KR910015206A - Manufacturing Method of Printed Circuit Board - Google Patents

Manufacturing Method of Printed Circuit Board Download PDF

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Publication number
KR910015206A
KR910015206A KR1019900000111A KR900000111A KR910015206A KR 910015206 A KR910015206 A KR 910015206A KR 1019900000111 A KR1019900000111 A KR 1019900000111A KR 900000111 A KR900000111 A KR 900000111A KR 910015206 A KR910015206 A KR 910015206A
Authority
KR
South Korea
Prior art keywords
adhesive
manufacturing
circuit board
printed circuit
board according
Prior art date
Application number
KR1019900000111A
Other languages
Korean (ko)
Other versions
KR920006017B1 (en
Inventor
박수연
Original Assignee
장정훈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 장정훈 filed Critical 장정훈
Priority to KR1019900000111A priority Critical patent/KR920006017B1/en
Publication of KR910015206A publication Critical patent/KR910015206A/en
Application granted granted Critical
Publication of KR920006017B1 publication Critical patent/KR920006017B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음No content

Description

인쇄회로 기판의 제조방법Manufacturing Method of Printed Circuit Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 의해 제조된 인쇄회로 기판의 단층구조를 나타낸 단면도, 제2도는 본 발명의 접착제 도포 확산방법을 단계적으로 설명한 단면도로서, (가)는 알루미나표면에 접착제를 실크스크린 인쇄한 상태의 확대도이고, (나)는(가)를 가열하여 접착제를 균일하게 확산시킨 상태를 나타낸것이다. 제3도는 본 발명의 접착제가 도포된 알루미늄판과 동박과의 접착시에 바람직하게 조절되는 온도와 시간을 나타낸 그래프.1 is a cross-sectional view showing a single layer structure of a printed circuit board manufactured by the present invention, Figure 2 is a cross-sectional view illustrating the step of spreading the adhesive coating of the present invention step by step, (a) silk-screen printing the adhesive on the surface of the alumina (B) shows a state in which (a) is heated to uniformly diffuse the adhesive. 3 is a graph showing the temperature and time which is preferably adjusted at the time of bonding the copper plate and the aluminum plate coated with the adhesive of the present invention.

Claims (4)

알루미늄의 표면에 산화피막을 형성시키고 이에 변성페놀과 NBR(또는 SBR)을 중합시켜 제조한 접착제를 도포한다음 동박을 접착함을 특징으로 한 인쇄회로 기판의 제조방법.A method of manufacturing a printed circuit board comprising forming an oxide film on the surface of aluminum and applying an adhesive prepared by polymerizing modified phenol with NBR (or SBR). 제1항에 있어서, 접착제의 도포는 실크인쇄방법으로 실시한뒤 도포면을 가열에 의해 균등 확산시킴과 동시에 접착제에 함유된 휘발물질을 제거함을 특징으로 한 인쇄회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 1, wherein the adhesive is applied by a silk printing method, and then the coating surface is uniformly diffused by heating, and at the same time, volatile substances contained in the adhesive are removed. 제1항에 있어서, 알루미늄판과 동박의 접착면에 접착제를 도포한 음 반경화상태로 저온 보관하여 사용하되 사용시 50℃정도로 예열한 후 핫프레스로 압착시켜서 접착함을 특징으로 한 인쇄회로 기판의 제조방법.The method of claim 1, wherein the adhesive surface of the aluminum plate and the copper foil is used in a cold semi-cured state in which the adhesive is applied, and then stored at a low temperature. Manufacturing method. 제1항에 있어서, 기 접착제에 알루미나 또는 질환규소등을 혼합함을 특징으로 한 인쇄회로 기판의 제조방법.The method of manufacturing a printed circuit board according to claim 1, wherein alumina or diseased silicon is mixed with the base adhesive. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900000111A 1990-01-06 1990-01-06 Manufacturing process for printed circuit board KR920006017B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900000111A KR920006017B1 (en) 1990-01-06 1990-01-06 Manufacturing process for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900000111A KR920006017B1 (en) 1990-01-06 1990-01-06 Manufacturing process for printed circuit board

Publications (2)

Publication Number Publication Date
KR910015206A true KR910015206A (en) 1991-08-31
KR920006017B1 KR920006017B1 (en) 1992-07-25

Family

ID=19295162

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900000111A KR920006017B1 (en) 1990-01-06 1990-01-06 Manufacturing process for printed circuit board

Country Status (1)

Country Link
KR (1) KR920006017B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020068013A (en) * 2002-07-31 2002-08-24 정민규 The working method depending on adhering Copper foil on the SUS plate
WO2010143829A2 (en) * 2009-06-08 2010-12-16 Exax Inc. A led array board
KR101480677B1 (en) * 2013-11-20 2015-01-09 강민정 Method for manufacturing electronic circuit device using hybrid heavy copper printed circuit board and the electronic circuit device manufacuted by using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100934476B1 (en) * 2009-03-30 2009-12-30 코아셈(주) Circuit board and method of manufacturing the same
KR101113810B1 (en) * 2009-11-27 2012-02-29 주식회사 유앤비오피씨 Metal core pcb and method for manufacturing the same
KR101154373B1 (en) * 2010-07-16 2012-06-15 주식회사 유앤비오피씨 Metal core substrate and method for manufacturing the same
KR101153701B1 (en) * 2010-10-27 2012-06-11 정제승 The manufacturing method of the metal printed circthe manufacturing method of the metal printed circuit board uit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020068013A (en) * 2002-07-31 2002-08-24 정민규 The working method depending on adhering Copper foil on the SUS plate
WO2010143829A2 (en) * 2009-06-08 2010-12-16 Exax Inc. A led array board
WO2010143829A3 (en) * 2009-06-08 2011-03-10 Exax Inc. A led array board
KR101480677B1 (en) * 2013-11-20 2015-01-09 강민정 Method for manufacturing electronic circuit device using hybrid heavy copper printed circuit board and the electronic circuit device manufacuted by using the same

Also Published As

Publication number Publication date
KR920006017B1 (en) 1992-07-25

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