CN209419988U - It is a kind of can sight check ground connection flexible circuit board structure - Google Patents
It is a kind of can sight check ground connection flexible circuit board structure Download PDFInfo
- Publication number
- CN209419988U CN209419988U CN201821676925.8U CN201821676925U CN209419988U CN 209419988 U CN209419988 U CN 209419988U CN 201821676925 U CN201821676925 U CN 201821676925U CN 209419988 U CN209419988 U CN 209419988U
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- China
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- via hole
- ground connection
- circuit board
- steel disc
- circuitry layer
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Abstract
The utility model disclose it is a kind of can sight check ground connection flexible circuit board structure, comprising: flexible circuitry layer is separately positioned on nickel plating steel disc, the IC chip of flexible circuitry layer two sides；The flexible circuitry layer is provided with the first via hole, the second via hole, and the IC chip is directly connected to the first via hole, and equal tin filling, the IC chip are electrically connected by the tin filling and the nickel plating steel disc in first via hole and in the second via hole.The utility model is by being arranged similar first via hole and the second via hole in flexible circuitry layer, first via hole and the equal tin filling of the second via hole, so the tin filling situation in the first via hole and the second via hole is consistent, by visual observation flexible circuitry layer in appearance tin point solidification on the second via hole the case where, it can examine whether the ground connection finger of flexible circuit board is electrically connected with nickel plating steel disc, it is simple and convenient without using multimeter detection, it can effective improving production efficiency.
Description
Technical field
The utility model relates to flexible circuit board structure, more particularly to it is a kind of can sight check ground connection flexible circuit board
Structure.
Background technique
Common earthing mode is tin filling ground connection, is directly to engrave on connecing for flexible circuit board when passing through print solder paste
Ground Kong Dangzhong, excessively Reflow Soldering melt tin and are cured on ground connection steel disc, to be grounded success, the mode of tin filling ground connection is in IC
The flexible circuitry layer of bottom section opens hole, is grounded in this way on the steel disc that tin filling flows into after going down, but when IC patch is in flexibility
After on wiring board, must just it use the grounding resistance of multimeter detection every that can just confirm whether be grounded success.It is this to pass through
The mode that multimeter is examined, is the ground connection finger for needing to detect pen while touching steel disc and flexible circuit board, could survey in this way
Whether steel disc is grounded successfully with ground line conducting to reach out, is to be confirmed whether to be grounded successfully by visual observation.
Therefore, the prior art is defective, needs to improve.
Utility model content
Technical problem to be solved by the utility model is: provide it is a kind of can sight check ground connection flexible circuit board knot
Structure, can sight check whether be grounded.
The technical solution of the utility model is as follows: provide it is a kind of can sight check ground connection flexible circuit board structure, packet
Include: flexible circuitry layer is separately positioned on nickel plating steel disc, the IC chip of flexible circuitry layer two sides；The flexible circuitry layer is set
It is equipped with the first via hole, the second via hole, first via hole and the second via hole are connected to the nickel plating steel disc, described
IC chip is directly connected to the first via hole, and equal tin filling, the IC chip are logical in first via hole and in the second via hole
It crosses the tin filling and the nickel plating steel disc is electrically connected；The flexible circuitry layer includes: substrate, the electricity of setting on the substrate
Road floor, the protective film layer being arranged on the circuit layer, the IC chip and the circuit layer are electrically connected.By in flexible wires
Similar first via hole and the second via hole, the first via hole and the equal tin filling of the second via hole, the first via hole is arranged in road floor
Interior tin filling is connect with IC chip and nickel plating steel disc respectively, and the tin filling in the second via hole is only connect with nickel plating steel disc, due to filling
Tin be by way of silk-screen by tin cream engrave in the first via hole and the second via hole in then generated through Overheating Treatment, so
Tin filling situation in first via hole and the second via hole will be consistent, by visual observation apparent second conducting of flexible circuitry layer
The case where tin point on hole solidifies, so that whether the ground connection finger of sight check flexible circuitry layer is electrically connected with nickel plating steel disc,
It is simple and convenient without using multimeter detection, it can effective improving production efficiency.
Further, the distance between edge of the edge of first via hole and the second via hole range is 2mm-
10mm。
Further, the side of second via hole is provided with cue mark, and the cue mark can give reviewer
The position for indicating sight check, facilitates reviewer to examine.
Further, the diameter of first via hole and the second via hole is 1.6mm.
Using the above scheme, the utility model provide it is a kind of can sight check ground connection flexible circuit board structure, pass through
In flexible circuitry layer, similar first via hole and the second via hole, the first via hole and the equal tin filling of the second via hole are set, the
Tin filling in one via hole is connect with IC chip and nickel plating steel disc respectively, and the tin filling in the second via hole only connects with nickel plating steel disc
It connects, since tin filling is to be engraved on tin cream in the first via hole and in the second conducting and then through Overheating Treatment life by way of silk-screen
At so the tin filling situation in the first via hole and the second via hole will be consistent, flexible circuitry layer is apparent by visual observation
The case where tin point on second via hole solidifies, so that whether the ground connection finger of sight check flexible circuit board is electric with nickel plating steel disc
Property connection, it is simple and convenient without using multimeter detection, can effective improving production efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cross-sectional view of line A-A in Fig. 1.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Please refer to Fig. 1 and Fig. 2, the utility model provide it is a kind of can sight check ground connection flexible circuit board structure, packet
Include: flexible circuitry layer 10 is separately positioned on nickel plating steel disc 20, the IC chip 30 of 10 two sides of flexible circuitry layer；The flexibility
Line layer 10 is provided with the first via hole 11, the second via hole 12, and first via hole 11 and the second via hole 12 are and institute
The connection of nickel plating steel disc 20 is stated, the IC chip 30 is directly connected to the first via hole 11, and first via hole 11 is interior with second
Equal tin filling 40 in via hole 12, the IC chip 30 are electrically connected by the tin filling 40 with the nickel plating steel disc 20；It is described soft
Property line layer 10 includes: substrate 13, the circuit layer 14 being arranged on the substrate 13, the protection being arranged on the circuit layer 14
Film layer 15, the IC chip 30 are electrically connected with the circuit layer 14.It is led by being arranged similar first in flexible circuitry layer 10
Through-hole 11 and the second via hole 12, the first via hole 11 and the equal tin filling of the second via hole 12, the tin filling 40 in the first via hole 11
It being connect respectively with IC chip 30 and nickel plating steel disc 20, the tin filling 40 in the second via hole 12 is only connect with nickel plating steel disc 20, due to
Tin filling 40 is to be engraved on tin cream in the first via hole 11 and in the second via hole 12 and then through Overheating Treatment by way of silk-screen
It generates, so the first via hole 11 will be consistent with 40 situation of tin filling in the second via hole 12, flexible circuitry layer by visual observation
10 in appearance tin point solidification on the second via hole 12 the case where, so that the ground connection finger of sight check flexible circuitry layer 10 is
It is no to be electrically connected with nickel plating steel disc 20, it is simple and convenient without using multimeter detection, it can effective improving production efficiency.
The side of second via hole 12 is provided with cue mark 16, and the cue mark 16 can be indicated to reviewer
The position of sight check, facilitates reviewer to examine.
The distance between edge of the edge of first via hole 11 and the second via hole 12 is 8mm.Described first leads
The diameter of through-hole 11 and the second via hole 12 is 1.6mm.
In conclusion the utility model provide it is a kind of can sight check ground connection flexible circuit board structure, by soft
Property line layer similar first via hole and the second via hole, the first via hole and the equal tin filling of the second via hole are set, first leads
Tin filling in through-hole is connect with IC chip and nickel plating steel disc respectively, and the tin filling in the second via hole is only connect with nickel plating steel disc, by
It is to engrave on tin cream by way of silk-screen in the first via hole to generate in the second conducting and then through Overheating Treatment in tin filling, institute
Will be consistent with the tin filling situation in the first via hole and the second via hole, flexible circuitry layer the second conducting in appearance by visual observation
The case where tin point on hole solidifies, so that whether the ground connection finger of sight check flexible circuit board is electrically connected with nickel plating steel disc,
It is simple and convenient without using multimeter detection, it can effective improving production efficiency.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (4)
1. one kind can sight check ground connection flexible circuit board structure characterized by comprising flexible circuitry layer is set respectively
Set nickel plating steel disc in flexible circuitry layer two sides, IC chip；The flexible circuitry layer is provided with the first via hole, second leads
Through-hole, first via hole and the second via hole are connected to the nickel plating steel disc, and the IC chip and the first via hole are straight
Lead in succession, equal tin filling, the IC chip pass through the tin filling and the nickel plating in first via hole and in the second via hole
Steel disc is electrically connected；The flexible circuitry layer includes: substrate, setting circuit layer on the substrate, is arranged in the circuit
Protective film layer on layer, the IC chip and the circuit layer are electrically connected.
2. one kind according to claim 1 can sight check ground connection flexible circuit board structure, which is characterized in that it is described
The distance between the edge of the edge of first via hole and the second via hole range is 2mm-10mm.
3. one kind according to claim 1 can sight check ground connection flexible circuit board structure, which is characterized in that it is described
The side of second via hole is provided with cue mark.
4. one kind according to claim 1 can sight check ground connection flexible circuit board structure, which is characterized in that it is described
The diameter of first via hole and the second via hole is 1.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821676925.8U CN209419988U (en) | 2018-10-16 | 2018-10-16 | It is a kind of can sight check ground connection flexible circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821676925.8U CN209419988U (en) | 2018-10-16 | 2018-10-16 | It is a kind of can sight check ground connection flexible circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209419988U true CN209419988U (en) | 2019-09-20 |
Family
ID=67931570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821676925.8U Active CN209419988U (en) | 2018-10-16 | 2018-10-16 | It is a kind of can sight check ground connection flexible circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209419988U (en) |
-
2018
- 2018-10-16 CN CN201821676925.8U patent/CN209419988U/en active Active
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