CN108346381A - A kind of LED display and its packaging method - Google Patents
A kind of LED display and its packaging method Download PDFInfo
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- CN108346381A CN108346381A CN201810297457.1A CN201810297457A CN108346381A CN 108346381 A CN108346381 A CN 108346381A CN 201810297457 A CN201810297457 A CN 201810297457A CN 108346381 A CN108346381 A CN 108346381A
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 238000004020 luminiscence type Methods 0.000 claims abstract description 58
- 238000009413 insulation Methods 0.000 claims abstract description 52
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000010146 3D printing Methods 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 7
- 230000004075 alteration Effects 0.000 claims description 6
- 230000003313 weakening effect Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 230000000007 visual effect Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 6
- 239000004831 Hot glue Substances 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004568 cement Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of LED display and its packaging methods, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, it is characterized in that, further include be covered in the circuit board surface and be filled in LED luminescence chips gap insulation glue-line and, between LED luminescence chips gap and be fixed at insulation film surface several bossy bodies, the upper surface of the LED luminescence chips is concordant with insulation glue-line, forms even curface；The color protrusion display of bossy body, visually first experience the color of bossy body, make the single-point color for becoming visual experience bossy body composition by the plane color of visual experience insulation glue-line originally, the color distortion of the insulation glue-line of single led display screen is weakened in during visually, solving integral color after LED display in the prior art is stitched together has significant difference, seam is visually apparent, the poor problem of display effect.
Description
Technical field
The present invention relates to display screen technology field more particularly to a kind of LED display and its packaging methods.
Background technology
LED display is just being sent out rapidly by due to widely attention the features such as its brightness is high, low in energy consumption, performance is stablized
Exhibition, and be increasingly being applied in daily life, for example, being set to Entertainment Plaza, commercial street, hospital, train
It stands, the electronic display in the places such as concert.
It is existing have in technology have a display screen, the full LED component of the same colour patch of the concealed LED of the integrated injection molding in the display screen
For piece on PCB bottom plates, LED component is integrally molded the integral structure to form colloid panel and shell package with PCB bottom plates by colloid,
The integral structure bottom surface is coated with the coating consistent with the color of PCB bottom plates and LED component, and the bottom of PCB bottom plates is equipped with
Remaining module of display screen.
LED display when in use, needs polylith LED display to be spliced into one piece big of display wall, the LED display
Every piece of screen although aberration difference is little, but still has aberration compared with a kind of standard screen, and eyes look over, the entire face for showing wall
Color directly reacts in vision, since color is all single whole presentation when multiple LED displays are combined, leads to color
Difference is particularly evident, and polylith LED display is stitched together can see that whole display wall color has by visual contrast
It is apparent different；Since the aberration problem of monolithic display screen causes the seam in stitching portion that can obviously observe, in display
There is apparent segmented sense, seam is visually apparent, and display effect is poor.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of LED display and its packaging method,
Aim to solve the problem that integral color has significant difference after LED display in the prior art is stitched together, seam is visually apparent, display
The poor problem of effect.
Technical scheme is as follows：
A kind of LED display, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, which is characterized in that also
Including be covered in the circuit board surface and be filled in LED luminescence chips gap insulation glue-line and, be located at described
Between LED luminescence chips gap and be fixed at insulation film surface several bossy bodies, the upper surface of LED luminescence chips with
Insulating, glue-line upper surface is concordant, and bossy body upper level is higher than the upper level of the LED luminescence chips, several bossy bodies
The interruption color of composition can protrude the aberration for showing and weakening the insulation glue-line.
Further, the bossy body is regularly arranged.
Further, the bossy body cross section is round, triangle or polygon, and the bossy body is in transversely with longitudinal
Lattice arrangement.
Further, 2 ~ 5 rows, axial clearance setting 2 ~ 5 is arranged in the lateral clearance for the LED luminescence chips that are connected in the bossy body
Row.
Further, the bossy body is linear, zigzag or waveform, the bossy body are arranged side by side in horizontal or vertical direction
Row.
Further, the bossy body color is as insulation glue-line color.
A kind of packaging method of LED display, which is characterized in that including：
Several LED luminescence chips are mounted on the board surface according to the needs of design；
The circuit board for being pasted with LED luminescence chips is put into die cavity, it is low to the circuit board surface low temperature for being pasted with LED luminescence chips
Pressure injection insulation colloid, until it is concordant with LED luminescence chips upper surface, form the insulation glue-line of surfacing；
It insulate after glue-line cooling, several bossy bodies of gap bonding on insulation film surface, the bossy body is in gap arrangement.
Further, the bossy body is molded using 3D printing.
Compared with prior art, a kind of LED display provided by the invention and its packaging method, including circuit board and attachment
The circuit board surface LED luminescence chips, be covered in the circuit board surface and be filled in LED luminescence chips gap
Insulation glue-line and, between LED luminescence chips gap and be fixed at insulation film surface several rules
The bossy body of arrangement.LED display provided by the invention is arranged regularly arranged bossy body on insulation glue-line, can make protrusion
The color protrusion display of body, visually first experiences the color of bossy body, makes originally through the plane of visual experience insulation glue-line
Color becomes the single-point color of visual experience bossy body composition, visually weakens the insulation glue-line of single led display screen in the process
Color distortion, even if the color of the insulation glue-line of single led display screen has differences, but the color of bossy body can protrude it is aobvious
Show, essentially identical color can be showed by organizing integral display wall, and the gap of stitching portion is between bossy body and bossy body, mesh
Depending on it is seen that dot matrix bossy body composition color, and gap is made to be not easy to be discovered by eyes, it is aobvious to efficiently solve existing LED
Integral color has significant difference after display screen is stitched together, and seam is visually apparent, the poor problem of display effect.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of LED display embodiment of the present invention；
Fig. 2 is the first scheme partial cross-sectional view of the embodiment of the present invention one；
Fig. 3 is the partial cross-sectional view of the alternative plan of the embodiment of the present invention one；
Fig. 4 is the partial cross-sectional view of the third program of the embodiment of the present invention one；
Fig. 5 is the first scheme partial front elevation view of LED display second embodiment of the present invention；
Fig. 6 is the partial front elevation view of the alternative plan of second embodiment of the invention；
Fig. 7 is the partial front elevation view of the third program of second embodiment of the invention；
Fig. 8 is the flow chart of black glue LED display packaging method preferred embodiment of the present invention.
In figure：10, circuit board；20, LED luminescence chips；30, insulate glue-line；40, bossy body.
Specific implementation mode
The present invention provides a kind of LED display and its packaging methods, to make the purpose of the present invention, technical solution and effect
It is clearer, clear, referring to the drawings and give an actual example that the present invention is described in more detail.It should be appreciated that described herein
Specific embodiment be only used to explain the present invention, be not intended to limit the present invention.
Embodiment one
Fig. 1 is a kind of structural schematic diagram of LED display embodiment of the present invention；Fig. 2 is LED display embodiment one of the present invention
First scheme partial cross-sectional view；Fig. 3 is the partial cross-sectional view of the alternative plan of the embodiment of the present invention one；Fig. 4 is this
The partial cross-sectional view of the third program of the embodiment one of invention.
As shown in Figure 1 and Figure 2, the present invention provides a kind of LED displays, including circuit board 10,20 and of LED luminescence chips
Insulate glue-line 30；The LED luminescence chips 20 are mounted on the surface of the circuit board 10, can according to the actual needs, if
Set the LED luminescence chips size and its ranks spacing of use.
Insulation glue-line 30 of the present invention is covered in 10 surface of circuit board for being pasted with LED luminescence chips 20, the LED hairs
20 gap filling of optical chip has the insulating cement layer 30, and the upper surface of LED luminescence chips 20 is concordant with insulation glue-line 30, is formed
Even curface is shone that is, the insulation glue-line 30 only covers the gap between the LED luminescence chips 20 with increasing LED
The luminous visual angle of chip 20.
The center spacing of the adjacent LED luminescence chips 20 can accomplish, compared with big-pitch screen, can also accomplish smaller
Clearance display screen, most preferably, adjacent 20 center spacing of LED luminescence chips are 1.0-8.0mm.That is, the LED of the present invention is shown
The center spacing range for shielding most suitably used LED luminescence chips 20 is 1.0-8.0mm.That is, the present invention is using insulation glue-line
LED luminescence chips 20 can reach dot spacing, pixel is very high, display picture be more clear.
In a preferred embodiment of the present invention, insulation glue-line 30 is preferably hot melt adhesive layer, by way of low-temp low-pressure injection molding
It is formed on 10 surface of circuit board for being already installed with LED luminescence chips 20, that is, mounting 20 gusts of LED luminescence chips
On 10 surface of circuit board of row, under conditions of low-temp low-pressure, using low-temp low-pressure Shooting Technique between LED luminescence chips 20
Gap in be molded hot melt adhesive, be allowed to form hot melt adhesive layer, the color of hot melt adhesive can select arbitrary face according to use environment
Color.The hot melt adhesive layer forms even curface with all 20 upper surfaces of LED luminescence chips, and the purpose is to both protect LED
Luminescence chip 20 is allowed to be not easy to damage by external force, and the light of LED luminescence chips 20 can be made normally to project, also
It is to say, LED luminescence chips 20 constitute the pixel on hot melt adhesive layer surface.
As shown in Figure 1 and Figure 2, bossy body 40 is gone out by 3D printing on the surface of insulation glue-line 30, bossy body 40 can also
It is adhesively attached on insulation glue-line 30 by silk-screen mode, the color of bossy body 40 is as the color of insulation glue-line 30, protrusion
Body 40 can be arranged arbitrarily on insulation glue-line 30, can also be regularly arranged, and bossy body 40 can make visually first to experience convex
The color for going out body 40 makes to become eyes impression by bossy body 40 by the continuous level color of visual experience insulation glue-line 30 originally
The interruption combined colors rearranged, during visual process, the interruption combined colors that several bossy bodies 40 form weaken insulating cement
The aberration of layer 30；The present embodiment preference rule arranges, and in processing, programming or making sheet are more convenient in this way, 40 the present embodiment of bossy body
In preferred plan be bossy body 30 circular in cross-section.
It is illustrated in figure 3 the alternative plan of the present embodiment, the cross section of bossy body 30 is triangle, is illustrated in figure 4 this
The cross section of the third program of embodiment, bossy body 20 is polygon, and 40 cross section of bossy body can also be other shapes；Protrusion
Body 40 is transversely paved with longitudinal direction between LED luminescence chips 20, is arranged in dot matrix, is connected between the transverse direction of LED luminescence chips
Gap generally 2 ~ 5 rows of setting, axial clearance generally be arrangeds 2 ~ 5 row, to improve production efficiency, facilitate production, preferred cross in embodiment
To 2 rows are arranged between gap, 2 row are set between axial clearance；The color of bossy body 40 can be made to protrude display in this way, visually first experienced
To the color of bossy body 40, make to become eyes by the insulate continuous level color of glue-line 30 of visual experience originally and experience protrusion
The single-point color that body 40 forms visually weakens the color distortion of the insulation glue-line 30 of single led display screen, even if single in the process
The color of the insulation glue-line 30 of a LED display has differences, but the color of bossy body 40 can protrude display, organize integral
LED show wall can show essentially identical color, the gap of stitching portion between the gap of bossy body 40, visually it is seen that
The color that dot matrix bossy body 40 forms, and stitching portion gap is made to be not easy to be discovered by eyes.
The thickness of bossy body 40 can be controlled by the number of 3D printing or silk-screen, general thickness is arranged in 0.1-2.0mm
Between, the size of thickness determines the shade of visually entire display wall.
Embodiment two
Fig. 5 is the first scheme partial front elevation view of LED display embodiment two of the present invention；Fig. 6 is the of the embodiment of the present invention two
The partial front elevation view of two schemes；Fig. 7 is the partial front elevation view of the third program of the embodiment of the present invention two.
As shown in figure 5, embodiment two from embodiment one the difference is that the structure of bossy body 40 is different, the present embodiment
The appearance profile of middle bossy body 40 is bar shaped, and bossy body 40 is adhesively attached to insulation glue-line 30 by 3D printing or silk-screen mode
Surface, bossy body 40 is arranged side by side in horizontal or vertical direction to be paved between LED luminescence chips 20, and preferably first in the present embodiment
The bossy body 40 of scheme is linear, and linear bossy body 40 is high in machining efficiency, facilitates production, the present embodiment as shown in FIG. 6
Alternative plan, 40 appearance profile of bossy body are zigzag, the present embodiment third program as shown in Figure 7,40 shape wheel of bossy body
Exterior feature is waveform, and 40 appearance profile of bossy body can also be other figures, can be determined according to client's needs of production.
The color of bossy body 40 can be made to protrude display in this way, visually first experience the color of bossy body 40, made originally logical
The continuous level color for crossing visual experience insulation glue-line 30 becomes the linear combination color that eyes impression is made of bossy body 40, mesh
Color distortion depending on the insulation glue-line 30 for weakening single led display screen in the process, even if the insulation glue-line of single led display screen
30 color has differences, but the color of bossy body 40 can protrude display, and the integral LED of single led display screen group shows wall
Essentially identical color can be showed, the gap of stitching portion can weaken under the color that bossy body 40 forms, and gap is made to be not easy
Discovered by eyes；Since bossy body 40 is linearly to highlight, highlights effect compared to the dot matrix of bossy body 40 and want poor.
As shown in figure 8, the present invention also provides a kind of LED display packaging method, include the following steps：
S100, several LED luminescence chips 20 are needed to be mounted on 10 surface of circuit board according to design；The circuit board 10
The center spacing of the adjacent LED luminescence chip 20 on surface can accomplish big-pitch screen, can also accomplish that dot spacing is shown
Screen, most preferably, adjacent 20 center spacing of LED luminescence chips are 1.0-8.0mm, i.e. LED display of the invention is most suitably used
LED luminescence chips 20 center spacing range be 1.0-8.0mm, pixel is very high, display picture be more clear.
S200, the circuit board 10 for being pasted with LED luminescence chips 20 is put into die cavity, to being pasted with LED luminescence chips 20
10 surface low-temperature low-pressure injection molding of circuit board insulation colloid, until it is concordant with 20 upper surface of LED luminescence chips, form surfacing
Insulate glue-line 30, and insulation glue-line 30 can use random color according to the requirement of client；The colloid that insulate is preferably hot melt adhesive, low temperature
The temperature of low-pressure injection molding hot melt adhesive is 180-240 DEG C, pressure 1.5-40Bar.The center spacing of adjacent LED luminescence chip 20 compared with
Hour, it is 1.0-8.0mm that low-temp low-pressure, which is molded range most suitably used when insulation colloid,.Mold used in the present invention is special
Large mold, after the circuit board 10 for being pasted with LED luminescence chips 20 is put into die cavity, hot melt adhesive is led by 9 glue-feeders
Enter, until hot melt adhesive is full of the gap of LED luminescence chips 20, the glue-feeder diameter is preferably 1.7mm.
After S300, insulation glue-line 30 cool down, several bossy bodies 40 of gap bonding on 30 surface of insulation glue-line, bossy body 40
In gap arrangement；Bossy body 40 can be single bossy body 40 or bossy body 40, and single bossy body 40 can be beaten by silk-screen or 3D
Print technology is adhesively attached to the surface of insulation glue-line 30, and formation rule dot matrix is simultaneously paved with insulation glue-line 30, and bossy body 40 can pass through
Silk-screen or 3D printing technique are adhesively attached to the surface of insulation glue-line 30, between bossy body 40 simultaneously in laterally or longitudinally gap arrangement
It is paved with insulation glue-line 30, preferred single bossy body 40 in embodiment；The feature that silk-screen mode has shaping speed fast, efficient,
But 3D printing method keeps 40 size of bossy body more accurate, and shape more preferably controls, and any molding structure can be realized, product quality
It is higher than silk-screen mode, preferred 3D printing in the present embodiment.
LED display shade is the height decision that 30 surface of insulation glue-line is protruded according to bossy body 40, also referred to as convex
Going out the thickness of body 40, general thickness is arranged between 0.1-2.0mm, and when bossy body 40 is thicker, the color of LED display is deeper,
Requirement in production process according to client to LED display shade can repeat step S300 for increasing bossy body 40
Thickness, meet the needs of client is to shade.
It is further comprising the steps of after step S200, after insulation glue-line 30 cools down, mounting circuit boards bottom case.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (8)
1. a kind of LED display, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, which is characterized in that
Further include be covered in the circuit board surface and be filled in LED luminescence chips gap insulation glue-line and, be located at described
Between LED luminescence chips gap and be fixed at insulation film surface several bossy bodies, the upper surface of LED luminescence chips with
Insulating, glue-line upper surface is concordant, and bossy body upper level is higher than the upper level of the LED luminescence chips, described several convex
The aberration for showing and weakening the insulation glue-line can be protruded by going out the interruption color of body composition.
2. LED display according to claim 1, which is characterized in that the bossy body is regularly arranged.
3. LED display according to claim 2, which is characterized in that the bossy body cross section be round, triangle or
Polygon, the bossy body is transversely with longitudinal in lattice arrangement.
4. LED display according to claim 3, which is characterized in that the bossy body is in the cross of LED luminescence chips that is connected
To 2 ~ 5 row of gap setting, 2 ~ 5 row of axial clearance setting.
5. LED display according to claim 2, which is characterized in that the bossy body is linear, zigzag or wave
Shape, the bossy body are arranged side by side in horizontal or vertical direction.
6. LED display according to claim 1, which is characterized in that the bossy body color and insulation glue-line color one
Sample.
7. a kind of packaging method of LED display, which is characterized in that including：
On the board surface by the attachment of several LED luminescence chips；
The circuit board for being pasted with LED luminescence chips is put into die cavity, it is low to the circuit board surface low temperature for being pasted with LED luminescence chips
Pressure injection insulation colloid, until it is concordant with LED luminescence chips upper surface, form the insulation glue-line of surfacing；
It insulate after glue-line cooling, several bossy bodies is bonded on insulation film surface, the bossy body is in gap arrangement.
8. the packaging method of LED display according to claim 7, which is characterized in that the bossy body uses 3D printing
Molding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810297457.1A CN108346381A (en) | 2018-04-04 | 2018-04-04 | A kind of LED display and its packaging method |
| PCT/CN2018/084673 WO2019192041A1 (en) | 2018-04-04 | 2018-04-26 | Led display screen and packaging method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810297457.1A CN108346381A (en) | 2018-04-04 | 2018-04-04 | A kind of LED display and its packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108346381A true CN108346381A (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810297457.1A Pending CN108346381A (en) | 2018-04-04 | 2018-04-04 | A kind of LED display and its packaging method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108346381A (en) |
| WO (1) | WO2019192041A1 (en) |
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| CN110349514A (en) * | 2019-08-09 | 2019-10-18 | 惠州市瀚举电子科技有限公司 | A kind of anti-LED display that collides with of band frame |
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| CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
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Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63279279A (en) * | 1987-05-12 | 1988-11-16 | Ricoh Co Ltd | Image forming device |
| JP2002372613A (en) * | 2001-06-13 | 2002-12-26 | Seiko Epson Corp | Method for manufacturing color filter and method for manufacturing liquid crystal display device |
| CN2593297Y (en) * | 2002-11-19 | 2003-12-17 | 惠州市德赛光电科技有限公司 | Antireflection LED display screen |
| CN2682451Y (en) * | 2004-02-27 | 2005-03-02 | 雷潇雨 | Seamless spliced large screen display device |
| CN2785068Y (en) * | 2005-04-11 | 2006-05-31 | 北京巴可利亚德电子科技有限公司 | LED unit module |
| JP2008083450A (en) * | 2006-09-28 | 2008-04-10 | Brother Ind Ltd | Electrophoresis display panel |
| CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
| CN203386433U (en) * | 2013-07-09 | 2014-01-08 | 深圳市华海诚信电子显示技术有限公司 | LED display module and display screen of COB (chip on board) packaging technique |
| JP2014235212A (en) * | 2013-05-31 | 2014-12-15 | 三菱電機株式会社 | Graphic display device |
| CN204066646U (en) * | 2014-08-25 | 2014-12-31 | 深圳市创显光电有限公司 | A kind of display screen face shield interlocks splicing construction |
| CN204117528U (en) * | 2014-07-10 | 2015-01-21 | 冠捷显示科技（中国）有限公司 | A kind of jointing display screens |
| WO2016112873A1 (en) * | 2015-01-14 | 2016-07-21 | 丁炜慷 | Fully zero-mullion video wall system providing full pixel coverage when joined |
| CN105869537A (en) * | 2016-06-21 | 2016-08-17 | 深圳市华夏光彩股份有限公司 | Transparent face mask and LED (light-emitting diode) display module employing transparent face mask |
| CN205910969U (en) * | 2016-08-23 | 2017-01-25 | 湖南明和光电设备有限公司 | Can reduce LED display screen face guard of concatenation gap luminance difference |
| CN206224924U (en) * | 2016-10-17 | 2017-06-06 | 杭州美卡乐光电有限公司 | Display screen cover |
| CN206370256U (en) * | 2016-11-24 | 2017-08-01 | 安徽卓上智能科技有限公司 | A kind of LED mosaic display screens |
| JP2017187710A (en) * | 2016-04-08 | 2017-10-12 | 三菱電機株式会社 | Display device |
| CN107657904A (en) * | 2017-11-28 | 2018-02-02 | 深圳市秀狐科技有限公司 | A kind of black glue LED display and its processing method |
| CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
| CN208014300U (en) * | 2018-04-04 | 2018-10-26 | 深圳市秀狐科技有限公司 | A kind of LED display |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201345201Y (en) * | 2009-01-19 | 2009-11-11 | 刘振亮 | Novel outdoor LED display module and display screen unit box body |
| US10088863B2 (en) * | 2011-09-30 | 2018-10-02 | Apple Inc. | Electronic devices with cover layers mounted to displays |
| CN103544887B (en) * | 2013-09-29 | 2016-03-02 | 长春希达电子技术有限公司 | The LED of surfacing, solid colour shows module splicing display unit |
-
2018
- 2018-04-04 CN CN201810297457.1A patent/CN108346381A/en active Pending
- 2018-04-26 WO PCT/CN2018/084673 patent/WO2019192041A1/en active Application Filing
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63279279A (en) * | 1987-05-12 | 1988-11-16 | Ricoh Co Ltd | Image forming device |
| JP2002372613A (en) * | 2001-06-13 | 2002-12-26 | Seiko Epson Corp | Method for manufacturing color filter and method for manufacturing liquid crystal display device |
| CN2593297Y (en) * | 2002-11-19 | 2003-12-17 | 惠州市德赛光电科技有限公司 | Antireflection LED display screen |
| CN2682451Y (en) * | 2004-02-27 | 2005-03-02 | 雷潇雨 | Seamless spliced large screen display device |
| CN2785068Y (en) * | 2005-04-11 | 2006-05-31 | 北京巴可利亚德电子科技有限公司 | LED unit module |
| JP2008083450A (en) * | 2006-09-28 | 2008-04-10 | Brother Ind Ltd | Electrophoresis display panel |
| CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
| JP2014235212A (en) * | 2013-05-31 | 2014-12-15 | 三菱電機株式会社 | Graphic display device |
| CN203386433U (en) * | 2013-07-09 | 2014-01-08 | 深圳市华海诚信电子显示技术有限公司 | LED display module and display screen of COB (chip on board) packaging technique |
| CN204117528U (en) * | 2014-07-10 | 2015-01-21 | 冠捷显示科技（中国）有限公司 | A kind of jointing display screens |
| CN204066646U (en) * | 2014-08-25 | 2014-12-31 | 深圳市创显光电有限公司 | A kind of display screen face shield interlocks splicing construction |
| WO2016112873A1 (en) * | 2015-01-14 | 2016-07-21 | 丁炜慷 | Fully zero-mullion video wall system providing full pixel coverage when joined |
| JP2017187710A (en) * | 2016-04-08 | 2017-10-12 | 三菱電機株式会社 | Display device |
| CN105869537A (en) * | 2016-06-21 | 2016-08-17 | 深圳市华夏光彩股份有限公司 | Transparent face mask and LED (light-emitting diode) display module employing transparent face mask |
| CN205910969U (en) * | 2016-08-23 | 2017-01-25 | 湖南明和光电设备有限公司 | Can reduce LED display screen face guard of concatenation gap luminance difference |
| CN206224924U (en) * | 2016-10-17 | 2017-06-06 | 杭州美卡乐光电有限公司 | Display screen cover |
| CN206370256U (en) * | 2016-11-24 | 2017-08-01 | 安徽卓上智能科技有限公司 | A kind of LED mosaic display screens |
| CN107657904A (en) * | 2017-11-28 | 2018-02-02 | 深圳市秀狐科技有限公司 | A kind of black glue LED display and its processing method |
| CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
| CN208014300U (en) * | 2018-04-04 | 2018-10-26 | 深圳市秀狐科技有限公司 | A kind of LED display |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020114227A1 (en) * | 2018-12-06 | 2020-06-11 | 深圳光峰科技股份有限公司 | Screen splicing structure and formation method therefor |
| US20220017786A1 (en) * | 2018-12-06 | 2022-01-20 | Appotronics Corporation Limited | Screen splicing structure and method for forming screen splicing structure |
| US11905442B2 (en) | 2018-12-06 | 2024-02-20 | Appotronics Corporation Limited | Screen splicing structure and method for forming screen splicing structure |
| CN109616026A (en) * | 2019-01-30 | 2019-04-12 | 华域视觉科技(上海)有限公司 | Improve the method and LED display of LED static state screen display effect |
| CN110349514A (en) * | 2019-08-09 | 2019-10-18 | 惠州市瀚举电子科技有限公司 | A kind of anti-LED display that collides with of band frame |
| CN110349514B (en) * | 2019-08-09 | 2024-05-03 | 深圳市秀狐科技有限公司 | LED display screen with frame and collision prevention function |
| CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
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