WO2010143829A3 - A led array board - Google Patents

A led array board Download PDF

Info

Publication number
WO2010143829A3
WO2010143829A3 PCT/KR2010/003338 KR2010003338W WO2010143829A3 WO 2010143829 A3 WO2010143829 A3 WO 2010143829A3 KR 2010003338 W KR2010003338 W KR 2010003338W WO 2010143829 A3 WO2010143829 A3 WO 2010143829A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
led array
board
array board
alumina
Prior art date
Application number
PCT/KR2010/003338
Other languages
French (fr)
Other versions
WO2010143829A2 (en
Inventor
Soon Yeong Heo
Hyun Mi Lee
Seung Jun Han
Min Suk Kang
Original Assignee
Exax Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exax Inc. filed Critical Exax Inc.
Publication of WO2010143829A2 publication Critical patent/WO2010143829A2/en
Publication of WO2010143829A3 publication Critical patent/WO2010143829A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Abstract

The present invention directed to a LED array board provides a LED array board comprising an aluminum base layer, an alumina insulating layer formed by anodizing monolithically on the aluminum base layer and a layer of electric circuit printed directly on the insulating layer with paste including conductive particles and heat-resistant binder. The present invention provides a LED array board with efficient structure for heat radiation by forming an insulating layer monolithically on the base layer, which can be as a densely arrayed board for high brightness. Forming electrode circuit by direct printing with conductive paste comprising conductive particles and heat resistant binder, integrated with the structure of board mentioned above, simplifies the manufacturing process, shortens cost and time for manufacture, and minimizes waste, while the binder of the paste increases the insulation of the alumina layer and adhesion force on the alumina layer.
PCT/KR2010/003338 2009-06-08 2010-05-26 A led array board WO2010143829A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0050321 2009-06-08
KR20090050321 2009-06-08

Publications (2)

Publication Number Publication Date
WO2010143829A2 WO2010143829A2 (en) 2010-12-16
WO2010143829A3 true WO2010143829A3 (en) 2011-03-10

Family

ID=43309326

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003338 WO2010143829A2 (en) 2009-06-08 2010-05-26 A led array board

Country Status (3)

Country Link
KR (2) KR101027422B1 (en)
TW (1) TW201117683A (en)
WO (1) WO2010143829A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101242218B1 (en) * 2011-01-07 2013-03-11 에이텍 테크놀로지 코포레이션 Lighting device and method for forming the same
US9046250B2 (en) * 2011-03-03 2015-06-02 Koninklijke Philips N.V. Circuit board assembly that includes plural LEDs electrically connected to underlying pads
AT12741U1 (en) * 2011-03-10 2012-10-15 Forster Verkehrs Und Werbetechnik Gmbh ARRANGEMENT WITH ELECTRICAL / ELECTRONIC COMPONENTS
KR20150074421A (en) 2013-12-24 2015-07-02 엘지이노텍 주식회사 printed circuit board AND LUMINOUS DEVICE
CN106887497A (en) * 2015-12-15 2017-06-23 易美芯光（北京）科技有限公司 A kind of low thermal resistance LED light source
KR101741068B1 (en) 2017-01-18 2017-05-29 주식회사 웰파인 Method manufacturing of mask for facial therapy
KR102359700B1 (en) 2020-05-29 2022-02-08 홍준표 LED module using PCB pattern directly for heat sink

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910015206A (en) * 1990-01-06 1991-08-31 장정훈 Manufacturing Method of Printed Circuit Board
KR940003435A (en) * 1992-07-30 1994-02-21 이장범 Manufacturing method of aluminum circuit board and circuit board
KR20050054813A (en) * 2003-12-05 2005-06-10 인터네셔널 리지스티브 컴퍼니 오브 텍사스, 엘.피. Light emitting assembly with heat dissipating support
KR20070070183A (en) * 2004-10-25 2007-07-03 크리 인코포레이티드 Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
JP2008091459A (en) * 2006-09-29 2008-04-17 Rohm Co Ltd Led illumination apparatus and manufacturing method thereof
KR20090030192A (en) * 2007-09-19 2009-03-24 피닉스 프리시젼 테크날로지 코포레이션 Packaging substrate structure and method for manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070039006A (en) * 2007-03-22 2007-04-11 백종수 Aluminium based insulated metal substrate for metal pcb
JP5093840B2 (en) * 2007-05-14 2012-12-12 株式会社住友金属エレクトロデバイス Multilayer wiring board for mounting light emitting device and method for manufacturing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910015206A (en) * 1990-01-06 1991-08-31 장정훈 Manufacturing Method of Printed Circuit Board
KR940003435A (en) * 1992-07-30 1994-02-21 이장범 Manufacturing method of aluminum circuit board and circuit board
KR20050054813A (en) * 2003-12-05 2005-06-10 인터네셔널 리지스티브 컴퍼니 오브 텍사스, 엘.피. Light emitting assembly with heat dissipating support
KR20070070183A (en) * 2004-10-25 2007-07-03 크리 인코포레이티드 Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
JP2008091459A (en) * 2006-09-29 2008-04-17 Rohm Co Ltd Led illumination apparatus and manufacturing method thereof
KR20090030192A (en) * 2007-09-19 2009-03-24 피닉스 프리시젼 테크날로지 코포레이션 Packaging substrate structure and method for manufacturing the same

Also Published As

Publication number Publication date
KR20100131918A (en) 2010-12-16
KR101587004B1 (en) 2016-01-22
KR20110025801A (en) 2011-03-11
TW201117683A (en) 2011-05-16
WO2010143829A2 (en) 2010-12-16
KR101027422B1 (en) 2011-04-11

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