JP2015153805A5 - Wiring board manufacturing method - Google Patents
Wiring board manufacturing method Download PDFInfo
- Publication number
- JP2015153805A5 JP2015153805A5 JP2014024147A JP2014024147A JP2015153805A5 JP 2015153805 A5 JP2015153805 A5 JP 2015153805A5 JP 2014024147 A JP2014024147 A JP 2014024147A JP 2014024147 A JP2014024147 A JP 2014024147A JP 2015153805 A5 JP2015153805 A5 JP 2015153805A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- wiring board
- metal
- wiring
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims 12
- 229910052751 metal Inorganic materials 0.000 claims 15
- 239000002184 metal Substances 0.000 claims 15
- 238000000034 method Methods 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 8
- 239000000919 ceramic Substances 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 230000000737 periodic effect Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 239000012768 molten material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Claims (11)
少なくとも一部が前記貫通孔内に位置するように前記金属塊を配置する工程と、
前記金属塊を溶融させ、その溶融物を前記貫通孔内に充填することで配線を形成する工程と、
を含むことを特徴とする配線基板の製造方法。 A step of preparing a substrate having a through-hole, and an active metal active against a component contained in the substrate, a metal block of an alloy containing silver and copper,
Arranging the metal mass so that at least a portion thereof is located in the through hole; and
Forming the wiring by melting the metal mass and filling the melt into the through hole; and
A method for manufacturing a wiring board, comprising:
前記活性金属は、前記セラミックス基板に含まれるセラミックス成分に対して活性である請求項１または２に記載の配線基板の製造方法。 The substrate is a ceramic substrate;
The method for manufacturing a wiring board according to claim 1, wherein the active metal is active against a ceramic component contained in the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024147A JP2015153805A (en) | 2014-02-12 | 2014-02-12 | Method for manufacturing wiring board, wiring board, electronic device, electronic apparatus, and mobile body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014024147A JP2015153805A (en) | 2014-02-12 | 2014-02-12 | Method for manufacturing wiring board, wiring board, electronic device, electronic apparatus, and mobile body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015153805A JP2015153805A (en) | 2015-08-24 |
| JP2015153805A5 true JP2015153805A5 (en) | 2017-02-16 |
Family
ID=53895797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014024147A Withdrawn JP2015153805A (en) | 2014-02-12 | 2014-02-12 | Method for manufacturing wiring board, wiring board, electronic device, electronic apparatus, and mobile body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2015153805A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6551301B2 (en) * | 2016-05-19 | 2019-07-31 | 株式会社デンソー | Electronic device and method of manufacturing electronic device |
| KR102232858B1 (en) * | 2020-01-08 | 2021-03-26 | 주식회사 우진더블유티피 | Space transfomer fabricating method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575253A (en) * | 1991-08-27 | 1993-03-26 | Hitachi Constr Mach Co Ltd | Method of forming circuit pattern by laser beam and method of forming conductor in through-hole |
| JPH11351876A (en) * | 1998-06-09 | 1999-12-24 | Mitsubishi Electric Corp | Angular velocity sensor and its manufacture |
| JP2002043740A (en) * | 2000-07-24 | 2002-02-08 | Matsushita Electric Works Ltd | Method for filling metal into through hole in ceramic substrate |
| JP2007192587A (en) * | 2006-01-17 | 2007-08-02 | Seiko Instruments Inc | Wiring board for dynamic quantity sensor, manufacturing method of the wiring board for dynamic quantity sensor, and dynamic quantity sensor |
-
2014
- 2014-02-12 JP JP2014024147A patent/JP2015153805A/en not_active Withdrawn
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