CN201089053Y - Auxiliary equipment for ball grid array packaged components welding - Google Patents
Auxiliary equipment for ball grid array packaged components welding Download PDFInfo
- Publication number
- CN201089053Y CN201089053Y CNU2007200547199U CN200720054719U CN201089053Y CN 201089053 Y CN201089053 Y CN 201089053Y CN U2007200547199 U CNU2007200547199 U CN U2007200547199U CN 200720054719 U CN200720054719 U CN 200720054719U CN 201089053 Y CN201089053 Y CN 201089053Y
- Authority
- CN
- China
- Prior art keywords
- welding
- package assembly
- bga package
- auxiliary equipment
- bga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses auxiliary equipment used for welding ball grid array packaging components which comprises: a body part, wherein, the middle part of the body part is provided with a plurality of through holes which are consistent with a tin-ball array of the welding surface of a ball grid array packaging component; a closing part which is pressed against one side of the body part and forms a receiving cavity for fixing and receiving the ball grid array packaging component with one side of the body part. The utility model uses the fixture to brush the tin paste on the BGA, which can ensure that the thickness of the tin paste is consistent everywhere, thereby improving the welding yield rate; during the melting of the tin paste, other ingredients except for tin are easy to volatilize and can not be adhered to the surface of the BGA components, thereby avoiding the bad appearance of products.
Description
Technical field
The utility model relates to circuit welding auxiliary equipment, especially relates to a kind of auxiliary equipment that is used for the welding of BGA Package assembly.
Background technology
Along with development of technology, chip integration improves constantly, and the I/O number of pins sharply increases, and power consumption also increases thereupon, and is also strict more to the requirement of integrated circuit encapsulation.In order to satisfy the needs of development, during the BGA encapsulation begins to be applied to produce.
BGA Package assembly (Ball Grid Array, BGA) be the organic support plate packaged integrated circuits of a kind of employing, the appearance of BGA Package technology just becomes the optimal selection of high density such as CPU, mainboard south, north bridge chips, high-performance, many pin package.From the angle of product manufacturing, the available coplane welding of the assembling of technology can improve the reliability of encapsulation greatly, thereby improve assembly yield.
At present, when going up circuit board (PCB) in the BGA assembly welding in the corresponding circuits, because on the pin of a wherein side of BGA assembly, be stained with and connect the tin ball that is used to weld, formed tin nodule number group.Based on this, the BGA assembly welding manner that generally adopts is at present: brush rosin cream on the welding position of PCB places this welding position with the BGA assembly, then again to the BGA assembly is welded on the PCB.
Adopt this mode to weld the BGA assembly, have the not high defective of yield of welding; And because in the welding process when heating, attach on the surface of BGA assembly after making the rosin cream of fusing, the cooling back influences BGA assembly outward appearance, thereby causes product appearance bad.
The utility model content
The purpose of this utility model is to provide a kind of auxiliary equipment that is used for the welding of BGA Package assembly, can effectively improve the welding yield of BGA and reduce in the welding process, the rosin cream of fusing causes the jaundice of BGA periphery to wait the situation that influences the mainboard bad order.
The utility model provides a kind of auxiliary equipment that is used for the welding of BGA Package assembly, comprising: main part, and its middle part is provided with the consistent through hole of solder ball array some and BGA Package assembly solder side; Cover portion, conflicting is arranged at a side of described main part, and forms the containing cavity of fixing ccontaining BGA Package assembly between the side of described main part.
More excellent, with respect to the marginal surface place of described containing cavity, the protuberance of continuous shape is set on the described main part.
More excellent, a side surface of described main part has and the consistent inner fovea part of BGA Package assembly profile, and this inner fovea part and described covering form described containing cavity between the portion.
More excellent, a described side surface that covers portion has and the consistent inner fovea part of BGA Package assembly profile, forms described containing cavity between this inner fovea part and the described main part.
In this, the utility model compared with prior art has following characteristics:
1, the utility model uses this fixture, on BGA, can guarantee the tin cream consistency of thickness at every place to the tin cream brush, thereby improves the welding yield;
2, in the process of fusing tin cream, other composition outside the detin is volatile, can not attach on the surface of BGA assembly, thereby avoid causing the product appearance condition of poor.
Description of drawings
Fig. 1 is the perspective view of the utility model one preferred embodiment.
Fig. 2 is the decomposition texture schematic diagram of the utility model one preferred embodiment.
Fig. 3 is the cross-sectional view of the utility model BGA when the brush tin cream.
Fig. 3 A is the enlarged drawing in a district among Fig. 3.
The specific embodiment
See also Fig. 1, be the perspective view of the utility model one preferred embodiment.
See also Fig. 2, be the decomposition texture schematic diagram of the utility model one preferred embodiment.This auxiliary equipment comprises: main part 12, and its middle part is provided with the consistent through hole 121 of solder ball array of some and described BGA Package assembly 20 solders side; Protuberance 11 is the box body of a no base; Inner fovea part 13 include and described BGA Package assembly 20 containing cavities 131 of the same size, and its side includes a groove 132; And cover portion 14, and the same side includes two baffle plates 141, and the opposite flank includes a trip 142.Wherein, described main part 12, described protuberance 11, described inner fovea part 13 and the described peripheral size that covers portion 14 are identical.
During assembling, with a plurality of screws 15 described protuberance 11, described main part 12 and described inner fovea part 13 are assembled in mode from top to bottom, after described BGA Package assembly 20 being positioned over the containing cavity 131 of described inner fovea part 13, described two baffle plates 141 that cover portion 14 are resisted against the side of described inner fovea part 13, described trip 142 is fastened in the described groove 132 again; Thus, be combined into the auxiliary equipment (see figure 1) that described BGA Package assembly 20 is installed.
Please continue to consult Fig. 3, be the cross-sectional view of the utility model BGA when brushing tin cream.Tin cream 30 is positioned on the described main part 12, and this tin cream 30 is that transparent light yellow or transparent milky form is the resin of sticking shape, works the weldering effect that helps.Fig. 3 A is the enlarged drawing in a district among Fig. 3.As seen from the figure, the through hole 121 of described main part 12 is corresponding with the tin ball 21 of described BGA Package assembly 20, by the described tin cream 30 of scraper 16 printings, described tin cream 30 is dropped on the tin ball 21 of described BGA Package assembly 20 from the through hole 121 of described main part 12 exactly, the thickness of the tin cream 30 on each tin ball 21 is consistent, and other position of described BGA Package assembly 20 can not polluted.
After having brushed tin cream 30, be inverted this auxiliary equipment, open the described portion 14 that covers, described BGA Package assembly 20 is taken out on PCB (Printed Circuit Board, the mainboard) relevant position, tin cream 30 is carried out melt processed.The fusing of tin cream 30 adopts general reflow soldering or the hot plate stove of SMT to carry out, and fusion temperature requires to set according to the composition of tin cream 30.
The above person only is the utility model preferred embodiment wherein, is not to be used for limiting practical range of the present utility model; Be that all equalizations of being done according to the utility model claim change and modification, be all the utility model claim and contain.
Claims (4)
1. an auxiliary equipment that is used for the welding of BGA Package assembly is characterized in that, comprising:
Main part, its middle part is provided with the consistent through hole of solder ball array some and BGA Package assembly solder side;
Cover portion, conflicting is arranged at a side of described main part, and forms the containing cavity of fixing ccontaining BGA Package assembly between the side of described main part.
2. the auxiliary equipment that is used for the welding of BGA Package assembly according to claim 1 is characterized in that: with respect to the marginal surface place of described containing cavity, the protuberance of continuous shape is set on the described main part.
3. the auxiliary equipment that is used for the welding of BGA Package assembly according to claim 1 and 2, it is characterized in that: a side surface of described main part has and the consistent inner fovea part of BGA Package assembly profile, and this inner fovea part and described covering form described containing cavity between the portion.
4. the auxiliary equipment that is used for the welding of BGA Package assembly according to claim 1 and 2, it is characterized in that: a described side surface that covers portion has and the consistent inner fovea part of BGA Package assembly profile, forms described containing cavity between this inner fovea part and the described main part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200547199U CN201089053Y (en) | 2007-07-27 | 2007-07-27 | Auxiliary equipment for ball grid array packaged components welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200547199U CN201089053Y (en) | 2007-07-27 | 2007-07-27 | Auxiliary equipment for ball grid array packaged components welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201089053Y true CN201089053Y (en) | 2008-07-23 |
Family
ID=39860811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200547199U Expired - Fee Related CN201089053Y (en) | 2007-07-27 | 2007-07-27 | Auxiliary equipment for ball grid array packaged components welding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201089053Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105880901A (en) * | 2015-10-28 | 2016-08-24 | 安徽翼迈科技股份有限公司 | Dry type meter welding tool |
-
2007
- 2007-07-27 CN CNU2007200547199U patent/CN201089053Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105880901A (en) * | 2015-10-28 | 2016-08-24 | 安徽翼迈科技股份有限公司 | Dry type meter welding tool |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204669723U (en) | A kind of circuit board, printed circuit board and steel mesh | |
| WO2015043499A1 (en) | Semiconductor encapsulation structure and forming method thereof | |
| CN105436825B (en) | Manufacturing method of LED constant current source driving circuit module | |
| WO2022143735A1 (en) | Double-sided plastic package power supply product | |
| CN101179034A (en) | Tin paste printed steel mesh opening method of pin-free flat pack type dense feet type component | |
| CN102843861A (en) | Printed circuit board and printed circuit board composite structure | |
| CN100487882C (en) | Integrated circuit and heat radiation member connecting method | |
| CN105513977B (en) | Intelligent power module and packaging method thereof | |
| CN101179035A (en) | Tin paste printed steel mesh opening method of pin-free flat pack type dense-feet-free type component | |
| CN201089053Y (en) | Auxiliary equipment for ball grid array packaged components welding | |
| CN209133467U (en) | A kind of multi-chip package production line merging SMT process | |
| CN2881949Y (en) | Apparatus for implanting tin ball | |
| CN109273375A (en) | A kind of MCM integrated circuit packaging method merging SMT | |
| CN101179918A (en) | Method for manufacturing cooling device assembly | |
| JP4168331B2 (en) | Semiconductor device and manufacturing method thereof | |
| CN213936226U (en) | Novel RGB unifies support more | |
| CN109661098B (en) | PCB metal hole copper embedding structure and processing technology thereof | |
| CN203941945U (en) | A kind of multilayer specular aluminium COB base plate for packaging | |
| CN102543929A (en) | QFP (Quad Flat Package) grounding welding plate | |
| CN104600047A (en) | Power module and packaging method thereof | |
| CN100590865C (en) | Packaging element | |
| CN206363987U (en) | A kind of special transfer mouth of electronic package | |
| CN110931449A (en) | Power module packaging structure and packaging method of power module | |
| CN110493954A (en) | PCB construction and preparation method thereof is buried in a kind of QFN device | |
| CN219553617U (en) | Packaging structure of chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080723 Termination date: 20120727 |