CN203467060U - Circuit board with built-in heat radiation structure - Google Patents
Circuit board with built-in heat radiation structure Download PDFInfo
- Publication number
- CN203467060U CN203467060U CN201320590641.8U CN201320590641U CN203467060U CN 203467060 U CN203467060 U CN 203467060U CN 201320590641 U CN201320590641 U CN 201320590641U CN 203467060 U CN203467060 U CN 203467060U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- metal
- built
- layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board with a built-in heat radiation structure. The circuit board comprises a metal substrate which is orderly provided with a metal welded layer and an insulating layer. The circuit board is characterized in that the insulating layer is provided with a plurality of component grooves used for installing components, a heat radiation baffle plate is arranged between the metal substrate and the metal welded layer, the heat radiation baffle plate is arranged at a middle position between the metal substrate and the metal welded layer, and other positions between the metal substrate and the metal welded layer are connected through insulated materials. By employing the above technical scheme, the heat radiation baffle plate is arranged between the metal substrate and the metal welded layer, the heat radiation baffle plate is provided with a heat radiation hole to provide a heat radiation effect, the heat radiation baffle plate is welded with a heat radiation fin to provide an additional heat radiation function, and the heat radiation degree in the production process is ensured.
Description
Technical field
The utility model belongs to wiring board, is specifically related to a kind of wiring board of built-in radiator structure.
Background technology
Wiring board applies to the every aspect of life, but in making the process of wiring board, especially on pad in the process of welding component, can produce a large amount of heats, and this heat is all to rely on the heat dispersion of self material to dispel the heat conventionally, so in manufacturing process, easily appearance is dispelled the heat not enough and is made the finished product of wiring board occur quality problems.
Summary of the invention
The utility model, in order to solve the technical problem of mentioning in background technology, provides a kind of wiring board of built-in radiator structure.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of wiring board of built-in radiator structure, comprise metal-based layer, on described metal-based layer, be provided with successively metal solder layer and insulating barrier, it is characterized in that: described insulating barrier has several for the components and parts groove position of mounting related components, between described metal-based layer and metal solder layer, be provided with heat radiation dividing plate, described heat radiation dividing plate is arranged on the centre position between metal-based layer and metal solder layer, and all the other positions between described metal-based layer and metal solder layer connect by insulating material.
Described heat radiation dividing plate centre position upwards has radiating groove, and described radiating groove inner bottom surface is welded with fin.
Described radiating groove inner bottom surface is provided with a large heat radiation through hole below fin.
Described fin adopts copper radiating rib.
Adopt after above technical scheme: between metal-based layer and metal solder layer, heat radiation dividing plate is set, heat radiation dividing plate is provided with heat radiation through hole radiating effect is provided, and heat radiation dividing plate also welds fin, and extra heat sinking function is provided, and has guaranteed degree of heat radiation in process of production.
Accompanying drawing explanation
Fig. 1 is structure cutaway view of the present utility model.
Embodiment
Referring to Fig. 1, a kind of wiring board of built-in radiator structure, comprise metal-based layer 1, on described metal-based layer 1, be provided with successively metal solder layer 2 and insulating barrier 3, described insulating barrier 3 has several for the components and parts groove position 5 of mounting related components, between described metal-based layer 1 and metal solder layer 2, be provided with heat radiation dividing plate 4, described heat radiation dividing plate 4 is arranged on the centre position between metal-based layer 1 and metal solder layer 2, and all the other positions between described metal-based layer 1 and metal solder layer 2 connect by insulating material.
For of the present utility model, further explain:
1) heat radiation dividing plate 4 centre positions upwards have radiating groove 6, and described radiating groove 6 inner bottom surfaces are welded with fin 7;
2) radiating groove 6 inner bottom surfaces are provided with a large heat radiation through hole 8 below fin 7;
3) fin 7 adopts copper radiating rib.
Adopt after above technical scheme: between metal-based layer and metal solder layer, heat radiation dividing plate is set, heat radiation dividing plate is provided with heat radiation through hole radiating effect is provided, and heat radiation dividing plate also welds fin, and extra heat sinking function is provided, and has guaranteed degree of heat radiation in process of production.
Claims (4)
1. the wiring board of a built-in radiator structure, comprise metal-based layer (1), on described metal-based layer (1), be provided with successively metal solder layer (2) and insulating barrier (3), it is characterized in that: described insulating barrier (3) has several for the components and parts groove position (5) of mounting related components, between described metal-based layer (1) and metal solder layer (2), be provided with heat radiation dividing plate (4), described heat radiation dividing plate (4) is arranged on the centre position between metal-based layer (1) and metal solder layer (2), all the other positions between described metal-based layer (1) and metal solder layer (2) connect by insulating material.
2. the wiring board of a kind of built-in radiator structure according to claim 1, is characterized in that: described heat radiation dividing plate (4) centre position upwards has radiating groove (6), and described radiating groove (6) inner bottom surface is welded with fin (7).
3. the wiring board of a kind of built-in radiator structure according to claim 1, is characterized in that: described radiating groove (6) inner bottom surface is provided with a large heat radiation through hole (8) below fin (7).
4. the wiring board of a kind of built-in radiator structure according to claim 2, is characterized in that: described fin (7) adopts copper radiating rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320590641.8U CN203467060U (en) | 2013-09-14 | 2013-09-14 | Circuit board with built-in heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320590641.8U CN203467060U (en) | 2013-09-14 | 2013-09-14 | Circuit board with built-in heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203467060U true CN203467060U (en) | 2014-03-05 |
Family
ID=50179395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320590641.8U Expired - Fee Related CN203467060U (en) | 2013-09-14 | 2013-09-14 | Circuit board with built-in heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203467060U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163082A (en) * | 2015-05-12 | 2016-11-23 | 三星电机株式会社 | Circuit board and manufacture method thereof |
-
2013
- 2013-09-14 CN CN201320590641.8U patent/CN203467060U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163082A (en) * | 2015-05-12 | 2016-11-23 | 三星电机株式会社 | Circuit board and manufacture method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014103295A5 (en) | ||
| CN201904999U (en) | Improved radiating structure of circuit board | |
| CN203748105U (en) | Double-face circuit board | |
| CN205159097U (en) | Paste base of sheet -type capacitor ware | |
| CN203467060U (en) | Circuit board with built-in heat radiation structure | |
| CN204069492U (en) | A kind of printed circuit board (PCB) | |
| CN204046918U (en) | One heat dissipation type circuit board | |
| CN204244567U (en) | There is the circuit board of good radiating structure | |
| CN203467056U (en) | Clamping aluminum base circuit board with heat dissipation material | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN202889776U (en) | Mixed aluminum based printed circuit board with heat sink material | |
| KR20110125771A (en) | Manufacturing method of internal antenna using multilayered structure dissimilar metalsand internal antenna thereof | |
| US9347712B2 (en) | Heat dissipating device | |
| CN204335161U (en) | Pcb board | |
| CN203537656U (en) | Circuit board | |
| CN203633007U (en) | Heat radiation fin and housing composition structure | |
| CN203895533U (en) | Protective resistor and explosion-proof battery | |
| CN202507609U (en) | Substrate | |
| CN204350441U (en) | A kind of two plane type wiring board with heat radiation | |
| CN101513662B (en) | Method for manufacturing radiator with radiating fins and structure of radiator | |
| CN202841681U (en) | Printed circuit board (PCB) possessing heat dissipation function | |
| CN204792887U (en) | COB LED module of ceramic honey comb base | |
| CN204408743U (en) | A kind of wiring board with cooling mechanism | |
| CN203590595U (en) | PCB through-hole structure | |
| CN202535637U (en) | Printed circuit board with good heat dissipation effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20170914 |