CN203386433U - LED display module and display screen of COB (chip on board) packaging technique - Google Patents
LED display module and display screen of COB (chip on board) packaging technique Download PDFInfo
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- CN203386433U CN203386433U CN201320403392.7U CN201320403392U CN203386433U CN 203386433 U CN203386433 U CN 203386433U CN 201320403392 U CN201320403392 U CN 201320403392U CN 203386433 U CN203386433 U CN 203386433U
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Abstract
The utility model discloses an LED display module of a COB packaging technique. The LED display module comprises a PCB (printed circuit board), wherein a plurality of concave type installation positions are arranged on the PCB in an array manner; the depth of the installation positions is 25%-50% of the thickness of the PCB; an LED chip is fixed on each installation position; a coating is arranged on the PCB and arranged on a lighting side of the PCB; and through holes formed in the same array manner are reserved in the coating layer according to the positions of the installation positions arranged in the array manner. With the adoption of the scheme, the COB technique is used for packaging the LED chips on the PCB, so that the effects such as good heat radiation and the like are provided, a light and high-resolution LED display screen can be manufactured, and high market practicability is provided.
Description
Technical field
The utility model relates to LED display, and in particular, a kind of LED of chip on board encapsulation (Chip On Board, COB) technology shows that module shows the display screen of module with adopting this LED.
Background technology
Existing LED display, often adopt surface mounting technology (Surface Mounted Technology, SMT) that components and parts are arranged on printed circuit board (Printed Circuit Board, PCB, circuit board); But, along with the development of technology, more and more higher for dot spacing and the heat radiation requirement of LED display, the SMT technology can't realize.
Therefore, there is defect in prior art, needs to improve.
The utility model content
The LED that technical problem to be solved in the utility model is to provide a kind of novel chip on board encapsulation technology shows module and LED display.
The technical solution of the utility model is as follows: a kind of LED of chip on board encapsulation technology shows module, and it comprises the PCB circuit board; Some concave types installation position that matrix is arranged is set on described PCB circuit board; 25% to 50% of the thickness that the degree of depth of described installation position is described PCB circuit board; Be fixedly installed a LED wafer on each described installation position; On described PCB circuit board, a coating is set, it is arranged on described PCB circuit board for luminous one side; Wherein, the installation bit position that described coating is arranged according to described matrix, be reserved with the through hole that same matrix is arranged.
Preferably, described LED shows that in module, described coating is the black material coating.
Preferably, described LED shows that in module, described coating is the sub-gloss varnish layer.
Preferably, described LED shows that in module, described coating surface arranges groove in length and breadth.
Preferably, described LED shows that, in module, described coating surface arranges the concave point that some matrixes are arranged.
Preferably, described LED shows that, in module, described coating surface arranges the salient point that some matrixes are arranged.
Preferably, in described LED demonstration module, described through hole is circular.
Preferably, described LED shows that in module, described through hole is square.
Preferably, in described LED demonstration module, described through hole is oval.
Another technical scheme of the present utility model is, a kind of LED display of chip on board encapsulation technology, and it comprises that some arbitrary above-mentioned LED show modules, each described LED shows that module matrix arranges.
Adopt such scheme, the utility model adopts the COB technology, and the LED wafer package, to pcb board, is had to the good texts of thermal diffusivity, can prepare frivolous, high-resolution LED display, has very strong market practicality.
The accompanying drawing explanation
The effect schematic diagram that Fig. 1 is an embodiment of the present utility model;
The schematic diagram that Fig. 2 is an embodiment of the present utility model.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
As shown in Figure 2, an embodiment of the present utility model is, a kind of LED of chip on board encapsulation technology shows module, and it comprises PCB circuit board 101; Some concave types installation position 103 that matrix is arranged is set on described PCB circuit board; 25% to 50% of the thickness that the degree of depth of described installation position is described PCB circuit board; Be fixedly installed a LED wafer (LED Chip, LED luminescent wafer) on each described installation position; One coating (not shown) is set on described PCB circuit board, and it is arranged on described PCB circuit board for luminous one side; And as shown in Figure 2, the installation bit position that described coating is arranged according to described matrix, be reserved with the through hole that same matrix is arranged.For example, described through hole is circular, square, and/or oval.
For example, as shown in Figure 1, the whole LED that forms shows module, comprises PCB circuit board 101 and top lamp point 102.Preferably, the spacing of concave type installation position 103 is 1 to 9 millimeter.For example, the spacing of concave type installation position 103 is 1.6 millimeters, that is, LED shows that the dot spacing of module is 1.6 millimeters.
Preferably, described coating is the black material coating.For example, described coating is the sub-gloss varnish layer.Preferably, described coating surface arranges groove in length and breadth; Perhaps, described coating surface arranges the concave point that some matrixes are arranged; And/or described coating surface arranges the salient point that some matrixes are arranged.Preferably, described concave point, salient point are spaced; Preferably, the degree of depth of described concave point is 0.01 to 0.1 millimeter, and the height of described salient point is 0.01 to 0.1 millimeter.Preferably, adopt paint to form described coating.
In conjunction with being applied to above-mentioned arbitrary embodiment, further embodiment of this invention is, a kind of LED display of chip on board encapsulation technology, and it comprises that some arbitrary above-mentioned LED show modules, each described LED shows that module matrix arranges.
For example, the LED display of above-mentioned employing COB technology, production method is as follows:
1. determine product specification and body structure.
2. determine display screen circuit diagram and frock layout design, formulate production technology.
3. the PCB circuit board making sheet of drawing a design, the shell on the back die sinking, tool fixture is drawn a design.
4. carry out SMT welding, connector welding, the detection of IC element after the pcb board cleaning.
5. the some glue of the luminescent wafer on display module or display board is fixed; Luminescent wafer comprises R, G, B, W, or R, G, B, or R, G, or B, G, or B, R, or R, or G, or B, or W.
6. the baking of heating of the luminescent wafer on display module or display board.
7. the line of the luminescent wafer on display module or display board welding; Detect.
8. on display module or display board, melanic epipedon is set.
Display module or display board injecting glue or the some glue.
10. display module or the display board baking of heating.
11. display module or display board detect.
12. the IC element on display module or display board be coated with heat conductive silica gel and with the metallic heat radiating plate splicing-locking.
13. display board energising in unit is aging, detects.
14. unit display board packing warehouse-in.
15. the document data, comprise display module or display board electrical schematic and pcb board engineering drawing, produce tool engineering drawing, production technology job instruction, product quality inspection standard, product material list.
Further, embodiment of the present utility model can also be, each technical characterictic of the various embodiments described above, and the LED mutually be combined to form shows module, and adopts these LED to show the LED display of modules.
It should be noted that, above-mentioned each technical characterictic continues combination mutually, forms the various embodiment that do not enumerate in the above, all is considered as the scope of the utility model instructions record; And, for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection domain of the utility model claims.
Claims (10)
1. the LED of a chip on board encapsulation technology shows module, it is characterized in that, comprises the PCB circuit board;
Some concave types installation position that matrix is arranged is set on described PCB circuit board;
25% to 50% of the thickness that the degree of depth of described installation position is described PCB circuit board;
Be fixedly installed a LED wafer on each described installation position;
On described PCB circuit board, a coating is set, it is arranged on described PCB circuit board for luminous one side; Wherein, the installation bit position that described coating is arranged according to described matrix, be reserved with the through hole that same matrix is arranged.
2. LED shows module according to claim 1, it is characterized in that, described coating is the black material coating.
3. LED shows module according to claim 2, it is characterized in that, described coating is the sub-gloss varnish layer.
4. LED shows module according to claim 2, it is characterized in that, described coating surface arranges groove in length and breadth.
5. LED shows module according to claim 2, it is characterized in that, described coating surface arranges the concave point that some matrixes are arranged.
6. LED shows module according to claim 5, it is characterized in that, described coating surface arranges the salient point that some matrixes are arranged.
7. LED shows module according to claim 1, it is characterized in that, described through hole is circular.
8. LED shows module according to claim 1, it is characterized in that, described through hole is square.
9. LED shows module according to claim 1, it is characterized in that, described through hole is oval.
10. the LED display of a chip on board encapsulation technology, is characterized in that, comprise some as arbitrary as claim 1 to 9 as described in LED show module, each described LED shows that module matrix arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320403392.7U CN203386433U (en) | 2013-07-09 | 2013-07-09 | LED display module and display screen of COB (chip on board) packaging technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320403392.7U CN203386433U (en) | 2013-07-09 | 2013-07-09 | LED display module and display screen of COB (chip on board) packaging technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386433U true CN203386433U (en) | 2014-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320403392.7U Expired - Fee Related CN203386433U (en) | 2013-07-09 | 2013-07-09 | LED display module and display screen of COB (chip on board) packaging technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386433U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106097915A (en) * | 2016-08-22 | 2016-11-09 | 安徽天众电子科技有限公司 | A kind of production technology of LED display |
| CN108346381A (en) * | 2018-04-04 | 2018-07-31 | 深圳市秀狐科技有限公司 | A kind of LED display and its packaging method |
-
2013
- 2013-07-09 CN CN201320403392.7U patent/CN203386433U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106097915A (en) * | 2016-08-22 | 2016-11-09 | 安徽天众电子科技有限公司 | A kind of production technology of LED display |
| CN108346381A (en) * | 2018-04-04 | 2018-07-31 | 深圳市秀狐科技有限公司 | A kind of LED display and its packaging method |
| WO2019192041A1 (en) * | 2018-04-04 | 2019-10-10 | 深圳市秀狐科技有限公司 | Led display screen and packaging method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YU DEHAI Free format text: FORMER OWNER: SHENZHEN HUAHAI CHENGXIN ELECTRONIC DISPLAY TECHNOLOGY CO., LTD. Effective date: 20140818 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 110041 SHENYANG, LIAONING PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140818 Address after: 110041, 1-5-2, 110-2 Dadong North Street, Dadong District, Liaoning, Shenyang Patentee after: Yu Dehai Address before: 518000 Guangdong City, Baoan District province big wave Street Office of the new bridge Industrial Park Hongfa Industrial Zone 1-2 Dong 1-4 floor Patentee before: Shenzhen Huahai Chengxin Electronic Display Technology Co., Ltd. |
|
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN HUAHAI CHENGXIN ELECTRONIC DISPLAY TECHNO Effective date: 20150107 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 110041 SHENYANG, LIAONING PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150107 Address after: 518000 Guangdong City, Baoan District province big wave Street Office of the new bridge Industrial Park Hongfa Industrial Zone 1-2 Dong 1-4 floor Patentee after: Shenzhen Huahai Chengxin Electronic Display Technology Co., Ltd. Address before: 110041, 1-5-2, 110-2 Dadong North Street, Dadong District, Liaoning, Shenyang Patentee before: Yu Dehai |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20160709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |