CN202889776U - Mixed aluminum based printed circuit board with heat sink material - Google Patents
Mixed aluminum based printed circuit board with heat sink material Download PDFInfo
- Publication number
- CN202889776U CN202889776U CN 201220605176 CN201220605176U CN202889776U CN 202889776 U CN202889776 U CN 202889776U CN 201220605176 CN201220605176 CN 201220605176 CN 201220605176 U CN201220605176 U CN 201220605176U CN 202889776 U CN202889776 U CN 202889776U
- Authority
- CN
- China
- Prior art keywords
- radiating
- circuit board
- heat sink
- printed circuit
- sink material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a mixed aluminum based printed circuit board with a heat sink material. The mixed aluminum based printed circuit board comprises an aluminum substrate, wherein an insulating layer and a bonding pad are orderly arranged at the outer layer of the aluminum substrate. The mixed aluminum based printed circuit board is characterized in that a plurality of radiating through holes are communicated on the aluminum substrate; radiating grooves are arranged inwards at the parts, corresponding to the radiating through holes, of the insulating layer; radiating plates are welded inside the radiating through holes; each radiating plate adopts a copper radiating plate, and the bottom of each radiating groove is arranged at the middle position of the insulating layer. After the technical scheme is adopted, the radiating plates are welded on the aluminum substrate and the insulating layer. Therefore, an extra radiating function is provided, and the radiating degree in the production process is also guaranteed.
Description
Technical field
The utility model belongs to wiring board, is specifically related to a kind of folder aluminum-based circuit board with heat sink material.
Background technology
The every aspect that wiring board applies to live, but in the process of making wiring board, especially on pad in the process of welding component, can produce a large amount of heats, and this heat all is to rely on the heat dispersion of self material to dispel the heat usually, so in manufacturing process, heat radiation easily occurs not enough and so that quality problems appear in the finished product of wiring board.
Summary of the invention
The utility model then provides a kind of folder aluminum-based circuit board with heat sink material in order to solve the technical problem of mentioning in the background technology.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of folder aluminum-based circuit board with heat sink material, comprise aluminium base, described aluminium base skin is provided with insulating barrier and pad successively, it is characterized in that: be connected with several heat radiation through holes on the described aluminium base, the corresponding heat radiation lead to the hole site of described insulating barrier is provided with radiating groove inwardly, is welded with fin in the described heat radiation through hole.
Described fin adopts copper radiating rib.
The bottom land of described radiating groove is positioned at the insulating barrier centre position.
After adopting above technical scheme: at aluminium base and insulating barrier place welding fin, provide extra heat sinking function, guaranteed degree of heat radiation in process of production.
Description of drawings
Fig. 1 is structure cutaway view of the present utility model.
Embodiment
Referring to Fig. 1, a kind of folder aluminum-based circuit board with heat sink material, comprise aluminium base 1, aluminium base 1 skin is provided with insulating barrier 2 and pad 3 successively, be connected with several heat radiation through holes 4 on the aluminium base 1, described insulating barrier 2 corresponding heat radiation through holes 4 positions are provided with radiating groove 5 inwardly, be welded with fin 6 in the described heat radiation through hole 4, fin 6 adopts copper radiating rib, the bottom land of radiating groove 5 is positioned at insulating barrier 2 centre positions, restriction for the bottom land position of radiating groove 5 can be set by concrete needs, to guarantee the effect of heat radiation.
After adopting above technical scheme: at aluminium base and insulating barrier place welding fin, provide extra heat sinking function, guaranteed degree of heat radiation in process of production.
Claims (3)
1. folder aluminum-based circuit board with heat sink material, comprise aluminium base (1), described aluminium base (1) skin is provided with insulating barrier (2) and pad (3) successively, it is characterized in that: be connected with several heat radiation through holes (4) on the described aluminium base (1), the corresponding heat radiation through hole of described insulating barrier (2) (4) position is provided with radiating groove (5) inwardly, is welded with fin (6) in the described heat radiation through hole (4).
2. a kind of folder aluminum-based circuit board with heat sink material according to claim 1 is characterized in that: described fin (6) employing copper radiating rib.
3. a kind of folder aluminum-based circuit board with heat sink material according to claim 1 and 2, it is characterized in that: the bottom land of described radiating groove (5) is positioned at insulating barrier (2) centre position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220605176 CN202889776U (en) | 2012-11-02 | 2012-11-02 | Mixed aluminum based printed circuit board with heat sink material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220605176 CN202889776U (en) | 2012-11-02 | 2012-11-02 | Mixed aluminum based printed circuit board with heat sink material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202889776U true CN202889776U (en) | 2013-04-17 |
Family
ID=48081157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220605176 Expired - Fee Related CN202889776U (en) | 2012-11-02 | 2012-11-02 | Mixed aluminum based printed circuit board with heat sink material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202889776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017073534A (en) * | 2015-10-07 | 2017-04-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board and manufacturing method of the same |
-
2012
- 2012-11-02 CN CN 201220605176 patent/CN202889776U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017073534A (en) * | 2015-10-07 | 2017-04-13 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board and manufacturing method of the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20161102 |