Summary of the invention

Therefore, the purpose of this utility model is to provide a kind of PCB through-hole structure, and this PCB through-hole structure can solve the problem that above-mentioned cost is high.

To achieve the above object, PCB through-hole structure of the present utility model, it is applied in dual inline type element, this dual inline type element comprises some pins, this pin correspondence is placed in a PCB through hole, this PCB through hole is placed in a pcb board, and this pcb board comprises TOP face and BOTTOM face, and this PCB through-hole structure comprises:

The first through hole, this first through hole is connected with the TOP face of described pcb board, and the hole depth of this first through hole is less than the thickness of described pcb board; And

The second through hole, this second through hole one end is connected with described the first through hole, and the other end is connected with the BOTTOM face of described pcb board, and the hole depth of this second through hole is less than the thickness of described pcb board, and the aperture of this second through hole is greater than the aperture of described the first through hole.

Preferably, the thickness that the hole depth sum of the hole depth of described the first through hole and described the second through hole is pcb board.

Preferably, described PCB through hole is inverted T shape.

Preferably, the area of section of described the first through hole is greater than the area of section of described dual inline type component pin.

Preferably, the central shaft of the central shaft of described the first through hole and described the second through hole coincides.

Preferably, described the first through hole is provided with the coat of metal, and described the second through hole is provided with the coat of metal, and the coat of metal on the first through hole is connected with the coat of metal on described the second through hole, to realize the electric connection with described pcb board.

Compared to prior art, PCB through-hole structure of the present utility model, by one first through hole is set, this the first through hole one end is connected with the TOP face of pcb board, the other end is connected with one second through hole, this second through hole is connected with the BOTTOM face of pcb board, and the aperture of the second through hole is greater than the aperture of the first through hole, in addition, the first through hole is provided with the coat of metal, the second through hole is provided with the coat of metal, PCB through hole and pcb board are electrically connected, the pin correspondence of dual inline type element is placed in this PCB through hole, pin one end is placed in the first through hole, the other end is placed in the second through hole, when welding, the flow of solder material of melting is in PCB through hole, because the aperture of the second through hole is greater than the aperture of the first through hole, therefore the flowing space of scolder is larger in the second through hole, can extend the temperature fall time of scolder, scolder is more easily flow on the plate face of pcb board, thereby make maintenance easier, reduced the scrappage of pcb board, reduced cost.

[accompanying drawing explanation]

Fig. 1 illustrates the structural representation of the PCB through hole of prior art.

Fig. 2 illustrates the structural representation of the utility model PCB through-hole structure.

Fig. 3 illustrates the structural representation in element when welding of the utility model PCB through-hole structure.

[embodiment]

Refer to Fig. 2 and Fig. 3, structural representation when it is the structural representation of the utility model PCB through-hole structure and the welding of the element of the utility model PCB through-hole structure.

PCB through-hole structure of the present utility model, it is applied in dual inline type element 40, in the present embodiment, refer to Fig. 2 and Fig. 3, this dual inline type element 40 comprises two pins 401, and these pin 401 correspondences are placed in a PCB through hole, and this PCB through hole is placed in a pcb board 10, this pcb board 10 comprises TOP face 101 and BOTTOM face 102, and this PCB through-hole structure comprises:

The first through hole 20, this first through hole 20 is connected with the TOP face 101 of described pcb board 10, and the hole depth of this first through hole 20 is less than the thickness of described pcb board 10; And

The second through hole 30, these the second through hole 30 one end are connected with described the first through hole 20, the other end is connected with the BOTTOM face 102 of described pcb board 10, and the hole depth of this second through hole 30 is less than the thickness of described pcb board 10, the aperture of this second through hole 30 is greater than the aperture of described the first through hole 20, in the present embodiment, the hole depth sum of the hole depth of described the first through hole 20 and described the second through hole 30 is the thickness of pcb board 10.

In the present embodiment, described PCB through hole is inverted T shape, in addition, the area of section of described the first through hole 20 is greater than the area of section of the pin 401 of described dual inline type element 40, and the central shaft of the central shaft of described the first through hole 20 and described the second through hole 30 coincides, wherein, described the first through hole 20 is provided with the coat of metal, described the second through hole 30 is provided with the coat of metal, and the coat of metal on the first through hole 20 is connected with the coat of metal on described the second through hole 30, to realize the electric connection with described pcb board 10.

The process of soldered elements 40 is: the pin of element 40 401 correspondences are placed in PCB through hole, these pin 401 one end are placed in the first through hole 20, the other end is placed in the second through hole 30, when solder fusing, because the aperture of the second through hole 30 is greater than the aperture of the first through hole 20, making has enough flow of solder material spaces in the second through hole 30, the diameter of the first through hole 20 is greater than the diameter of pin 401 again, the scolder of fusing flows to the TOP face 101 of pcb board 10 by the space of the first through hole 20, realize the electric connection of element 40 and pcb board 10, the space of cause the second through hole 30 is large, therefore the scolder in the second through hole 30 is many, thereby extended the time of scolder cooling, and make element 40 more easily go up tin, when when pcb board 10 takes off element 40, by solder fusing, because of the scolder setting time of melting elongated, thereby can take off easily element 40.

Compared to prior art, PCB through-hole structure of the present utility model, can extend the temperature fall time of scolder, and scolder is more easily flow on the plate face of pcb board 10, thereby makes maintenance easier, has reduced the scrappage of pcb board 10, has reduced cost.

Claims

1. a PCB through-hole structure, it is applied in dual inline type element, and this dual inline type element comprises some pins, this pin correspondence is placed in a PCB through hole, and this PCB through hole is placed in a pcb board, and this pcb board comprises TOP face and BOTTOM face, it is characterized in that, this PCB through-hole structure comprises:

2. PCB through-hole structure according to claim 1, is characterized in that, the thickness that the hole depth sum of the hole depth of described the first through hole and described the second through hole is pcb board.

3. PCB through-hole structure according to claim 1, is characterized in that, described PCB through hole is inverted T shape.

4. PCB through-hole structure according to claim 1, is characterized in that, the area of section of described the first through hole is greater than the area of section of described dual inline type component pin.

5. PCB through-hole structure according to claim 1, is characterized in that, the central shaft of the central shaft of described the first through hole and described the second through hole coincides.

6. PCB through-hole structure according to claim 1, it is characterized in that, described the first through hole is provided with the coat of metal, described the second through hole is provided with the coat of metal, and the coat of metal on the first through hole is connected with the coat of metal on described the second through hole, to realize the electric connection with described pcb board.