CN206302634U - Silver paste hole filled circuit board - Google Patents
Silver paste hole filled circuit board Download PDFInfo
- Publication number
- CN206302634U CN206302634U CN201621424042.9U CN201621424042U CN206302634U CN 206302634 U CN206302634 U CN 206302634U CN 201621424042 U CN201621424042 U CN 201621424042U CN 206302634 U CN206302634 U CN 206302634U
- Authority
- CN
- China
- Prior art keywords
- hole
- silver paste
- reaming
- circuit board
- apertures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model is related to a kind of silver paste hole filled circuit board, including substrate, the upper surface and bottom surface of substrate are respectively provided with copper conductor, the substrate is provided with several through holes, silver paste guide pillar is filled with the through hole, reaming end is provided with silver paste guide pillar connection two copper conductors, and two apertures of through hole, and at least provided with two oblique slots on the hole wall of through hole；Reaming end at two apertures of the through hole is arc reaming；Described two oblique slots are extended respectively on two reaming ends.The utility model is improved on through hole, reaming end is provided with two apertures of through hole, and at least provided with two oblique slots on the hole wall of through hole, when reaming end causes that silver paste is filling, it is more smooth, and oblique slot has guide functions so that and silver paste can smoothly fill whole through hole, improve product quality, it is to avoid occur doing over again.
Description
Technical field
The utility model is related to a kind of circuit board, more particularly to a kind of silver paste hole filled circuit board.
Background technology
Printed circuit board is typically served to as each component provides necessary support in circuit in the electronic device, is easy to each
Individual component inserting, realizes that it is electrically connected.Widely used in an electronic.But the more sensitive unit of electromagnetic induction
Device, can easily receive electromagnetic interference.Electromagnetic interference is generally eliminated by the way of silver paste hole filled, but in filling silver paste,
Due to through hole problem, cause silver paste to be possible to bubble occur, so as to cause the circuit between two pieces of copper conductors not turn on, produce
Quality problem not up to standard and do over again.
The content of the invention
The purpose of this utility model be one kind is provided can smooth filling silver paste, it is to avoid the silver paste hole filled circuit done over again
Plate.
In order to achieve the above object, the technical solution of the utility model is：A kind of silver paste hole filled circuit board, including substrate,
The upper surface and bottom surface of substrate are respectively provided with copper conductor, and the substrate is provided with several through holes, is filled with the through hole
Silver paste guide pillar, reaming end is provided with silver paste guide pillar connection two copper conductors, and two apertures of through hole, and through hole hole wall
On at least provided with two oblique slots.
Reaming end at two apertures of the through hole is arc reaming.
Described two oblique slots are extended respectively on two reaming ends.
After said structure, the utility model is improved on through hole, and reaming is provided with two apertures of through hole
End, and at least provided with two oblique slots on the hole wall of through hole, it is more smooth when reaming end causes that silver paste is filling and oblique
Groove has guide functions so that silver paste can smoothly fill whole through hole, is not in bubble, improve product quality, it is to avoid go out
Now do over again.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
The utility model is described in further detail below in conjunction with the embodiment that accompanying drawing is given.
It is shown in Figure 1, a kind of silver paste hole filled circuit board, including substrate 1, the upper surface and bottom surface of substrate 1 are respectively provided with copper
Wire 2, the substrate 1 is provided with several through holes 3, the through hole 3 and is filled with silver paste guide pillar 4, and silver paste guide pillar 4 is connected
It is provided with two copper conductors 2, and two apertures of through hole 3 on reaming end 31, and the hole wall of through hole 3 at least provided with two tiltedly
To groove 32.
Shown in Figure 1, in order that silver paste is filling more smooth, the reaming end 31 at 3 two apertures of the through hole is
Arc reaming.
Shown in Figure 1, in order that silver paste can rapidly enter oblique slot 32, described two oblique slots 32 are extended respectively to
On two reaming ends 31.
Shown in Figure 1, the utility model is double-layer circuit board, with two 2 layers of copper conductors, and by filling silver paste
Turned in through hole 3.The utility model is improved on through hole 3, and reaming end is provided with two apertures of through hole 3
It is more smooth when reaming end 31 causes that silver paste is filling at least provided with two oblique slots 32 on 31, and the hole wall of through hole 3, and
Oblique slot 32 has guide functions, is not in bubble so that silver paste can smoothly fill whole through hole 3, improve product quality,
Avoid the occurrence of and do over again.
Above-described is only preferred embodiment of the present utility model, it is noted that for the ordinary skill of this area
For personnel, on the premise of the utility model creation design is not departed from, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.
Claims (3)
1. a kind of silver paste hole filled circuit board, including substrate (1), the upper surface and bottom surface of substrate (1) are respectively provided with copper conductor (2), its
It is characterised by：The substrate (1) is provided with several through holes (3), the through hole (3) and is filled with silver paste guide pillar (4), silver
Slurry guide pillar (4) connects two copper conductors (2), and reaming end (31), and through hole (3) are provided with two apertures of through hole (3)
Hole wall at least provided with two oblique slots (32).
2. silver paste hole filled circuit board according to claim 1, it is characterised in that：At (3) two apertures of the through hole
Reaming end (31) is arc reaming.
3. silver paste hole filled circuit board according to claim 1, it is characterised in that：Described two oblique slots (32) each extend over
To two reaming ends (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424042.9U CN206302634U (en) | 2016-12-22 | 2016-12-22 | Silver paste hole filled circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621424042.9U CN206302634U (en) | 2016-12-22 | 2016-12-22 | Silver paste hole filled circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206302634U true CN206302634U (en) | 2017-07-04 |
Family
ID=59204910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621424042.9U Expired - Fee Related CN206302634U (en) | 2016-12-22 | 2016-12-22 | Silver paste hole filled circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206302634U (en) |
-
2016
- 2016-12-22 CN CN201621424042.9U patent/CN206302634U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170704 Termination date: 20191222 |