CN206302634U - Silver paste hole filled circuit board - Google Patents

Silver paste hole filled circuit board Download PDF

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Publication number
CN206302634U
CN206302634U CN201621424042.9U CN201621424042U CN206302634U CN 206302634 U CN206302634 U CN 206302634U CN 201621424042 U CN201621424042 U CN 201621424042U CN 206302634 U CN206302634 U CN 206302634U
Authority
CN
China
Prior art keywords
hole
silver paste
reaming
circuit board
apertures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621424042.9U
Other languages
Chinese (zh)
Inventor
张钧诚
陆萍
朱健勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU SHUANGJIN ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU SHUANGJIN ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU SHUANGJIN ELECTRONICS Co Ltd filed Critical CHANGZHOU SHUANGJIN ELECTRONICS Co Ltd
Priority to CN201621424042.9U priority Critical patent/CN206302634U/en
Application granted granted Critical
Publication of CN206302634U publication Critical patent/CN206302634U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The utility model is related to a kind of silver paste hole filled circuit board, including substrate, the upper surface and bottom surface of substrate are respectively provided with copper conductor, the substrate is provided with several through holes, silver paste guide pillar is filled with the through hole, reaming end is provided with silver paste guide pillar connection two copper conductors, and two apertures of through hole, and at least provided with two oblique slots on the hole wall of through hole;Reaming end at two apertures of the through hole is arc reaming;Described two oblique slots are extended respectively on two reaming ends.The utility model is improved on through hole, reaming end is provided with two apertures of through hole, and at least provided with two oblique slots on the hole wall of through hole, when reaming end causes that silver paste is filling, it is more smooth, and oblique slot has guide functions so that and silver paste can smoothly fill whole through hole, improve product quality, it is to avoid occur doing over again.

Description

Silver paste hole filled circuit board
Technical field
The utility model is related to a kind of circuit board, more particularly to a kind of silver paste hole filled circuit board.
Background technology
Printed circuit board is typically served to as each component provides necessary support in circuit in the electronic device, is easy to each Individual component inserting, realizes that it is electrically connected.Widely used in an electronic.But the more sensitive unit of electromagnetic induction Device, can easily receive electromagnetic interference.Electromagnetic interference is generally eliminated by the way of silver paste hole filled, but in filling silver paste, Due to through hole problem, cause silver paste to be possible to bubble occur, so as to cause the circuit between two pieces of copper conductors not turn on, produce Quality problem not up to standard and do over again.
The content of the invention
The purpose of this utility model be one kind is provided can smooth filling silver paste, it is to avoid the silver paste hole filled circuit done over again Plate.
In order to achieve the above object, the technical solution of the utility model is:A kind of silver paste hole filled circuit board, including substrate, The upper surface and bottom surface of substrate are respectively provided with copper conductor, and the substrate is provided with several through holes, is filled with the through hole Silver paste guide pillar, reaming end is provided with silver paste guide pillar connection two copper conductors, and two apertures of through hole, and through hole hole wall On at least provided with two oblique slots.
Reaming end at two apertures of the through hole is arc reaming.
Described two oblique slots are extended respectively on two reaming ends.
After said structure, the utility model is improved on through hole, and reaming is provided with two apertures of through hole End, and at least provided with two oblique slots on the hole wall of through hole, it is more smooth when reaming end causes that silver paste is filling and oblique Groove has guide functions so that silver paste can smoothly fill whole through hole, is not in bubble, improve product quality, it is to avoid go out Now do over again.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
The utility model is described in further detail below in conjunction with the embodiment that accompanying drawing is given.
It is shown in Figure 1, a kind of silver paste hole filled circuit board, including substrate 1, the upper surface and bottom surface of substrate 1 are respectively provided with copper Wire 2, the substrate 1 is provided with several through holes 3, the through hole 3 and is filled with silver paste guide pillar 4, and silver paste guide pillar 4 is connected It is provided with two copper conductors 2, and two apertures of through hole 3 on reaming end 31, and the hole wall of through hole 3 at least provided with two tiltedly To groove 32.
Shown in Figure 1, in order that silver paste is filling more smooth, the reaming end 31 at 3 two apertures of the through hole is Arc reaming.
Shown in Figure 1, in order that silver paste can rapidly enter oblique slot 32, described two oblique slots 32 are extended respectively to On two reaming ends 31.
Shown in Figure 1, the utility model is double-layer circuit board, with two 2 layers of copper conductors, and by filling silver paste Turned in through hole 3.The utility model is improved on through hole 3, and reaming end is provided with two apertures of through hole 3 It is more smooth when reaming end 31 causes that silver paste is filling at least provided with two oblique slots 32 on 31, and the hole wall of through hole 3, and Oblique slot 32 has guide functions, is not in bubble so that silver paste can smoothly fill whole through hole 3, improve product quality, Avoid the occurrence of and do over again.
Above-described is only preferred embodiment of the present utility model, it is noted that for the ordinary skill of this area For personnel, on the premise of the utility model creation design is not departed from, various modifications and improvements can be made, these all belong to In protection domain of the present utility model.

Claims (3)

1. a kind of silver paste hole filled circuit board, including substrate (1), the upper surface and bottom surface of substrate (1) are respectively provided with copper conductor (2), its It is characterised by:The substrate (1) is provided with several through holes (3), the through hole (3) and is filled with silver paste guide pillar (4), silver Slurry guide pillar (4) connects two copper conductors (2), and reaming end (31), and through hole (3) are provided with two apertures of through hole (3) Hole wall at least provided with two oblique slots (32).
2. silver paste hole filled circuit board according to claim 1, it is characterised in that:At (3) two apertures of the through hole Reaming end (31) is arc reaming.
3. silver paste hole filled circuit board according to claim 1, it is characterised in that:Described two oblique slots (32) each extend over To two reaming ends (31).
CN201621424042.9U 2016-12-22 2016-12-22 Silver paste hole filled circuit board Expired - Fee Related CN206302634U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621424042.9U CN206302634U (en) 2016-12-22 2016-12-22 Silver paste hole filled circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621424042.9U CN206302634U (en) 2016-12-22 2016-12-22 Silver paste hole filled circuit board

Publications (1)

Publication Number Publication Date
CN206302634U true CN206302634U (en) 2017-07-04

Family

ID=59204910

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621424042.9U Expired - Fee Related CN206302634U (en) 2016-12-22 2016-12-22 Silver paste hole filled circuit board

Country Status (1)

Country Link
CN (1) CN206302634U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170704

Termination date: 20191222