CN204887684U - Novel heat dissipation formula circuit board - Google Patents
Novel heat dissipation formula circuit board Download PDFInfo
- Publication number
- CN204887684U CN204887684U CN201520655744.7U CN201520655744U CN204887684U CN 204887684 U CN204887684 U CN 204887684U CN 201520655744 U CN201520655744 U CN 201520655744U CN 204887684 U CN204887684 U CN 204887684U
- Authority
- CN
- China
- Prior art keywords
- pad
- hole
- mainboard
- fixture block
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel heat dissipation formula circuit board, which comprises a mainboard, be equipped with the more than one through -hole on the mainboard, this through -hole supreme and set up down, a first fixture block is all installed to through -hole inner wall both sides, all be equipped with a pad in the through -hole, this pad is cylindrical structure, the lower extreme all is equipped with a locating piece on the pad lateral surface, the pad is located and all is equipped with a first spout between locating piece and the locating piece, first fixture block movable mounting on the through -hole inner wall is in first spout. The utility model discloses simple structure, convenient to use, economic cost low, application range is wide, through reciprocating the pad, makes not offset between its connecting element and the mainboard for heat dissipation that can be quick.
Description
Technical field
The utility model relates to a kind of heat sinking formula circuit board.
Background technology
Nowadays, circuit board is one of vitals of electronics industry.Almost often kind of electronic equipment, little of electronic watch, calculator, large to computer, communication electronic device, because the object installed on circuit boards gets more and more, and in order to reduce the size of object, make the distance between its Connection Element and Connection Element more and more nearer, again and be offset owing to installing Connection Element on circuit boards with circuit board, circuit board can not be dispelled the heat fast, this just may cause computer, electronic equipment etc. to decommission, and has brought unnecessary trouble.
Summary of the invention
It is simple that technical problem to be solved in the utility model is to provide a kind of structure, easy to use, carried out the heat sinking formula circuit board of quick heat radiating by pad moving up and down.
The utility model is achieved through the following technical solutions: a kind of heat sinking formula circuit board, comprise mainboard, described mainboard is provided with more than one through hole, this through hole is arranged from top to down, one first fixture block is all installed in described through-hole wall both sides, a pad is equipped with in described through hole, this pad is cylindrical structural, described pad lateral surface upper and lower side is equipped with a positioning block, described pad is equipped with one first chute between locating piece and locating piece, and the first fixture block on described through-hole wall is movably installed in the first chute.
As preferred technical scheme, a layer conductor is laid in described mainboard upper surface, and described wire is positioned at through hole side and all extends to mainboard inside, extends in through hole all connect an arc fixture block through mainboard, this arc fixture block is made up of Copper Foil, and described arc fixture block internal face and face, pad outer ring all offset.
As preferred technical scheme, lower surface, described mainboard both sides all fixedly mounts a support bar, and this support bar medial surface is equipped with one second chute.
As preferred technical scheme, described pad lower surface is fixedly connected with a jacking block, this jacking block is divided into ground floor and the second layer, ground floor is made up of insulating material, ground floor is provided with more than one first air vent hole, and the second layer is made of plastics, and the second layer is provided with more than one second air vent hole, described ground floor both sides all fixedly mount one second fixture block, and described second fixture block is movably installed in the second chute.
The beneficial effects of the utility model are: the utility model structure is simple, and easy to use, Financial cost is low, and the scope of application is wide, by moving up and down pad, making not offset between its Connection Element and mainboard, making it possible to dispel the heat fast.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is overall structure schematic diagram of the present utility model;
Fig. 2 is the schematic diagram after mobile pad of the present utility model.
Embodiment
All features disclosed in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Arbitrary feature disclosed in this specification (comprising any accessory claim, summary and accompanying drawing), unless specifically stated otherwise, all can be replaced by other equivalences or the alternative features with similar object.That is, unless specifically stated otherwise, each feature is an example in a series of equivalence or similar characteristics.
As depicted in figs. 1 and 2, a kind of heat sinking formula circuit board of the present utility model, comprise mainboard 1, described mainboard 1 is provided with more than one through hole 3, this through hole 3 is arranged from top to down, one first fixture block 6 is all installed in described through hole 3 inwall both sides, a pad 2 is equipped with in described through hole 3, this pad 2 is cylindrical structural, described pad 2 lateral surface upper and lower side is equipped with a positioning block 4, described pad 2 is equipped with one first chute 7 between locating piece and locating piece, and the first fixture block 6 on described through hole 3 inwall is movably installed in the first chute 7.
In the present embodiment, a layer conductor 5 is laid in mainboard 1 upper surface, described wire 5 is positioned at through hole 3 side and all extends to mainboard 1 inside, extend in through hole 3 through mainboard 1 and all connect an arc fixture block 14, this arc fixture block 14 is made up of Copper Foil, and described arc fixture block 14 internal face and face, pad 2 outer ring all offset.
In the present embodiment, lower surface, mainboard 1 both sides all fixedly mounts a support bar 10, and this support bar 10 medial surface is equipped with one second chute 8; Pad 2 lower surface is fixedly connected with a jacking block 13, this jacking block 13 is divided into ground floor 11 and the second layer 12, ground floor 11 is made up of insulating material, ground floor 11 is provided with more than one first air vent hole (unmarked), the second layer 12 is made of plastics, the second layer 12 is provided with more than one second air vent hole (unmarked), and described ground floor 11 both sides all fixedly mount one second fixture block 9, and described second fixture block 9 is movably installed in the second chute 8.
Operation principle: first Connection Element is being welded on pad, to note preventing pad to be connected with mainboard when welding, after (just can not move pad once connection) is firm with pad solder again, the distance between Connection Element and mainboard is changed according to the degree of the self-heating of Connection Element, (by the jacking block that moves up, its pad is moved upward, chamber is made a concession owing to forming one between the first chute on pad and the first fixture block in through hole, cause pad can not drop in through hole) can dispel the heat fast (wherein vertically between jacking block with pad to be connected, its pad is made to there will not be inclination).
The beneficial effects of the utility model are: the utility model structure is simple, and easy to use, Financial cost is low, and the scope of application is wide, by moving up and down pad, making not offset between its Connection Element and mainboard, making it possible to dispel the heat fast.
The above, be only embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection range of the present utility model.Therefore, the protection range that protection range of the present utility model should limit with claims is as the criterion.
Claims (4)
1. a heat sinking formula circuit board, it is characterized in that: comprise mainboard, described mainboard is provided with more than one through hole, this through hole is arranged from top to down, and one first fixture block is all installed in described through-hole wall both sides, is equipped with a pad in described through hole, this pad is cylindrical structural, described pad lateral surface upper and lower side is equipped with a positioning block, and described pad is equipped with one first chute between locating piece and locating piece, and the first fixture block on described through-hole wall is movably installed in the first chute.
2. heat sinking formula circuit board according to claim 1, it is characterized in that: a layer conductor is laid in described mainboard upper surface, described wire is positioned at through hole side and all extends to mainboard inside, extend in through hole through mainboard and all connect an arc fixture block, this arc fixture block is made up of Copper Foil, and described arc fixture block internal face and face, pad outer ring all offset.
3. heat sinking formula circuit board according to claim 1, is characterized in that: lower surface, described mainboard both sides all fixedly mounts a support bar, and this support bar medial surface is equipped with one second chute.
4. heat sinking formula circuit board according to claim 1, it is characterized in that: described pad lower surface is fixedly connected with a jacking block, this jacking block is divided into ground floor and the second layer, ground floor is made up of insulating material, ground floor is provided with more than one first air vent hole, and the second layer is made of plastics, and the second layer is provided with more than one second air vent hole, described ground floor both sides all fixedly mount one second fixture block, and described second fixture block is movably installed in the second chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520655744.7U CN204887684U (en) | 2015-08-27 | 2015-08-27 | Novel heat dissipation formula circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520655744.7U CN204887684U (en) | 2015-08-27 | 2015-08-27 | Novel heat dissipation formula circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204887684U true CN204887684U (en) | 2015-12-16 |
Family
ID=54832001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520655744.7U Expired - Fee Related CN204887684U (en) | 2015-08-27 | 2015-08-27 | Novel heat dissipation formula circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204887684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111406447A (en) * | 2017-10-03 | 2020-07-10 | Mks仪器有限公司 | Cooling and hold-down fixture for short lead power supply unit |
-
2015
- 2015-08-27 CN CN201520655744.7U patent/CN204887684U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111406447A (en) * | 2017-10-03 | 2020-07-10 | Mks仪器有限公司 | Cooling and hold-down fixture for short lead power supply unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203181404U (en) | PCB panel easy for surface mounting LED paster identification and processing debugging | |
| CN205184127U (en) | Circuit board soldering anchor clamps | |
| CN104488077A (en) | Chip heat dissipation structure and terminal device | |
| JP2016184920A5 (en) | ||
| CN204887684U (en) | Novel heat dissipation formula circuit board | |
| CN103167736A (en) | Printed circuit board (PCB) compensation processing method, equipment and PCB | |
| RU2014152993A (en) | HEADPHONE SOCKET ASSEMBLY ASSEMBLY AND ELECTRONIC EQUIPMENT | |
| CN202262058U (en) | Printed circuit board (PCB) and mobile terminal | |
| CN103052276A (en) | PCB (Printed Circuit Board) welding fixture | |
| CN204721720U (en) | A kind of circuit board and electronic device | |
| CN103839661A (en) | Conical inductor, printed circuit board and optical module | |
| CN104124534B (en) | The method of hybrid antenna, punch elements and manufacture hybrid antenna | |
| CN202488880U (en) | PCB (printed circuit board) capable of preventing hole from being plugged in tin soldering | |
| CN103249246A (en) | Circuit board and display device | |
| CN204810689U (en) | Cell -phone module circuit board makeup structure of making a video recording | |
| WO2017050301A1 (en) | Printed circuit board and user equipment | |
| CN107039384B (en) | Surface-mounted element | |
| CN104582268B (en) | Circuit board assemblies and the electronic installation with the circuit unit | |
| CN202018526U (en) | Mini-type two-way two-channel transmit-receive module | |
| CN204498476U (en) | A kind of PCB localization tool | |
| CN203801159U (en) | Angle adjustable wave soldering jig | |
| CN106817853A (en) | Fixture | |
| CN211321635U (en) | Integrated circuit device with quick capacitor mounting structure | |
| CN205051988U (en) | SMT feeder stabilising arrangement | |
| CN204795843U (en) | Anti -drop circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151216 Termination date: 20210827 |